GP2D15 - Sharp Microelectronics

1 Data Sheet

GP2D15

Optoelectronic Device

FEATURES

• Digital output

• Effective Range: 10 to 80 cm

• LED pulse cycle duration: 32 ms

• Factory set trigger point: 24°

• Typical response time: 39 ms

• Typical start up delay: 46 ms

• Average current consumption: 33 mA

• Detection area diameter @ 80 cm: 6 cm

DESCRIPTION

The GP2D15 is a distance measuring sensor with

integrated signal processing and digital output.

Figure 1. Pinout

VCC

GND

SIGNAL NAMEPIN

GP2D15-7

Figure 2. Block Diagram

GP2D15-4

SIGNAL

PROCESSING

CIRCUIT

PSD

LED

GND VCC

LED

DRIVE CIRCUIT

VOLTAGE

REGULATOR

OUTPUT

CIRCUIT

VCC

12 kΩ

OSCILLATOR

CIRCUIT

DISTANCE MEASURING IC

GP2D15

2 Data Sheet

ELECTRICAL SPECIFICATIONS

Absolute Maximum Ratings

Ta = 25°C, VCC = 5 VDC

Operating Supply Voltage

Electro-optical Characteristics

Ta = 25°C, VCC = 5 VDC

NOTES:

1. Measurements made with Kodak R-27 Gray Card, using the white side, (90% reflectivity).

2. L = Distance to reflective object.

3. Factory set to detect at L = 24 cm ±3 cm.

4. Distance measuring range of the sensor optics.

5. Output switching has hysteresis. The distance specified by VO is for LOW to HIGH switching.

PARAMETER SYMBOL RATING UNIT REMARKS

Supply Voltage VCC -0.3 to +7 V

Output Terminal Voltage VO-0.3 to (VCC +0.3) VOpen collector output

Operating Temperature Topr -10 to +60 °C

Storage Temperature Tstg -40 to +70 °C

PARAMETER SYMBOL RATING UNIT

Operating Supply Voltage VCC 4.5 to 5.5 V

PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT NOTES

Measuring Distance Range ΔL 10 — 80 cm 1, 3

Output Terminal Voltage

VOH Output voltage at high level VCC -0.3 — — V1

VOL Output voltage at low level — — 0.6 V1

Output Distance

Characteristics VO21 24 27 cm 1, 2, 4

Average Supply Current ICC —3350mA

GP2D15

3 Data Sheet

REALIABILITY

The reliability of requirements of this device are

listed in Table 1.

NOTES:

1. Test conditions are according to Electro-optical Characteristics, shown on page 2.

2. At completion of the test, allow device to remain at nominal room temperature and humidity (non-condensing) for two hours.

3. Confidence level: 90%, Lot Tolerance Percent Defect (LTPD): 20% /40%.

MANUFACTURER’S INSPECTION

Inspection Lot

Inspection shall be carried out per each delivery lot.

Inspection Method

A single sampling plan, normal inspection level II

based on ISO 2859 shall be adopted.

NOTE: *Any one of these that affects the Electro-optical Characteristics shall be considered a defect.

Table 1. Reliability

TEST ITEMS TEST CONDITIONS

FAILURE

JUDGEMENT

CRITERIA

SAMPLES (n),

DEFECTIVE (C)

Temperature Cycling One cycle -40°C (30 min.) to +70°C in 30 min-

utes, repeated 25 times

Initial × 0.8 > VO

VO > Initial × 1.2

n = 11, C = 0

High Temperature and

High Humidity Storage +40°C, 90% RH, 500h n = 11, C = 0

High Temperature Storage +70°C, 500h n = 11, C = 0

Low Temperature Storage -40°C, 500h n = 11, C = 0

Operation Life

(High Temperature) +60°C, VCC = 5 V, 500h n = 11, C = 0

Mechanical Shock 100 m /s2, 6.0 ms

3 times/ ±X, ±Y, ±Z direction n = 6, C = 0

Variable Frequency Vibration

10-to-55-to-10 Hz in 1 minute

Amplitude: 1.5 mm

2h in each X, Y, Z direction

n = 6, C = 0

Table 2. Quality Level

DEFECT INSPECTION ITEM/TEST METHOD AQL (%)

