© 2020 Kingbright. All Rights Reserved. Spec No: DSAF1574 / 1102012927 Rev No: V.12B Date: 04/17/2020
Page 1 / 4
DESCRIPTION
The Green source color devices are made with
Gallium Phosphide Green Light Emitting Diode
FEATURES
Quad-level design, save board space
Different color combination available
Black case enhances contrast ratio
Housing UL rating: 94V-0
Housing material: Type 66 nylon
RoHS compliant
APPLICATIONS
Status indicator
Illuminator
Signage applications
Decorative and entertainment lighting
Commercial and residential architectural lighting
PACKAGE DIMENSIONS
SELECTION GUIDE
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
3. Luminous intensity value is traceable to CIE127-2007 standards.
Part Number
Emitting Color
(Material)
Lens Type
Iv (mcd) @ 10mA
[2]
Viewing Angle
[1]
Min. Typ. 2θ1/2
WP934SB/4GD
■
Green (GaP) Green Diffused 10 50°
25
WP934SB/4GD
T-1 (3mm) Quad-Level Circuit Board Indicator
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the leads emerge from the package.
4. The specifications, characteristics and technical data described in the datasheet are subject to change
without prior notice.
© 2020 Kingbright. All Rights Reserved. Spec No: DSAF1574 / 1102012927 Rev No: V.12B Date: 04/17/2020
Page 2 / 4
ABSOLUTE MAXIMUM RATINGS at T
A
=25°C
ELECTRICAL / OPTICAL CHARACTERISTICS at T
A
=25°C
WP934SB/4GD
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
Parameter Symbol Emitting Color
Value
Unit
Typ. Max.
Wavelength at Peak Emission I
F
= 10mA λ
peak
Green 565 - nm
Dominant Wavelength I
F
= 10mA λ
dom
[1]
Green 568 - nm
Spectral Bandwidth at 50% Φ
REL MAX
I
F
= 10mA ∆λ
Green 30 - nm
Capacitance C Green 15 - pF
Forward Voltage I
F
= 10mA V
F
[2]
Green 2.0 2.4 V
Reverse Current (V
R
= 5V) I
R
Green - 10 µA
Temperature Coefficient of λ
peak
I
F
= 10mA, -10°C ≤ T ≤ 85°C TC
λpeak
Green 0.1 - nm/°C
Temperature Coefficient of λ
dom
I
F
= 10mA, -10°C ≤ T ≤ 85°C TC
λdom
Green 0.06 - nm/°C
Temperature Coefficient of V
F
I
F
= 10mA, -10°C ≤ T ≤ 85°C TC
V
Green -2 - mV/°C
Parameter
Symbol
Value
Unit
Power Dissipation P
D
62.5 mW
Reverse Voltage V
R
5 V
Junction Temperature
T
j
110 °C
Operating Temperature T
op
-40 To +85 °C
Storage Temperature T
stg
-40 To +85 °C
DC Forward Current I
F
25 mA
Peak Forward Current I
FM
[1]
140 mA
Electrostatic Discharge Threshold (HBM)
-
8000 V
Lead Solder Temperature
[3]
260°C For 3 Seconds
Lead Solder Temperature
[4]
260°C For 5 Seconds
Thermal Resistance (Junction / Ambient) R
th
JA
[2]
680 °C/W
Thermal Resistance (Junction / Solder point) R
th
JS
[2]
460 °C/W
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. R
t h
JA
,R
t h
JS
Results from mounting on PC board FR4 (pad size ≥ 16 mm
2
per pad).
3. 2mm below package base.
4. 5mm below package base.
5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
© 2020 Kingbright. All Rights Reserved. Spec No: DSAF1574 / 1102012927 Rev No: V.12B Date: 04/17/2020
Page 3 / 4
TECHNICAL DATA
0.5 0.50.0
-90°
-75°
-60°
-45°
-30°
-15°
75°
60°
45°
30°
0° 15°
90°
1.0 1.0
T
a
= 25 °C
SPATIAL DISTRIBUTION
WP934SB/4GD
RECOMMENDED WAVE SOLDERING PROFILE
Notes:
1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple
attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath
temperature of 260°C
2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max).
3. Do not apply stress to the epoxy resin while the temperature is above 85°C.
4. Fixtures should not incur stress on the component when mounting and during soldering process.
5. SAC 305 solder alloy is recommended.
6. No more than one wave soldering pass.
PACKING & LABEL SPECIFICATIONS
0
4
8
12
16
20
1.5 1.7 1.9 2.1 2.3 2.5
T
a
= 25 °C
Forward voltage (V)
Forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
0 4 8 12 16 20
T
a
= 25 °C
Forward current (mA)
Luminous intensity normalised at
10 mA
0
10
20
30
40
50
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
Permissible forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
Luminous intensity normalised
at Ta = 25 °C
0%
20%
40%
60%
80%
100%
350 400 450 500 550 600 650 700 750 800
T
a
= 25 °C
Green
Wavelength (nm)
Relative Intensity (a. u.)
RELATIVE INTENSITY vs. WAVELENGTH
GREEN
Forward Current vs.
Forward Voltage
Luminous Intensity vs.
Forward Current
Forward Current Derating Curve
Luminous Intensity vs.
Ambient Temperature
© 2020 Kingbright. All Rights Reserved. Spec No: DSAF1574 / 1102012927 Rev No: V.12B Date: 04/17/2020
Page 4 / 4
WP934SB/4GD
PRECAUTIONS
Storage Conditions
1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient
temperature.
2. LEDs should be stored with temperature ≤ 30°C and relative humidity < 60%.
3. Product in the original sealed package is recommended to be assembled within 72 hours of opening.
Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.
"
○
"
Correct mounting method " x " Incorrect mounting method
LED Mounting Method
1. The lead pitch of the LED must match the
pitch of the mounting holes on the PCB
during component placement.
Lead-forming may be required to insure
the lead pitch matches the hole pitch.
Refer to the figure below for proper lead
forming procedures.
Note 1-3: Do not route PCB trace in the contact area between the
leadframe and the PCB to prevent short-circuits.
Lead Forming Procedures
1. During soldering, component covers and holders should leave
clearance to avoid placing damaging stress on the LED during
soldering.
2. The tip of the soldering iron should never touch the lens epoxy.
3. Through-hole LEDs are incompatible with reflow soldering.
4. If the LED will undergo multiple soldering passes or face other
processes where the part may be subjected to intense heat,
please check with Kingbright for compatibility.
PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes
