LITE-ON DCC
RELEASE
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
Through Hole Lamp
Product Data Sheet
LTL-307G-011A
Spec No.: DS20-2015-0180
Effective Date: 07/18/2015
Revision: -
BNS-OD-FC001/A4
BNS-OD-FC001/A4
BNS-OD-FC001/A4
BNS-OD-FC001/A4
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Part No. : LTL-307G-011A
BNS-OD-FC002/A4
Through Hole Lamp
LTL-307G-011A
Rev
Description
By
Date
P001
Preliminary SPEC (RDR-20140161-01)
Sasipan
03/18/2014
Above data for PD and Customer tracking only
-
NPPR Received and Upload on OPNC
Sasipan
06/29/2015
2/10
Part No. : LTL-307G-011A
BNS-OD-FC002/A4
1. Description
Through-hole LEDs are offered in a variety of packages such as 3mm, 4mm, 5mm, rectangular, and cylinder which are suitable
for all applications requiring status indication. Several intensity and viewing angle choices are available in each color for design
flexibility.
1. 1. Features
Low power consumption & High efficiency
Lead free & RoHS Compliant
Popular T-13/4 diameter
Yellow Green 569nm Lamp & Green Diffused lens
1.2. Applications
Communication
Computer
Consumer
Home appliance
Industrial
2. Outline Dimensions
Notes :
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (.010") unless otherwise noted.
3. Protruded resin under flange is 1.0mm (.04") max.
4. Lead spacing is measured where the leads emerge from the package.
5. Specifications are subject to change without notice.
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3. Absolute Maximum Ratings at TA=25°C
Parameter
Maximum Rating
Unit
Power Dissipation
52
mW
Peak Forward Current
(Duty Cycle≦1/10, Pulse Width≦10ms)
60
mA
DC Forward Current
20
mA
Operating Temperature Range
-40°C to + 85°C
Storage Temperature Range
-40°C to + 100°C
Lead Soldering Temperature
[2.0mm (.079") From Body]
260°C for 5 Seconds Max.
4. Electrical / Optical Characteristics at TA=25°C
Parameter
Symbol
Min.
Typ.
Max.
Unit
Test Condition
Luminous Intensity
IV
8.7
30
100
mcd
IF = 10mA
Note 1,5
Viewing Angle
2θ1/2
50
deg
Note 2 (Fig.6)
Peak Emission Wavelength
λP
565
nm
Measurement
@Peak (Fig.1)
Dominant Wavelength
λd
566
569
573
nm
IF = 10mA
Note 4
Spectral Line Half-Width
Δλ
30
nm
Forward Voltage
VF
1.6
2.1
2.6
V
IF = 20mA
Reverse Current
IR
100
μA
VR = 5V
NOTE:
1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. Iv classification code is marked on each packing bag.
4. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines
the color of the device.
5. Iv guarantee must be included with ±15% testing tolerance.
6. Reverse voltage (VR) condition is applied for IR test only. The device is not designed for reverse operation.
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Part No. : LTL-307G-011A
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5. Typical Electrical / Optical Characteristics Curves
(25°C Ambient Temperature Unless Otherwise Noted)
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Part No. : LTL-307G-011A
BNS-OD-FC002/A4
6. Taping Features
* Compatible with radial lead automatic insertion equipment.
* Most radial lead plastic lead lamps available packaged in tape and folding.
* 2.54mm (0.1") straight lead spacing available.
* Folding packaging simplifies handling and testing.
* Reel packaging is available by removing suffix “A” on option.
Package Dimensions
Specification
Item
Symbol
Minimum
Maximum
mm
inch
mm
inch
Tape Feed Hole Diameter
D
3.8
0.149
4.2
0.165
Component Lead Pitch
F
4.8
0.188
5.8
0.228
Front to Rear Deflection
△H
--
--
2.0
0.078
Height of Seating Plane
H
15.5
0.610
16.5
0.649
Feed Hole to Bottom of Component
H1
19.0
0.748
21.0
0.827
Feed Hole to Overall Component Height
H2
27.3
1.074
29.9
1.177
Lead Length After Component Height
L
W0
11.0
0.433
Feed Hole Pitch
P
12.4
0.488
13.0
0.511
Lead Location
P1
3.15
0.124
4.55
0.179
Center of Component Location
P2
5.05
0.198
7.65
0.301
Total Tape Thickness
T
--
--
0.90
0.035
Feed Hole Location
W0
8.5
0.334
9.75
0.384
Adhesive Tape Position
W2
0
0
3.0
0.118
Tape Width
W3
17.5
0.689
19.0
0.748
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Part No. : LTL-307G-011A
BNS-OD-FC002/A4
7. Packing Spec.
Total 2,000pcs per inner carton
10 Inner cartons per outer carton
Total 20,000 pcs per outer carton
In every shipping lot, only the last pack will be non-full packing
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Part No. : LTL-307G-011A
BNS-OD-FC002/A4
8. Bin Table Specification
Luminous Intensity Unit : mcd @10mA
Bin Code
Min.
Max.
M4
8.7
12.6
M3
12.6
19
M2
19
29
M1
29
40
N1
40
100
Note: Tolerance of each bin limit is ±15%
Dominant Wavelength Unit : nm @10mA
Bin Code
Min
Max
GG1
566
568
GG
568
569.5
PG
569.5
571
YG
571
573
Note: Tolerance of each bin limit is ±1nm
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9. CAUTIONS
9.1. Application
This LED lamp is good for application of indoor and outdoor sign, also ordinary electronic equipment.
