INTEGRATED CIRCUITS
SL2 FCS20
I-CONNECT SLI
Flip Chip Package Specification
January 2003
Product Specification
Revision 3.0
Public
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ADDENDUM
Philips Semiconductors Product Specification Rev 3.0 January 2003
I-CONNECT Specification SL2 FCS 20
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CONTENTS
1SCOPE...................................................................................................................................... 3
2SPECIFICATIONS...................................................................................................................... 4
2.1 Chip........................................................................................................................................... 4
2.2 ABSOLUTE MAXIMUM RATINGS1, 2........................................................................................... 4
2.3 OPERATING CONDITIONS ........................................................................................................ 4
2.4 Electrical Characteristics............................................................................................................. 5
3ORDERING INFORMATION....................................................................................................... 5
4DEFINITIONS ............................................................................................................................ 6
5DISCLAIMERS........................................................................................................................... 6
5.1 Life support applications.............................................................................................................. 6
5.2 Licence Policy............................................................................................................................ 6
6REVISION HISTORY.................................................................................................................. 7
ICODE is a registered trademark of Philips Electronics N.V.
Philips Semiconductors Product Specification Rev 3.0 January 2003
I-CONNECT Specification SL2 FCS 20
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1 SCOPE
This document gives specifications for the product SL2FCS20; the I-CONNECT SLI.
The SL2FCS2001DV/DH is the integrated circuit SL2ICS2001 in the package SOT732AA1.
The SL2FCS2001DV/DC is the integrated circuit SL2ICS2001 in the package SOT732BB1.
Therefore this document encompasses all information not covered by the specification of the package and/or
the functional specification of the integrated circuit.
Detailed information on the package is given in the specification FCP 2.1 Flip Chip Package.
Functionality of the integrated circuit is described in the Functional Specification I•CODE SLI Smart
Label IC SL2ICS2001.
Philips Semiconductors Product Specification Rev 3.0 January 2003
I-CONNECT Specification SL2 FCS 20
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2 SPECIFICATIONS
2.1 Chip
Functionality of the integrated circuit is described in the I•CODE SLI Smart Label IC SL2ICS2001 Functional
Specification.
2.2 ABSOLUTE MAXIMUM RATINGS1, 2
ABSOLUTE MAXIMUM RATINGS TEST
CONDITIONS MIN TYP1MAX UNIT
ESD Voltage Immunity MIL-STD-883D,
Method 3015.7,
Human Body Model
± 2 kVpeak
Input Peak Current -60 +60 mApeak
Processing temperature: refer to specification “FCP 2.1 Flip Chip Package”
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and
Electrical Characteristics section of this specification is not implied.
2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
2.3 OPERATING CONDITIONS
SYMBOL PARAMETER TEST
CONDITIONS MIN TYP1MAX UNIT
Tj op Operating Junction Temperature - 25 + 85 °C
ILA-LB Input Current230 mArms
VLA-LB Minimum Supply Voltage
for READ/WRITE/EAS ± 2.5 ± 2.6 ± 2.9 Vrms
fop Operating Frequency313.553 13.560 13.567 MHz
NOTES:
1. Typical ratings are not guaranteed. These values listed are at room temperature.
2. The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to parameter ILA-LB).
3. Bandwidth limitation (±7 kHz) according to ISM band regulations.
Philips Semiconductors Product Specification Rev 3.0 January 2003
I-CONNECT Specification SL2 FCS 20
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2.4 Electrical Characteristics
Tjop = - 25 to +85 °C
SYMBOL PARAMETER TEST
CONDITIONS MIN TYP1MAX UNIT
Cres Input Capacitance between LA - LB2VLA-LB = 2 Vrms 22,7 23,5 25,1 pF
Pmin Minimum Operating Supply Power3280 µW
mModulation of RF Voltage for
Demodulator Response m
V
-
V + V
max min
max min
=** ** ** %
tP sm Modulation Pulse Length
of RF Voltage ** ** ** µs
tDDemodulator Response Time m 10 %, 100% ** ** ** µs
Rmod Load Modulation ** ** **
tret EEPROM Data Retention Tamb 55 °C 10 Years
nwrite EEPROM Write Endurance 100 000 Cycles
NOTES:
1. Typical ratings are not guaranteed. These values listed are at room temperature.
2. Measured with an HP4285A LCR meter at 13.56 MHz.
3. Including losses in resonant capacitor and rectifier.
** : refer to ISO/IEC 15693-2 and 15693-3 including pulse shapes and tolerances; proper coil design assumed
3 ORDERING INFORMATION
Ordering Name Description Ordering Code
SL2FCS2001DV/DH I-CONNECT SLI,
Hot laminated backside tape
12NC: 9352 725 07118
SL2FCS2001DV/DC I-CONNECT SLI,
Cold laminated backside tape
12NC: 9352 725 06118
Philips Semiconductors Product Specification Rev 3.0 January 2003
I-CONNECT Specification SL2 FCS 20
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4 DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be
published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress
above one or more of the limiting values may cause permanent damage to the device. These are stress
ratings only and operation of the device at these or at any other conditions above those given in the
Characteristics section of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
5 DISCLAIMERS
5.1 Life support applications
These products are not designed for use in life support appliances, devices, or systems where malfunction of
these products can reasonably be expected to result in personal injury. Philips customers using or selling
these products for use in such applications do so on their own risk and agree to fully indemnify Philips for
any damages resulting from such improper use or sale.
5.2 Licence Policy
Purchase of this Philips IC with a functionally according to ISO/IEC 15693 Standard does not convey an
implied license under any patent right on this standard. A license for the Philips portfolio of patents on the
ISO/IEC 15693 Standard can be obtained via the Philips Intellectual Property and Standards department.
For more information please contact the nearest Philips Semiconductors sales office.
Philips Semiconductors Product Specification Rev 3.0 January 2003
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6 REVISION HISTORY
Table 1 Addendum Flip Chip Package Specification Revision History
REVISION DATE CPCN PAGE DESCRIPTION
3.0 Jan. 2003 Product version
2.1 Oct. 2002 -5typo of 12NC ordering code
2.0 Sept. 2002 Preliminary version
1.0 May 2002 Initital version.
Philips Semiconductors Product Specification Rev 3.0 January 2003
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NOTES
Philips Semiconductors - a worldwide company
Contact Information
For additional information please visit http://www.semiconductors.philips.com.Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2002 SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without any notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
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