LQA10T300
Qspeed™ Family
300 V, 10 A Q-Series Diode
www.powerint.com January 2011
Product Summary
IF(AVG) 10 A
VRRM 300 V
QRR (Typ at 125 °C) 38 nC
IRRM (Typ at 125 °C) 2.3 A
Softness tb/ta (Typ at 125 °C) 0.7
AC
TO-220AC
RoHS Compliant
Package uses Lead-free plating and
Green mold compound.
Halogen free per IEC 61249-2-21.
General Description
This device has the lowest QRR of any 300 V
Silicon diode. Its recovery characteristics
increase efficiency, reduce EMI and eliminate
snubbers.
Applications
• AC/DC and DC/DC output rectification
• Output & freewheeling diodes
• Motor control drive circuits
• Uninterruptible Power Supply (UPS) inverters
Features
• Low QRR, Low IRRM, Low tRR
• High dIF/dt capable (1000 A/µs)
• Soft recovery
Benefits
• Increases efficiency
• Eliminates need for snubber circuit s
• Reduces EMI filter component size & count
• Enables extremely fast switching
Absolute Maximum Ratings
Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional
operation under these conditions is not implied.
Symbol Parameter Conditions Rating Units
VRRM Peak repetitive reverse voltage 300 V
IF(AVG) Average forward current TJ = 150 °C, TC = 115°C 10 A
IFSM Non-repetitive peak surge cur r ent 60 Hz, ½ c ycle 80 A
IFSM Non-repetitive peak surge cur r ent ½ cycle of T = 28 us Sinusoid, TC = 25 °C 350 A
TJ Maximum junction temperatur e 150 °C
TSTG Storage temperature –55 to 150 °C
Lead soldering temperature Leads at 1.6mm from case, 10 sec 300 °C
PD Power dissipation TC = 25 °C 52 W
Thermal Resistance
Symbol Resistance from: Conditions Rating Units
RθJA Junction to ambient TO-220 62 °C/W
RθJC Junction to case TO-220 2.4 °C/W
Pin Assignment
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LQA10T300
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Electrical Specifications at TJ= 25 °C (unless otherwise specified)
Symbol Parameter Conditions Min Typ Max Units
DC Characteristics
IR Reverse current VR = 300V, TJ = 25 °C - - 25 µA
V
R = 300V, TJ = 125 °C - 0.32 - mA
VF Forward voltage IF = 10A, TJ = 25 °C - 1.58 1.9 V
I
F = 10A, TJ = 150 °C - 1.36 - V
CJ Junction capacitance VR = 10V, 1 MHz - 33 - pF
Dynamic Characteristics
tRR T
J=25 °C - 12.6 - ns
Reverse recovery time, dIF/dt =200A/µs
VR=200V,IF=10A TJ=125 °C - 24 - ns
QRR T
J=25 °C - 10.2 16 nC
Reverse recovery charge, dIF/dt =200A/µs
VR=200V,IF=10A TJ =125 °C - 38 - nC
IRRM T
J =25 °C - 1.3 1.7 A
Maximum reverse
recovery current, dIF/dt =200A/µs
VR=200V,IF=10A TJ=125 °C - 2.3 - A
S TJ =25 °C - 0.7 -
Softness = a
b
t
t dIF/dt =200A/µs
VR=200V,IF=10A TJ=125 °C - 0.7 -
Note to component engineers: Q-Series diodes employ Schottky technologies in their design and construction.
Therefore, component engineers should plan their test setups to be similar to traditional Schottky test setups.
(For further details, see application note AN- 300.)
