TLP2403
1
Photocouplers GaAℓAs Infrared LED & Photo IC
TLP2403
TLP2403
TLP2403
TLP2403
1.
1.
1.
1. Applications
Applications
Applications
Applications
High-Speed Digital Interfacing for Instrumentation and Control Devices
Simplex/Multiplex Data Transmission
2.
2.
2.
2. General
General
General
General
The Toshiba TLP2403 consists of a high-output GaAℓAs light-emitting diode coupled with a high-speed photo-
diode-transistor chip. It is housed in the SO8 package.
The TLP2403 uses a high-speed, high-gain detector element and thus is ideal for applications which require low-
input current and high-speed data transmission.
3.
3.
3.
3. Features
Features
Features
Features
(1) Package: SO8
(2) Operating temperature: -40 to 100
(3) Current transfer ratio: 400% (min) @IF = 0.5 mA
(4) Maximum output current: 60 mA
(5) Propagation delay time: tpHL = 2 µs (typ.), tpLH = 4 µs (typ.) @ RL = 4.7 k, IF = 0.5 mA
(6) Isolation voltage: 3750 Vrms (min)
(7) Safety standards
UL-approved: UL1577 File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A, File No.E67349
VDE-approved: Option (V4) EN60747-5-2 (Note)
(Note)
(Note)
(Note)
Note: When an EN60747-5-2 approved type is needed, please designate the Option (V4)
Option (V4)
Option (V4)
Option (V4).
4.
4.
4.
4. Packaging and Pin Configuration
Packaging and Pin Configuration
Packaging and Pin Configuration
Packaging and Pin Configuration
1: NC
2: Anode
3: Cathode
4: NC
5: GND (Emitter)
6: Output (Collector)
7: Base
8: VCC
SO8
2010-09-06
Rev.1.0
TLP2403
2
5.
5.
5.
5. Internal Circuit
Internal Circuit
Internal Circuit
Internal Circuit
Fig.
Fig.
Fig.
Fig. 5.1
5.1
5.1
5.1 Internal Circuit
Internal Circuit
Internal Circuit
Internal Circuit
6.
6.
6.
6. Principle of Operation
Principle of Operation
Principle of Operation
Principle of Operation
6.1.
6.1.
6.1.
6.1. Mechanical Parameters
Mechanical Parameters
Mechanical Parameters
Mechanical Parameters
Characteristics
Creepage distances
Clearance
Internal isolation thickness
Min
4.0
4.0
Unit
mm
2010-09-06
Rev.1.0
TLP2403
3
7.
7.
7.
7. Absolute Maximum Ratings (Note)
Absolute Maximum Ratings (Note)
Absolute Maximum Ratings (Note)
Absolute Maximum Ratings (Note)
Unless otherwise specified, Ta = 25
LED
Detector
Common
Characteristics
Forward current
Forward current derating
Pulse forward current
Pulse forward current derating
Transient pulse forward current
Transient pulse forward current
derating
Reverse voltage
Power dissipation
Power dissipation derating
Output current
Output current derating
Output voltage
Supply voltage
Emitter-base reverse voltage
Output power dissipation
Output power dissipation
derating
Operating temperature
Storage temperature
Lead soldering temperature
Isolation voltage
(Ta 85)
(Ta 85)
(Ta 85)
(Ta 85)
(Ta 25)
(Ta 25)
(10 s)
AC, 1 min, R.H. 60%
Symbol
IF
IF/
IFP
IFP/
IFPT
IFPT/
VR
PD
PD/
IO
IO/
VO
VCC
VEB
PO
PO/
Topr
Tstg
Tsol
BVS
Note
(Note 1)
(Note 2)
(Note 3)
Rating
20
-0.67
40
-1.0
1
-25
5
40
-1.0
60
-0.6
-0.5 to 18
-0.5 to 18
0.5
100
-1.0
-40 to 100
-55 to 125
260
3750
Unit
mA
mA/
mA
mA/
A
mA/
V
mW
mW/
mA
mA/
V
mW
mW/
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width (PW) 1 ms, duty = 50%
Note 2: Pulse width (PW) 1 µs, 300 pps
Note 3: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
8.
8.
8.
8. Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Characteristics
Forward current
Output current
Supply voltage
Operating temperature
Symbol
IF
IO
VCC
Topr
Note
(Note 1)
Min
0.5
-40
Typ.
Max
15
30
16
100
Unit
mA
V
Note: The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this datasheet should also be considered.
Note 1: Denotes the operating range, not the recommended operating condition.
2010-09-06
Rev.1.0
TLP2403
4
9.
9.
9.
