Semiconductor Components Industries, LLC, 2001
May, 2001 – Rev. 5 1Publication Order Number:
MC74AC138/D
MC74AC138, MC74ACT138
1-of-8
Decoder/Demultiplexer
The MC74AC138/74ACT138 is a high–speed 1–of–8
decoder/demultiplexer . This device is ideally suited for high–speed
bipolar memory chip select address decoding.
The multiple input enables allow parallel expansion to a 1–of–24
decoder using just three MC74AC138/74ACT138 devices or a
1–of–32 decoder using four MC74AC138/74ACT138 devices and
one inverter.
•Demultiplexing Capability
•Multiple Input Enable for Easy Expansion
•Active LOW Mutually Exclusive Outputs
•Outputs Source/Sink 24 mA
•′ACT138 Has TTL Compatible Inputs
VCC
GNDA0A1A2E1E2E3
1516 14 13 12 11 10
21 34567
9
8
O7
O0O1O2O3O4O5O6
Figure 1. Pinout: 16–Lead Packages Conductors
(Top V iew)
Figure 2. Logic Symbol
A0A1A2E1E2E3
O1O2O3O4O5O6O7
O0
PIN ASSIGNMENT
PIN FUNCTION
A0–A2Address Inputs
E1–E2Enable Inputs
E3Enable Input
O0–O7Outputs
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DIP–16
N SUFFIX
CASE 648
1
16
SO–16
D SUFFIX
CASE 751B
1
16
Device Package Shipping
ORDERING INFORMATION
MC74AC138N PDIP–16 25 Units/Rail
MC74AC138D SOIC–16 48 Units/Rail
MC74AC138DR2 2500 Tape & Reel
TSSOP–16
DT SUFFIX
CASE 948F
MC74AC138DT TSSOP–16 96 Units/Rail
MC74AC138DTR2 TSSOP–16
SOIC–16
2500 Tape & Reel
MC74ACT138N PDIP–16 25 Units/Rail
MC74ACT138D SOIC–16 48 Units/Rail
MC74ACT138DR2 2500 Tape & Reel
MC74ACT138DT TSSOP–16 96 Units/Rail
MC74ACT138DTR2 TSSOP–16
SOIC–16
2500 Tape & Reel
1
16
See general marking information in the device marking
section on page 6 of this data sheet.
DEVICE MARKING INFORMATION
1
16
EIAJ–16
M SUFFIX
CASE 966
MC74AC138M EIAJ–16
MC74AC138MEL EIAJ–16 2000 Tape & Reel
MC74ACT138M EIAJ–16
MC74ACT138MEL EIAJ–16 2000 Tape & Reel
50 Units/Rail
50 Units/Rail
MC74AC138, MC74ACT138
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2
FUNCTIONAL DESCRIPTION
The MC74AC138/74ACT138 high–speed 1–of–8
decoder/demultiplexer accepts three binary weighted
inputs (A0, A1, A2) and, when enabled, provides eight
mutually exclusive active–LOW outputs (O0–O7). The
MC74AC138/74ACT138 features three Enable inputs, two
active–LOW (E1, E2) and one active–HIGH (E3). All
outputs will be HIGH unless E1 and E2 are LOW and E3 is
HIGH. This multiple enabled function allows easy parallel
expansion of the device to a 1–of–32 (5 lines to 32 lines)
decoder with just four MC74AC138/74ACT138 devices
and one inverter (See Figure 4). The
MC74AC138/74ACT138 can be used as an 8–output
demultiplexer by using one of the active LOW Enable
inputs as the data input and the other Enable inputs as
strobes. The Enable inputs which are not used must be
permanently tied to their appropriate active–HIGH or
active–LOW state.
TRUTH TABLE
Inputs Outputs
E1E2E3A0A1A2O0O1O2O3O4O5O6O7
H X X X X X H H H H H H H H
X H X X X X H H H H H H H H
X X L X X X H H H H H H H H
L L H L L L L H H H H H H H
L L H H L L H L H H H H H H
L L H L H L H H L H H H H H
L L H H H L H H H L H H H H
L L H L L H H H H H L H H H
L L H H L H H H H H H L H H
L L H L H H H H H H H H L H
L L H H H H H H H H H H H L
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
A2A1A0E3
E1E2
0706050403020100
NOTE: This diagram is provided only for the understanding of logic
operations and should not be used to estimate propagation delays.