9.2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is recommended that
LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is
recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen
ambient.
9.3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
9.4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the
lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly
on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
9.5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. Dipping the lens into the
solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high
temperature.
Recommended soldering conditions:
Soldering iron
Wave soldering
Temperature
Soldering time
Position
350°C Max.
3 seconds Max.
(one time only)
No closer than 2mm
from the base of the epoxy bulb
Pre-heat
Pre-heat time
Solder wave
Soldering time
Dipping Position
100°C Max.
60 seconds Max.
260°C Max.
5 seconds Max.
No lower than 2mm from the
base of the epoxy bulb
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic
failure of the LED. IR reflow is not suitable process for through hole type LED lamp product.
9.6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an
application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as
shown in Circuit A below.
Circuit model (A) Circuit model (B)
LED
LED
(A) Recommended circuit
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs.
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9.7. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
Use a conductive wrist band or anti- electrostatic glove when handling these LEDs
All devices, equipment, and machinery must be properly grounded
Work tables, storage racks, etc. should be properly grounded
Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic
lens as a result of friction between LEDs during storage and handing
Suggested checking list:
Training and Certification
9.7.1.1. Everyone working in a static-safe area is ESD-certified?
9.7.1.2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
9.7.2.1. Static-safe workstation or work-areas have ESD signs?
9.7.2.2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
9.7.2.3. All ionizer activated, positioned towards the units?
9.7.2.4. Each work surface mats grounding is good?
Personnel Grounding
9.7.3.1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or conductive shoes
with conductive flooring?
9.7.3.1. If conductive footwear used, conductive flooring also present where operator stand or walk?
9.7.3.2. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
9.7.3.3. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
9.7.3.4. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
9.7.4.1. Every ESDS items identified by EIA-471 labels on item or packaging?
9.7.4.2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation?
9.7.4.3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
9.7.4.4. All flexible conductive and dissipative package materials inspected before reuse or recycle?
Others
9.7.5.1. Audit result reported to entity ESD control coordinator?
9.7.5.2. Corrective action from previous audits completed?
9.7.5.3. Are audit records complete and on file?
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Part No. : LTL-307G-011A
BNS-OD-FC002/A4
10. Reliability Test
Classification
Test Item
Test Condition
Sample Size
Reference Standard
Endurance
Test
Operation Life
Ta = Under room temperature
IF = per datasheet maximum drive
current
Test Time= 1000hrs
22 PCS
(CL=90%;
LTPD=10%)
MIL-STD-750D:1026 (1995)
MIL-STD-883G:1005 (2006)
High Temperature
High Humidity
storage
Ta = 60°C
RH = 90%
Test Time= 240hrs
22 PCS
(CL=90%;
LTPD=10%)
MIL-STD-202G:103B (2002)
JEITA ED-4701:100 103 (2001)
High Temperature
Storage
Ta= 105 ± 5°C
Test Time= 1000hrs
22 PCS
(CL=90%;
LTPD=10%)
MIL-STD-750D:1031 (1995)
MIL-STD-883G:1008 (2006)
JEITA ED-4701:200 201 (2001)
Low Temperature
Storage
Ta= -55 ± 5°C
Test Time= 1000hrs
22 PCS
(CL=90%;
LTPD=10%)
JEITA ED-4701:200 202 (2001)
Environmental
Test
Temperature
Cycling
100°C ～ 25°C ～ -40°C ～ 25°C
30mins 5mins 30mins 5mins
30 Cycles
22 PCS
(CL=90%;
LTPD=10%)
MIL-STD-750D:1051 (1995)
MIL-STD-883G:1010 (2006)
JEITA ED-4701:100 105 (2001)
JESD22-A104C (2005)
Thermal
Shock
100 ± 5°C ～ -30°C ± 5°C
15mins 15mins
30 Cycles
(<20 secs transfer)
22 PCS
(CL=90%;
LTPD=10%)
MIL-STD-750D:1056 (1995)
MIL-STD-883G:1011 (2006)
MIL-STD-202G:107G (2002)
JESD22-A106B (2004)
Solder
Resistance
T.sol = 260 ± 5°C
Dwell Time= 10±1 seconds
3mm from the base of the epoxy bulb
11 PCS
(CL=90%;
LTPD=18.9%)
MIL-STD-750D:2031(1995)
JEITA ED-4701: 300 302 (2001)
Solderability
T. sol = 245 ± 5°C
Dwell Time= 5 ± 0.5 seconds
(Lead Free Solder, Coverage ≧95% of
the dipped surface)
11 PCS
(CL=90%;
LTPD=18.9%)
MIL-STD-750D:2026 (1995)
MIL-STD-883G:2003 (2006)
MIL-STD-202G:208H (2002)
IPC/EIA J-STD-002 (2004)
Soldering Iron
T. sol = 350 ± 5°C
Dwell Time= 3.5 ± 0.5 seconds
11 PCS
(CL=90%;
LTPD=18.9%)
MIL-STD-202G:208H (2002)
JEITA ED-4701:300 302 (2001)
11. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.