N80L188EB-13 - Intel Corporation

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July, 2004

Order Number: 272433-006

80C186EB/80C188E B AND 80L186EB/80L188EB

16-BIT HIGH-INTEGRATION EMBEDDED PROCESSORS

■Full Static Operation

■True CMOS Inputs and Outputs

■Integrate d Feature Set

— Low-Power Static CPU Core

— Two Independent UARTs each with

an Integral Baud Rate Generator

— Two 8-Bit Multiplexed I/ O Ports

— Programmable Interrupt Controller

— Three Programmable 16-Bit

Timer/Counters

— Clock Generator

— Ten Programmable Chip Selects with

Integral Wait-State Generator

— Memory Refresh Control Unit

— System Level Testing Support (ONCE

Mode)

■Direct Addressing Capability to 1 Mbyte

Memory and 64 Kbyte I/O

■Speed Versions Available (5V):

— 25 MHz (80C186EB25/80C188EB25)

— 20 MHz (80C186EB20/80C188EB20)

— 13 MHz (80C186EB13/80C188EB13)

■Available in Extended Temperature

Range (-40°C to +85°C)

■Speed Versions Available (3V):

— 16 MHz (80L186EB16/80L188EB16)

— 13 MHz (80L186EB13/80L188EB13)

■Low-Power Operating Modes:

—Idle Mode Freezes CPU Clocks but

keeps Peripherals Active

—Powerdown Mode Freezes All

Internal Clocks

■Supports 80C187 Numeric Coprocessor

Interface (80C186EB PLCC Only)

■Available In:

—80-Pin Quad Flat Pack (QFP)

—84-Pin Plastic Leaded Chip Carrier

(PLCC)

—80-Pin Shrink Quad Flat Pack (SQFP)

The 80C186EB is a second generation CHMOS High-Integration microprocessor. It has features that are new

to the 80C186 family and include a STATIC CPU core, an enhanced Chip Select decode unit, two independent

Serial Channels, I/O ports, and the capability of Idle or Powerdown low power modes.

272433–1

80C186EB/80C188EB and 80L186EB/80L188EB

16-Bit High-Integration Embedded Processors

CONTENTS PAGE

INTRODUCTION ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 4

CORE ARCHITECTURE ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 4

Bus Interface Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 4

Clock Generator ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 4

80C186EC PERIPHERAL

ARCHITECTURE ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 5

Interrupt Control Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 5

Timer/Counter Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 5

Serial Communications Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 7

Chip-Select Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 7

I/O Port Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 7

Refresh Control Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 7

Power Management Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 7

80C187 Interface (80C186EB Only) ÀÀÀÀÀÀÀÀÀ 7

ONCE Test Mode ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 7

PACKAGE INFORMATION ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 8

Prefix Identification ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 8

Pin Descriptions ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 8

80C186EB PINOUT ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 14

PACKAGE THERMAL

SPECIFICATIONS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 22

ELECTRICAL SPECIFICATIONS ÀÀÀÀÀÀÀÀÀ 23

Absolute Maximum Ratings ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 23

CONTENTS PAGE

Recommended Connections ÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 23

DC SPECIFICATIONS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 24

ICC versus Frequency and Voltage ÀÀÀÀÀÀÀÀÀ 27

PDTMR Pin Delay Calculation ÀÀÀÀÀÀÀÀÀÀÀÀÀ 27

AC SPECIFICATIONS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 28

AC CharacteristicsÐ80C186EB25 ÀÀÀÀÀÀÀÀÀ 28

AC CharacteristicsÐ80C186EB20/13 ÀÀÀÀÀ 30

AC CharacteristicsÐ80L186EB16 ÀÀÀÀÀÀÀÀÀ 32

Relative Timings ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 36

Serial Port Mode 0 Timings ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 37

AC TEST CONDITIONS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 38

AC TIMING WAVEFORMS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 38

DERATING CURVES ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 41

RESET ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 42

BUS CYCLE WAVEFORMS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 45

EXECUTION TIMINGS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 52

INSTRUCTION SET SUMMARY ÀÀÀÀÀÀÀÀÀÀ 53

ERRATA ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 59

REVISION HISTORY ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 59

80C186EB/80C188EB, 80L186EB/80L188EB

272433–2

NOTE:

Pin names in parentheses apply to the 80C188EB/80L188EB

Figure 1. 80C186EB/80C188EB Block Diagram

80C186EB/80C188EB, 80L186EB/80L188EB

INTRODUCTION

Unless specifically noted, all references to the

80C186EB apply to the 80C188EB, 80L186EB, and

80L188EB. References to pins that differ between

the 80C186EB/80L186EB and the 80C188EB/

80L188EB are given in parentheses. The ‘‘L’’ in the

part number denotes low voltage operation. Physi-

cally and functionally, the ‘‘C’’ and ‘‘L’’ devices are

identical.

The 80C186EB is the first product in a new genera-

tion of low-power, high-integration microprocessors.

It enhances the existing 186 family by offering new

features and new operating modes. The 80C186EB

is object code compatible with the 80C186XL/

80C188XL microprocessors.

The 80L186EB is the 3V version of the 80C186EB.

The 80L186EB is functionally identical to the

80C186EB embedded processor. Current

80C186EB users can easily upgrade their designs to

use the 80L186EB and benefit from the reduced

power consumption inherent in 3V operation.

The feature set of the 80C186EB meets the needs

of low power, space critical applications. Low-Power

applications benefit from the static design of the

CPU core and the integrated peripherals as well as

low voltage operation. Minimum current consump-

tion is achieved by providing a Powerdown mode

that halts operation of the device, and freezes the

clock circuits. Peripheral design enhancements en-

sure that non-initialized peripherals consume little

current.

Space critical applications benefit from the inte-

gration of commonly used system peripherals. Two

serial channels are provided for services such as

diagnostics, inter-processor communication, modem

interface, terminal display interface, and many oth-

ers. A flexible chip select unit simplifies memory and

peripheral interfacing. The interrupt unit provides

sources for up to 129 external interrupts and will pri-

oritize these interrupts with those generated from

the on-chip peripherals. Three general purpose tim-

er/counters and sixteen multiplexed I/O port pins

round out the feature set of the 80C186EB.

Figure 1 shows a block diagram of the 80C186EB/

80C188EB. The Execution Unit (EU) is an enhanced

8086 CPU core that includes: dedicated hardware to

speed up effective address calculations, enhance

execution speed for multiple-bit shift and rotate in-

structions and for multiply and divide instructions,

string move instructions that operate at full bus

bandwidth, ten new instruction, and fully static oper-

ation. The Bus Interface Unit (BIU) is the same as

that found on the original 186 family products, ex-

cept the queue status mode has been deleted and

buffer interface control has been changed to ease

system design timings. An independent internal bus

is used to allow communication between the BIU

and internal peripherals.

CORE ARCHITECTURE

Bus Interface Unit

The 80C186EB core incorporates a bus controller

that generates local bus control signals. In addition,

it employs a HOLD/HLDA protocol to share the local

bus with other bus masters.

The bus controller is responsible for generating 20

bits of address, read and write strobes, bus cycle

status information, and data (for write operations) in-

formation. It is also responsible for reading data off

the local bus during a read operation. A READY in-

put pin is provided to extend a bus cycle beyond the

minimum four states (clocks).

The local bus controller also generates two control

signals (DEN and DT/R) when interfacing to exter-

nal transceiver chips. (Both DEN and DT/R are

available on the PLCC devices, only DEN is avail-

able on the QFP and SQFP devices.) This capability

allows the addition of transceivers for simple buffer-

ing of the multiplexed address/data bus.

Clock Generator

The processor provides an on-chip clock generator

for both internal and external clock generation. The

clock generator features a crystal oscillator, a divide-

by-two counter, and two low-power operating

modes.

The oscillator circuit is designed to be used with ei-

ther a parallel resonant fundamental or third-over-

tone mode crystal network. Alternatively, the oscilla-

tor circuit may be driven from an external clock

source. Figure 2 shows the various operating modes

of the oscillator circuit.

The crystal or clock frequency chosen must be twice

the required processor operating frequency due to

the internal divide-by-two counter. This counter is

used to drive all internal phase clocks and the exter-

nal CLKOUT signal. CLKOUT is a 50% duty cycle

processor clock and can be used to drive other sys-

tem components. All AC timings are referenced to

CLKOUT.

80C186EB/80C188EB, 80L186EB/80L188EB

272433–3

(A) Crystal Connection

NOTE:

The L1C1network is only required when using a third-

overtone crystal.

272433–4

(B) Clock Connection

Figure 2. Clock Configurations

The following parameters are recommended when

choosing a crystal:

Temperature Range: Application Specific

ESR (Equivalent Series Resistance): 40Xmax

C0 (Shunt Capacitance of Crystal): 7.0 pF max

CL(Load Capacitance): 20 pF g2pF

Drive Level: 1 mW max

80C186EB PERIPHERAL

ARCHITECTURE

The 80C186EB has integrated several common sys-

tem peripherals with a CPU core to create a com-

pact, yet powerful system. The integrated peripher-

als are designed to be flexible and provide logical

interconnections between supporting units (e.g., the

interrupt control unit supports interrupt requests

from the timer/counters or serial channels).

The list of integrated peripherals includes:

#7-Input Interrupt Control Unit

#3-Channel Timer/Counter Unit

#2-Channel Serial Communications Unit

#10-Output Chip-Select Unit

#I/O Port Unit

#Refresh Control Unit

#Power Management Unit

The registers associated with each integrated peri-

heral are contained within a 128 x 16 register file

called the Peripheral Control Block (PCB). The PCB

can be located in either memory or I/O space on

any 256 Byte address boundary.

Figure 3 provides a list of the registers associated

with the PCB. The Register Bit Summary at the end

of this specification individually lists all of the regis-

ters and identifies each of their programming attri-

butes.

Interrupt Control Unit

The 80C186EB can receive interrupts from a num-

ber of sources, both internal and external. The inter-

rupt control unit serves to merge these requests on

a priority basis, for individual service by the CPU.

Each interrupt source can be independently masked

by the Interrupt Control Unit (ICU) or all interrupts

can be globally masked by the CPU.

Internal interrupt sources include the Timers and Se-

rial channel 0. External interrupt sources come from

the five input pins INT4:0. The NMI interrupt pin is

not controlled by the ICU and is passed directly to

the CPU. Although the Timer and Serial channel

each have only one request input to the ICU, sepa-

rate vector types are generated to service individual

interrupts within the Timer and Serial channel units.

Timer/Counter Unit

The 80C186EB Timer/Counter Unit (TCU) provides

three 16-bit programmable timers. Two of these are

highly flexible and are connected to external pins for

control or clocking. A third timer is not connected to

any external pins and can only be clocked internally.

However, it can be used to clock the other two timer

channels. The TCU can be used to count external

events, time external events, generate non-repeti-

tive waveforms, generate timed interrupts. etc.

80C186EB/80C188EB, 80L186EB/80L188EB

PCB Function

Offset

00H Reserved

02H End Of Interrupt

04H Poll

06H Poll Status

08H Interrupt Mask

0AH Priority Mask

0CH In-Service

0EH Interrupt Request

10H Interrupt Status

12H Timer Control

14H Serial Control

16H INT4 Control

18H INT0 Control

1AH INT1 Control

1CH INT2 Control

1EH INT3 Control

20H Reserved

22H Reserved

24H Reserved

26H Reserved

28H Reserved

2AH Reserved

2CH Reserved

2EH Reserved

30H Timer0 Count

32H Timer0 Compare A

34H Timer0 Compare B

36H Timer0 Control

38H Timer1 Count

3AH Timer1 Compare A

3CH Timer1 Compare B

3EH Timer1 Control

PCB Function

Offset

40H Timer2 Count

42H Timer2 Compare

44H Reserved

46H Timer2 Control

48H Reserved

4AH Reserved

4CH Reserved

4EH Reserved

50H Port 1 Direction

52H Port 1 Pin

54H Port 1 Control

56H Port 1 Latch

58H Port 2 Direction

5AH Port 2 Pin

5CH Port 2 Control

5EH Port 2 Latch

60H Serial0 Baud

62H Serial0 Count

64H Serial0 Control

66H Serial0 Status

68H Serial0 RBUF

6AH Serial0 TBUF

6CH Reserved

6EH Reserved

70H Serial1 Baud

72H Serial1 Count

74H Serial1 Control

76H Serial1 Status

78H Serial1 RBUF

7AH Serial1 TBUF

7CH Reserved

7EH Reserved

PCB Function

Offset

80H GCS0 Start

82H GCS0 Stop

84H GCS1 Start

86H GCS1 Stop

88H GCS2 Start

8AH GCS2 Stop

8CH GCS3 Start

8EH GCS3 Stop

90H GCS4 Start

92H GCS4 Stop

94H GCS5 Start

96H GCS5 Stop

98H GCS6 Start

9AH GCS6 Stop

9CH GCS7 Start

9EH GCS7 Stop

A0H LCS Start

A2H LCS Stop

A4H UCS Start

A6H UCS Stop

A8H Relocation

AAH Reserved

ACH Reserved

AEH Reserved

B0H Refresh Base

B2H Refresh Time

B4H Refresh Control

B6H Reserved

B8H Power Control

BAH Reserved

BCH Step ID

BEH Reserved

PCB Function

Offset

C0H Reserved

C2H Reserved

C4H Reserved

C6H Reserved

C8H Reserved

CAH Reserved

CCH Reserved

CEH Reserved

D0H Reserved

D2H Reserved

D4H Reserved

D6H Reserved

D8H Reserved

DAH Reserved

DCH Reserved

DEH Reserved

E0H Reserved

E2H Reserved

E4H Reserved

E6H Reserved

E8H Reserved

EAH Reserved

ECH Reserved

EEH Reserved

F0H Reserved

F2H Reserved

F4H Reserved

F6H Reserved

F8H Reserved

FAH Reserved

FCH Reserved

FEH Reserved

Figure 3. Peripheral Control Block Registers

80C186EB/80C188EB, 80L186EB/80L188EB

Serial Communications Unit

The Serial Control Unit (SCU) of the 80C186EB con-

tains two independent channels. Each channel is

identical in operation except that only channel 0 is

supported by the integrated interrupt controller

(channel 1 has an external interrupt pin). Each

channel has its own baud rate generator that is in-

dependent of the Timer/Counter Unit, and can be

internally or externally clocked at up to one half the

80C186EB operating frequency.