9. Electrical Characteristics (Note)
Electrical Characteristics (Note)
Electrical Characteristics (Note)
Electrical Characteristics (Note)
Unless otherwise specified, Ta = 0 to 100
Characteristics
Input forward voltage
Input temperature coefficient
of forward voltage
Input reverse current
Input capacitance
High-level output current
High-level supply current
Low-level supply current
Current transfer ratio
Low-level output voltage
Symbol
VF
VF/Ta
IR
Ct
IOH
ICCH
ICCL
IO/IF
VOL
Note Test
Circuit Test Condition
IF = 1.6 mA, Ta = 25
IF = 1.6 mA
VR = 5 V, Ta = 25
V = 0 V, f = 1 MHz, Ta = 25
VF = 0.8 V, VCC = VO = 18 V
IF = 0 mA, VCC = 5 V,
VO = Open
IF = 1.6 mA, VCC = 5 V,
VO = Open
IF = 0.5 mA, VCC = 4.5 V,
VO = 0.4 V
IF = 1.6 mA, VCC = 4.5 V,
VO = 0.4 V
IF = 1.6 mA, VCC = 4.5 V,
IOL = 6.4 mA
IF = 5 mA, VCC = 4.5 V,
IOL = 15 mA
IF = 12 mA, VCC = 4.5 V,
VO = 24 mA
Min
1.30
0.1
400
500
Typ.
1.45
-1.8
60
0.1
0.01
1
1000
900
0.1
0.1
0.15
Max
1.70
10
100
10
1.5
0.4
0.4
0.4
Unit
V
mV/
µA
pF
µA
µA
mA
%
V
Note: All typical values are at Ta = 25.
10.
10.
10.
10. Isolation Characteristics
Isolation Characteristics
Isolation Characteristics
Isolation Characteristics
Unless otherwise specified, Ta = 25
Characteristics
Capacitance (input to output)
Isolation resistance
Isolation voltage
Symbol
CS
RS
BVS
Note
(Note 1)
(Note 1)
Test Conditions
VS = 0 V, f = 1 MHz
VS = 500 V, R.H. 60%
AC, 1 min
AC, 1 s in oil
DC, 1 min in oil
Min
1×1012
3750
Typ.
0.8
1014
10000
10000
Max
Unit
pF
Vrms
Vdc
Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
2010-09-06
Rev.1.0
TLP2403
5
11.
11.
11.
11. Switching Characteristics
Switching Characteristics
Switching Characteristics
Switching Characteristics
Unless otherwise specified, Ta = 0 to 100, VCC = 5 V
Characteristics
Propagation delay time
(H/L)
Propagation delay time
(L/H)
Common-mode transient
immunity at output high
Common-mode transient
immunity at output low
Symbol
tpHL
tpLH
CMH
CML
Note
(Note 1)
(Note 2)
Test
Circuit
Fig.
12.1.1
Fig.
12.1.1
Fig.
12.1.2
Test Condition
IF = 0.5 mA, RL = 4.7 k,
Ta = 25
IF = 0.5 mA, RL = 4.7 k
IF = 12 mA, RL = 270 ,
Ta = 25
IF = 12 mA, RL = 270
IF = 1.6 mA, RL = 2.2 k,
Ta = 25
IF = 1.6 mA, RL = 2.2 k
IF = 0.5 mA, RL = 4.7 k,
Ta = 25
IF = 0.5 mA, RL = 4.7 k
IF = 12 mA, RL = 270 ,
Ta = 25
IF = 12 mA, RL = 270
IF = 1.6 mA, RL = 2.2 k,
Ta = 25
IF = 1.6 mA, RL = 2.2 k
IF = 0 mA, RL = 2.2 k,
VCM = 10 V, VO(min) = 2 V
IF = 1.6 mA, RL = 2.2 k,
VCM = 10 V, VO(max) = 0.8 V
Min
Typ.
2
2
0.3
0.3
0.5
0.5
4
4
1
1
4.5
4.5
500
-500
Max
25
30
1
2
10
15
60
90
7
10
35
50
Unit
µs
µs
V/µs
Note 1: CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage
in the logic high state (VO > 2.0 V).
Note 2: CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in
the logic low state (VO < 0.8 V).
2010-09-06
Rev.1.0
TLP2403
6
12.
12.
12.
12. Test Circuits and Characteristics Curves
Test Circuits and Characteristics Curves
Test Circuits and Characteristics Curves
Test Circuits and Characteristics Curves
12.1.
12.1.
12.1.
12.1. Test Circuits
Test Circuits
Test Circuits
Test Circuits
Fig.
Fig.
