FEATURES
DDIGITAL OUTPUT: SPI-Compatible Interface
DRESOLUTION: 10-Bit, 0.25°C
DACCURACY:
±2.0°C (max) from −25°C to +85°C
±2.5°C (max) from −40°C to +125°C
DLOW QUIESCENT CURRENT: 50µA (max)
DWIDE SUPPLY RANGE: 2.7V to 5.5V
DTINY SOT23-6 PACKAGE
DOPERATION FROM −40°C to +125°C
APPLICATIONS
DBASE STATION EQUIPMENT
DCOMPUTER PERIPHERAL THERMAL
PROTECTION
DNOTEBOOK COMPUTERS
DDATA ACQUISITION SYSTEMS
DTELECOM EQUIPMENT
DOFFICE MACHINES
TMP125 RELATED PRODUCTS
FEATURES PRODUCT
2°C Digital Temp Sensors with Two-Wire Interface TMP100/101
1.5°C Digital Temp Sensors with Two-Wire Interface TMP75/175
1.5°C Digital Temp Sensors with SPI TMP121/123
1.5°C Programmable Digital Temp Sensors with SPI TMP122/124
DESCRIPTION
The TMP125 is an SPI-compatible temperature sensor
available in the tiny SOT23-6 package. Requiring no
external components, the TMP125 is capable of
measuring temperatures within 2°C of accuracy over a
temperature range of −25°C to +85°C and 2.5°C of
accuracy over −40°C to +125°C. Low supply current, and
a supply range from 2.7V to 5.5V, make the TMP125 an
excellent candidate for low-power applications.
The TMP125 is ideal for extended thermal measurement
in a variety of communication, computer, consumer,
environmental, industrial, and instrumentation
applications.
Diode
Temp.
Sensor
∆Σ
A/D
Converter
OSC
Control
Logic
Serial
Interface
Config.
and Temp.
Register
TMP125
Temperature
SI
GND 1
2
3
6
5
4
V+
SO
CS
SCK
TMP125
SBOS323A − DECEMBER 2004 − REVISED JUNE 2005
2°C Accurate Digital Temperature Sensor
with SPI Interface
! !
www.ti.com
Copyright 2004−2005, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty , and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI is a registered trademark of Motorola. All other trademarks are the property of their respective owners.
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SBOS323A − DECEMBER 2004 − REVISED JUNE 2005
www.ti.com
2
ABSOLUTE MAXIMUM RATINGS(1)
Supply V oltage +7V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Voltage(2) −0.3V to +7V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Current ±10mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Short Circuit(3) Continuous. . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Temperature Range −55°C to +125°C. . . . . . . . . . . . . . .
Storage Temperature Range −60 °C to +150°C. . . . . . . . . . . . . . . . .
Junction Temperature (TJ max) +150°C. . . . . . . . . . . . . . . . . . . . . .
Lead Temperature (soldering) +300°C. . . . . . . . . . . . . . . . . . . . . . . .
ESD Rating (Human Body Model) 4000V. . . . . . . . . . . . . . . . . . . .
(Charged Device Model) 1000V. . . . . . . . . . . . . . . . .
(1) Stresses above these ratings may cause permanent damage.
Exposure t o absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only , a nd
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.5V beyond the supply
rails should be current limited to 10mA or less.
(3) Short-circuit to ground.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
PRODUCT PACKAGE-LEAD PACKAGE DESIGNAT OR PACKAGE MARKING
TMP125
SOT23-6
DBV
T125
TMP125
SOT23-6
DBV
T125
TMP125
SOT23-6
DBV
T125
TMP125
SOT23-6
DBV
T125
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
PIN CONFIGURATION
Top View
GND
SI
V+
NOTE: Pin 1 is determined by orienting
the package marking as shown.
SOT23−6
SO
CS
SCK
1
2
3
6
5
4
T125
TMP125
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SBOS323A − DECEMBER 2004 − REVISED JUNE 2005
www.ti.com
3
ELECTRICAL CHARACTERISTICS
At TA = −40°C to +125°C and VS = +2.7V to 5.5V, unless otherwise noted.
TMP125
PARAMETER CONDITIONS MIN TYP MAX UNIT
TEMPERATURE INPUT
Range −40 +125 °C
Accuracy (temperature error) −25°C to +85°C±0.5 ±2.0 °C
−40°C to +125°C±1.0 ±2.5 °C
Resolution 10 Bits
Temperature Measurement Noise 0.1 LSB
DIGITAL INPUT/OUTPUT
Input Logic Levels:
VIH 0.7(V+) V
VIL 0.3(V+) V
Input Current, SI, SCK, CS IIN 0V = VIN = V+ ±1µA
Output Logic Levels:
VOL SO ISINK = 3mA 0.4 V
VOH SO ISOURCE = 2mA (V+)−0.4 V
Input Capacitance, SI, SCK, CS 2.5 pF
Conversion Time 10-Bit 60 ms
Update Rate 120 ms
POWER SUPPLY
Operating Range 2.7 5.5 V
Quiescent Current, at TA = 25°C IQSerial Bus Inactive 36 50 µA
over Temperature −40°C to +125°C 60 µA
Shutdown Current 0.1 1 µA
over Temperature 1 µA
TEMPERATURE RANGE
Specified Range −40 +125 °C
Operating Range −55 +125 °C
Storage Range −60 +150 °C
Thermal Resistance qJA SOT23-6 Surface-Mount 200 °C/W
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SBOS323A − DECEMBER 2004 − REVISED JUNE 2005
www.ti.com
4
TYPICAL CHARACTERISTICS
At TA = −40°C to +125°C and VS = +2.7V to 5.5V, unless otherwise noted.
45
40
35
30
25
20
QUIESCENT CURRENT vs TEMPERATURE
Temperature (_C)
−55 −35 −155 25456585105125
IQ(µA)
VS=5.5V
Active Conversion
Serial Bus Inactive
80
75
70
65
60
55
50
45
40
CONVERSION TIME vs TEMPERATURE
Temperature (_C)
Conversion Time (ms)
VS=5.5V
5 Typical Units Shown
−55 −35 −15 5 25 45 65 85 105 125
2.0
1.5
1.0
0.5
0.0
−0.5
−1.0
−1.5
−2.0
TEMPERATURE ACCURACY vs TEMPERATURE
Temperature (_C)
−55 −35 −155 25456585105125
Temperature Error (_C)
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SBOS323A − DECEMBER 2004 − REVISED JUNE 2005
www.ti.com
5
APPLICATIONS
The TMP125 10-bit, read-only digital temperature sensor
is optimal for thermal management and thermal protection
applications. The TMP125 is specified for a temperature
range of − 40°C to +125°C, with operation extending down
to −55°C. It is specified for a supply voltage range of 2.7V
to 5.5V, and also features a hardware shutdown to provide
power savings. Quiescent current is reduced to 1µA during
analog shutdown.
The TMP125 communicates through a serial interface that
is SPI-compatible. Temperature is converted to a 10-bit
data word with 0.25°C resolution. The TMP125 is optimal
for low-power applications, with a 120ms conversion
period for reduced power consumption.
The sensing device of the TMP125 is the chip itself.
Thermal paths run through the package leads as well as
the plastic package, and the lower thermal resistance of
metal causes the leads to provide the primary thermal
path.
The TMP125 requires no external components for
operation, though a 0.1µF supply bypass capacitor is
recommended. Figure 1 shows typical connection for the
TMP125.
TMP125
0.1µF
V+
1
5
2
3
CS
SI
4
6
SCK
SO
Figure 1. Typical Connections for the TMP125
COMMUNICATING WITH THE TMP125
The TMP125 continuously converts temperatures to
digital data. Temperature data is read by pulling CS low.
Once CS is pulled low, temperature data from the last
completed conversion prior to dropping CS is latched into
the shift register and clocked out at SO on the falling SCK
edge. The 16-bit data word is clocked out sign bit first,
followed by the MSB. The SI pin is used to put the device
into shutdown mode. To enter shutdown mode, S I must be
high on the rising edge of the third bit of SCK (see
Figure 3). Also, all 16 bits must be clocked to allow
shutdown on the TMP125. To bring the device out of
shutdown, perform a 16-clock communication with SI set
to logic low. The 16-clock communication is the same as
the Data Read shown in Figure 3, except that the data o n
SO will be the last conversion prior to putting the device
into shutdown mode. Note that SO is only used to control
the shutdown function; if not using this function, connect
this pin to ground.