Independent baud rate generators are provided for

each of the serial channels. For the asynchronous

modes, the generator supplies an 8x baud clock to

both the receive and transmit register logic. A 1x

baud clock is provided in the synchronous mode.

Chip-Select Unit

The 80C186EB Chip-Select Unit (CSU) integrates

logic which provides up to ten programmable chip-

selects to access both memories and peripherals. In

addition, each chip-select can be programmed to

automatically insert additional clocks (wait-states)

into the current bus cycle and automatically termi-

nate a bus cycle independent of the condition of the

READY input pin.

I/O Port Unit

The I/O Port Unit (IPU) on the 80C186EB supports

two 8-bit channels of input, output, or input/output

operation. Port 1 is multiplexed with the chip select

pins and is output only. Most of Port 2 is multiplexed

with the serial channel pins. Port 2 pins are limited to

either an output or input function depending on the

operation of the serial pin it is multiplexed with.

Refresh Control Unit

The Refresh Control Unit (RCU) automatically gen-

erates a periodic memory read bus cycle to keep

dynamic or pseudo-static memory refreshed. A 9-bit

counter controls the number of clocks between re-

fresh requests.

A 12-bit address generator is maintained by the RCU

and is presented on the A12:1 address lines during

the refresh bus cycle. Address bits A19:13 are pro-

grammable to allow the refresh address block to be

located on any 8 Kbyte boundary.

Power Management Unit

The 80C186EB Power Management Unit (PMU) is

provided to control the power consumption of the

device. The PMU provides three power modes: Ac-

tive, Idle, and Powerdown.

Active Mode indicates that all units on the

80C186EB are functional and the device consumes

maximum power (depending on the level of periph-

eral operation). Idle Mode freezes the clocks of the

Execution and Bus units at a logic zero state (all

peripherals continue to operate normally).

The Powerdown mode freezes all internal clocks at

a logic zero level and disables the crystal oscillator.

All internal registers hold their values provided VCC

is maintained. Current consumption is reduced to

just transistor junction leakage.

80C187 Interface (80C186EB Only)

The 80C186EB (PLCC package only) supports the

direct connection of the 80C187 Numerics Coproc-

essor.

ONCE Test Mode

To facilitate testing and inspection of devices when

fixed into a target system, the 80C186EB has a test

mode available which forces all output and input/

output pins to be placed in the high-impedance

state. ONCE stands for ‘‘ON Circuit Emulation’’. The

ONCE mode is selected by forcing the A19/ONCE

pin LOW (0) during a processor reset (this pin is

weakly held to a HIGH (1) level) while RESIN is ac-

tive.

80C186EB/80C188EB, 80L186EB/80L188EB

PACKAGE INFORMATION

This section describes the pins, pinouts, and thermal

characteristics for the 80C186EB in the Plastic

Leaded Chip Carrier (PLCC) package, Shrink Quad

Flat Pack (SQFP), and Quad Flat Pack (QFP) pack-

age. For complete package specifications and infor-

mation, see the Intel Packaging Outlines and Dimen-

sions Guide (Order Number: 231369).

Prefix Identification

With the extended temperature range, operational

characteristics are guaranteed over the temperature

range corresponding to -40°C to +85°C ambient.

Package types are identified by a two-letter prefix to

the part number. The prefixes are listed in Table 1.

Table 1. Prefix Identification

Prefix Note Package Temperature

Type Type

XX PLCC Extended

XX QFP (EIAJ) Extended

XX 2 SQFP Extended/Commercial

X 2 PLCC Commercial

X 2 QFP (EIAJ) Commercial

NOTE:

2. The 5V 25 MHz and 3V 16 MHz versions are only avail-

able in commercial temperature range corresponding to

0°C to a70°C ambient.

Pin Descriptions

Each pin or logical set of pins is described in Table

3. There are three columns for each entry in the Pin

Description Table.

The Pin Name column contains a mnemonic that

describes the pin function. Negation of the signal

name (for example, RESIN) denotes a signal that is

active low.

The Pin Type column contains two kinds of informa-

tion. The first symbol indicates whether a pin is pow-

er (P), ground (G), input only (I), output only (O) or

input/output (I/O). Some pins have multiplexed

functions (for example, A19/S6). Additional symbols

indicate additional characteristics for each pin. Table

2 lists all the possible symbols for this column.

The Input Type column indicates the type of input

(Asynchronous or Synchronous).

Asynchronous pins require that setup and hold times

be met only in order to guarantee

recognition

at a

particular clock edge. Synchronous pins require that

setup and hold times be met to guarantee proper

operation.

For example, missing the setup or hold

time for the SRDY pin (a synchronous input) will re-

sult in a system failure or lockup. Input pins may also

be edge- or level-sensitive. The possible character-

istics for input pins are S(E), S(L), A(E) and A(L).

The Output States column indicates the output

state as a function of the device operating mode.

Output states are dependent upon the current activi-

ty of the processor. There are four operational

states that are different from regular operation: bus

hold, reset, Idle Mode and Powerdown Mode. Ap-

propriate characteristics for these states are also in-

dicated in this column, with the legend for all possi-

ble characteristics in Table 2.

The Pin Description column contains a text de-

scription of each pin.

As an example, consider AD15.0. I/O signifies the

pins are bidirectional. S(L) signifies that the input

function is synchronous and level-sensitive. H(Z)

signifies that, as outputs, the pins are high-imped-

ance upon acknowledgement of bus hold. R(Z) sig-

nifies that the pins float during reset. P(X) signifies

that the pins retain their states during Powerdown

Mode.

1. To address the fact that many of the package prefix variables

have changed, all package prefix variables in this document

are now indicated with an "x".

80C186EB/80C188EB, 80L186EB/80L188EB

Table 2. Pin Description Nomenclature

Symbol Description

P Power Pin (Apply aVCC Voltage)

G Ground (Connect to VSS)

I Input Only Pin

O Output Only Pin

I/O Input/Output Pin

S(E) Synchronous, Edge Sensitive

S(L) Synchronous, Level Sensitive

A(E) Asynchronous, Edge Sensitive

A(L) Asynchronous, Level Sensitive

H(1) Output Driven to VCC during Bus Hold

H(0) Output Driven to VSS during Bus Hold

H(Z) Output Floats during Bus Hold

H(Q) Output Remains Active during Bus Hold

H(X) Output Retains Current State during Bus Hold

R(WH) Output Weakly Held at VCC during Reset

R(1) Output Driven to VCC during Reset

R(0) Output Driven to VSS during Reset

R(Z) Output Floats during Reset

R(Q) Output Remains Active during Reset

R(X) Output Retains Current State during Reset

I(1) Output Driven to VCC during Idle Mode

I(0) Output Driven to VSS during Idle Mode

I(Z) Output Floats during Idle Mode

I(Q) Output Remains Active during Idle Mode

I(X) Output Retains Current State during Idle Mode

P(1) Output Driven to VCC during Powerdown Mode

P(0) Output Driven to VSS during Powerdown Mode

P(Z) Output Floats during Powerdown Mode

P(Q) Output Remains Active during Powerdown Mode

P(X) Output Retains Current State during Powerdown Mode

80C186EB/80C188EB, 80L186EB/80L188EB

Table 3. Pin Descriptions

Pin Pin Input Output Description

Name Type Type States

VCC PÐ ÐPOWER connections consist of four pins which must be

shorted externally to a VCC board plane.