Figure 3. Logic Diagram
MC74AC138, MC74ACT138
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3
H
123 123 123 123
A0
A2
A3
A4
A0A1A2E
0001020304050607
A0A1A2E
0001020304050607
A0A1A2E
0001020304050607
A0A1A2E
0001020304050607
00031
′04
Figure 4. Expansion to 1–of–32 Decoding
A1
MAXIMUM RATINGS*
Symbol Parameter Value Unit
VCC DC Supply Voltage (Referenced to GND) –0.5 to +7.0 V
VIN DC Input Voltage (Referenced to GND) –0.5 to VCC +0.5 V
VOUT DC Output Voltage (Referenced to GND) –0.5 to VCC +0.5 V
IIN DC Input Current, per Pin ±20 mA
IOUT DC Output Sink/Source Current, per Pin ±50 mA
ICC DC VCC or GND Current per Output Pin ±50 mA
Tstg Storage Temperature –65 to +150 °C
*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recom-
mended Operating Conditions.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
VCC
Supply Voltage
′AC 2.0 5.0 6.0
V
VCC Supply Voltage ′ACT 4.5 5.0 5.5 V
VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND) 0 – VCC V
VCC @ 3.0 V – 150 –
tr, tfInput Rise and Fall Time (Note 1)
′
AC Devices exce
p
t Schmitt In
p
uts
VCC @ 4.5 V – 40 – ns/V
r,f
′AC
Devices
except
Schmitt
Inputs
VCC @ 5.5 V – 25 –
tt
f
Input Rise and Fall Time (Note 2) VCC @ 4.5 V – 10 –
ns/V
tr, tf
In ut
Rise
and
Fall
Time
(Note
2)
′ACT Devices except Schmitt Inputs VCC @ 5.5 V – 8.0 – ns/V
TJJunction Temperature (PDIP) – – 140 °C
TAOperating Ambient Temperature Range –40 25 85 °C
IOH Output Current – High – – –24 mA
IOL Output Current – Low – – 24 mA
1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that dif fer from the typical input rise and fall times.
2. VIN from 0.8 V to 2.0 V ; see individual Data Sheets for devices that differ from the typical input rise and fall times.
MC74AC138, MC74ACT138
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4
DC CHARACTERISTICS
74AC 74AC
Symbol Parameter VCC
(V) TA = +25°CTA =
–40°C to
+85°CUnit Conditions
Typ Guaranteed Limits
VIH Minimum High Level 3.0 1.5 2.1 2.1 VOUT = 0.1 V
g
Input Voltage 4.5 2.25 3.15 3.15 V or VCC – 0.1 V
5.5 2.75 3.85 3.85
VIL Maximum Low Level 3.0 1.5 0.9 0.9 VOUT = 0.1 V
Input Voltage 4.5 2.25 1.35 1.35 V or VCC – 0.1 V
5.5 2.75 1.65 1.65
VOH Minimum High Level 3.0 2.99 2.9 2.9 IOUT = –50 µA
g
Output Voltage 4.5 4.49 4.4 4.4 V
5.5 5.49 5.4 5.4
*VIN = VIL or VIH
3.0 – 2.56 2.46
V
–12 mA
4.5 – 3.86 3.76
V
IOH –24 mA
5.5 – 4.86 4.76 –24 mA
VOL Maximum Low Level 3.0 0.002 0.1 0.1 IOUT = 50 µA
Output Voltage 4.5 0.001 0.1 0.1 V
5.5 0.001 0.1 0.1
*VIN = VIL or VIH
3.0 – 0.36 0.44
V
12 mA
4.5 – 0.36 0.44
V
IOL 24 mA
5.5 – 0.36 0.44 24 mA
IIN Maximum Input
55
–
±01
±10
µA
VI=V
CC GND
Leakage Current 5.5 – ±
0
.
1
±
1
.
0
µ
A
V
I =
V
CC,
GND
IOLD †Minimum Dynamic
Ot tC t
5.5 – – 75 mA VOLD = 1.65 V Max
IOHD Output Current 5.5 – – –75 mA VOHD = 3.85 V Min
ICC Maximum Quiescent
55
–
80
80
µA
VIN =V
CC or GND
Q
Supply Current 5.5 –
8
.
