(0.635 mm) .025" QFSS SERIES
Increased insertion
depth for rugged applications
QFSS–026–04.25–L–D–A
QFSS–078–04.25–L–D–A
QFSS–052–04.25–L–D–PC4
Standard shield grounding
is GSSSSG. Application
Specific options available.
11 mm
Stack Height
Single-Ended
Signal routing
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
(7.06)
.278
(7.44)
.293
(8.13)
.320
(2.54)
.100
(1.02) .040 DIA
(0.89)
.035
(0.10)
.004
(1.78)
.070
No. of Banks x (21.34) .840 + (12.87) .507
(2.54)
.100
(21.34) .840
(2.10) .083
No. of Banks x (21.34) .840 + (1.02) .040
(0.23)
.009
02
02
01
01
(0.635)
.025
(8.13)
.320
(2.00) .07874
For complete specifications and
recommended PCB layouts see
www.samtec.com?QFSS
Insulator Material:
Liquid Crystal Polymer
Contact, Ground
Plane & Shield Material:
Phosphor Bronze
Plating:
Au over 50 µ" (1.27 µm) Ni
(Tin on Ground Plane tails)
Voltage Rating:
300 VAC mated with QMSS
Operating Temp:
-55 °C to +125 °C
RoHS Compliant:
Ye s
–PC4 OPTION
QFSS PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
–026, –052, –078
(52 total pins per bank
40 signals + 12 grounds to shield = –D)
–016, –032, –048
(16 pairs per bank = –D–DP)
–L
= 10 µ" (0.25 µm)
Gold on Signal
Pins, Shield and
Ground Plane
(Tin on Signal Pin
tails, and Ground
Plane tails)
–D
= Single-Ended
–D–DP
= Differential Pair
TYPE AOTHER
OPTION
–PC4
= 4 Power
Pins/End
(N/A with –A)
04.25
–D
–D–DP See SO Series for precision
machined standoffs.
SHIELDED GROUND PLANE SOCKET
APPLICATION
OTHER
SOLUTIONS
QFSS
QMSS
(11.00)
.433
(1.30 mm)
.051"
NOMINAL
WIPE
ALSO AVAILABLE
(MOQ Required)
SPECIFICATIONS
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
FILE NO. E111594
PROCESSING
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (026-078)
Board Stacking:
For applications requiring more
than two connectors per board,
contact ipg@samtec.com
• Increased
insertion depth
• Integral guide post
Board Mates:
QMSS
Standoffs:
SO
Gbps
14
HIGH-SPEED CHANNEL PERFORMANCE
QMSS-DP/QFSS-DP @ 11 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
• Headers without
Alignment Pins
• 8 Power Pins/End
• 4 or 8 Power Pins/End for
(2.36 mm) .093" thick board
• Guide Holes
• 64 (-DP) and 104 pins per row
Notes:
Patented
Some lengths, styles and
options are non-standard,
non-returnable.
F-219