VSS GÐ ÐGROUND connections consist of six pins which must be

shorted externally to a VSS board plane.

CLKIN I A(E) Ð CLocK INput is an input for an external clock. An external

oscillator operating at two times the required processor

operating frequency can be connected to CLKIN. For crystal

operation, CLKIN (along with OSCOUT) are the crystal

connections to an internal Pierce oscillator.

OSCOUT O Ð H(Q) OSCillator OUTput is only used when using a crystal to

generate the external clock. OSCOUT (along with CLKIN)

R(Q)

are the crystal connections to an internal Pierce oscillator.

P(Q) This pin is not to be used as 2X clock output for non-crystal

applications (i.e., this pin is N.C. for non-crystal applications).

OSCOUT does not float in ONCE mode.

CLKOUT O Ð H(Q) CLocK OUTput provides a timing reference for inputs and

outputs of the processor, and is one-half the input clock

R(Q)

(CLKIN) frequency. CLKOUT has a 50% duty cycle and

P(Q) transistions every falling edge of CLKIN.

RESIN I A(L) Ð RESet IN causes the processor to immediately terminate

any bus cycle in progress and assume an initialized state. All

pins will be driven to a known state, and RESOUT will also

be driven active. The rising edge (low-to-high) transition

synchronizes CLKOUT with CLKIN before the processor

begins fetching opcodes at memory location 0FFFF0H.

RESOUT O Ð H(0) RESet OUTput that indicates the processor is currently in

the reset state. RESOUT will remain active as long as RESIN

R(1)

remains active.

P(0)

PDTMR I/O A(L) H(WH) Power-Down TiMeR pin (normally connected to an external

capacitor) that determines the amount of time the processor

R(Z)

waits after an exit from power down before resuming normal

P(1) operation. The duration of time required will depend on the

startup characteristics of the crystal oscillator.

NMI I A(E) Ð Non-Maskable Interrupt input causes a TYPE-2 interrupt to

be serviced by the CPU. NMI is latched internally.

TEST/BUSY I A(E) Ð TEST is used during the execution of the WAIT instruction to

suspend CPU operation until the pin is sampled active

(TEST)

(LOW). TEST is alternately known as BUSY when interfacing

with an 80C187 numerics coprocessor (80C186EB only).

AD15:0 I/O S(L) H(Z) These pins provide a multiplexed Address and Data bus.

During the address phase of the bus cycle, address bits 0

(AD7:0) R(Z)

through 15 (0 through 7 on the 80C188EB) are presented on

P(X) the bus and can be latched using ALE. 8- or 16-bit data

information is transferred during the data phase of the bus

cycle.

NOTE:

Pin names in parentheses apply to the 80C188EB/80L188EB.

80C186EB/80C188EB, 80L186EB/80L188EB

Table 3. Pin Descriptions (Continued)

Pin Pin Input Output Description

Name Type Type States

A18:16 I/O A(L) H(Z) These pins provide multiplexed Address during the address

phase of the bus cycle. Address bits 16 through 19 are presented

A19/ONCE R(WH)

on these pins and can be latched using ALE. These pins are

(A15:A8) P(X) driven to a logic 0 during the data phase of the bus cycle. On the

(A18:16) 80C188EB, A15– A8 provide valid address information for the

(A19/ONCE) entire bus cycle. During a processor reset (RESIN active), A19/

ONCE is used to enable ONCE mode. A18:16 must not be driven

low during reset or improper operation may result.

S2:0 O Ð H(Z) Bus cycle Status are encoded on these pins to provide bus

transaction information. S2:0 are encoded as follows:

R(Z)

P(1) S2 S1 S0 Bus Cycle Initiated

0 0 0 Interrupt Acknowledge

0 0 1 Read I/O

0 1 0 Write I/O

0 1 1 Processor HALT

1 0 0 Queue Instruction Fetch

1 0 1 Read Memory

1 1 0 Write Memory

1 1 1 Passive (no bus activity)

ALE O Ð H(0) Address Latch Enable output is used to strobe address

information into a transparent type latch during the address phase

R(0)

of the bus cycle.

P(0)

BHE O Ð H(Z) Byte High Enable output to indicate that the bus cycle in progress

is transferring data over the upper half of the data bus. BHE and

(RFSH) R(Z)

A0 have the following logical encoding

P(X)

A0 BHE Encoding (for the 80C186EB/80L186EB only)

0 0 Word Transfer

0 1 Even Byte Transfer

1 0 Odd Byte Transfer

1 1 Refresh Operation

On the 80C188EB/80L188EB, RFSH is asserted low to indicate a

refresh bus cycle.

RD O Ð H(Z) ReaD output signals that the accessed memory or I/O device

must drive data information onto the data bus.

R(Z)

P(1)

WR O Ð H(Z) WRite output signals that data available on the data bus are to be

written into the accessed memory or I/O device.

R(Z)

P(1)

READY I A(L) Ð READY input to signal the completion of a bus cycle. READY

must be active to terminate any bus cycle, unless it is ignored by

S(L)

correctly programming the Chip-Select Unit.

DEN O Ð H(Z) Data ENable output to control the enable of bi-directional

transceivers in a buffered system. DEN is active only when data is

R(Z)

to be transferred on the bus.

P(1)

NOTE:

Pin names in parentheses apply to the 80C188EB/80L188EB.

80C186EB/80C188EB, 80L186EB/80L188EB

Table 3. Pin Descriptions (Continued)

Pin Pin Input Output Description

Name Type Type States

DT/R O Ð H(Z) Data Transmit/Receive output controls the direction of a

bi-directional buffer in a buffered system. DT/R is only

R(Z)

available for the PLCC package.

P(X)

LOCK O Ð H(Z) LOCK output indicates that the bus cycle in progress is not

to be interrupted. The processor will not service other bus

R(WH)

requests (such as HOLD) while LOCK is active. This pin is

P(1) configured as a weakly held high input while RESIN is

active and must not be driven low.

HOLD I A(L) Ð HOLD request input to signal that an external bus master

wishes to gain control of the local bus. The processor will

relinquish control of the local bus between instruction

boundaries not conditioned by a LOCK prefix.

HLDA O Ð H(1) HoLD Acknowledge output to indicate that the processor

has relinquished control of the local bus. When HLDA is

R(0)

asserted, the processor will (or has) floated its data bus

P(0) and control signals allowing another bus master to drive the

signals directly.

NCS O Ð H(1) Numerics Coprocessor Select output is generated when

accessing a numerics coprocessor. NCS is not provided on

(N.C.) R(1)

the QFP or SQFP packages. This signal does not exist on

P(1) the 80C188EB/80L188EB.