0
80
µ
A
V
IN =
V
CC or
GND
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
MC74AC138, MC74ACT138
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5
AC CHARACTERISTICS (For Figures and W aveforms – See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
74AC 74AC
Symbol Parameter VCC*
(V) TA = +25°C
CL = 50 pF
TA = –40°C
to +85°C
CL = 50 pF Unit Fig.
No.
Min Typ Max Min Max
tPLH
Propagation Delay 3.3 1.5 8.5 13.0 1.5 15.0
ns
3
–
6
tPLH
gy
An to On5.0 1.5 6.5 9.5 1.5 10.5 ns
3
–
6
tPHL
Propagation Delay 3.3 1.5 8.0 12.5 1.5 14.0
ns
3
–
6
tPHL
gy
An to On5.0 1.5 6.0 9.0 1.5 10.5 ns
3
–
6
tPLH
Propagation Delay 3.3 1.5 11.0 15.0 1.5 16.0
ns
3
–
6
tPLH
gy
E1 or E2 to On5.0 1.5 8.0 11.0 1.5 12.0 ns
3
–
6
tPHL
Propagation Delay 3.3 1.5 9.5 13.5 1.5 15.0
ns
3
–
6
tPHL
gy
E1 or E2 to On5.0 1.5 7.0 9.5 1.5 10.5 ns
3
–
6
tPLH
Propagation Delay 3.3 1.5 11.0 15.5 1.5 16.5
ns
3
–
6
tPLH
gy
E3 to On5.0 1.5 8.0 11.0 1.5 12.5 ns
3
–
6
tPHL
Propagation Delay 3.3 1.5 8.5 13.0 1.5 14.0
ns
3
–
6
tPHL
gy
E3 to On5.0 1.5 6.0 8.0 1.0 9.5 ns
3
–
6
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
DC CHARACTERISTICS
74ACT 74ACT
Symbol Parameter VCC
(V) TA = +25°CTA =
–40°C to
+85°CUnit Conditions
Typ Guaranteed Limits
VIH Minimum High Level 4.5 1.5 2.0 2.0
V
VOUT = 0.1 V
g
Input Voltage 5.5 1.5 2.0 2.0
V
or VCC – 0.1 V
VIL Maximum Low Level 4.5 1.5 0.8 0.8
V
VOUT = 0.1 V
Input Voltage 5.5 1.5 0.8 0.8
V
or VCC – 0.1 V
VOH Minimum High Level 4.5 4.49 4.4 4.4
V
IOUT = –50 µA
g
Output Voltage 5.5 5.49 5.4 5.4
V
*VIN = VIL or VIH
4.5 – 3.86 3.76 V
–24 mA
5.5 – 4.86 4.76
OH –24 mA
VOL Maximum Low Level 4.5 0.001 0.1 0.1
V
IOUT = 50 µA
Output Voltage 5.5 0.001 0.1 0.1
V
*VIN = VIL or VIH
4.5 – 0.36 0.44 V
24 mA
5.5 – 0.36 0.44
OL 24 mA
IIN Maximum Input
55
–
±01
±10
µA
VI=V
CC GND
Leakage Current 5.5 – ±
0
.
1
±
1
.
0
µ
A
V
I =
V
CC,
GND
∆ICCT Additional Max. ICC/Input 5.5 0.6 – 1.5 mA VI = VCC – 2.1 V
IOLD †Minimum Dynamic
Ot tC t
5.5 – – 75 mA VOLD = 1.65 V Max
IOHD Output Current 5.5 – – –75 mA VOHD = 3.85 V Min
ICC Maximum Quiescent
55
–
80
80
µA
VIN =V
CC or GND
Q
Supply Current 5.5 –
8
.
0
80
µ
A
V
IN =
V
CC or
GND
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
MC74AC138, MC74ACT138
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6
AC CHARACTERISTICS (For Figures and W aveforms – See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
74ACT 74ACT
Symbol Parameter VCC*
(V) TA = +25°C
CL = 50 pF
TA = –40°C
to +85°C
CL = 50 pF Unit Fig.
