EC1078B-PCB - WJ Communications, Inc.

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 1 of 4 April 2006

EC1078

InGaP HBT Gain Block Product Information

The Communications Ed

e TM

Product Features

• DC – 3.5 GHz

• +21 dBm P1dB at 1 GHz

• +37 dBm OIP3 at 1 GHz

• 20 dB Gain at 1 GHz

• 4.4 dB Noise Fi gu re at 2 GHz

• Available in Lead-free / green

SOT-89 Package Style

• Internally matched to 50 Ω

Applications

• Mobile Infrastru cture

• CATV / FTTX

• W-LAN / ISM

• RFID

• WiMAX / WiBro

Product Description

The EC1078B is a general-purpose buffer amplifier that

offers high dynamic range in a low-cost surface-mount

package. At 1000 MHz, the EC1078B typically provides 20

dB of gain, +37 dBm Output IP3, and +21 dBm P1dB.

The EC1078B consists of Darlington pair amplifiers using

the high reliability InGaP/GaAs HBT process technology

and only requires DC-blocking capacitors, a bias resistor,

and an inductive RF choke for operation. The device is

ideal for wireless applications and is available in a low-cost,

surface-mountable lead-free/green/RoHS-compliant SOT-

89 package. All devices are 100% RF and DC tested.

The broadband MMIC amplifier can be directly applied to

various current and next generation wireless technologies

such as GPRS, GSM, CDMA, and W-CDMA. In addition,

the EC1078B will work for other various applications

within the DC to 3.5 GHz frequency range such as CATV

and mobile wireless.

Functional Diagram

RF IN GND RF OUT

GND

1 23

Function Pin No.

Input 1

Output/Bias 3

Ground 2, 4

Specifications (1)

Parameter Units Min Typ Max

Operational Bandwidth MHz DC 3500

Test Frequency MHz 1000

Gain dB 20

Output P1dB dBm +21

Output IP3 (2) dBm +37

Test Frequency MHz 2000

Gain dB 17

Large-signal Gain (3) dB 14.7 16

Input Return Loss dB 12

Output Return Loss dB 8

Output P1dB dBm +20

Output IP3 (2) dBm +33

Noise Figure dB 4.4

Test Frequency MHz 3000

Gain dB 13 14.5

Device Voltage V 5.3 5.6 5.9

Device Current mA 96

1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +7 V, Rbias = 14 Ω, 50 Ω Sy s tem.

2. 3OIP measured with two tones at an output power of +7 dBm/tone separated by 1 MHz. The

suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.

3. Large-signal gain is tested with an input power level of +3 dBm.

Absolute Maximum Rating

Parameter Rating

Operating Case Temperature -40 to +85 °C

Storage Temperature -55 to +150 °C

Device Current 150 mA

RF Input Power (continuous) +12 dBm

Junction Temperature +250 °C

Operation of this device above any of these parameters may cause permanent damage.

Typical Performance (1)

Parameter Units Typical

Frequency MHz 500 900 1900 2140

S21 dB 20.7 20 17.2 16.6

S11 dB -13 -14 -14 -15

S22 dB -12 -12 -12 -12

Output P1dB dBm +20.6 +21 +20.5 +20

Output IP3 (2) dBm +37.5 +37 +33.5 +32.5

Noise Figure dB 3.1 3.5 4.3 4.4

Ordering Information

Part No. Description

EC1078B-G InGaP HBT Gain Block

(lead-free/green/RoHS-compliant SOT-89 package)

EC1078B-PCB 700 – 2400 MHz Fully Assembled Eval. Board

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 2 of 4 April 2006

EC1078

InGaP HBT Gain Block Product Information

The Communications Ed

e TM

Typical Device RF Performance

Supply Bias = +7 V, Rbias = 14 Ω, Icc = 96 mA

Frequency MHz 100 500 900 1900 2140 2400 3500

S21 dB 21.2 20.7 20 17.2 16.6 15.9 13.5

S11 dB -13 -13 -14 -14 -15 -15 -13

S22 dB -11 -12 -12 -12 -12 -11 -9.2

Output P1dB dBm +20 +20.6 +21 +20.5 +20 +19

Output IP3 dBm +38 +37.5 +37 +33.5 +32.5 +32

Noise Figure dB 3.4 3.5 3.5 3.8 3.8 3.9

1. Test conditions: T = 25º C, Supply Voltage = +7 V, Device Voltage = 5.6 V, Rbias = 14 Ω, Icc = 96 mA typical, 50 Ω System.

2. 3OIP measured with two tones at an output power of +7 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.

3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. The performance data does not

account for losses attributed to recommended input and output series resistances shown in the application circuit on page 3.