ERROR I A(L) Ð ERROR input that indicates the last numerics coprocessor

operation resulted in an exception condition. An interrupt

(N.C.)

TYPE 16 is generated if ERROR is sampled active at the

beginning of a numerics operation. ERROR is not provided

on the QFP or SQFP packages. This signal does not exist

on the 80C188EB/80L188EB.

PEREQ I A(L) Ð CoProcessor REQuest signals that a data transfer

between an External Numerics Coprocessor and Memory is

(N.C.)

pending. PEREQ is not provided on the QFP or SQFP

packages. This signal does not exist on the 80C188EB/

80L188EB.

UCS O Ð H(1) Upper Chip Select will go active whenever the address of

a memory or I/O bus cycle is within the address limitations

R(1)

programmed by the user. After reset, UCS is configured to

P(1) be active for memory accesses between 0FFC00H and

0FFFFFH.

LCS O Ð H(1) Lower Chip Select will go active whenever the address of

a memory bus cycle is within the address limitations

R(1)

programmed by the user. LCS is inactive after a reset.

P(1)

P1.0/GCS0 O Ð H(X)/H(1) These pins provide a multiplexed function. If enabled, each

pin can provide a Generic Chip Select output which will go

P1.1/GCS1 R(1)

active whenever the address of a memory or I/O bus cycle

P1.2/GCS2 P(X)/P(1) is within the address limitations programmed by the user.

P1.3/GCS3 When not programmed as a Chip-Select, each pin may be

P1.4/GCS4 used as a general purpose output Port. As an output port

P1.5/GCS5 pin, the value of the pin can be read internally.

P1.6/GCS6

P1.7/GCS7

NOTE:

Pin names in parentheses apply to the 80C188EB/80L188EB.

80C186EB/80C188EB, 80L186EB/80L188EB

Table 3. Pin Descriptions (Continued)

Pin Pin Input Output Description

Name Type Type States

T0OUT O Ð H(Q) Timer OUTput pins can be programmed to provide a

single clock or continuous waveform generation,

T1OUT R(1)

depending on the timer mode selected.

P(Q)

T0IN I A(L) Ð Timer INput is used either as clock or control signals,

depending on the timer mode selected.

T1IN A(E)

INT0 I A(E,L) Ð Maskable INTerrupt input will cause a vector to a

specific Type interrupt routine. To allow interrupt

INT1

expansion, INT0 and/or INT1 can be used with

INT4 INTA0 and INTA1 to interface with an external slave

controller.

INT2/INTA0 I/O A(E,L) H(1) These pins provide a multiplexed function. As inputs,

they provide a maskable INTerrupt that will cause

INT3/INTA1 R(Z)

the CPU to vector to a specific Type interrupt routine.

P(1) As outputs, each is programmatically controlled to

provide an INTERRUPT ACKNOWLEDGE

handshake signal to allow interrupt expansion.

P2.7 I/O A(L) H(X) BI-DIRECTIONAL, open-drain Port pins.

P2.6 R(Z)

P(X)

CTSO I A(L) Ð Clear-To-Send input is used to prevent the

transmission of serial data on their respective TXD

P2.4/CTS1

signal pin. CTS1 is multiplexed with an input only port

function.

TXD0 O Ð H(X)/H(Q) Transmit Data output provides serial data

information. TXD1 is multiplexed with an output only

P2.1/TXD1 R(1)

Port function. During synchronous serial

P(X)/P(Q) communications, TXD will function as a clock output.

RXD0 I/O A(L) R(Z) Receive Data input accepts serial data information.

RXD1 is multiplexed with an input only Port function.

P2.0/RXD1 H(Q)

During synchronous serial communications, RXD is

P(X) bi-directional and will become an output for

transmission or data (TXD becomes the clock).

P2.5/BCLK0 I A(L)/A(E) Ð Baud CLocK input can be used as an alternate clock

source for each of the integrated serial channels.

P2.2/BCLK1

BCLKx is multiplexed with an input only Port function,

and cannot exceed a clock rate greater than one-half

the operating frequency of the processor.

P2.3/SINT1 O Ð H(X)/H(Q) Serial INTerrupt output will go active to indicate

serial channel 1 requires service. SINT1 is

R(0)

multiplexed with an output only Port function.

P(X)/P(X)

NOTE:

Pin names in parentheses apply to the 80C188EB/80L188EB.

80C186EB/80C188EB, 80L186EB/80L188EB

80C186EB PINOUT

Tables 4 and 5 list the 80C186EB/80C188EB pin

names with package location for the 84-pin Plastic

Leaded Chip Carrier (PLCC) component. Figure 5

depicts the complete 80C186EB/80C188EB pinout

(PLCC package) as viewed from the top side of the

component (i.e., contacts facing down).

Tables 6 and 7 list the 80C186EB/80C188EB pin

names with package location for the 80-pin Quad

Flat Pack (QFP) component. Figure 6 depicts the

complete 80C186EB/80C188EB (QFP package) as

viewed from the top side of the component (i.e., con-

tacts facing down).

Tables 8 and 9 list the 80186EB/80188EB pin

names with package location for the 80-pin Shrink

Quad Flat Pack (SQFP) component. Figure 7 depicts

the complete 80C186EB/80C188EB (SQFP pack-

age) as viewed from the top side of the component

(i.e., contacts facing down).

Table 4. PLCC Pin Names with Package Location

Address/Data Bus

Name Location

AD0 61

AD1 66

AD2 68

AD3 70

AD4 72

AD5 74

AD6 76

AD7 78

AD8 (A8) 62

AD9 (A9) 67

AD10 (A10) 69

AD11 (A11) 71

AD12 (A12) 73

AD13 (A13) 75

AD14 (A14) 77

AD15 (A15) 79

A16 80

A17 81

A18 82

A19/ONCE 83

Bus Control

Name Location

ALE 6

BHE (RFSH)7

S0 10

S1 9

S2 8

RD 4

WR 5

READY 18

DEN 11

DT/R 16

LOCK 15

HOLD 13

HLDA 12

Power

Name Location

VSS 2, 22, 43

63, 65, 84

VCC 1, 23

42, 64

Processor Control

Name Location

RESIN 37

RESOUT 38

CLKIN 41

OSCOUT 40

CLKOUT 44

TEST/BUSY 14

NCS (N.C.) 60

PEREQ (N.C.) 39

ERROR (N.C.) 3

PDTMR 36

NMI 17

INT0 31

INT1 32

INT2/INTA0 33

INT3/INTA1 34

INT4 35

I/O

Name Location

UCS 30

LCS 29

P1.0/GCS0 28

P1.1/GCS1 27

P1.2/GCS2 26

P1.3/GCS3 25

P1.4/GCS4 24

P1.5/GCS5 21

P1.6/GCS6 20

P1.7/GCS7 19

T0OUT 45

T0IN 46

T1OUT 47

T1IN 48

RXD0 53

TXD0 52

P2.5/BCLK0 54

CTS0 51

P2.0/RXD1 57

P2.1/TXD1 58

P2.2/BCLK1 59

P2.3/SINT1 55

P2.4/CTS1 56

P2.6 50

P2.7 49

NOTE:

Pin names in parentheses apply to the 80C188EB/80L188EB.