Figure 1. Reverse Recovery Definitions
Figure 2. Reverse Recovery Test Circuit
Pulse generator
Rg Q1
VR
+
15V
D1
DUT
L1
IF
dIF/dt
IRRM
tRR
tb
ta
0
0.1xIRRM
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LQA10T300
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Electrical Specifications at TJ= 25 °C (unless otherwise specified)
0
2
4
6
8
10
12
14
16
18
20
0.0 0.5 1.0 1.5 2.0
V
F
(V)
I
F
(A)
Tj=125C
Tj=25C
Figure 3. Typical IF vs VF
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
V
F
(V)
I
F
(A)
Tj=125C
Tj=25C
Figure 4. Typical IF vs VF
0
20
40
60
80
100
120
0 20 40 60 80 100 120 140 160 180
V
R
(V)
C
j
(pF)
Figure 5. Typical Cj vs VR
0
5
10
15
20
25
30
25 50 75 100 125 150
Case Temperature, T
C
(
o
C)
I
F(AV)
(A)
Figure 6. DC Current Derating Curve
0
10
20
30
40
50
60
70
80
02468101214
I
F
(A)
Q
RR
(n C )
dI
F
/dt=200A/us
dI
F
/dt=500A/us
Figure 7. Typical QRR vs IF at Tj=125 °C
0
10
20
30
40
50
60
70
80
02468101214
I
F
(A)
Q
RR
(n C )
dI
F
/dt=200A/us
dI
F
/dt=500A/us
Figure 8. Typical tRR vs IF at Tj=125 °C
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LQA10T300
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0
10
20
30
40
50
60
25 50 75 100 125 150
Case Temperature, T
C
(
o
C)
P ( W )
Figure 9. Power Derating Curve
0
5
10
15
20
25
30
35
40
45
50
25 50 75 100 125 150
TC(°C)
IF(PEAK) (A)
duty cycle =1 0%
duty cycle =5 0%
duty cycle =3 0%
DC
Figure 10. IF(Peak) vs TC, f=70 kHz
LQA10T300
0.001
0.01
0.1
1
1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
t1(sec)
Zth(j-c)/Rth(j-c
)
D=0.002
D=0.005
D= 0.01
D= 0.02
D= 0.05
D= 0.1
D = 0. 3
D= 0.5
Single Pulse
Figure 11. Normalized Maximum Transient Thermal Impedance
Rev 1.2 01/11 www.powerint.com
LQA10T300
5
Dimensional Outline Drawings
Millimeters
Dim MIN MAX
A 4.32 4.70
A1 1.14 1.40
A2 2.03 2.79
C 0.34 0.610
D 9.65 10.67
E 2.49 2.59
E1 4.98 5.18
F 0.508 1.016
F1 1.14 1.78
H 14.71 16.51
H1 5.84 6.55
H2 8.51 9.25
H3 3.53 3.96
H4 2.54 3.05
L 12.70 14.22
L1 - 6.35
Mechanical Mounting
Method Maximum Torque / Pressure specification
Screw through hole in package tab 1 Newton Meter (nm) or 8.8 inch-pounds (lb-in)
Clamp against package body 12.3 kilogram-force per square centimeter (kgf/cm2) or 175 lbf/in2
Soldering time and temperature: This product has been designed for use with high-
temperature, lead-free solder. The component leads can be subjected to a maximum
temperature of 300 °C, for up to 10 seconds. See Application Note AN-303, for more
details.
Ordering Information
Part Number Package Packing
LQA10T300 TO-220AC 50 units/tube
The information contained in this document is subject to change without notice.
www.powerint.com Rev 1.2 01/11
LQA10T300
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Revision Notes Date
1.1 Released by Qspeed 05/09
1.2 Converted to Power Integrations Document 01/11
Rev 1.2 01/11 www.powerint.com
LQA10T300
7
For the latest updates, visit our website: www.powerint.com
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Power Integrations do es not assume an y li abilit y arisi ng from the use of any device or circuit described herein. PO WE R
INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING,
WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS.
PATENT INFORMATION
The products and applications illustrated herein (including transformer construction and circuits external to the products)
may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applicatio ns
assigned to Power Integrations. A complete list of Power Integrations’ patents may be found at www.powerint.com. Power
Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm.
The PI Logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS,
Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, StackFET, PI Expert and PI FACTS ar e t ra de ma rks of Power Integrations, Inc.
Other trademarks are property of their respective companies. ©Cop yright 2011 Power Integrations, Inc.
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