○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
1/28 TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・14・001
Datashee
t
Sound Processor Series for Car Audio
Sound processor with Built-in
2-band Equalizer
BD37503FV
●General Description
Sound processor which has built-in 4inp ut selector and
2-band equalizer filter. And, loudness filter and 2nd-order
anti-aliasing filter which attenuate noise occurs at output
of DAC are available, either one by switching.
●Features
Built-in differential input selector that can make
various combination of single- ended / differential
input.
Reduce switching noise by using advanced switch
circuit
Built-in ground isolation amplifier inputs, ideal for
external stereo input.
Decrease the number of external com ponents by
built-in 2nd-order anti-aliasi ng filter
Decrease the number of external com ponents by
built-in 2-band equalizer filter and loudness filter.
A PCB area can be reduced and PCB layouts become
easy thanks to that signal flow is gathered to one
direction by arrangement of input and output left side
and right side separately.
It is possible to control by 3.3V / 5V for I2C BUS serial
controller.
●Applications
It is the optimal for the car audio. Besides, it is
possible to use for the audio equipm ent of mini
Compo, micro Compo, TV etc with all kinds.
●Key Specifications
Total harmonic distortion： 0.001%(Typ.)
Maximum input voltage： 2.2Vrms(Typ.)
Common mode rejection ratio： 50dB(Min.)
Maximum output voltage： 2.1Vrms(Typ.)
Output noise voltage： 5.8μVrms(Typ.)
Residual output noise voltage： 2.8μVrms (Typ.)
Ripple rejection: -70dB (Typ.)
Operating temperature range -40℃ to +85℃
●Package W(Typ.) x D(Typ.) x H(Max.)
SSOP-B20 6.50mm x 6.40mm x 1.45mm
SSOP-B20
●T ypical Application Circuit
Figure 1. Application Circuit Diagram
2/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
● Pin Configuration
Figure 2. Pin configuration
●Pin Description
Terminal
No. Symbol Description of terminals Terminal
No. Symbol Description of terminals
1 N.C. Non connection terminal 11 GND GND terminal
2 D1 D input terminal of 1ch 12 SDA I2C Communication data terminal
3 CN1 C negative input terminal of 1ch 13 SCL I2C Communication clock terminal
4 CP1 C positive i np ut terminal of 1ch 14 OUTR2 Rear output terminal of 2ch
5 B1 B input terminal of 1ch 15 OUTF2 Front output terminal of 2ch
6 A1 A input terminal of 1ch 16 A2 A input terminal of 2ch
7 OUTF1 Front output terminal of 1ch 17 B2 B input terminal of 2ch
8 OUTR1 Rear output terminal of 1ch 18 CP2 C positive input terminal of 2ch
9 VCC Power supply terminal 19 CN2 C negative input terminal of 2ch
10 VREF BIAS terminal 20 D2 D input terminal of 2ch
●Block Diagram
Figure 3. Block Diagram
TREBLE
BASS
Loudness
/ Anti-aliasing
VOLUME
FADER FADER
FADER FADER
1
2
3
4
5
6
7
8
9
SSOP-B20
(TOP VIEW)
10 11
12
13
14
15
16
17
18
19
20
D1
CN1
CP1
B1
A1
OUTF1
OUTR1
VCC
VREF GND
SDA
SCL
OUTR2
OUTF2
A2
B2
CP2
CN2
D2
3/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
●Absolute Maximum Ratings (Ta=25℃)
Item Symbol Rating Unit
Power supply Voltage VCC 10.0 V
Input voltage Vin VCC+0.3 to GND-0.3
SCL,SDA : 7 to GND-0.3 V
Power Dissipation Pd 937 ※1 mW
Storage Temperature Tastg -55 to +150 ℃
※1 This value decreases 7.5mW/℃ for Ta=25℃ or more.
ROHM standard board shall be mounted. Thermal resistance θja = 133.3(℃/W)
ROHM Standard board size：70×70×1.6(㎣)
material：FR4 A FR4 gr ass epoxy board(3% or less of copper foil area)
●Recommended Operating Rating
Item Symbol MIN. TYP. MAX. Unit
Power supply Voltage VCC 7.0 8.5 9.5 V
Temperature Topr -40 - +85 ℃
4/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
●Electrical Characteristic
Unless specified particularly, Ta=25℃, VCC=8.5V, f=1kHz, Vin=1Vrms, Rg=600Ω, RL=10kΩ, A input, Input gain 0dB,
Volume 0dB, Tone co ntrol 0dB, Loudness 0dB, Fader 0dB, Output Gain 0dB
BLOCK
Item Symbol
Limit Unit Condition
MIN. TYP. MAX.
