HSMP-3820-TR2G - Agilent / Hewlett-Packard

Surface Mount RF PIN Switch

and Limiter Diodes

Technical Data

Features

• Diodes Optimized for:

Low Current Switching

Low Distortion Attenuating

• Power Limiting/Circuit

Protection

• Surface Mount SOT-23 and

SOT-323 Packages

Single and Dual Versions

Tape and Reel Options

Available

• Low Failure in Time (FIT)

Rate[1]

• Lead-free Option Available

Note:

1. For more information see the

Surface Mount PIN Reliability Data

Sheet.

HSMP-382x Series and

HSMP-482x Series

Package Lead Code

Identification, SOT-323

(Top View)

Description/Applications

The HSMP-382x series is

optimized for switching applica-

tions where ultra-low resistance is

required. The HSMP-482x diode is

ideal for limiting and low induc-

tance switching applications up to

1.5 GHz.

A SPICE model is not available

for PIN diodes as SPICE does not

provide for a key PIN diode

characteristic, carrier lifetime.

Package Lead Code

Identification, SOT-23

(Top View)

COMMON

CATHODE

COMMON

ANODE

SERIES

SINGLE

DUAL ANODE

HSMP-4820

DUAL ANODE

HSMP-482B

Absolute Maximum Ratings[1] TC = +25°C

Symbol Parameter Unit SOT-23 SOT-323

IfForward Current (1 µs Pulse) Amp 1 1

PIV Peak Inverse Voltage V 50 50

TjJunction Temperature °C 150 150

Tstg Storage Temperature °C -65 to 150 -65 to 150

θjc Thermal Resistance[2] °C/W 500 150

Notes:

1. Operation in excess of any one of these conditions may result in permanent damage to

the device.

2. TC = +25°C, where TC is defined to be the temperature at the package pins where

contact is made to the circuit board.

Typical Parameters at T

= 25°C

Part Number Series Resistance Carrier Lifetime Reverse Recovery Time Total Capacitance

HSMP- RS (Ω)τ (ns) Trr (ns) CT (pF)

382x 1.5 70 7 0.60 @ 20 V

Test Conditions f = 100 MHz IF = 10 mA VR = 10 V

IF = 10 mA IF = 20 mA

90% Recovery

Electrical Specifications T

= 25°C

Package Minimum Maximum Maximum

Part Number Marking Lead Breakdown Series Resistance Total Capacitance

HSMP- Code[1] Code Configuration Voltage VBR (V) RS (Ω)C

T (pF)

3820 F0 0 Single 50 0.6 0.8

3822 F2 2 Series

3823 F3 3 Common Anode

3824 F4 4 Common Cathode

Test Conditions VR = VBR f = 100 MHz f = 1 MHz

Measure IF = 10 mA VR = 20 V

IR ≤ 10 µA

High Frequency (Low Inductance, 500 MHz – 3 GHz) PIN Diodes

Minimum Maximum Typical Maximum Typical

Part Package Breakdown Series Total Total Total

Number Marking Lead Voltage Resistance Capacitance Capacitance Inductance

HSMP- Code Code Configuration VBR (V) RS (Ω)C

T (pF) CT (pF) LT (nH)

4820 FA A Dual Anode 50 0.6 0.75 1.0 1.0

482B FA A Dual Anode

Test Conditions VR = VBR IF = 10 mA f = 1 MHz f = 1 MHz f = 500 MHz –

Measure VR = 20 V VR = 0 V 3 GHz

IR ≤ 10 µA

Note:

1. Package marking code is white, except for HSMP-482B, which is laser marked.

Typical Parameters at TC = 25°C (unless otherwise noted), Single Diode

Figure 3. RF Resistance at 25°C vs.

Forward Bias Current.

100

0.1

RF RESISTANCE (OHMS)

– FORWARD BIAS CURRENT (mA)

0.01 0.1 1 10 100

1.4

1.2

1.0

0.8

0.6 0 1020304050

– REVERSE VOLTAGE (V)

CAPACITANCE (pF)

Figure 4. Capacitance vs. Reverse

Voltage.

