TLP2403 Photocouplers GaAAs Infrared LED & Photo IC TLP2403 1. Applications * High-Speed Digital Interfacing for Instrumentation and Control Devices * Simplex/Multiplex Data Transmission 2. General The Toshiba TLP2403 consists of a high-output GaAAs light-emitting diode coupled with a high-speed photodiode-transistor chip. It is housed in the SO8 package. The TLP2403 uses a high-speed, high-gain detector element and thus is ideal for applications which require lowinput current and high-speed data transmission. 3. Features (1) Package: SO8 (2) Operating temperature: -40 to 100 (3) Current transfer ratio: 400% (min) @IF = 0.5 mA (4) Maximum output current: 60 mA (5) Propagation delay time: tpHL = 2 s (typ.), tpLH = 4 s (typ.) @ RL = 4.7 k, IF = 0.5 mA (6) Isolation voltage: 3750 Vrms (min) (7) Safety standards UL-approved: UL1577 File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A, File No.E67349 Note: VDE-approved: Option (V4) EN60747-5-2 (Note) When an EN60747-5-2 approved type is needed, please designate the Option (V4) (V4). 4. Packaging and Pin Configuration 1: NC 2: Anode 3: Cathode 4: NC 5: GND (Emitter) 6: Output (Collector) 7: Base 8: VCC SO8 1 2010-09-06 Rev.1.0 TLP2403 5. Internal Circuit Fig. 5.1 Internal Circuit 6. Principle of Operation 6.1. Mechanical Parameters Characteristics Min Unit Creepage distances 4.0 mm Clearance 4.0 Internal isolation thickness 2 2010-09-06 Rev.1.0 TLP2403 7. Absolute Maximum Ratings (Note) Unless otherwise specified, Ta = 25 Characteristics LED Symbol Forward current Note IF Forward current derating (Ta 85) IF/ Pulse forward current Pulse forward current derating IFP (Ta 85) Transient pulse forward current Transient pulse forward current derating IFP/ IFPT (Ta 85) (Note 1) (Note 2) IFPT/ Rating Unit 20 mA -0.67 mA/ 40 mA -1.0 mA/ 1 A -25 mA/ Reverse voltage VR 5 V Power dissipation PD 40 mW PD/ -1.0 mW/ IO 60 mA Power dissipation derating (Ta 85) Detector Output current Output current derating IO/ -0.6 mA/ Output voltage (Ta 25) VO -0.5 to 18 V Supply voltage VCC -0.5 to 18 Emitter-base reverse voltage VEB 0.5 Output power dissipation Output power dissipation derating (Ta 25) Common Operating temperature Storage temperature Lead soldering temperature Isolation voltage PO 100 mW PO/ -1.0 mW/ Topr -40 to 100 Tstg -55 to 125 (10 s) Tsol 260 AC, 1 min, R.H. 60% BVS (Note 3) 3750 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width (PW) 1 ms, duty = 50% Note 2: Pulse width (PW) 1 s, 300 pps Note 3: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. 8. Recommended Operating Conditions (Note) Characteristics Symbol Note Min Typ. Max Unit mA Forward current IF 0.5 15 Output current IO 30 Supply voltage VCC 16 V Operating temperature Topr -40 100 (Note 1) Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this datasheet should also be considered. Note 1: Denotes the operating range, not the recommended operating condition. 3 2010-09-06 Rev.1.0 TLP2403 9. Electrical Characteristics (Note) Unless otherwise specified, Ta = 0 to 100 Characteristics Input forward voltage Input temperature coefficient of forward voltage Symbol Note VF VF/Ta Test Circuit Test Condition Min Typ. Max Unit IF = 1.6 mA, Ta = 25 1.30 1.45 1.70 V IF = 1.6 mA -1.8 mV/ Input reverse current IR VR = 5 V, Ta = 25 10 A Input capacitance Ct V = 0 V, f = 1 MHz, Ta = 25 60 pF High-level output current IOH VF = 0.8 V, VCC = VO = 18 V 0.1 100 A High-level supply current ICCH IF = 0 mA, VCC = 5 V, VO = Open 0.01 10 A Low-level supply current ICCL IF = 1.6 mA, VCC = 5 V, VO = Open 0.1 1 1.5 mA Current transfer ratio IO/IF IF = 0.5 mA, VCC = 4.5 V, VO = 0.4 V 400 1000 % IF = 1.6 mA, VCC = 4.5 V, VO = 0.4 V 500 900 IF = 1.6 mA, VCC = 4.5 V, IOL = 6.4 mA 0.1 0.4 IF = 5 mA, VCC = 4.5 V, IOL = 15 mA 0.1 0.4 IF = 12 mA, VCC = 4.5 V, VO = 24 mA 0.15 0.4 Min Typ. Max Unit 0.8 pF 1x1012 1014 Vrms Low-level output voltage Note: VOL V All typical values are at Ta = 25. 10. Isolation Characteristics Unless otherwise specified, Ta = 25 Characteristics Symbol Note Test Conditions Capacitance (input to output) CS (Note 1) VS = 0 V, f = 1 MHz Isolation resistance RS (Note 1) VS = 500 V, R.H. 60% Isolation voltage BVS 3750 AC, 1 s in oil 10000 DC, 1 min in oil 10000 AC, 1 min Vdc Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. 