GENERAL
Current upon no signal IQ － 20 27 mA No signal
Voltage gain GV -1.5 0 1.5 dB Gv=20log(VOUT/VIN)
Channel balance CB -1.5 0 1.5 dB CB = GV1-GV2
Total harmonic distortion THD+N1 － 0.001 0.05 % VOUT=1Vrms
BW=400-30KHz
Output noise voltage ＊ V
NO － 5.8 18 μVrms Rg = 0Ω
BW = IHF-A
Residual output noise voltage ＊ V
NOR － 2.8 9 μVrms Fader = -∞dB
Rg = 0Ω
BW = IHF-A
Cross-talk between channels ＊ CTC － -100 -90 dB Rg = 0Ω
CTC=20log(VOUT/VIN)
BW = IHF-A
Ripple rejection RR － -70 -40 dB
f=1kHz
VRR=100mVrms
RR=20log(VCC IN/VOUT)
INPUT SELECTO R
Input impedance(A, B, D) RIN
_
S 70 100 130 kΩ
Input impedance(CP,CN) RIN
_
D 35 50 65 kΩ
Maximum input voltage VIM 2 2.2 － Vrms
VIM at THD+N(VOUT)=1%
BW=400-30KHz
Cross-talk between selectors ＊ CTS － -100 -90 dB
Rg = 0Ω
CTS=20log(VOUT/VIN)
BW = IHF-A
Common mode rejection ratio CMRR 50 60 － dB
CP1 and CN1 input
CP2 and CN2 input
CMRR=20log(VIN/VOUT)
BW = IHF-A,
INPUT GAIN
Minimum input gain GIN MIN -2 0 2 dB
Input gain 0dB
VIN=100mVrms
GIN=20log(VOUT/VIN)
Maximum input gain GIN MAX 18 20 22 dB
Input gain 20dB
VIN=100mVrms
GIN=20log(VOUT/VIN)
Gain set error GIN ERR -2 0 2 dB GAIN=+1 to +20dB
5/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
BLOCK
Item Symbol Limit Unit Condition
MIN. TYP. MAX.
VOLUME
Maximum gain GV MAX -1.5 0 1.5 dB
Volume = 0dB
VIN=100mVrms
Gv=20log(VOUT/VIN)
Maximum attenuation ＊ G
V MIN － -100 -85 dB Volume = -∞dB
Gv=20log(VOUT/VIN)
BW = IHF-A
Attenuation set erro
r
G
V ERR1 -2 0 2 dB ATT=0dB to -36dB
BASS
Maximum boost gain GB BST 18 20 22 dB
Gain=+20dB f=100Hz
VIN=100mVrms
GB=20log (VOUT/VIN)
Maximum cut gain GB CUT -22 -20 -18 dB Gain=-20dB f=100Hz
VIN=2Vrms
GB=20log (VOUT/VIN)
Gain set error GB ERR -2 0 2 dB Gain=+20 to -2 0dB f=100Hz
TREBLE
Maximum boost gain GT BST 18 20 22 dB
Gain=+20dB f=10kHz
VIN=100mVrms
GT=20log (VOUT/VIN)
Maximum cut gain GT CUT -22 -20 -18 dB Gain=-20dB f=10kHz
VIN=2Vrms
GT=20log (VOUT/VIN)
Gain set error GT ERR -2 0 2 dB Gain=+20 to -20dB f= 10kHz
FADER
Maximum gain GF BST -2 0 2 dB
Gain=0dB
GF=20log(VOUT/VIN)
Maximum attenuation ＊ GF MIN － -100 -90 dB
Fader = -∞dB
GF=20log(VOUT/VIN)
BW = IHF-A
Attenuation set error 1 GF ERR1 -2 0 2 dB ATT=-1 to -15dB
Attenuation set error 2 GF ERR2 -3 0 3 dB ATT=-16 to -47dB
Attenuation set error 3 GF ERR3 -4 0 4 dB ATT=-48 to -63dB
Output impedance RO FAD - － 50 Ω VIN=100mVrms
Maximum output voltage VOM F 2 2.1 － Vrms
THD+N=1％
BW=400-30KHz
LOUDNESS
Maximum gain GLD MAX 13 15 17 dB
Gain=15dB
GLD=20log(VOUT/VIN)
BW=IHF-A
Gain set error GLD ERR -2 0 2 dB
Gain=0dB to -15dB
GLD=20log(VOUT/VIN)
OUTPUT
GAIN
Maximum gain GOUT
MAX 4 6 8 dB
Gain +6dB
VIN=100mVrms
GOUT=20log(VOUT/VIN)
Gain set error GOUT
ERR -2 0 2 dB Gain=0dB, +6dB
※VP-9690A(Average value detection, effective value display) filter by Matsushita Communication is used for ＊ measurement.
※Phase between input / output is same.
6/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
●Typical Performance Curve(reference data)
0.001
0.01
0.1
1
10
0.001 0.01 0.1 1 10
Vin [Vrms]
THD + n [%]
-80
-70
-60
-50
-40
-30
-20
10 100 1000 10000 100000
Frequency [Hz]
CMRR [dB]
-10
-8
-6
-4
-2
0
2
4
6
8
10
10 100 1000 10000 100000
Frequency [Hz]
GAIN [dB]
0
5
10
15
20
0246810
VCC [V]
Iq [mA]
Figure 4. Iq vs VCC Figure 5. Gain vs Frequency
Figure 6. THD+n vs Input Voltage Figure 7. CMRR vs Frequency
Operational Range
10kHz
1 kHz
100Hz
7 9.5
7/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
Figure 8. PSRR vs Frequency Figure 9. Cross-talk between channels vs Frequency
Figure 10. Loudness Gain vs Freque ncy Figure 11. Antifilter Gain vs Frequenc y
-100
-90
-80
-70
-60
-50
-40
10 100 1000 10000 100000
Frequency [Hz]
PSRR [dB]
-120
-110
-100
-90
-80
-70
-60
10 100 1000 10000 100000
Frequency [Hz]
CTC [dB]
-20
-15
-10
-5
0
5
10 100 1000 10000 100000
Frequency [Hz]
GAIN [dB]
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
2
10 100 1000 10000 100000
Frequency [Hz]
Gain [dB]
8/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
-25
-20
-15
-10
-5
0
5
10
15
20
25
10 100 1000 10000 100000
Frequency [Hz]
Gain [dB]
-25
-20
-15
-10
-5
0
5
10
15
20
25
10 100 1000 10000 100000
Frequency [Hz]
Gain [dB]
Figure 12. Bass Gain vs Frequency Figure 13. Treble Gain vs Frequency
9/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
ｔBUF
：4us
ｔHD;STA
：2us
ｔHD;DAT
：1us
ｔLOW
：3us
ｔHIGH
：1us
ｔSU;DAT
：1us
ｔSU;STO
：2us
SCL clock frequency：250kHz
SCL
SDA
●CONTROL SIGNAL SPECIFICATION
(1) Electrical specifications and timing for bus lines and I/O stages
Figure 14. Definition of timing on the I 2C-bus
Table 1 Characteristics of the SDA and SCL bus lines for I2C-bus devices
Parameter Symbol
Fast-mode I
2
C-bus Unit
MIN. MAX.