No.
Min Typ Max Min Max
tPLH
Propagation Delay
50
15
70
10 5
15
11 5
ns
3
–
6
tPLH
Pro agation
Delay
An to On5.
0
1
.5 7.
0
10
.5
1
.5
11
.5 ns
3
–
6
tPHL
Propagation Delay
50
15
65
10 5
15
11 5
ns
3
–
6
tPHL
Pro agation
Delay
An to On5.
0
1
.5
6
.5
10
.5
1
.5
11
.5 ns
3
–
6
tPLH
Propagation Delay
50
25
80
11 5
20
12 5
ns
3
–
6
tPLH
Pro agation
Delay
E1 or E2 to On5.
0
2
.5
8
.
0
11
.5
2
.
0
12
.5 ns
3
–
6
tPHL
Propagation Delay
50
20
75
11 5
20
12 5
ns
3
–
6
tPHL
Pro agation
Delay
E1 or E2 to On5.
0
2
.
0
7.5
11
.5
2
.
0
12
.5 ns
3
–
6
tPLH
Propagation Delay
50
25
80
12 0
20
13 0
ns
3
–
6
tPLH
Pro agation
Delay
E3 to On5.
0
2
.5
8
.
0
12
.
0
2
.
0
13
.
0
ns
3
–
6
tPHL
Propagation Delay
50
20
65
10 5
15
11 5
ns
3
–
6
tPHL
Pro agation
Delay
E3 to On5.
0
2
.
0
6
.5
10
.5
1
.5
11
.5 ns
3
–
6
*Voltage Range 5.0 V is 5.0 V ± 0.5 V
CAPACITANCE
Symbol Parameter Value
Typ Unit T est Conditions
CIN Input Capacitance 4.5 pF VCC = 5.0 V
CPD Power Dissipation Capacitance 60 pF VCC = 5.0 V
MARKING DIAGRAMS
A = Assembly Location
WL, L = W afer Lot
YY, Y = Year
WW, W = W ork Week
AC138
AWLYWW
MC74AC138N
AWLYYWW AC
138
ALYW
ACT138
AWLYWW ACT
138
ALYW
MC74ACT138N
AWLYYWW
DIP–16 SO–16 TSSOP–16 EIAJ–16
74AC138
ALYW
74ACT138
ALYW
MC74AC138, MC74ACT138
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7
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
FC
S
HGD
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
PDIP–16
N SUFFIX
16 PIN PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
RX 45
G
8 PLP
–B–
–A–
M
0.25 (0.010) B S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.80 10.00 0.386 0.393
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.229 0.244
R0.25 0.50 0.010 0.019

SO–16
D SUFFIX
16 PIN PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
MC74AC138, MC74ACT138
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8
PACKAGE DIMENSIONS
TSSOP–16
DT SUFFIX
16 PIN PLASTIC TSSOP PACKAGE
CASE948F–01
ISSUE O
ÇÇÇ
ÇÇÇ
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C--- 1.20 --- 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.18 0.28 0.007 0.011
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.

SECTION N–N
SEATING
PLANE
IDENT.
PIN 1
18
16 9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
–U–
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V S
T
0.10 (0.004)
–T–
–V–
–W–
0.25 (0.010)
16X REFK
N
N
EIAJ–16
M SUFFIX
16 PIN PLASTIC EIAJ PACKAGE
CASE966–01
ISSUE O
HE
A1
DIM MIN MAX MIN MAX
INCHES
--- 2.05 --- 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
--- 0.78 --- 0.031
A1
HE
Q1
LE
10 0
10
LEQ1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL
CONDITION. DAMBAR CANNOT BE LOCATED ON
THE LOWER RADIUS OR THE FOOT. MINIMUM
SPACE BETWEEN PROTRUSIONS AND
ADJACENT LEAD TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005) 0.10 (0.004)
1
16 9
8
D
Z
E
A
b
c
D
E
e
L
M
Z
MC74AC138, MC74ACT138
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9
Notes
MC74AC138, MC74ACT138
http://onsemi.com
10
Notes
MC74AC138, MC74ACT138
http://onsemi.com
11
Notes
MC74AC138, MC74ACT138
http://onsemi.com
12
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