Major Defect Electro-optical characteristics defect 0.4

Minor Defect Defect on appearance and dimension (crack, split, chip, scratch, stain)* 1.0

GP2D15

4 Data Sheet

Figure 3. GP2D15 Example of Output Distance Characteristics

HIGH

LOW

SET-UP DETECTION DISTANCE

L = 24 ±3 cm

DISTANCE TO REFLECTIVE OBJECT L (cm)

0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80

OUTPUT [V]

HYSTERESIS WIDTH

(NON DETECTION)

(DETECTION) H → L

L → H

GP2D15-6

GP2D15

5 Data Sheet

PACKAGE SPECIFICATIONS

φ3.2 HOLE

STAMP

R3.75

LIGHT

DETECTOR

SIDE

R3.75

PCB

CONNECTOR

LIGHT

EMITTER

SIDE

STAMP EXAMPLE

GP2D15 5 3

Month (1 to 9, X, Y, Z)

Year (2005:5)

Model Name

10.1

3.75

7.2

8.4

13.0

37.0

2.0

6.3 LENS

CASE

29.5

20 ±0.1 (Note 1)

4.5 (Note 1)

14.75

7.5 16.34.15

13.5

2-1.5

1.2

3.3

GP2D15 83

18.9+0.3

-0.3

Connector: J.S.T. Trading Company, LTD

S3B-PH

NOTES:

1. Dimensions shall reference lens center.

2. Unspecified tolerance shall be ±0.3 mm.

3. Scale: 2/1, dimensions are in mm. GP2D15-3

VCC

GND

SIGNAL NAMEPIN

CONNECTOR SIGNAL

GP2D15

6 Data Sheet

PACKING SPECIFICATION

TRAY

PACKING METHOD

1. Each tray holds 50 pieces. Packing methods are shown in (A).

2. Each box holds 10 trays. Pads are added to top and bottom, and between layers, as in (B).

top and bottom. Put pads between each tray (9 pads total) see above drawing (B).

3. The box is sealed with craft tape. (C) shows the location of the Model number, Quantity, and Inspection date.

4. Package weight: Approximately 4 kg.

MODEL NUMBER

PACKING TAPE

PRODUCT TRAYS

(10-TRAY/CASE)

PRODUCT

PAD (CORRUGATED

CARDBOARD)

(9 SHEETS/CASE

BETWEEN TRAYS)

PAD (CORRUGATED CARDBOARD)

(2 SHEETS/CASE: TOP AND BOTTOM)

PACKING

CASE

QUANTITY

DATE

(A)

(B)

(C)

PART NAME

Packing case Corrugated cardboard

Pad Corrugated cardboard

Tray Polystyrene

MATERIAL

GP2D15-8

GP2D15

7 Data Sheet

NOTES

• Keep the sensor lens clean. Dust, water, oil, and

other contaminants can deteriorate the characteris-

tics of this device. Applications should be designed

to eliminate sources of lens contamination.

• When using a protective cover over the emitter

and detector, ensure the cover efficiently transmits

light throughout the wavelength range of the LED

(λ = 850 nm ± 70 nm). Both sides of the protective

cover should be highly polished. Use of a protective

cover may decrease the effective distance over

which the sensor operates. Ensure that any cover

does not negatively affect the operation over the

intended application range.

• Objects in proximity to the sensor may cause reflec-

tions that can affect the operation of the sensor.

• Sources of high ambient light (the sun or strong arti-

ficial light) may affect measurement. For best

results, the application should be designed to pre-

vent interference from direct sunlight or artificial light.

• Using the sensor with a mirror can induce measure-

ment errors. Often, changing the incident angle on

the mirror can correct this problem.

• If a prominent boundary line exists in the surface

being measured, it should be aligned vertically to

avoid measurement error. See Figure 4 for further

details.

• When measuring the distance to objects in motion,

align the sensor so that the motion is in the horizontal

direction instead of vertical. Figure 5 illustrates the

preferred alignment.

• A 10 µF (or larger) bypass capacitor between VCC

and GND near the sensor is recommended.

• To clean the sensor, use a dry cloth. Use of any liq-

uid to clean the device may result in decreased sen-

sitivity or complete failure.