1 SCL clock frequency fSCL 0 400 kHz
2 Bus free time between a STOP and START condition tBUF 1.3 － μS
3 Hold time (repeated) START conditi on. After this period, the first clock
pulse is generated tHD;STA 0.6 － μS
4 LOW period of the SCL cl ock tLOW 1.3 － μS
5 HIGH period of the SCL clock tHIGH 0.6 － μS
6 Set-up time for a repeated START condition tSU;STA 0.6 － μS
7 Data hold time tHD;DAT 0 － μS
8 Data set-up time tSU; DAT 100 － ns
9 Set-up time for STOP condition tSU;STO 0.6 － μS
All values referred to VIH min. and VIL max. Levels (see Table 2).
About 7(tHD;DAT), 8(tSU;DAT), please make setup which has enough margin.
Table 2 Characteristics of the SDA and SCL I/O stages for I2C-bus devices
Item Symbol
Fast-mode I
2
C-bus Unit
MIN. MAX.
10 LOW level input voltage: In case an input level is fixed VIL -0.5 1 V
11 HIGH level input voltage: In case an input level is fixed VIH 2.3 - V
12 Pulse width of spikes which must be suppressed by the input filter. tSP 0 50 ns
13 LOW level output voltage(open drain or open collect or):
at 3mA sink current VOL1 0 0.4 V
14 Input current each I/O pin with an input voltage between 0.4V and
0.9V. Ii -10 10 μA
SDA
S
SCL
tLOW tR
tHD;DAT
P
tHD;STA tHIGH
tBUF
tF
tSU;DAT tSU;STA tSU;STO
tSP
tHD;STA
Sr
P
Figure 15. A command timing example in the I2C data transmission
10/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
(2) I2C BUS FORMAT
MSB LSB MSB LSB MSB LSB
S Slave Address A Select Address A Data A P
1bit 8bit 1bit 8bit 1bit 8bit 1bit 1bit
S = Start conditions (Recognition of start bit)
Slave Address = Recognition of slave address. 7 bits in upper order are voluntary.
The least significant bit is “L” due to writing.
A = ACKNOWLEDGE bit (Recognition of ackno wledgement)
Select Address = Select every of volume, bass and treble.
Data = Data on every volume and tone.
P = Stop condition (Recognition of stop bit)
(3) I2C BUS Interface Protocol
1) Basic form
S Slave Address A Select Address A Data A P
MSB LSB MSB LSB MSB LSB
2) Automatic increment (Select Address increases (+1) according to the number of data.)
S Slave Address A Select Address A Data1 A Data2 A ････ DataN A P
MSB LSB MSB LSB MSB LSB MSB LSB MSB LSB
(Example)① D ata1 shall be s et as data of address specifie d by Select Address.
② Data2 shall be set as data of address specified b y Select Address +1.
③ DataN shall be set as data of address specified by Select Address +N-1.
3) Configuration unavailable for transmission (In this case, only Select Address1 is set.
S Slave Address A Select Address1 A Data A Select Address 2 A Data A P
MSB LSB MSB LSB MSB LSB MSB LSB MSB LSB
（Note）If any data is transmitted as Select Address 2 next to data,
it is recognized as data, not as Select Address 2.
(4) Slave address
MSB LSB
A6 A5 A4 A3 A2 A1 A0
R/W
1 0 0 0 0 0 0 0
80H
11/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
(5) Select Address & Data
Items
Select
Address
(hex)
MSB Data LSB
D7 D6 D5 D4 D3 D2 D1 D0
Initial setup 1 01 1 0 1 0 0 0 0 0
Initial setup 2 03 Output
Gain 0 0 0
Loudness
select 0 0
Loudness
fo
Input selector 05 0 0 0 0 0 Input selector
Input gain 06 0 0 0 Input Gain
Volume gain 20 V olume Attenuation
Fader 1ch Front 28 Fader Attenuation F1
Fader 2ch Front 29 Fader Attenuation F2
Fader 1ch Rear 2A Fader Attenuation R1
Fader 2ch Rear 2B Fader Attenuation R2
Bass gain 51 Bass
Boost/Cut 0 0 Bass Gain
Treble gain 57 Treble
Boost/Cut 0 0 Treble Gain
Loudness Gain 75 0 0 0 0 Loudness Gain
System Reset FE 1 0 0 0 0 0 0 1
Advanced switch
Note
1. In function changing of the hatching part, it works Advanced switch.
2. Upon c ontinuous data transfer, the Select Address is circul ated by the automatic incr ement function, as sho wn
below.