Fig.
Fig. 12.1.1
12.1.1
12.1.1
12.1.1 Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Fig.
Fig.
Fig.
Fig. 12.1.2
12.1.2
12.1.2
12.1.2 Common-Mode Transient Immunity
Common-Mode Transient Immunity
Common-Mode Transient Immunity
Common-Mode Transient Immunity
2010-09-06
Rev.1.0
TLP2403
7
13.
13.
13.
13. Soldering and Storage
Soldering and Storage
Soldering and Storage
Soldering and Storage
13.1.
13.1.
13.1.
13.1. Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
When using soldering reflow (See Fig. 13.1.1 and 13.1.2)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig.
Fig.
Fig.
Fig. 13.1.1
13.1.1
13.1.1
13.1.1 An example of a temperature profile
An example of a temperature profile
An example of a temperature profile
An example of a temperature profile
when Sn-Pb eutectic solder is used
when Sn-Pb eutectic solder is used
when Sn-Pb eutectic solder is used
when Sn-Pb eutectic solder is used
Fig.
Fig.
Fig.
Fig. 13.1.2
13.1.2
13.1.2
13.1.2 An example of a temperature profile
An example of a temperature profile
An example of a temperature profile
An example of a temperature profile
when lead(Pb)-free solder is used
when lead(Pb)-free solder is used
when lead(Pb)-free solder is used
when lead(Pb)-free solder is used
When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Apply preheating of 150 for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
13.2.
13.2.
13.2.
13.2. Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
Avoid storage locations where devices may be exposed to moisture or direct sunlight.
Follow the precautions printed on the packing label of the device for transportation and storage.
Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%,
respectively.
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
When restoring devices after removal from their packing, use anti-static containers.
Do not allow loads to be applied directly to devices while they are in storage.
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
2010-09-06
Rev.1.0
TLP2403
8
14.
14.
14.
14. Land Pattern Dimensions for Reference Only
Land Pattern Dimensions for Reference Only
Land Pattern Dimensions for Reference Only
Land Pattern Dimensions for Reference Only
Fig.
Fig.
Fig.
Fig. 14.1
14.1
14.1
14.1 Land Pattern Dimensions for Reference Only (unit: mm)
Land Pattern Dimensions for Reference Only (unit: mm)
Land Pattern Dimensions for Reference Only (unit: mm)
Land Pattern Dimensions for Reference Only (unit: mm)
15.
15.
15.
15. Marking
Marking
Marking
Marking
Fig.
Fig.
Fig.
Fig. 15.1
15.1
15.1
15.1 Marking
Marking
Marking
Marking
2010-09-06
Rev.1.0
TLP2403
9
16.
16.
16.
16. EN60747-5-2 Option (V4) Specification
EN60747-5-2 Option (V4) Specification
EN60747-5-2 Option (V4) Specification
EN60747-5-2 Option (V4) Specification
Part number: TLP2403 (Note)
(Note)
(Note)
(Note)
The following part naming conventions are used for the devices that have been qualified according to
option (V4) of EN60747.
Example: TLP2403(V4-TP, F)
V4: EN60747 option specification
TP: Standard taping name
Note: Use TOSHIBA standard type number for safety standard application.
e.g., TLP2403(V4-TP, F) TLP2403
Fig.
Fig.
Fig.
Fig. 16.1
16.1
16.1
16.1 EN60747 Insulation Characteristics
EN60747 Insulation Characteristics
EN60747 Insulation Characteristics
EN60747 Insulation Characteristics
2010-09-06
Rev.1.0
TLP2403
10
Fig.
Fig.
Fig.
Fig. 16.2
16.2
16.2
16.2 Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.
g., at a standard distance between soldering eye centers of 3.5 mm). If this is not permissible, the user shall
take suitable measures.
Note: This photocoupler is suitable for safe electrical isolation
safe electrical isolation
safe electrical isolation
safe electrical isolation only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Fig.
Fig.
Fig.
Fig. 16.3
16.3
16.3
16.3 Marking Example (Note)
Marking Example (Note)
Marking Example (Note)
Marking Example (Note)
Note: The above marking is applied to the photocouplers that have been qualified according to option (V4) of EN60747.
2010-09-06
Rev.1.0
TLP2403
11
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions Unit: mm
Weight: 0.11 g (typ.)
Package Name(s)
TOSHIBA: 11-5K1S
Nickname: SO8
2010-09-06
Rev.1.0
TLP2403
12
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product
is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/
or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact
("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace
industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment,
equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and
equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
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FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
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PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange
and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology
are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
2010-09-06
Rev.1.0