• Excessive mechanical stress can damage the

internal sensor or lens.

Figure 4. Proper Alignment to Surface Being Measured

Figure 5. Proper Alignment to Moving Surfaces

GP2D15-1

(AVOID IF POSSIBLE) (PREFERRED)

GP2D15-2

(AVOID IF POSSIBLE) (PREFERRED)

DIRECTION

OF MOVEMENT

DIRECTION

OF MOVEMENT

GP2D15

NOTICE

The circuit application examples in this publication are provided to explain representative applications of SHARP

devices and are not intended to guarantee any circuit design or license any intellectual property right. SHARP takes

no responsibility for any problems related to any intellectual property right of a third party resulting from the use of

SHARP devices.

SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structures and

other contents described herein at any time without notice in order to improve design or reliability.

Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Manu-

facturing locations are also subject to change without notice.

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that

occur in equipment using any SHARP devices shown in catalogs, data books, etc.

The devices listed in this publication are designed for standard applications for use in general electronic equip-

ment. SHARP’s devices shall not be used for or in connection with equipment that requires an extremely high level

of reliability, such as military and aerospace applications, telecommunication equipment (trunk lines), nuclear power

control equipment and medical or other life support equipment (e.g. Scuba). SHARP takes no responsibility for dam-

age caused by improper use of device, which does not meet the conditions for use specified in the relevant specifi-

cation sheet.

If the SHARP devices listed in the publication fall within the scope of strategic products described in the Foreign

Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices.

right laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or

mechanical for any purpose, in whole or in part, without the express written permission of SHARP. Express written

permission is also required before any use of this publication may be made by a third party.

Contact and consult with a SHARP representative if there are any questions about the contents of this publication.

SHARP CORPORATION

SALES & MARKETING GROUP

ELECTRONIC COMPONENTS & DEVICES

22-22 NAGAIKE-CHO, ABENO-KU, OSAKA 545-8522, JAPAN

PHONE: (81) 6-6621-1221

FAX: (81) 6117-725300, 6117-725301, 6117-725302

http://sharp-world.com/products/device Specifications are subject to change without notice.