3. For the function of input selector, input gain and output gain etc, it is not corresponded for advanced switch.
Therefore, please apply mute on the side of a set when changes these setting.
→
01
→
03
→
05
→
06
→
20
→
28
→
29
→
2A
→
2B
→
51
→
57
→
75
12/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
Select address 03(hex)
fo
MSB Loudness fo LSB
D7 D6 D5 D4 D3 D2 D1 D0
650 Hz Output
Gain 0 0 0
Loudness
select 0 0 0
1.3k Hz 1
Mode
MSB Loudness select LSB
D7 D6 D5 D4 D3 D2 D1 D0
Loudness Output
Gain 0 0 0 0 0 0
Loudness
fo
Anti-aliasing filter 1
Gain
MSB Output Gain LSB
D7 D6 D5 D4 D3 D2 D1 D0
0dB 0 0 0 0
Loudness
select 0 0
Loudness
fo
+6dB 1
Select address 05(hex)
Mode
MSB Input Selector LSB
D7 D6 D5 D4 D3 D2 D1 D0
A single
0 0 0 0 0
0 0 0
B single 0 0 1
C single 0 1 0
D single 0 1 1
C diff 1 0 0
Input SHORT 1 0 1
Prohibition 0 1 1
1 1 0
1 1 1
Input SHORT： The input impedance of each input terminal is lowered from 100kΩ(TYP) to 1 kΩ(TYP).(For quick
charge of coupling capacitor)
: Initial condition
The list of terminals that is active when each mode of input selector is selected
Mode 1ch+Input Terminal 1ch-Input Terminal 2ch+Input Terminal 2ch-Input Terminal
A single 6pin(A1) - 16pin(A2) -
B single 5pin(B1) - 17pin(B2) -
C single 4pin(CP1) - 18pin(CP2) -
D single 2pin(D1) - 20pin(D2) -
C diff 4pin(CP1) 3pin(CN1) 18pi n(CP2) 19pin(CN2)
13/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
Select address 06 (hex)
Gain
MSB Input Gain LSB
D7 D6 D5 D4 D3 D2 D1 D0
0dB
0 0 0
0 0 0 0 0
1dB 0 0 0 0 1
2dB 0 0 0 1 0
3dB 0 0 0 1 1
4dB 0 0 1 0 0
5dB 0 0 1 0 1
6dB 0 0 1 1 0
7dB 0 0 1 1 1
8dB 0 1 0 0 0
9dB 0 1 0 0 1
10dB 0 1 0 1 0
11dB 0 1 0 1 1
12dB 0 1 1 0 0
13dB 0 1 1 0 1
14dB 0 1 1 1 0
15dB 0 1 1 1 1
16dB 1 0 0 0 0
17dB 1 0 0 0 1
18dB 1 0 0 1 0
19dB 1 0 0 1 1
20dB 1 0 1 0 0
Prohibition 1 0 1 0 1
： ： ： ： ：
1 1 1 1 1
Select address 20 (hex)
ATT
MSB Volume Attenuation LSB
D7 D6 D5 D4 D3 D2 D1 D0
Prohibition
0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 1
： ： ： ： ： ： ： ：
0 1 1 1 1 1 1 1
0dB 1 0 0 0 0 0 0 0
-1dB 1 0 0 0 0 0 0 1
-2dB 1 0 0 0 0 0 1 0
： ： ： ： ： ： ： ： ：
-35dB 1 0 1 0 0 0 1 1
-36dB 1 0 1 0 0 1 0 0
Prohibition 1 0 1 0 0 1 0 1
： ： ： ： ： ： ： ：
1 1 1 1 1 1 1 0
-∞dB 1 1 1 1 1 1 1 1
: Initial condition
14/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
Select address 28, 29, 2A, 2B (hex)
ATT
MSB Fader Attenuation LSB
D7 D6 D5 D4 D3 D2 D1 D0
Prohibition
0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 1
： ： ： ： ： ： ： ：
0 1 1 1 1 1 1 1
0dB 1 0 0 0 0 0 0 0
-1dB 1 0 0 0 0 0 0 1
-2dB 1 0 0 0 0 0 1 0
： ： ： ： ： ： ： ： ：
-62dB 1 0 1 1 1 1 1 0
-63dB 1 0 1 1 1 1 1 1
Prohibition 1 1 0 0 0 0 0 0
： ： ： ： ： ： ： ：
1 1 1 1 1 1 1 0
-∞dB 1 1 1 1 1 1 1 1
Select address 51, 57 (hex)
Gain
MSB Bass/Treble Gain LSB
D7 D6 D5 D4 D3 D2 D1 D0
0dB
Bass/
T reble
Boost
/cut
0 0
0 0 0 0 0
1dB 0 0 0 0 1
2dB 0 0 0 1 0
3dB 0 0 0 1 1
4dB 0 0 1 0 0
5dB 0 0 1 0 1
6dB 0 0 1 1 0
7dB 0 0 1 1 1
8dB 0 1 0 0 0
9dB 0 1 0 0 1
10dB 0 1 0 1 0
11dB 0 1 0 1 1
12dB 0 1 1 0 0
13dB 0 1 1 0 1
14dB 0 1 1 1 0
15dB 0 1 1 1 1
16dB 1 0 0 0 0
