(1.27 mm) .050" FW-SM SERIES
(1.27 mm x 1.27 mm)
.050" x .050"
micro pitch
Surface
mount
Variable
board spacing
Low-profile or
skyscraper styles
FW–12–05–G–D–530–101
FW–20–05–F–D–610–065
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
STACKER
HEIGHT
POST
HEIGHT
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
FW NO. PINS
PER ROW DOPTION
–F
= Gold flash on post,
Matte Tin on tail
–L
= 10 µ" (0.25 µm)
Gold on post,
Matte Tin on tail
–G
= 10 µ" (0.25 µm)
Gold on post,
Gold flash on tail
CLP
FW
MATED
HEIGHT
APPLICATIONS
02 thru 50
For complete specifications and
recommended PCB layouts
see www.samtec.com?FW-SM
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Sn or Au over 50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
RoHS Compliant:
Ye s
This Series is non-standard,
non-returnable.
(1.19)
.047
(3.42)
.135
(0.41) .016 SQ
STACKER
HEIGHT
POST HEIGHT
(1.65) .065
MIN
(1.27)
.050
(2.92)
.115
(1.27) .050
(0.89)
.035
DIA
(0.86)
.034
(4.06)
.160
(3.45)
.136
x
(5.08)
.200
(0.76)
.030
(2.51)
.099
No. of positions x
(1.27) .050 100
99
02
01
(3.05)
.120
(1.91)
.075
DIA
(4.27)
.168
(4.76)
.188
–ES
= End Shroud
(–075 post height only.
Mate only with CLP)
(5.46 mm) .215" to
(15.49 mm) .610"
stacker height only
9 pins/row min.
–EP
= End Shroud
with Guide Post
(–075 post height only.
Mate only with CLP.)
(5.46 mm) .215"
to (15.49 mm) .610"
stacker height only)
9 pins/row min.
–A
= Alignment Pin
(3 positions min.)
(5.46 mm) .215" to
(15.75 mm) .620"
stacker height only
–P
= Pick & Place Pad
(5 positions min.)
–TR
= Tape & Reel
(Max overall height =
Post+Stacker Height+
Pad+Alignment Pin =
.700 (17.78))
–“XXX”
= Stacker
Height
(in inches)
Example:
–250
= (6.35 mm)
.250"
–“XXX”
= Post Height
(in inches)
(1.65 mm)
.065"
minimum
Example:
–065
= (1.65 mm)
.065"
SPECIFICATIONS
SMT MICRO BOARD STACKER
Notes:
For added mechanical stability,
Samtec recommends
mechanical board spacers be
used in applications with gold or
selective gold plated connectors.
Contact ipg@samtec.com for
more information.
For complete scope
of recognitions see
www.samtec.com/quality
RECOGNITIONS
ALSO AVAILABLE
(MOQ Required)
• Smaller stack heights
–ES
–P
–A
–EP
FILE NO. E111594
Board Mates:
CLP, FLE
Cable Mates:
FFSD
PROCESSING
Lead-Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-30)
(0.15 mm) .006" max (31-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
F-219 (Rev 26MAY20)
LEAD
STYLE
STACKER
HEIGHT
STACKER
+ POST
–03 (5.46) to (8.51)
.215 .335
(7.11) to (10.16)
.280 .400
–05 (8.64) to (15.49)
.340 .610
(10.29) to (17.15)
.405 .675
LEAD STYLE MATED
HEIGHT*
FW CLP
FW-XX-03-X-X-233-065
–02
(8.13)
.320
FW-XX-03-X-X-303-065 (9.91)
.390
*Processing conditions will affect mated height.
Gbps
4
HIGH-SPEED CHANNEL PERFORMANCE
Rating based on Samtec reference
channel. For full SI performance data
visit Samtec.com or contact
SIG@samtec.com