SHARP MICROELECTRONICS

OF THE AMERICAS

North American Head Office

5700 North West Pacific Rim Boulevard

Camas,Washington 98607 USA

PHONE: (1)360-834-2500

FAX: (1)360-834-8903

http://www.sharpsma.com

Western Area

1980 Zanker Road, San Jose, CA 95112

PHONE: (1)408-436-4900

FAX: (1)408-436-0924

5901 Bolsa Ave.

Huntington Beach, CA 92647-2053

PHONE: (1)714-903-4600

FAX: (1)714-903-0295

6390 Greenwich Drive, S uite 175

San Diego, CA 92122

PHONE: (1)858-597-0982

FAX: (1)858-597-8701

Central Area

85 W. Algonquin Road, Suite 280

Arlington Heights, IL 60005

PHONE: (1)847-258-2750

FAX: (1)847-439-2479

6303 Commerce Drive, Suite 175 Irving, TX 75063

PHONE: (1)972-582-1710

FAX: (1)972-580-7537

8911 Capitol of Texas Hwy. Suite 3130

Austin, TX 78759

PHONE: (1)512-349-7262

FAX: (1)512-349-7002

20333 State Hwy. 249, Suite 200 Houston, TX 77070

PHONE: (1)281-378-1520

FAX: (1)281-378-1521

W129 S 9647 Tony Lema Lane Muskego, WI 53150

PHONE: (1)414-529-9568

FAX: (1)414-529-9569

3001 West Big Beaver Road, Suite 722

Troy, ML 48084

PHONE: (1)248-458-1527

FAX: (1)248-458-6255

Eastern Area

1070 N. Kimbles Road, Yardley, PA 19067

PHONE: (1)215-321-5530

FAX: (1)215-321-5534

200 Wheeler Rd., Burlington, MA 01803

PHONE: (1)781-270-7979; (1)781-229-5100

FAX: (1)781-229-9117

8000 Regency Parkway, Suite 280 Cary, NC 27511

PHONE: (1)919-460-0695

FAX: (1)919-460-0795

2321 Sidney St. Pittsburgh, PA 15203

PHONE: (1)412-381-1191

FAX: (1)412-381-1192

4875 North Federal Highway, Third Floor

Ft. Lauderlade, FL 33318

PHONE: (1)954-267-8883

FAX: (1)954-267-0254

SHARP MICROELECTRONICS EUROPE

A division of Sharp Electronics (Europe) GmbH

Head Office

Sonninstrasse 3, 20097, Hamburg, Germany

PHONE: (49)180-5073507

FAX: (49)40-2376-2232

http://www.sharpsme.com/

Germany

SME München Office

Fuerstenriederstrasse 5, 80687 München, Germany

PHONE: (49)89-5468420

FAX: (49)89-54 684250

France

SME Paris Office

1 Rue Raoul Follereau Bussy Saint Georges

77608 Marne la Vallee Cedex 3

PHONE: (33)1 6476 22 22

FAX: (33)1 6476 22 23

Italy

SME Milano Office

Centro Direzionale Colleoni

Palazzo Taurus Ingresso 2

20041 Agrate Brianza, Milano, Italy

PHONE: (390)39-68 99 946

FAX: (390)39-68 99 948

U.K .

SME London Office

Centennial Court, Easthampstead Road,

Bracknell, Berkshire R G12 1YQ, United Kingdom

PHONE: (44)1344-86 99 22

FAX: (44)1344-36 09 03

Ireland

SME Dublin Office

First Floor, Block 1, St. Johns Court, Santry,

Dublin 9, Ireland

PHONE: (353)1-842 87 05

FAX: (353)1-842 84 55

SHARP ELECTRONICS (SHANGHAI) CO., LTD.

Microelectronics Sales & Marketing Division

16F, King Tower, 28 Xin Jin Qiao Road,

Pudong DIST, Shanghai 201206 P.R . China

PHONE: (86)21-5854-7710/21-5834-6056

FAX: (86)21-5854-4340/21-5834-6057

Registered Address

No. 11, De Bao Road, Xin Development BLDG

46 Wai Gao Qiao Free Trade Zone, Shanghai

200131, P.R . China

Beijing Office

Room 1062, Beijing Jing An Center No. 8 East

Bei San Huan Road, Chao Yang DIST, Beijing

100028 P.R . China

PHONE: (86) 10-6466-7543/10-6466-6561

FAX: (86) 10-6468-8920

http://sharp-world.com/products/devicechina/

index.html

SHARP-ROXY (HONG KONG) LTD.

Device Sales Division, 17/F, Admiralty Centre,

Tower 1, 18 Harcourt Road, Hong Kong

PHONE: (852)28229311

FAX: (852)28660779

http://www.sharp.com.hk

Shenzhen Representative Office

Room 13B1, Tower C, Electronics Science &

Technology Building, Shen Nan Zhong Road,

Shenzhen, P.R . China

PHONE: (86)755-83273731

FAX: (86)755-83273735

SHARP ELECTRONIC COMPONENTS

(TAIWAN) CORPORATION

8F-A, No. 16, Sec. 4, Nanking E. R d., Taipei, Taiwan

PHONE: (886)2-2577-7341

FAX: (886)2-2577-7326/2-2577-7328

SHARP ELECTRONICS (SINGAPORE) PTE ., LTD.

396 Alexandra Road #07-00

BP Tower Singapore 119954

PHONE: (65) 62713566

FAX: (65) 62713855

http://www.sesl-sharp.com

SHARP MICROELECTRONICS

TECHNOLOGY (M) SDN BHD.

Suite E 408, 4th Floor, East Tower,

Wisma Consplant 1, No. 2 J ln. SS 16/4,

Subng Jaya, 47500, Selangor Darul Ehsan, Malaysia

PHONE: (60) 3-5637-8964

FAX: (60) 3-5638-4029

SHARP ELECTRONIC COMPONENTS

(KOREA) CORPORATION

RM 501 iLsin B/D. 541, Dohwa-dong,

Mapo-ku, Seoul, Korea, 121-701

PHONE: (82)2-711-5813 ~ 8

FAX: (82)2-711-5819

U.S.A. EUROPE

ASIA

Countries and Areas

Distributed By