17dB 1 0 0 0 1
18dB 1 0 0 1 0
19dB 1 0 0 1 1
20dB 1 0 1 0 0
Prohibition 1 0 1 0 1
： ： ： ： ：
1 1 1 1 1
Select address 51, 57 (hex)
Mode
MSB Bass/Treble Boost/Cut LSB
D7 D6 D5 D4 D3 D2 D1 D0
Boost 0
0 0 Bass/Treble Gain
Cut 1
: Initial condition
15/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
Select address 75 (hex)
Gain
MSB Loudness Gain LSB
D7 D6 D5 D4 D3 D2 D1 D0
0dB
0 0 0 0
0 0 0 0
1dB 0 0 0 1
2dB 0 0 1 0
3dB 0 0 1 1
4dB 0 1 0 0
5dB 0 1 0 1
6dB 0 1 1 0
7dB 0 1 1 1
8dB 1 0 0 0
9dB 1 0 0 1
10dB 1 0 1 0
11dB 1 0 1 1
12dB 1 1 0 0
13dB 1 1 0 1
14dB 1 1 1 0
15dB 1 1 1 1
: Initial condition
16/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
●Volume / Fader volume attenuation of the details
Volume attenuation is 0dB to -36dB/Fader volume is 0dB to -63dB
(dB) D7 D6 D5 D4 D3 D2 D1 D0
(dB) D7 D6 D5 D4 D3 D2 D1 D0
0 1 0 0 0 0 0 0 0 -33 1 0 1 0 0 0 0 1
-1 1 0 0 0 0 0 0 1 -34 1 0 1 0 0 0 1 0
-2 1 0 0 0 0 0 1 0 -35 1 0 1 0 0 0 1 1
-3 1 0 0 0 0 0 1 1 -36 1 0 1 0 0 1 0 0
-4 1 0 0 0 0 1 0 0 -37 101 0 0 1 0 1
-5 1 0 0 0 0 1 0 1 -38 101 0 0 1 1 0
-6 1 0 0 0 0 1 1 0 -39 1 0 1 0 0 1 1 1
-7 1 0 0 0 0 1 1 1 -40 1 0 1 0 1 0 0 0
-8 1 0 0 0 1 0 0 0 -41 101 0 1 0 0 1
-9 1 0 0 0 1 0 0 1 -42 1 0 1 0 1 0 1 0
-10 1 0 0 0 1 0 1 0 -43 1 0 1 0 1 0 1 1
-11 1 0 0 0 1 0 1 1 -44 1 0 1 0 1 1 0 0
-12 1 0 0 0 1 1 0 0 -45 1 0 1 0 1 1 0 1
-13 1 0 0 0 1 1 0 1 -46 1 0 1 0 1 1 1 0
-14 1 0 0 0 1 1 1 0 -47 1 0 1 0 1 1 1 1
-15 1 0 0 0 1 1 1 1 -48 1 0 1 1 0 0 0 0
-16 1 0 0 1 0 0 0 0 -49 1 0 1 1 0 0 0 1
-17 1 0 0 1 0 0 0 1 -50 1 0 1 1 0 0 1 0
-18 1 0 0 1 0 0 1 0 -51 1 0 1 1 0 0 1 1
-19 1 0 0 1 0 0 1 1 -52 1 0 1 1 0 1 0 0
-20 1 0 0 1 0 1 0 0 -53 1 0 1 1 0 1 0 1
-21 1 0 0 1 0 1 0 1 -54 1 0 1 1 0 1 1 0
-22 1 0 0 1 0 1 1 0 -55 1 0 1 1 0 1 1 1
-23 1 0 0 1 0 1 1 1 -56 1 0 1 1 1 0 0 0
-24 1 0 0 1 1 0 0 0 -57 1 0 1 1 1 0 0 1
-25 1 0 0 1 1 0 0 1 -58 1 0 1 1 1 0 1 0
-26 1 0 0 1 1 0 1 0 -59 1 0 1 1 1 0 1 1
-27 1 0 0 1 1 0 1 1 -60 1 0 1 1 1 1 0 0
-28 1 0 0 1 1 1 0 0 -61 1 0 1 1 1 1 0 1
-29 1 0 0 1 1 1 0 1 -62 1 0 1 1 1 1 1 0
-30 1 0 0 1 1 1 1 0 -63 1 0 1 1 1 1 1 1
-31 1 0 0 1 1 1 1 1 -∞ 1 1 11 1 1 1 1
-32 1 0 1 0 0 0 0 0 - - - - - - - - -
：Initial condition
(6) About power on reset
At ON of supply voltage circuit made initialization inside IC is built-in. Please send data to all address as initial data at
supply voltage on. And please supply mute at set side until this initial data is sent.
Item Symbol Limit Unit Condition
Min. Typ. Max.
Rise time of VCC Trise 20 － － usec VCC rise time from 0V to 5V
VCC voltage of
release power on
reset Vpor － 5.0 － V
17/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
●About Advanced s witching circuit
【1】About Advanced switch
1-1. Effect of Advanced switch
It is the ROHM original tec hnology for prevention of swit ching noise. When gain s witching such as volume and tone
control is done momentarily, a music signal isn't continuous, and unpleasant shock noise is made. Advanced switch
can reduce shock noise with the technology which signal wa ve shape is complemente d so that a music signal may not
continue drastically.
