60 05/02
Applications
Temperature measurement and
compensation in
hybrid circuits
data systems
telecom systems
automotive electronics
Features
Silver palladium termination (AgPd)
Cost-effective
Suitable for wave and reflow soldering
Options
Alternative resistance ratings and resistance tolerance
< 5% available on request
Delivery mode
Blister tape, 180-mm reel, PU: 4000 or 2000 pcs, depending on chip thickness
+: J for RN/RN = ± 5 %
Kfor
RN/RN = ± 10 %
Mfor
RN/RN = ± 20 %
Climatic category (IEC 60068-1)
Max. power at 25 °C (on PCB) P25
Resistance tolerance RN/RN
Rated temperature TN
B value tolerance B/B
Dissipation factor (on PCB) δth1)
Thermal cooling time constant (on PCB) τc1)
Heat capacity Cth1)
55/125/21
300
± 5 %, ± 10 %, ± 20 %
25
± 3 %
approx. 5
approx. 10
approx. 50
mW
°C
mW/K
s
mJ/K
R25
No. of R/T
characteristic
B25/50
K
B25/85
K
B25/100
K
Ordering code
2,2 k 1308 3010 3040 3060 B57621C0222+062
3,3 k 1309 3430 3500 3520 B57621C0332+062
4,7 k 1309 3430 3500 3520 B57621C0472+062
10 k 1010 3470 3510 3530 B57621C0103+062
15 k 1008 3480 3550 3560 B57621C0153+062
22 k 1008 3480 3550 3560 B57621C0223+062
33 k 2003 3930 3960 3980 B57621C0333+062
47 k 2001 3860 3890 3920 B57621C0473+062
68 k 2001 3860 3890 3920 B57621C0683+062
Dimensions in mm/Approx. weight 18 mg
Termination
0,5±0,25
1,6±0,2
3,2±0,2
TNT0398-F
1,3 max.
1) Depends on mounting situation
B57621Temperature Measurement
C621
SMD NTC Thermistors with Silver Palladium Termination, Size 1206
61 05/02
+: J for RN/RN = ± 5 %
Kfor
RN/RN = ± 10 %
Mfor
RN/RN = ± 20 %
R25
No. of R/T
characteristic
B25/50
K
B25/85
K
B25/100
K
Ordering code
100 k 4901 3870 3930 3950 B57621C0104+062
150 k 2903 4120 4190 4200 B57621C0154+162
220 k 2903 4120 4190 4200 B57621C0224+062
330 k 1014 4090 4210 4250 B57621C0334+062
470 k 1014 4090 4210 4250 B57621C0474+062
Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test Standard Test conditions R25/R25
(typical)
Remarks
Storage in
dry heat
IEC
60068-2-2
JIS C 0021
Storage at upper
category temperature
T: (125 ± 2) °C
t: 1000 h
< 3 %
Storage in damp
heat, steady state
IEC
60068-2-3
JIS C 0022
Temperature of air: (40 ± 2) °C
Relative humidity of air:
(93 +2/3) %
Duration: 21 days
< 3 % No visible
damage
Rapid temperature
cycling
IEC
60068-2-14
JIS C 0025
Lower test temperature: 55 °C
Upper test temperature: 125 °C
Number of cycles: 10
< 3 %
Endurance Pmax: 300 mW
T: (65 ± 2) °C
t: 1000 h
< 5 %
Solderability IEC
60068-2-58
JIS C 0054
Solderability:
(215 ± 3) °C / (3 ± 0,3) s
(235 ± 5) °C / (2 ± 0,2) s
Resistance to soldering heat:
(260 ± 5) °C / (10 ± 1) s
95 % of
terminations
wetted
Resistance drift
after soldering
Reflow soldering profile
Wave soldering profile
< 5 %
B57621Temperature Measurement
C621
SMD NTC Thermistors with Silver Palladium Termination, Size 1206
Herausgegeben von EPCOS AG
Unternehmenskommunikation, Postfach 80 17 09, 81617 München, DEUTSCHLAND
(
++49 89 636 09, FAX (0 89) 636-2 26 89
EPCOS AG 2002. Vervielfältigung, Veröffentlichung, Verbreitung und Verwertung dieser Broschüre und ihres Inhalts ohne aus-
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Corporate Communications, P.O. Box 80 17 09, 81617 Munich, GERMANY
(
++49 89 636 09, FAX (0 89) 636-2 26 89
EPCOS AG 2002. Reproduction, publication and dissemination of this brochure and the information contained therein without
EPCOS’ prior express consent is prohibited.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics
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