The one-shot command can be used to force a single
conversion. When the command is issued, the part will
perform a single conversion and then go into shutdown
mode. After the conversion is complete, the conversion
result should be read with the power-down bit high (see
Figure 3) if you do not want to start a new conversion.
The TMP125 will go into idle mode for 60ms, requiring only
20µA of current. A new conversion begins every 120ms.
Figure 2 describes the conversion timing for the TMP125.
TEMPERATURE REGISTER
The Temperature Register of the TMP125 is a 16-bit,
read-only register that stores the output of the most recent
conversion. However, temperature is represented by only
10-bits, which are in signed two’ s complement format. The
first bit of the Temperature Register, D15, is a leading zero.
Bits D14 and D5 are used to indicate temperature. Bits D4
to D0 are the same as D5 (see Table 1). Data format for
temperature is summarized in Table 2. When calculating
the signed two’s complement temperature value, be sure
to use only the 10 data bits.
Following power-up or reset, the Temperature Register will
read 0°C until the first conversion is complete.
D15 D14 D13 D12 D11 D10 D9 D8
0 T9 T8 T7 T6 T5 T4 T3
D7 D6 D5 D4 D3 D2 D1 D0
T2 T1 T0 T0 T0 T0 T0 T0
Table 1. Temperature Register
TEMPERATURE
(°C) DIGITAL OUTPUT
D14…D5
+127 01 11 11 1100
+125 01 11 11 0100
+100 01 1001 0000
+75 01 0010 1100
+50 00 1100 1000
+25 00 0110 0100
+10 00 0010 1000
+0.25 00 0000 0001
000 0000 0000
−0.25 11 1111 1111
−25 11 1001 1 100
−50 11 001 1 1000
−55 11 0010 0100
Table 2. Temperature Data Format
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SBOS323A − DECEMBER 2004 − REVISED JUNE 2005
www.ti.com
6
60ms
120ms
50µA(active)
20µA(idle)
Figure 2. Conversion Time and Period
Timing Diagrams
The TMP125 is SPI-compatible. Figure 3 and Figure 4
describe the output data of the TMP125. Figure 5,
Figure 6, and Figure 7 describe the various timing
requirements, with parameters defined in Table 3.
PARAMETER MIN MAX UNITS
SCK Period t1100 ns
Data In to Rising Edge SCK Setup Time t220 ns
SCK Falling Edge to Output Data Delay t330 ns
SCK Rising Edge to Input Data Hold Time t420 ns
CS to Rising Edge SCK Set-Up Time t540 ns
CS to Output Data Delay t630 ns
CS Rising Edge to Output High Impedance t730 ns
Table 3. Timing Description
SO
SCK
CS
T0T0T0T0T0T0T1T2T3T4T5T6T7T8T9
Leading
Zero
SI Don’t
Care Don’t
Care Power
Down
To enter shutdown mode, SI must be high on the rising edge of the third bit of SCK (see the Communicating with the TMP125 section).
Figure 3. Data READ
SO
SCK
CS
T0T0T0T0T0T0T1T2T3T4T5T6T7T8T9
Leading
Zero
SI Don’t
Care Don’t
Care Power
Down One−
Shot
Figure 4. One-Shot Command
"#$%
SBOS323A − DECEMBER 2004 − REVISED JUNE 2005
www.ti.com
7
SCK
CS
SO
t4
t2
t4
t2
SCK
CS
SO
Figure 5. Input Data Timing Diagram
SCK
CS
SO
t1
t5t3
t6
Figure 6. Output Data Timing Diagram
SCK
CS
SI
t7t7
SCK
CS
SI
Figure 7. High Impedance Output Timing Diagram
PACKAGE OPTION ADDENDUM
www.ti.com 18-Apr-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TMP125AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP125AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP125AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP125AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TMP125AIDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3
TMP125AIDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Mar-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TMP125AIDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0
TMP125AIDBVT SOT-23 DBV 6 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Mar-2012
Pack Materials-Page 2
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