Advanced switch starts switching after the control data from a microcomputer are received. It takes one fixed time,
and wave shape transits as the above figure. The data transmitted by a microcomputer are processed inside, and the
most suitable movement is done inside the IC so that switching shock noise may not be made.
But, it presumes by the transmitting timing wh en it doesn't become intended s witc hing wave shape b ecause it is the
function which needs time. The example in which there are relation with the switching time of the data transmitting
timing and the reality are shown in the following. It asks for design when it is confirmed well.
1-2. About a kind of transmission method
・A data setup except for the item for advanced switch
(p11/27 select address and the data format, the thing which isn't indicated by gray)
There is no regulation in transmission sp ecially.
・The data setup of the item for advanced switch
（p11/27 select address and the data format,, the thing which is indicated b y gra y）
Though there is no regulation in data transmission, the switching order when data are transmitted to several blocks
follows the next 2.
A change of DC voltage
80 20 86
G ain is made to change r ight aft er the dat a transmission mome ntari ly. At this time, a
change of DC volt age oc c urs only in the one for the dif ference of the amplit ude
before and after t he c hange.
T he technology of Advanced sw itching makes t his DC voltage change slow.
W ave of Advanced swit chi ng
I2C BUS
slave select data
18/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
【2】About transmission DATA of advanced s witching item
2-1. About switching time of advanced switch
Advanced switching time are equivalent to the switching time and invalid time(effect-less time) inside the IC, and
switching time and invalid time is equal to 11.2msec x (1±0.4(dispersion margin))
Therefore, actual Advanced switching time (Tsoft) is defined as follows.
Advanced switching time Tsoft is, Tsoft = switching time and invalid time(= switching time x 2).
2-2. About the data transmitting timing in same block state and the switching movement
■ Transmitting example 1
A time chart to the start of switching from the data transmission is as following.
At first, the example are shown as below when the interval time is sufficient in which transmission of the same
blocks.
(Sufficient interval means time which is more than T soft maximum value, 11.2msec x 1.4(dispersion margin) x 2 =
31.4msec
■ Transmitting example 2
Next, when a transmitting interval isn't sufficient (when it is shorter than the above interval), the example is shown.
In case data are transmitted during the first switching movement, the next switching movement is started in
succession after the first switching movement is finished.
Sw itching time
Adva nc ed switching tim e
Tsoft= Sw itching time×2
The total time of 1 time ad van ced sw itching need s 2 times of the sw itching time
Inv alid time
80 28 80
Fader F1
Switching time
I2C BU S
Advanced sw itching time
(F1 0dB )
slave select data AKS
OUTF1
80 28 FF
(F1 –INFdB)
Interval≧Tso f t maximum(=31.4msec)
Invalid time Fader F1
Sw itching t ime Invalid time
80 28 80
I2C BUS
Adva nced switching time
(F1 0dB)
slave select data AKS
OUTF 1
80 28 FF
(F1 –INFdB)
Interval＜Tsoft maximum
(=31.4msec)
Fader F1
Switching time Invali d time Fader F1
Switching time Invali d time
19/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
Volume
‘h20
BS1 BS3
Fader F1
‘h28
Fader F2
‘h29
Loudness
‘h75
Select address
Bass
‘h51
Fader R1
‘h2A
Fader R2
‘h2B
Treble
‘h57
BS2
■ Transmitting example 3
Next, the example of the s witching movement when a transmitting interval was shorte ned more is shown.
Inside the IC, It has the buffer which memorizes data, and a buffer always does transmitting data.
But, data of +4dB which transmitted to the second bec ome invalid with this example b ecause the buffer holds only
the latest data.
■ Transmitting example 4
At first, transmitting data are stored in the maintenance data, and next it is written in the setup data in which gain
is set up to. But, in case there is no difference bet ween the transmitting data and the setup data as a r efresh data,
Advanced switch movement isn't started.
2-3. About the data transmitting timing and the switching movement in several block state
When data are transmitted to several blocks, treatment in the BS (bl ock state) unit is carried out inside the IC. The
order of advanced switch movement start is decided in advance depe ndent on BS.
The order of advanced switch start
※It is possible that blocks in the same BS start switching at the same timing.
Data of -8dB recei ved from buffer : 0dB→-8dB
80 28 80 80 28 04 80 28 88
+4dB
I2C BUS
Fader F1 bu fferd da ta
(FaderF1 0dB) (FaderF1 +4B) (FaderF1 -8B)
T h is is inv alid as a r e s u lt. Only an end is effective in the dat a tr ansmitted duri ng F1 swi tching.
Advanced switching time
-8dB
Data of 0dB received : -∞→0dB
0dB
Replacement
Fader F1
swit ching time Invalid time Fader F1
swit c hing time Invalid time
80 28 80
I2C BUS
Ad vance d sw itching time
(FaderF1 0dB)
Refresh data
80 28 80
(FaderF1 0dB)
Because receiving as refresh-data,
Advanced switching doesn't start.
Fader F1
switching time Invalid
time
Figure 16. The example of the timing of command of in I
2
Cdata transmitting
20/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
■ Transmitting example 5
About the transmission to several blocks also, as explained in the previous section, though there is no restriction of the
I2C BUS data transmitting timing, the start timing of switching follows the figure of previous page, figure16.
