SN74LS145N3 - Texas Instruments

PACKAGING INFORMATION

Orderable Device Status (1) Package

Type Package

Drawing Pins Package

Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)

5962-8508401VEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type

85084012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

8508401EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type

8508401FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type

SN54LS145J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type

SN74145N ACTIVE PDIP N 16 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type

SN74145N3 OBSOLETE PDIP N 16 TBD Call TI Call TI

SN74145NE4 ACTIVE PDIP N 16 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type

SN74LS145D ACTIVE SOIC D 16 40 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS145DE4 ACTIVE SOIC D 16 40 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS145DG4 ACTIVE SOIC D 16 40 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS145DR ACTIVE SOIC D 16 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS145DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS145DRG4 ACTIVE SOIC D 16 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS145N ACTIVE PDIP N 16 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type

SN74LS145N3 OBSOLETE PDIP N 16 TBD Call TI Call TI

SN74LS145NE4 ACTIVE PDIP N 16 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type

SN74LS145NSR ACTIVE SO NS 16 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS145NSRE4 ACTIVE SO NS 16 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LS145NSRG4 ACTIVE SO NS 16 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SNJ54145J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type

SNJ54LS145FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

SNJ54LS145J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type

SNJ54LS145W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

PACKAGE OPTION ADDENDUM

www.ti.com 11-Nov-2009

Addendum-Page 1

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

PACKAGE OPTION ADDENDUM

www.ti.com 11-Nov-2009

Addendum-Page 2

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

SN74LS145DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1

SN74LS145NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 11-Nov-2009

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

SN74LS145DR SOIC D 16 2500 333.2 345.9 28.6

SN74LS145NSR SO NS 16 2000 346.0 346.0 33.0

PACKAGE MATERIALS INFORMATION

www.ti.com 11-Nov-2009

Pack Materials-Page 2

MECHANICAL DATA

MLCC006B – OCTOBER 1996

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER

4040140/D 10/96

28 TERMINAL SHOWN

0.358

(9,09)

MAX

(11,63)

0.560

(14,22)

0.560

0.458

0.858

(21,8)

1.063

(27,0)

(14,22)

NO. OF

MINMAX

0.358

0.660

0.761

0.458

0.342

(8,69)

MIN

(11,23)

(16,26)

0.640

0.739

0.442

(9,09)

(11,63)

(16,76)

0.962

1.165

(23,83)

0.938

(28,99)

1.141

(24,43)

(29,59)

(19,32)(18,78)

0.020 (0,51)

TERMINALS

0.080 (2,03)

0.064 (1,63)

(7,80)

0.307

(10,31)

0.406

(12,58)

0.495

(12,58)

0.495

(21,6)

0.850

(26,6)

1.047

0.045 (1,14)

0.035 (0,89)

0.010 (0,25)

1314151618 17

432

0.020 (0,51)

0.010 (0,25)

12826 27

B SQ

A SQ 22

0.055 (1,40)

0.045 (1,14)

0.028 (0,71)

0.022 (0,54)

0.050 (1,27)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a metal lid.

D. The terminals are gold plated.

E. Falls within JEDEC MS-004

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