4 2010-09-06 Rev.1.0 TLP2403 11. Switching Characteristics Unless otherwise specified, Ta = 0 to 100, VCC = 5 V Characteristics Propagation delay time (H/L) Propagation delay time (L/H) Symbol Note tpHL Test Circuit Fig. 12.1.1 tpLH Fig. 12.1.1 Common-mode transient immunity at output high CMH (Note 1) Common-mode transient immunity at output low CML (Note 2) Fig. 12.1.2 Test Condition Min Typ. Max Unit IF = 0.5 mA, RL = 4.7 k, Ta = 25 2 25 s IF = 0.5 mA, RL = 4.7 k 2 30 IF = 12 mA, RL = 270 , Ta = 25 0.3 1 IF = 12 mA, RL = 270 0.3 2 IF = 1.6 mA, RL = 2.2 k, Ta = 25 0.5 10 IF = 1.6 mA, RL = 2.2 k 0.5 15 IF = 0.5 mA, RL = 4.7 k, Ta = 25 4 60 IF = 0.5 mA, RL = 4.7 k 4 90 IF = 12 mA, RL = 270 , Ta = 25 1 7 IF = 12 mA, RL = 270 1 10 IF = 1.6 mA, RL = 2.2 k, Ta = 25 4.5 35 IF = 1.6 mA, RL = 2.2 k 4.5 50 IF = 0 mA, RL = 2.2 k, VCM = 10 V, VO(min) = 2 V 500 IF = 1.6 mA, RL = 2.2 k, VCM = 10 V, VO(max) = 0.8 V -500 s V/s Note 1: CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic high state (VO > 2.0 V). Note 2: CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in the logic low state (VO < 0.8 V). 5 2010-09-06 Rev.1.0 TLP2403 12. Test Circuits and Characteristics Curves 12.1. Test Circuits Fig. 12.1.1 Switching Time Test Circuit Fig. 12.1.2 Common-Mode Transient Immunity 6 2010-09-06 Rev.1.0 TLP2403 13. Soldering and Storage 13.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. * When using soldering reflow (See Fig. 13.1.1 and 13.1.2) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. Fig. 13.1.1 An example of a temperature profile when Sn-Pb eutectic solder is used * Fig. 13.1.2 An example of a temperature profile when lead(Pb)-free solder is used When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder) Apply preheating of 150 for 60 to 120 seconds. Mounting condition of 260 within 10 seconds is recommended. Flow soldering must be performed once. * When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder) Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not exceeding 350 Heating by soldering iron must be done only once per lead. 13.2. Precautions for General Storage * Avoid storage locations where devices may be exposed to moisture or direct sunlight. * Follow the precautions printed on the packing label of the device for transportation and storage. * Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%, respectively. * Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. * Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. * When restoring devices after removal from their packing, use anti-static containers. * Do not allow loads to be applied directly to devices while they are in storage. * If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. 7 2010-09-06 Rev.1.0 TLP2403 14. Land Pattern Dimensions for Reference Only Fig. 14.1 Land Pattern Dimensions for Reference Only (unit: mm) 15. Marking Fig. 15.1 Marking 8 2010-09-06 Rev.1.0 TLP2403 16. EN60747-5-2 Option (V4) Specification * Part number: TLP2403 (Note) * The following part naming conventions are used for the devices that have been qualified according to option (V4) of EN60747. Example: TLP2403(V4-TP, F) V4: EN60747 option specification TP: Standard taping name Note: Use TOSHIBA standard type number for safety standard application. e.g., TLP2403(V4-TP, F) TLP2403 Fig. 16.1 EN60747 Insulation Characteristics 9 2010-09-06 Rev.1.0 TLP2403 Fig. 16.2 Insulation Related Specifications (Note) Note: Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e. g., at a standard distance between soldering eye centers of 3.5 mm). If this is not permissible, the user shall take suitable measures. This photocoupler is suitable for safe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. Fig. 16.3 Marking Example (Note) Note: The above marking is applied to the photocouplers that have been qualified according to option (V4) of EN60747. 10 2010-09-06 Rev.1.0 TLP2403 Package Dimensions Unit: mm Weight: 0.11 g (typ.) Package Name(s) TOSHIBA: 11-5K1S Nickname: SO8 11 2010-09-06 Rev.1.0 TLP2403 RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. 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No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 12 2010-09-06 Rev.1.0