80C186EB/80C188EB, 80L186EB/80L188EB

Table 5. PLCC Package Locations with Pin Name

Location Name

3 ERROR (N.C.)

4RD

5WR

6 ALE

7 BHE (RFSH)

8S2

9S1

10 S0

11 DEN

12 HLDA

13 HOLD

14 TEST/BUSY

15 LOCK

16 DT/R

17 NMI

18 READY

19 P1.7/GCS7

20 P1.6/GCS6

21 P1.5/GCS5

Location Name

22 VSS

23 VCC

24 P1.4/GCS4

25 P1.3/GCS3

26 P1.2/GCS2

27 P1.1/GCS1

28 P1.0/GCS0

29 LCS

30 UCS

31 INT0

32 INT1

33 INT2/INTA0

34 INT3/INTA1

35 INT4

36 PDTMR

37 RESIN

38 RESOUT

39 PEREQ (N.C.)

40 OSCOUT

41 CLKIN

42 VCC

Location Name

43 VSS

44 CLKOUT

45 T0OUT

46 T0IN

47 T1OUT

48 T1IN

49 P2.7

50 P2.6

51 CTS0

52 TXD0

53 RXD0

54 P2.5/BCLK0

55 P2.3/SINT1

56 P2.4/CTS1

57 P2.0/RXD1

58 P2.1/TXD1

59 P2.2/BCLK1

60 NCS (N.C.)

61 AD0

62 AD8 (A8)

63 VSS

Location Name

64 VCC

65 VSS

66 AD1

67 AD9 (A9)

68 AD2

69 AD10 (A10)

70 AD3

71 AD11 (A11)

72 AD4

73 AD12 (A12)

74 AD5

75 AD13 (A13)

76 AD6

77 AD14 (A14)

78 AD7

79 AD15 (A15)

80 A16

81 A17

82 A18

83 A19/ONCE

84 VSS

NOTE:

Pin names in parentheses apply to the 80C188EB/80L188EB.

80C186EB/80C188EB, 80L186EB/80L188EB

272433–5

NOTE:

This is the FPO number location (indicated by X’s).

Pin names in parentheses apply to the 80C188EB/80L188EB.

Figure 4. 84-Pin Plastic Leaded Chip Carrier Pinout Diagram

80C186EB/80C188EB, 80L186EB/80L188EB

Table 6. QFP Pin Name with Package Location

Address/Data Bus

Name Location

AD0 10

AD1 15

AD2 17

AD3 19

AD4 21

AD5 23

AD6 25

AD7 27

AD8 (A8) 11

AD9 (A9) 16

AD10 (A10) 18

AD11 (A11) 20

AD12 (A12) 22

AD13 (A13) 24

AD14 (A14) 26

AD15 (A15) 28

A16 29

A17 30

A18 31

A19/ONCE 32

Bus Control

Name Location

ALE 38

BHE (RFSH)39

S0 42

S1 41

S2 40

RD 36

WR 37

READY 49

DEN 43

LOCK 47

HOLD 45

HLDA 44

Power

Name Location

VSS 12, 14, 33

35, 53, 73

VCC 13, 34

54, 72

Processor Control

Name Location

RESIN 68

RESOUT 69

CLKIN 71

OSCOUT 70

CLKOUT 74

TEST 46

PDTMR 67

NMI 48

INT0 62

INT1 63

INT2/INTA0 64

INT3/INTA1 65

INT4 66

I/O

Name Location

UCS 61

LCS 60

P1.0/GCS0 59

P1.1/GCS1 58

P1.2/GCS2 57

P1.3/GCS3 56

P1.4/GCS4 55

P1.5/GCS5 52

P1.6/GCS6 51

P1.7/GCS7 50

T0OUT 75

T0IN 76

T1OUT 77

T1IN 78

RXD0 3

TXD0 2

P2.5/BCLK0 4

CTS0 1

P2.0/RXD1 7

P2.1/TXD1 8

P2.2/BCLK1 9

P2.3/SINT1 5

P2.4/CTS1 6

P2.6 80

P2.7 79

NOTE:

Pin names in parentheses apply to the 80C188EB/80L188EB.

80C186EB/80C188EB, 80L186EB/80L188EB

Table 7. QFP Package Location with Pin Names

Location Name

1 CTS0

2 TXD0

3 RXD0

4 P2.5/BCLK0

5 P2.3/SINT1

6 P2.4/CTS1

7 P2.0/RXD1

8 P2.1/TXD1

9 P2.2/BCLK1

10 AD0

11 AD8 (A8)

12 VSS

13 VCC

14 VSS

15 AD1

16 AD9 (A9)

17 AD2

18 AD10 (A10)

19 AD3

20 AD11 (A11)

Location Name

21 AD4

22 AD12 (A12)

23 AD5

24 AD13 (A13)

25 AD6

26 AD14 (A14)

27 AD7

28 AD15 (A15)

29 A16

30 A17

31 A18

32 A19/ONCE

33 VSS

34 VCC

35 VSS

36 RD

37 WR

38 ALE

39 BHE (RFSH)

40 S2

Location Name

41 S1

42 S0

43 DEN

44 HLDA

45 HOLD

46 TEST

47 LOCK

48 NMI

49 READY

50 P1.7/GCS7

51 P1.6/GCS6

52 P1.5/GCS5

53 VSS

54 VCC

55 P1.4/GCS4

56 P1.3/GCS3

57 P1.2/GCS2

58 P1.1/GCS1

59 P1.0/GCS0

60 LCS

Location Name

61 UCS

62 INT0

63 INT1

64 INT2/INTA0

65 INT3/INTA1

66 INT4

67 PDTMR

68 RESIN

69 RESOUT

70 OSCOUT

71 CLKIN

72 VCC

73 VSS

74 CLKOUT

75 T0OUT

76 T0IN

77 T1OUT

78 T1IN

79 P2.7

80 P2.6

NOTE:

Pin names in parentheses apply to the 80C188EB/80L188EB.

80C186EB/80C188EB, 80L186EB/80L188EB

272433–6

NOTE:

This is the FPO number location (indicated by X’s).

Pin names in parentheses apply to the 80C188EB/80L188EB.

