INTEGRATED CIRCUITS
MF1 FCP2 S50
Flip Chip Package Specification
October 2004
Product Specification
Revision 3.1
PUBLIC
P
h
i
l
i
p
s
Semiconductors
ADDENDUM
Philips Semiconductors Product Specification Rev 3.1 October 2004
Flip Chip Package Specification MF1 FCP2 S50
2 PUBLIC
CONTENTS
1
SCOPE...................................................................................................................................... 3
2
SPECIFICATIONS ..................................................................................................................... 4
2.1
Integrated Circuit........................................................................................................................ 4
2.2
Absolute Maximum Rati ngs........................................................................................................ 4
2.3
Electrical Characteristics............................................................................................................ 4
3
ORDERING INFORMATION...................................................................................................... 5
4
DEFINITIONS............................................................................................................................ 6
5
DISCLAIMERS........................................................................................................................... 6
5.1
Life support applicati ons............................................................................................................. 6
6
REVISION HISTORY................................................................................................................. 7
MIFARE
is a registered trademark of Philips Electronics N.V.
Philips Semiconductors Product Specification Rev 3.1 October 2004
Flip Chip Package Specification MF1 FCP2 S50
3 PUBLIC
1 SCOPE
This document specifies the product MF1FCP2S50:
• The MF1FCP2S50/DH is the integrated circuit MF1ICS50 in the package SOT732CA2.
Therefore this document encompasses all information not covered by the specification of the package and/or
the functional specification of the integrated circuit:
• Detailed information on the package is given in the “Specification FCP2 Flip Chip Package”.
• Functionality of the integrated circuit is described in the “MF1 IC S50 Functional Specification”.
Philips Semiconductors Product Specification Rev 3.1 October 2004
Flip Chip Package Specification MF1 FCP2 S50
4 PUBLIC
2 SPECIFICATIONS
2.1 Integrated Circuit
Functionality of the integrated circuit is described in the MF1 IC S50 Functional Specification.
2.2 Absolute Maximum Ratings
ABSOLUTE MAXIMUM RATINGS
1, 2
TEST CONDITIONS MIN TYP
1
MAX UNIT
Operating Temperature -25 - +70 °C
ESD Voltage Immunity
MIL-STD-883-C, Method
3015, Human Body Model
C= 100 pF, R = 1.5kς
2 - - kV
peak
Input Current
- - 30 mA
Storage and Processing temperature: refer to specification “FCP2 Flip Chip Package”
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and
Electrical Characteristics section of this specification is not implied.
2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
2.3 Electrical Characteristics
T
jop
= - 25 to +70 °C
SYMBOL
PARAMETER TEST
CONDITIONS MIN TYP
1
MAX UNIT
f
IN
input frequency - 13.56 - MHz
C
in
Input Capacitance between LA - LB
2
22°C, Cp-D, 13.56
MHz, 2 V 14.85 20.13 pF
t
W
EEPROM write time - 2.9 - ms
t
ret
EEPROM Data Retention 10 - - Years
n
write
EEPROM Write Endurance 10
5
- - Cycles
NOTES:
1. Typical ratings are not guaranteed. These values listed are at room temperature.
2. Measured with an HP4258 LCR meter at 13.56 MHz.
Philips Semiconductors Product Specification Rev 3.1 October 2004
Flip Chip Package Specification MF1 FCP2 S50
5 PUBLIC
3 ORDERING INFORMATION
Ordering Name Description Ordering Code
MF1FCP2S50/DH Hot laminated backside tape 12NC: 9352 722 00118
Philips Semiconductors Product Specification Rev 3.1 October 2004
Flip Chip Package Specification MF1 FCP2 S50
6 PUBLIC
4 DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be
published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress
above one or more of the limiting values may cause permanent damage to the device. These are stress
ratings only and operation of the device at these or at any other conditions above those given in the
Characteristics section of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
5 DISCLAIMERS
5.1 Life support applications
These products are not designed for use in life support appliances, devices, or systems where malfunction of
these products can reasonably be expected to result in personal injury. Philips customers using or selling
these products for use in such applications do so on their own risk and agree to fully indemnify Philips for
any damages resulting from such improper use or sale.
Philips Semiconductors Product Specification Rev 3.1 October 2004
Flip Chip Package Specification MF1 FCP2 S50
7 PUBLIC
6 REVISION HISTORY
Table 1 Addendum Flip Chip Package Specification Revision History
REVISION
DATE CPCN
PAGE
DESCRIPTION
3.1 Oct 2004 2004
01023
FCP2 layout improvements
3.0 Dec 2002 Product version
2.0 June 2002
Preliminary version
1.0 June 2002
Initial version.
Philips Semiconductors - a worldwide company
Contact Information
For additional information please visit http://www.semiconductors.philips.com.Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2002 SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without any notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
P
h
i
l
i
p
s
Semiconductors
