2–18 Alpha Industries
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Features
Silicon Step Recovery Diodes for High Order
Frequency Band Multiplication
Fast transition times for output frequencies to
18 GHz
Available as chips or packaged diodes
Maximum Ratings
Reverse Voltage, VR:
Operating Temperature:
Storage Temperature:
VBR rating
– 55 to 150°C
– 65 to 200°C
Electrical Characteristics (TA = 25
°
C)
Step Recovery Diode Chips
VBR
IR (80% of
CJ
–
TL1TT1FC
Typical
Typical
Outline
art
Number
(V)
BR
(nA)
–
(pF)
(ns)
(ps)
–
(GHz)
npu
Frequenc
u
u
Frequency
Drawing
N
m
r
Max. Max. Min. Max. Min. Max. Min.
(GHz) (GHz)
CVB1151–000 15 100 0.25 0.5 10 70 300 0.5–3.0 9–18 150–806
CVB1152–000 15 100 0.5 1.0 10 70 300 0.5–3.0 9–18 150–801
CVB1153–000 15 100 1.0 1.5 10 70 300 0.5–3.0 9–18 150–801
CVB1031–000 30 100 0.25 0.5 10 100 300 0.5–3.0 5–15 150–801
CVB1032–000 30 100 0.5 1.0 10 100 300 0.5–3.0 5–15 150–801
CVB1033–000 30 100 1.0 1.5 10 100 300 0.5–3.0 5–15 150–801
1. Test conditions for carrier lifetime (TL) are IF = 10 mA and IR = 6 mA. Test conditions for transition time (TT) are VR = 10V and IF = 10 mA.
METALIZED
SILICON
GOLD DOT
150–801 .002 (min) .010 .014
Chip
Style Bonding Pad
Nominal (In.) Min. Max.
Chip Size (In.)
MET ALIZED BACK
CONT ACT GOLD
150–806 .010 .014
.0011 (min)
.004 – .006”
Outline Dimensions
Step Recovery Diodes
CVB1151 to CVB1153, CVB1031 to CVB1033