Figure 5. Quad Flat Pack Pinout Diagram

80C186EB/80C188EB, 80L186EB/80L188EB

Table 8. SQFP Pin Functions with Location

AD Bus

AD0 47

AD1 52

AD2 54

AD3 56

AD4 58

AD5 60

AD6 62

AD7 64

AD8 (A8) 48

AD9 (A9) 53

AD10 (A10) 55

AD11 (A11) 57

AD12 (A12) 59

AD13 (A13) 61

AD14 (A14) 63

AD15 (A15) 65

A16 66

A17 67

A18 68

A19/ONCE 69

Bus Control

ALE 75

BHEÝ(RFSHÝ)76

S0Ý79

S1Ý78

S2Ý77

RDÝ73

WRÝ74

READY 6

DENÝ80

LOCKÝ4

HOLD 2

HLDA 1

Processor Control

RESINÝ25

RESOUT 26

CLKIN 28

OSCOUT 27

CLKOUT 31

TESTÝ/BUSY 3

NMI 5

INT0 19

INT1 20

INT2/INTA0Ý21

INT3/INTA1Ý22

INT4 23

PDTMR 24

Power and Ground

VCC 11

VCC 29

VCC 50

VCC 71

VSS 10

VSS 30

VSS 49

VSS 51

VSS 70

VSS 72

I/O

UCSÝ18

LCSÝ17

P1.0/GCS0Ý16

P1.1/GCS1Ý15

P1.2/GCS2Ý14

P1.3/GCS3Ý13

P1.4/GCS4Ý12

P1.5/GCS5Ý9

P1.6/GCS6Ý8

P1.7/GCS7Ý7

P2.0/RXD1 44

P2.1/TXD1 45

P2.2/BCLK1 46

P2.3/SINT1 42

P2.4/CTS1Ý43

P2.5/BCLK0 41

P2.6 37

P2.7 36

CTS0Ý38

TXD0 39

RXD0 40

T0IN 33

T1IN 35

T0OUT 32

T1OUT 34

Table 9. SQFP Pin Locations with Pin Names

1 HLDA

2 HOLD

3 TESTÝ

4 LOCKÝ

5 NMI

6 READY

7 P1.7/GCS7Ý

8 P1.6/GCS6Ý

9 P1.5/GCS5Ý

10 VSS

11 VCC

12 P1.4/GCS4Ý

13 P1.3/GCS3Ý

14 P1.2/GCS2Ý

15 P1.1/GCS1Ý

16 P1.0/GCS0Ý

17 LCSÝ

18 UCSÝ

19 INT0

20 INT1

21 INT1/INTA0Ý

22 INT3/INTA1Ý

23 INT4

24 PDTMR

25 RESINÝ

26 RESOUT

27 OSCOUT

28 CLKIN

29 VCC

30 VSS

31 CLKOUT

32 T0OUT

33 T0IN

34 T1OUT

35 T1IN

36 P2.7

37 P2.6

38 CTS0Ý

39 TXD0

40 RXD0

41 P2.5/BCLK0

42 P2.3/SINT1

43 P2.4/CTS1Ý

44 P2.0/RXD1

45 P2.1/TXD1

46 P2.2/BCLK1

47 AD0

48 AD8 (A8)

49 VSS

50 VCC

51 VSS

52 AD1

53 AD9 (A9)

54 AD2

55 AD10 (A10)

56 AD3

57 AD11 (A11)

58 AD4

59 AD12 (A12)

60 AD5

61 AD13 (A13)

62 AD6

63 AD14 (A14)

64 AD7

65 AD15 (A15)

66 A16

67 A17

68 A18

69 A19/ONCE

70 VSS

71 VCC

72 VSS

73 RDÝ

74 WRÝ

75 ALE

76 BHEÝ(RFSHÝ)

77 S2Ý

78 S1Ý

79 S0Ý

80 DENÝ

NOTE:

Pin names in parentheses apply to the 80C188EB/80L188EB.

80C186EB/80C188EB, 80L186EB/80L188EB

272433–7

NOTE:

XXXXXXXXC indicates Intel FPO number.

Pin names in parentheses apply to the 80C188EB/80L188EB.

Figure 6. SQFP Package

80C186EB/80C188EB, 80L186EB/80L188EB

PACKAGE THERMAL

SPECIFICATIONS

The 80C186EB/80L186EB is specified for operation

when TC(the case temperature) is within the range

of b40§Ctoa

100§C (PLCC package) or b40§Cto

114§C (QFP package). TCmay be measured in

any environment to determine whether the proces-

sor is within the specified operating range. The case

temperature must be measured at the center of the

top surface.

TA(the ambient temperature) can be calculated

from iCA (thermal resistance from the case to ambi-

ent) with the following equation:

TAeTCbP*iCA

Typical values for iCA at various airflows are given

in Table 10. P (the maximum power consumption,

specified in watts) is calculated by using the maxi-

mum ICC as tabulated in the DC specifications and

VCC of 5.5V.

Table 10. Thermal Resistance (iCA) at Various Airflows (in §C/Watt)

Airflow Linear ft/min (m/sec)

0 200 400 600 800 1000

(0) (1.01) (2.03) (3.04) (4.06) (5.07)

iCA (PLCC) 30 24 21 19 17 16.5

iCA (QFP) 58 47 43 40 38 36

iCA (SQFP) 70 TBD TBD TBD TBD TBD

80C186EB/80C188EB, 80L186EB/80L188EB

ELECTRICAL SPECIFICATIONS

Absolute Maximum Ratings

Storage Temperature ÀÀÀÀÀÀÀÀÀÀb65§Ctoa

150§C

Case Temp under Bias ÀÀÀÀÀÀÀÀÀb65§Ctoa

120§C

Supply Voltage

with Respect to VSSÀÀÀÀÀÀÀÀÀÀÀb0.5V to a6.5V

Voltage on other Pins

with Respect to VSS ÀÀÀÀÀÀb0.5V to VCC a0.5V

NOTICE: This data sheet contains preliminary infor-

mation on new products in production. It is valid for

the devices indicated in the revision history. The

specifications are subject to change without notice.

WARNING: Stressing the device beyond the ‘‘Absolute

Maximum Ratings’’ may cause permanent damage.

These are stress ratings only. Operation beyond the

‘‘Operating Conditions’’ is not recommended and ex-

tended exposure beyond the ‘‘Operating Conditions’’

may affect device reliability.

Recommended Connections

Power and ground connections must be made to

multiple VCC and VSS pins. Every 80C186EB-based

circuit board should include separate power (VCC)

and ground (VSS) planes. Every VCC pin must be

connected to the power plane, and every VSS pin

must be connected to the ground plane. Pins identi-

fied as ‘‘NC’’ must not be connected in the system.

Liberal decoupling capacitance should be placed

near the processor. The processor can cause tran-

sient power surges when its output buffers tran-

sition, particularly when connected to large capaci-

tive loads.

Low inductance capacitors and interconnects are

recommended for best high frequency electrical per-

formance. Inductance is reduced by placing the de-

coupling capacitors as close as possible to the proc-

essor VCC and VSS package pins.

Always connect any unused input to an appropriate

signal level. In particular, unused interrupt inputs

(INT0:4) should be connected to VCC through a pull-

up resistor (in the range of 50 KX). Leave any un-

used output pin or any NC pin unconnected.