120

115

110

105

100

11030

– FORWARD BIAS CURRENT (mA)

Figure 5. 2nd Harmonic Input

Intercept Point vs. Forward Bias

Current.

INPUT INTERCEPT POINT (dBm)

Diode Mounted as a

Series Attenuator in a

50 Ohm Microstrip and

Tested at 123 MHz

FORWARD CURRENT (mA)

Figure 2. Reverse Recovery Time vs.

Forward Current for Various Reverse

Voltages.

– REVERSE RECOVERY TIME (ns)

100

10 20 30

= 2V

= 5V

= 10V

100

0.1

0.01 0 0.2 0.4 0.6 0.8 1.0 1.2

– FORWARD CURRENT (mA)

– FORWARD VOLTAGE (mA)

Figure 1. Forward Current vs.

Forward Voltage.

125°C25°C–50°C

CW POWER IN (dBm)

Figure 6. Large Signal Transfer Curve

of the HSMP-482x Limiter.

CW POWER OUT (dBm)

4010

520 25 30 3515

Measured with external

bias return

1.0 GHz

1.5 GHz

Typical Applications for Multiple Diode Products

RF COMMON

RF 1

BIAS 1

RF 2

BIAS 2

Figure 7. Simple SPDT Switch, Using Only Positive

Current.

Figure 8. High Isolation SPDT Switch, Dual Bias.

RF COMMON

BIAS BIAS

RF 2

RF 1

Typical Applications for Multiple Diode Products, continued

BIAS

Figure 9. Switch Using Both Positive and Negative

Bias Current.

Figure 10. Very High Isolation SPDT Switch,

Dual Bias.

Figure 11. High Isolation SPST Switch (Repeat Cells

as Required.

Figure 12. Power Limiter Using HSMP-3822 Diode

Pair. See Application Note 1050 for details.

RF COMMON

RF 1 RF 2

BIAS

RF COMMON

RF 2

RF 1

BIAS

Typical Applications for

HSMP-482x Low

Inductance Series

Microstrip Series Connection

for HSMP-482x Series

In order to take full advantage of

the low inductance of the

HSMP-482x series when using

them in series applications, both

lead 1 and lead 2 should be

connected together, as shown in

Figure 14.

HSMP-482x

Figure 13. Internal Connections.

Figure 14. Circuit Layout.

Microstrip Shunt Connections

for HSMP-482x Series

In Figure 15, the center conductor

of the microstrip line is inter-

rupted and leads 1 and 2 of the

HSMP-482x diode are placed

across the resulting gap. This

forces the 0.5 nH lead inductance

of leads 1 and 2 to appear as part

of a low pass filter, reducing the

shunt parasitic inductance and

increasing the maximum available

attenuation. The 0.3 nH of shunt

inductance external to the diode

is created by the via holes, and is

a good estimate for 0.032" thick

material.

50 OHM MICROSTRIP LINES

PAD CONNECTED TO

GROUND BY TWO

VIA HOLES

Figure 15. Circuit Layout,

HSMP-482x Limiter.

0.3 nH

0.8 pF

1.5 nH 1.5 nH

Figure 16. Equivalent Circuit.

Co-Planar Waveguide Shunt

Connection for HSMP-482x

Series

Co-Planar waveguide, with

ground on the top side of the

printed circuit board, is shown in

Figure 17. Since it eliminates the

need for via holes to ground, it

offers lower shunt parasitic

inductance and higher maximum

attenuation when compared to a

microstrip circuit. See AN1050 for

details.

Co-Planar Waveguide

Groundplane

Center Conductor

Groundplane

Figure 17. Circuit Layout.

0.8 pF

0.75 nH

Figure 18. Equivalent Circuit.

Assembly Information

SOT-323 PCB Footprint

A recommended PCB pad layout

for the miniature SOT-323 (SC-70)

package is shown in Figure 19

(dimensions are in inches). This

layout provides ample allowance

for package placement by auto-

mated assembly equipment

without adding parasitics that

could impair the performance.

