Philips Semiconductors Product Specification Rev 3.0 January 2003
I-CONNECT Specification SL2 FCS 20
4
2 SPECIFICATIONS
2.1 Chip
Functionality of the integrated circuit is described in the I•CODE SLI Smart Label IC SL2ICS2001 Functional
Specification.
2.2 ABSOLUTE MAXIMUM RATINGS1, 2
ABSOLUTE MAXIMUM RATINGS TEST
CONDITIONS MIN TYP1MAX UNIT
ESD Voltage Immunity MIL-STD-883D,
Method 3015.7,
Human Body Model
± 2 kVpeak
Input Peak Current -60 +60 mApeak
Processing temperature: refer to specification “FCP 2.1 Flip Chip Package”
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and
Electrical Characteristics section of this specification is not implied.
2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
2.3 OPERATING CONDITIONS
SYMBOL PARAMETER TEST
CONDITIONS MIN TYP1MAX UNIT
Tj op Operating Junction Temperature - 25 + 85 °C
ILA-LB Input Current230 mArms
VLA-LB Minimum Supply Voltage
for READ/WRITE/EAS ± 2.5 ± 2.6 ± 2.9 Vrms
fop Operating Frequency313.553 13.560 13.567 MHz
NOTES:
1. Typical ratings are not guaranteed. These values listed are at room temperature.
2. The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to parameter ILA-LB).
3. Bandwidth limitation (±7 kHz) according to ISM band regulations.