Therefore, it isn't based on the data transmitting order, and an actual switching order becomes as the figure16
(Transmitting example 6).
Each block data is being transmitted separately in the transmitting example 5, but it becomes the same result even if
data are transmitted by automatic increment.
■ Transmitting example 6
When an actual switching order is different from the transmitting order or data except for the same BS are transmitted at
the timing when advanced switch movement isn't finished, switching of the next BS is done after the present switching
completion .
■ Transmitting example 7
In this example, data of BS2 and BS3 are transmitted during Advances switching of BS2(same BS2 group) .
0dB receive d from buffe r –INF→0dB
80 28 80 80 51 06
I2C BUS
Fader R1 buffered data
BS2
(FaderF1 0dB) BS2
(BASS +6dB)
The different data (BASS) of the same BS2 group during adva nced switching of (F1) are tra ns mitted.
Ad vanced switching time
0dB recei ve d -∞→0dB 6dB receive d from b uffe r 0dB→+6dB
80 2A 80
BS3
(FaderR1 0dB)
6dB
BASS buffered data
Fader F 1
switchi ng time Invalid time Fader R1
switchi ng time Invalid time BASS
switchi ng time Invalid time
OUTF1
80 20 80 80 28 06 80 2A 06
Volume
Switching time
I2C BUS
Advanced switch time
Start after advanced switch of
VOLUME
Start after advanced sw itch of
Fader F1
(VOLUME 0dB) (FaderF 1 +6dB) ( FaderR 1 +6dB)
slave select data AKS
Inva lid
time Fader F1
Switching time Inv alid
time Fader R1
Switching time Inva lid
time
OUTR1
VOLUME
Sw itching time
Advanced sw itching time
80 20 80 80 2A 80 80 28 80
I2C BUS (VOLUME 0dB) (FaderR1 0dB) (FaderF1 0dB)
slave select data
Inva lid time Fader F1
Switching time Inva lid tim e Fader R1
Switching time
Inva lid time
21/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
2-4. About gain switching of TONE(Bass/ Treble)
When gain is changed from boost to cut (or, from cut to boost), advanced switching is two-step transition movement
that it go through 0dB to prevent the occurrence of the switching noise. And when boost/cut doesn't change between
before switching and after switching, advanc ed switching is the same as 2-2, 2-3. About advanced s witching time, it is
same time length as other switching time length.
■ Transmitting example 8
In case changing Bass gain + 15dB from -15dB
【3】Advanced switch transmitting timing list
3-1. Volume/Fader(F1,F2,R1,R2)/TONE(BASS,TREBLE,LOUDNESS)
Advanced switch stand by Advanced switch active
Transmission timing optional optional
Start timing Starts right after the data
transmission Starts right after present
switching was finished.
Advanced switching
time Tsoft※1 T
soft
3-2. TONE BOOST ⇔ CUT
Advanced switch stand by Advanced s witch active
Transmission timing optional optional
Start timing Starts right after the data
transmission Starts right after present
switching was finished.
Advanced switching
time Tsoft※2 T
soft
※1 Advanced switching time Tsoft equalls to 2times of swithcing time.
※2 About Tsoft of TONE BOOST⇔CUT, the time length until gain switching finishes is equal to 2times of swithcing
time, because it go through 0dB when switching from initial gain to requested gain. In this case, Advanced
switching time is same as ※1 above.
80 51 0F
I2C BUS
Ad vanced switching time
-15d B → 0dB 0dB → +15dB
(BASS+15dB)
OU TF1
Tsoft=switching time×2
BASS
S wit c hing tim e BASS
S wit c hing tim e
22/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
●Application Circuit Diagram
Figure 17. Application Circuit Diagram
Notes on wiring
①Please connect the decoupling capacitor of a power supply in the shortest distance as much as possible to GND.
②Lines of GND shall be one-point connected.
③Wiring pattern of Digital shall be away from that of analog unit and cross-talk shall not be acceptable.
④Lines of SCL and SDA of I2C BUS shall not be parallel if possible.
The lines shall be shielded, if they are adjacent to each other.
⑤Lines of analog input shall not be parallel if possible. The lines shall be shielded, if they are adjacent to each other.
UNIT
RESISTANCE: Ω
CAPACITANCE: F
VREF
GND
SDA
SCL
2.2μ
0.1μ
OUTF1 OUTR1
（About single input C, it is possible to change from
single input to GND Isolation input.）
10μ
2.2μ
2.2μ 2.2μ
2.2μ 10μ10μ
CN1 B1CP1
D1
2.2μ
CN2
2.2μ
CP2
2.2μ
B2 OUTR2
OUTF2
10μ
VCC
GND Isolation
10μ
D2
2.2μ
A2
10μ
A1
N.C.
