Mar
.
201
3. V
ersion 2.0
MagnaC
hip Semiconducto
r Ltd
.
1
MP
K
C2
SA/
CA1
5
0U40
40
0V FRD Module
A
bsolute Maximum Ra
tings
@Tc = 25
o
C (Per
Leg)
Characterist
ics
Conditions
Symbol
Rating
Unit
Repetitive Peak
Reverse Voltag
e
V
RRM
400
V
Reverse DC Vol
tage
V
R(DC)
3
20
V
Average Forw
ard
Current
T
C
=25
o
C
Resistive Load
I
F(AV)
3
00
A
T
C
=
10
0
o
C
150
A
Surge(non-r
epetitive) Forw
ard
Current
One Half Cy
cle at 60Hz,
Peak Value
I
FSM
2
75
0
A
I
2
t for Fusing
Value for One Cy
cle Curren
t,
t
w
= 8.3ms, T
j
= 25
℃
Start
I
2
t
31.3* 10
3
A
2
s
Junction
T
e
mperature
T
J
-40 ~ 1
50
℃
Maximum Pow
er Dissipation
P
D
500
W
Isolation
Voltage
@AC 1 minutes
V
isol
2500
V
Storage Temper
ature
T
stg
-40 ~ 1
25
℃
Mounting Torqu
e
-
4.0
N.m
Terminal Torque
Typical Including
Screws
-
3.0
N.m
Weight
-
180
g
Product
Name
MPKC2SA150U40
MPKC2CA150U40
Optional
Information
Side Comm
on
Center Comm
on
MP
K
C2
S
A
/CA150U40
400V FRD Module
General Description
Ultra-FRD module devices ar
e optimized to red
uce losses
and EMI/RFI in high frequency p
ower conditioning electr
ical
systems.
These diode modules ar
e ideally suited for po
wer converters,
Motors drives and othe
r applications where switching
losses
are significant portion of th
e total losses.
5
DM
-2
Features
Repe
titive Reverse V
oltage : V
RRM
= 400V
Lo
w Forward V
oltage
: V
F
(typ.)
=
1.0V
Average Forward Current : I
F
(
Av
.)=150A
@T
C
=100
℃
Ultra
-Fast Reverse Recovery
T
ime : t
rr
(typ.) =
35
ns
E
xtensive Characterization of
Recovery Parameters
Redu
ced EMI and RFI
Is
olation T
ype Package
A
pplications
Hig
h Speed & High Power converters,
Welders
V
arious
Switching and T
elecommunication Power Supply
E
301932
Ordering Information
Mar
.
201
3. V
ersion 2.0
MagnaC
hip Semiconducto
r Ltd
.
2
MP
K
C2
SA/
CA1
5
0U40
40
0V FRD Module
Electrical Characteristics
@Tc = 25
o
C
(unle
ss otherwise
specified)
Characterist
ics
Conditions
Symbol
Min.
Typ.
Max.
Unit
Cathode Anode
Breakdow
n Voltage
I
R
=100uA
V
R
400
-
-
V
Diode Max
imum Forwar
d Voltage
I
F
=1
5
0A
T
C
=25
℃
V
FM
-
1.0
1.
3
V
T
C
=100
℃
-
0.9
-
Diode Peak Rev
erse Recovery Cu
rrent
T
c
=100
℃
,
V
RRM
applied
T
C
=100
℃
I
RRM
-
-
1.0
mA
Diode Reve
rse Recovery Ti
me
I
F
=1
A,
V
R
=30V
di/dt = -300A/uS
T
C
=
25
℃
t
rr
-
35
50
ns
Diode Reve
rse Recovery Ti
me
I
F
=150
A,
V
R
=200V
di/dt = -300A/uS
T
C
=25
℃
t
rr
-
80
-
ns
T
C
=100
℃
-
110
-
Thermal Characteristics
Characterist
ics
Conditions
Symbol
Min.
Typ.
Max.
Unit
Thermal Resistan
ce(Isolation Typ
e)
Junction to
Case
R
th(j-c)
-
-
0.25
℃
/W
Mar
.
201
3. V
ersion 2.0
MagnaC
hip Semiconducto
r Ltd
.
3
MP
K
C2
SA/
CA1
5
0U40
40
0V FRD Module
Fig.1 T
ypical Forward V
oltage Drop
vs. Instantaneous Forw
ard Current
Fig.2 T
ypical Reverse R
ecovery Time
V
s.
–
di/dt
Fig.3T
ransient T
hermal Imp
edance(Zthjc)
Characteristics
Fig.4Forward Current
Derating Curve
0.0
0.5
1.0
1.5
0
50
100
150
200
250
300
Forward Current,I
F
[A]
T
C
=25
℃
T
C
=125
℃
Forward Voltage
Drop,V
F
[V]
200
400
600
800
1000
0
25
50
75
100
Reverse R
ecovery Time[n
s]
di/dt[A/us]
1E-5
1E-4
1E-3
0.01
0.1
1
10
1E-4
1E-3
0.01
0.1
1
T
C
=25
℃
Thermal Response Zthjc[
℃
/W]
Rectangular Pulse Duration
Time[sec]
0
20
40
60
80
100
120
140
160
0
50
100
150
200
250
300
350
400
DC
Average Forward
Current,I
F(AVG)
[A]
Case Temperatute, Tc[
℃
]
Mar
.
201
3. V
ersion 2.0
MagnaC
hip Semiconducto
r Ltd
.
4
MP
K
C2
SA/
CA1
5
0U40
40
0V FRD Module
Package Dimension
5
DM
-2
Dimensions are in mil
limeters, unles
s otherwise specified
T
BD
T
BD
Mar
.
201
3. V
ersion 2.0
MagnaC
hip Semiconducto
r Ltd
.
5
MP
K
C2
SA/
CA1
5
0U40
40
0V FRD Module
DISCLAIMER:
The
Prod
ucts
are
not
designed
for
use
i
n
hostile
environments,
including,
without
limitation,
aircraft,
nuclear
power
generation,
medical
appliances,
and
devices
or
systems
in
which
mal
function
of
any
Product
can
reasonably
be
expected
to
result
in
a
personal
injury.
Seller’s
customers
using
or
selling
Seller’s
products
for
use
in
such
applications do so at their own risk and agree to fully defend and indemnify
Seller.
MagnaC
hip reserves
the
right t
o change the
specifications and
circuitry
without
notice
at any
time. MagnaChip does
not c
onsider responsibility
for
use
of
any
circuitry
other
than
circuitry
entirely
inc
luded
in
a
Magna
Chip
product.
is
a
registered
trade
mark
of
MagnaChip
Semiconductor
Ltd.
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