www.ti.com
FEATURES
DESCRIPTION
TSB42AA4
TSB42AA4ITSB42AB4 , TSB42AB4I
SLLA217 – JUNE 2006
(ceLynx) IEEE 1394-a Consumer Electronics Link Layer Controller
•8K-byte FIFO supports the following datatypes:•DTCP content protection (TSB42AA4 only). Aseparate document explains the DTCP – DVB MPEG2 transport streams (IEChardware errata for TSB42AA4. It is available 61883-4)upon request to DTLA licensees only.
– DirecTV™ transport streams•Interfaces directly to industry standard 400-,
– DV program streams (IEC 61883-2)200-, and 100-Mbps physical layer devices,
– Asynchronous streamsincluding Texas Instruments TSB41LV0X and
– Support for external processor DMATSB41AXX family of physical layer devices
•Programmable data-/space-available•Compliant with IEEE 1394-1995 and IEEE
indications for flow control; almost full and1394a–2000 standards
almost empty indicators•MPEG2 time stamp-based release, as
•Supports bus manager functions anddescribed in IEC 61883-4
automatic 1394 self-ID verification•High-speed data interface (HSDI):
•Interrupt driven to minimize host polling– Byte-wide or serial mode
•Single 3.3-V supply– Two independent HSDI ports
•Separate async acknowledge buffer– Bidirectional
decreases the ack-tracking burden on host– Several control modes for a variety of
•JTAG interface to support post-assemblyapplications
scan of device I/O– Connects seamlessly to common MPEG2
•Bus holder isolationdecoder chipsets
•Embedded support for DTCP content•16-bit microprocessor interface supports
protection:Motorola 68000/68020-style bus
– Two M6 baseline ciphers (one per HSDI•Large 8K-byte FIFO can be configured up to
port)eight independent Tx or Rx FIFOs
– Random number generator in hardware– SHA-1 secure hash algorithm in hardware– Authentication key cipher in hardware•Optional auto-configuration for MPEG2/DVtransmit and receive functions•PID filtering and packet insertion for MPEG2transport stream
Consumer Electronics Link (ceLynx) is a high-performance 1394 link layer device designed specifically tosupport advanced consumer electronics applications, particularly those applications which require thetransmission of Moving Picture Expert Group 2 (MPEG2) transport streams and encryption/decryption of thosestreams across a 1394 network. The device supports both digital video broadcasting (DVB) and DirecTV™ typeMPEG2 streams using the digital transmission content protection method (DTCP) method of encryption, as wellas digital video (DV) encoded streams. The ceLynx supports both the IEC 61883 standard for DVB and DVstreams over 1394 and the 1394 Trade Association standard for DirecTV over 1394.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.DirecTV is a trademark of Hughes Communications, Inc..
PRODUCTION DATA information is current as of publication date.
Copyright © 2006, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
TSB42AA4
TSB42AA4I
TSB42AB4 , TSB42AB4I
SLLA217 – JUNE 2006
The ceLynx is also versatile enough to handle asynchronous data and asynchronous streams. A key feature ofthe ceLynx is its ability to handle multiple data type streams simultaneously; the user may transport DVB,DirecTV, DV data streams, and asynchronous data simultaneously. The ceLynx can also support multiplestreams of the same data type simultaneously, (for example, transmit or receive two DVB transport streams ortwo DV streams).
The ceLynx is full duplex, allowing simultaneous playback and recording of audio/video data. Full duplex supportalso includes the capability of using the DTCP method, simultaneously using the two embedded M6 ciphermodules. The large internal 8-Kbyte FIFO is very flexible, allowing the user to partition it into eight independentfirst in first out (FIFOs) and allowing the user to determine the exact configuration of each of these FIFOs to fitthe application. Advanced features have been added to support program ID (PID) filtering and packet insertions.
The ceLynx is also designed to interface seamlessly with popular MPEG2 decoder chipsets. This decreases thedesign-in effort of customers when using these popular chipsets.
NOTE:
This product is for high-volume CE applications only. For a complete datasheet ormore information contact support@ti.com.
2
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Samples
(Requires Login)
TSB42AA4IPDT OBSOLETE TQFP PDT 128 TBD Call TI Call TI
TSB42AB4PDT ACTIVE TQFP PDT 128 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
TSB42AB4PDTG4 ACTIVE TQFP PDT 128 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
MECHANICAL DATA
MPQF013 – NOVEMBER 1995
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PDT (S-PQFP-G128) PLASTIC QUAD FLATPACK
64
33 0,13 NOM
Gage Plane
0,25
0,45
0,75
Seating Plane
0,05 MIN
4087726/A 1 1/95
0,23
0,13
65
32
96
1
12,40 TYP
128
97
SQ
SQ
0,95
1,05
15,90
16,10
13,95
1,20 MAX
14,05
0,08
0,40 M
0,05
0°–5°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