80C186EB/80C188EB, 80L186EB/80L188EB

DC SPECIFICATIONS (80C186EB/80C188EB)

Symbol Parameter Min Max Units Notes

VCC Supply Voltage 4.5 5.5 V

VIL Input Low Voltage b0.5 0.3 VCC V

VIH Input High Voltage 0.7 VCC VCC a0.5 V

VOL Output Low Voltage 0.45 V IOL e3 mA (Min)

VOH Output High Voltage VCC b0.5 V IOH eb

2 mA (MIn)

VHYR Input Hysterisis on RESIN 0.50 V

ILI1 Input Leakage Current for Pins: g15 mA0V

IN sVCC

AD15:0 (AD7:0), READY, HOLD,

RESIN, CLKIN, TEST, NMI, INT4:0,

T0IN, T1IN, RXD0, BCLK0, CTS0,

RXD1, BCLK1, CTS1, P2.6, P2.7

ILI2 Input Leakage Current for Pins: g0.275 g7mA0V

IN kVCC

ERROR, PEREQ

ILI3 Input Leakage Current for Pins: b0.275 b5.0 mA VIN e0.7 VCC (Note 1)

A19/ONCE, A18:16, LOCK

ILO Output Leakage Current g15 mA 0.45 sVOUT sVCC

(Note 2)

ICC Supply Current Cold (RESET)

80C186EB25 115 mA (Notes 3, 7)

80C186EB20 108 mA (Note 3)

80C186EB13 73 mA (Note 3)

IID Supply Current Idle

80C186EB25 91 mA (Notes 4, 7)

80C186EB20 76 mA (Note 4)

80C186EB13 48 mA (Note 4)

IPD Supply Current Powerdown

80C186EB25 100 mA (Notes 5, 7)

80C186EB20 100 mA (Note 5)

80C186EB13 100 mA (Note 5)

CIN Input Pin Capacitance 0 15 pF TFe1 MHz

COUT Output Pin Capacitance 0 15 pF TFe1 MHz (Note 6)

NOTES:

1. These pins have an internal pull-up device that is active while RESIN is low and ONCE Mode is not active. Sourcing more

current than specified (on any of these pins) may invoke a factory test mode.

2. Tested by outputs being floated by invoking ONCE Mode or by asserting HOLD.

3. Measured with the device in RESET and at worst case frequency, VCC, and temperature with ALL outputs loaded as

specified in AC Test Conditions, and all floating outputs driven to VCC or GND.

4. Measured with the device in HALT (IDLE Mode active) and at worst case frequency, VCC, and temperature with ALL

outputs loaded as specified in AC Test Conditions, and all floating outputs driven to VCC or GND.

5. Measured with the device in HALT (Powerdown Mode active) and at worst case frequency, VCC, and temperature with

ALL outputs loaded as specified in AC Test Conditions, and all floating outputs driven to VCC or GND.

6. Output Capacitance is the capacitive load of a floating output pin.

7. Operating temperature for 25 MHz is 0§Cto70

C, VCC e5.0 g10%.

80C186EB/80C188EB, 80L186EB/80L188EB

DC SPECIFICATIONS (80L186EB16) (operating temperature, 0§Cto70

Symbol Parameter Min Max Units Notes

VCC Supply Voltage 3.0 5.5 V

VIL Input Low Voltage b0.5 0.3 VCC V

VIH Input High Voltage 0.7 VCC VCC a0.5 V

VOL Output Low Voltage 0.45 V IOL e1.6 mA (Min) (Note 1)

VOH Output High Voltage VCC b0.5 V IOH eb

1 mA (Min) (Note 1)

VHYR Input Hysterisis on RESIN 0.50 V

ILI1 Input Leakage Current for pins: g15 mA0V

IN sVCC

AD15:0 (AD7:0), READY, HOLD,

RESIN, CLKIN, TEST, NMI,

INT4:0, T0IN, T1IN, RXD0,

BCLK0, CTS0, RXD1, BCLK1,

CTS1, SINT1, P2.6, P2.7

ILI2 Input Leakage Current for Pins: b0.275 b2mAV

IN e0.7 VCC (Note 2)

A19/ONCE, A18:16, LOCK

ILO Output Leakage Current g15 mA 0.45 sVOUT sVCC (Note 3)

ICC3 Supply Current (RESET, 3.3V)

80L186EB16 54 mA (Note 4)

IID3 Supply Current Idle (3.3V)

80L186EB16 38 mA (Note 5)

IPD3 Supply Current Powerdown (3.3V)

80L186EB16 40 mA (Note 6)

CIN Input Pin Capacitance 0 15 pF TFe1 MHz

COUT Output Pin Capacitance 0 15 pF TFe1 MHz (Note 7)

NOTES:

1. IOL and IOH measured at VCC e3.0V.

2. These pins have an internal pull-up device that is active while RESIN is low and ONCE Mode is not active. Sourcing more

current than specified (on any of these pins) may invoke a factory test mode.

3. Tested by outputs being floated by invoking ONCE Mode or by asserting HOLD.

4. Measured with the device in RESET and at worst case frequency, VCC, and temperature with ALL outputs loaded as

specified in AC Test Conditions, and all floating outputs driven to VCC or GND.

5. Measured with the device in HALT (IDLE Mode active) and at worst case frequency, VCC, and temperature with ALL

outputs loaded as specified in AC Test Conditions, and all floating outputs driven to VCC or GND.

6. Measured with the device in HALT (Powerdown Mode active) and at worst case frequency, VCC, and temperature with

ALL outputs loaded as specified in AC Test Conditions, and all floating outputs driven to VCC or GND.

7. Output Capacitance is the capacitive load of a floating output pin.

80C186EB/80C188EB, 80L186EB/80L188EB

DCSPECIFICATIONS(80L186EB13/80L188EB13

Symbol Parameter Min Max Units Notes

VCC Supply Voltage 2.7 5.5 V

VIL Input Low Voltage b0.5 0.3 VCC V

VIH Input High Voltage 0.7 VCC VCC a0.5 V

VOL Output Low Voltage 0.45 V IOL e1.6 mA (Min) (Note 1)

VOH Output High Voltage VCC b0.5 V IOH eb

1 mA (Min) (Note 1)

VHYR Input Hysterisis on RESIN 0.50 V

ILI1 Input Leakage Current for pins: g15 mA0V

IN sVCC

AD15:0 (AD7:0), READY, HOLD,

RESIN, CLKIN, TEST, NMI,

INT4:0, T0IN, T1IN, RXD0,

BCLK0, CTS0, RXD1, BCLK1,

CTS1, SINT1, P2.6, P2.7

ILI2 Input Leakage Current for Pins: b0.275 b2mAV

IN e0.7 VCC (Note 2)

A19/ONCE, A18:16, LOCK

ILO Output Leakage Current g15 mA 0.45 sVOUT sVCC (Note 3)

ICC5 Supply Current (RESET, 5.5V)

80L186EB13 73 mA (Note 4)

80L186EB8 45 mA (Note 4)

ICC3 Supply Current (RESET, 2.7V)

80L186EB13 36 mA (Note 4)

80L186EB8 22 mA (Note 4)

IID5 Supply Current Idle (5.5V)

80L186EB13 48 mA (Note 5)

80L186EB8 31 mA (Note 5)

IID3 Supply Current Idle (2.7V)

80L186EB13 24 mA (Note 5)

80L186EB8 15 mA (Note 5)

IPD5 Supply Current Powerdown (5.5V)

80L186EB13 100 mA (Note 6)

80L186EB8 100 mA (Note 6)

IPD3 Supply Current Powerdown (2.7V)

80L186EB13 30 mA (Note 6)

80L186EB8 30 mA (Note 6)

CIN Input Pin Capacitance 0 15 pF TFe1 MHz

COUT Output Pin Capacitance 0 15 pF TFe1 MHz (Note 7)

NOTES:

1. IOL and IOH measured at VCC e2.7V.