Gain vs. Frequency

0123456

Frequency (GH z)

Gain

(

)

S11, S22 vs. Frequency

-20

-16

-12

-8

-4

0123456

Frequency (GHz)

S11, S22

(

)

S22

S11

Icc vs. Vde

120

160

200

02468

Vde (V)

Icc

(

)

25°C

O IP3 vs. Frequency

500 1000 1500 2000 2500 3000

Frequency (MH z)

OIP3

(

dBm

)

25°C 85°C -40°C

Noise Figure vs. Frequency

500 1000 1500 2000

Frequency (M Hz)

(

)

P1dB vs. Frequency

500 1000 1500 2000 2500 3000

Frequency (M Hz)

P1dB

(

dBm

)

25°C 85°C -40°C

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 3 of 4 April 2006

EC1078

InGaP HBT Gain Block Product Information

The Communications Ed

e TM

Recommended Application Circuit (EC1078B-PCB)

Recommended Component Values

Reference Frequency (MHz)

Designator 50 500 900 1900 2200 2500 3500

L1 820 nH 220 nH 68 nH 27 nH 22 nH 18 nH 15 nH

C1, C2, C3 .018 µF 1000 pF 100 pF 68 pF 68 pF 56 pF 39 pF

1. The proper values for the components are dependent upon the intended frequency of operation.

2. The component values in the table below are contained on the evaluation board to achieve optimal broadband

performance.

3. R1 and R2 are shown in the circuit diagram to avoid potential instab ilities. The configurati on shown above assu res

of unconditional stability with the use of the device. It is expected that linearity parameters (OIP3 and P1dB) to

degrade about only 0.5 dB, while overall gain will be about 1 dB less than the performance shown in page 1 and 2 of

this data sheet. Input and output return loss is expected to improve with the use of the I/O series resi stances at 2 GHz.

Ref. Desig. Value / Type Size

L1 39 nH wirewound inductor 0603

C1, C2 56 pF chip capacitor 0603

C3 0.018 μF chip capacitor 0603

C4 Do Not Place

R1 6 Ω chip resistor 0603

R2 6 Ω chip resistor 0603

R3 14 Ω 1% tolerance 2010

Recommended Bias Resistor Values

Supply

Voltage R bias value Size

7 V 14.6 ohms 1210

8 V 25 ohms 1210

9 V 35 ohms 2010

10 V 46 ohms 2010

12 V 67 ohms 2512

The proper value for R bias is dependent upon the

supply voltage and allows for bias stability over

temperature. WJ recommends a minimum supply bias

of +7 V. A 1% tolerance resistor is recommended.

Typical Device S-Parameters

S-Parameters (Vdevice = +5.6 V, ICC = 96 mA, T = 25°C, calibrated to device leads)

Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)

50 -13.94 -3.83 21.57 176.70 -24.12 0.80 -11.86 -4.93

500 -13.75 -39.71 20.96 148.92 -23.37 6.98 -11.69 -48.17

1000 -13.18 -77.85 19.93 122.53 -22.08 8.80 -10.82 -90.17

1500 -12.31 -113.82 18.86 98.71 -20.68 4.63 -9.54 -126.09

2000 -11.09 -148.03 17.94 76.48 -19.38 -1.93 -8.31 -158.11

2500 -9.97 -177.99 16.84 54.17 -18.50 -11.42 -7.34 173.96

3000 -8.87 154.89 15.65 33.67 -17.80 -21.55 -6.41 148.41

3500 -7.79 129.58 14.44 13.81 -17.41 -32.42 -5.63 125.43

4000 -6.76 106.00 13.18 -5.36 -17.25 -43.17 -4.78 105.05

4500 -5.72 85.30 11.80 -23.83 -17.22 -53.97 -4.07 86.50

5000 -4.72 66.77 10.39 -41.03 -17.40 -64.41 -3.41 70.24

5500 -3.91 51.00 8.85 -57.10 -17.84 -74.10 -2.93 56.07

6000 -3.22 37.49 7.41 -71.74 -18.28 -83.92 -2.53 43.40

Device S-parameters are available for download off of the website at: http://www.wj.com

Blocking

Capacitor

RF OUT

RF Choke

0.018 µF

Bias

Resisto

RF IN

Bypass

Capacito

Blocking

acito

Vcc

Icc = 96 mA

EC1078B

6 Ω R2

6 Ω

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 4 of 4 April 2006

EC1078

InGaP HBT Gain Block Product Information

The Communications Ed

e TM

EC1078B-G Mechanical Information

This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free

(maximum 260°C reflow temperature) and leaded (maximum 245°C reflow temperature) soldering processes.

Outline Drawing

Land Pattern

Product Marking

The component will be marked with an

“1078G” designator with an alphanumeric lot

code on the top surface of the package. The

obsolete tin-lead package is marked with an

“1078” designator followed by an

alphanumeric lot code.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

MSL / ESD Rating

ESD Rating: Class 1A

Value: Passes between 250 and 500V

Test: Human Body Model (HBM)

Standard: JEDEC Standard JESD22-A114

MSL Rating: Level 3 at +260 °C convection reflow

Standard: JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper p erformance o f this

device. Vias should use a .35mm (#80 / .0135”) diameter drill and

have a final plated thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers near the

part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the board to a

heatsink. Ensure that the ground / thermal via region contacts the

heatsink.

4. Do not put solder mask on the backside of the PC board in the

region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material and

construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in degrees.