GND Isolation
2.2μ
■Output Gain
Gain：0dB/6dB
F1/F2/R1/R2
■Fader Volume
Gain:0dB～-63ｄB、-INF/1dB step
■Bass/Treble (f0=100/10k)
Gain：+20dB～-20dB/1dB step
■Loudness f0=650,1.3kHz
Gain: 15dB～0dB/1dB step
19
TREBLE
1 2 3 4 5 6 7 8
11
121314
15
17
100k
100k
25k
VCC
■VOLUME
ATT：0dB～-36dB/1dB step, -INF dB
■Input Gain
Gain：+20dB～0dB/1dB step
BASS
100k
Input Gain
Loudness
/ Anti-aliasing
Advanced
switch
I2C BUS
LOGIC
VOLUME
Input selector
(3 single-end and 1 stereo ISO)
Input selector
(3 single-end and 1 stereo ISO)
FADER FADER
Input Gain
FADER FADER
16
20
100k 100k
100k
10
VREF
9
18
25k
25k
25k
25k
25k
25k
25k
23/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
●Thermal Derating Curve
About the thermal design by the IC
Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum
ratings may degrade and destroy elements. Careful consideration mu st be given to the heat of the IC from the two standpoints
of immediate damage and long-term relia bility of operation.
Figure 18. Temperature Derating Curve
Power dissipation values vary according to the board on which the IC is mounted.
Note) Values are actual measurements and are not guaranteed.
SSOP-B20
1.5
1.0
0.5
0.0 0 25 50 75 100 125
150
Ambient Temperature Ta（℃）
Power Dissipation Pd (W)
937mW
θja = 133.3℃/W
85
Reference data
Measurement condition: ROHM Standard board
board Size：70×70×1.6(㎣)
material：A FR4 grass epoxy board
(3% or less of copper fo il area)
24/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
●Terminal Eq uivalent Circuit and Description
Terminal Name Terminal
Voltage Equivalent Circuit Terminal Description
A1
A2
B1
B2
D1
D2
4.2
A terminal for signal input.
The input impedance is 100kΩ(typ).
CP1
CP2 4.2
A terminal for positive input of ground
isolation amplifier.
CN1
CN2 4.2
A terminal for negative input of ground
isolation amplifier.
SCL -
A terminal for clock input of I
2
C BUS
communication.
SDA -
A terminal for data input of I
2
C BUS
communication.
GND
VCC
1.65V
25/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
Terminal
Name Terminal
Voltage Equivalent Circuit Terminal Description
OUTF1
OUTR1
OUTR2
OUTF2
4.2
A terminal for fader output.
N.C. - Non connect terminal
VCC 8.5 Power supply terminal.
GND 0 Ground terminal.
VREF 4.2
BIAS terminal.
Voltage for reference bias of analog
signal system. The simple pre-charge
circuit and simple discharge c ircuit for
an external capacitor are built in.
※The figure in the pin explanation and input/output equivalent circuit is reference value, it doesn’t guarantee the value.
26/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
●Operational Notes
1. Absolute-Maximum-Rating V oltage
When voltage is impressed to VCC exceeding absolute-maximum-rating voltage, circuit current increase rapidly, and it
may result in property degradation and destruction of a device.
When impressed by a VCC terminal (9pin) es pecially by serge examination etc., even if it includes an of operation
voltage + serge pulse component, be careful not to impress voltage (about 14V) greatly more than
absolute-maximum-rating vol tage.
2. About a signal input part
1) About constant set up of input coupling capacitor
In the signal input terminal, the constant setting of input coupling capacitor C(F) be sufficient input impedance
RIN(Ω) inside IC and please decide. The first HPF characteristic of RC is composed.
Figure 19. Input SHORT circuit
2) About the input SHORT
SHORT mode is the command which makes switch SSH =ON an input selector part and input impedance RIN of all
terminals, and makes resistance small. Switch SSH is OFF when not choosing a SHORT command.
A constant time becomes small at the time of this command twisting to the resistance inside the capacitor
connected outside and LSI. The charge time of a capacitor becomes short.
Since SHORT mode turns ON the switch of SSH and makes it low impedance, please use it at the time of a
non-signal.
3. About output load characteristics
The usages of load for output are below (reference). Please use the load more than 10kΩ(TYP).
The target output terminal
Terminal
No. Terminal
Name Terminal
No. Terminal
Name
7 OUTF1 8 OUTR1
15 OUTF2 14 OUTR2
Fig.16 Output Load Characteristic Vcc=8.5V(reference data)
VCC=8.5V
THD+n=1%
BW=400 to 30kHz
C〔F〕
RIN
〔Ω〕
INPUT
SSH
2
IN)
2
IN
(2πfCR1
)(2πfCR
A(f)
0
A(f)
G〔dB〕
f〔Hz〕
Rload[Ω]
27/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a
reference to help reading the formal versi on.
If there are any differences in translation version of this docum ent formal version takes priority
●Ordering Information
B D 3 7 5 0 3 F V E 2
Part Number
Package
FV: SSOP-B20
Packaging and forming specific ation
E2: Embossed tape and reel
(SSOP-B20)
●Physical Dimension Tape and Reel Information
●Marking Diagram(s)(TOP VIEW)
SSOP-B20(TOP VIEW)
BD37503
Part Number Marking
LOT Number
1PIN MARK
(Unit : mm)
SSOP-B20
0.1
11
10
20
1
0.1± 0.1
6.4 ± 0.3
4.4 ± 0.2
6.5 ± 0.2
0.15 ± 0.1
0.22 ± 0.1
0.65
1.15 ± 0.1
0.3Min.
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
28/28
Datasheet
Datasheet
BD37503FV
TSZ02201-0V2V0E100000-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 2013.07.12 Rev.002
www.rohm.co.jp
TSZ22111・15・001
●Revision History
Date Revision Changes
03.Aug.2012 001 New Release
03.Jul.2013 002 2/28 Figure2 Correction
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