0.026

0.035

0.07

0.016

Figure 19. PCB Pad Layout

(dimensions in inches).

SOT-23 PCB Footprint

0.037

0.95

0.037

0.95

0.079

2.0

0.031

0.8

DIMENSIONS IN inches

0.035

0.9

Figure 20. PCB Pad Layout.

TIME (seconds)

TMAX

TEMPERATURE (°C)

100

150

200

250

Preheat

Zone Cool Down

Zone

Reflow

Zone

120 180 240 300

Figure 21. Surface Mount Assembly Profile.

SMT Assembly

Reliable assembly of surface

mount components is a complex

process that involves many

material, process, and equipment

factors, including: method of

heating (e.g., IR or vapor phase

reflow, wave soldering, etc.)

circuit board material, conductor

thickness and pattern, type of

solder alloy, and the thermal

conductivity and thermal mass of

components. Components with a

low mass, such as the SOT-323/-23

package, will reach solder reflow

temperatures faster than those

with a greater mass.

Agilent’s diodes have been

qualified to the time-temperature

profile shown in Figure 21. This

profile is representative of an IR

reflow type of surface mount

assembly process.

After ramping up from room

temperature, the circuit board

with components attached to it

(held in place with solder paste)

passes through one or more

preheat zones. The preheat zones

increase the temperature of the

board and components to prevent

thermal shock and begin evaporat-

ing solvents from the solder paste.

The reflow zone briefly elevates

the temperature sufficiently to

produce a reflow of the solder.

The rates of change of tempera-

ture for the ramp-up and cool-

down zones are chosen to be low

enough to not cause deformation

of the board or damage to compo-

nents due to thermal shock. The

maximum temperature in the

reflow zone (TMAX) should not

exceed 235°C.

These parameters are typical for a

surface mount assembly process

for Agilent diodes. As a general

guideline, the circuit board and

components should be exposed

only to the minimum tempera-

tures and times necessary to

achieve a uniform reflow of

solder.

Package Characteristics

Lead Material ................................... Copper (SOT-323); Alloy 42 (SOT-23)

Lead Finish ............................................................................ Tin-Lead 85-15%

Maximum Soldering Temperature .............................. 260°C for 5 seconds

Minimum Lead Strength .......................................................... 2 pounds pull

Typical Package Inductance .................................................................. 2 nH

Typical Package Capacitance .............................. 0.08 pF (opposite leads)

Ordering Information

Specify part number followed by option. For example:

HSMP - 382x - XXX

Bulk or Tape and Reel Option

Part Number; x = Lead Code

Surface Mount PIN

Option Descriptions

-BLK = Bulk, 100 pcs. per antistatic bag

-TR1 = Tape and Reel, 3000 devices per 7" reel

-TR2 = Tape and Reel, 10,000 devices per 13" reel

Tape and Reeling conforms to Electronic Industries RS-481, “Taping of

Surface Mounted Components for Automated Placement.”

For lead-free option, the part number will have the character "G" at the

end, eg. -TR2G for a 10K pc lead-free reel.

Package Dimensions

Outline SOT-323 (SC-70) Outline 23 (SOT-23)

2.20 (0.087)

2.00 (0.079)

1.35 (0.053)

1.15 (0.045)

1.30 (0.051)

REF.

0.650 BSC (0.025)

2.20 (0.087)

1.80 (0.071)

0.10 (0.004)

0.00 (0.00)

0.25 (0.010)

0.15 (0.006)

1.00 (0.039)

0.80 (0.031)

0.20 (0.008)

0.10 (0.004)

0.30 (0.012)

0.10 (0.004)

0.30 REF.

10°

0.425 (0.017)

TYP.

DIMENSIONS ARE IN MILLIMETERS

(

INCHES

)

PACKAGE

MARKING

CODE (XX)

X X X

DATE CODE (X)

SIDE VIEW

TOP VIEW

END VIEW

DIMENSIONS ARE IN MILLIMETERS

(

INCHES

)

1.02 (0.040)

0.89 (0.035)

0.60 (0.024)

0.45 (0.018)

1.40 (0.055)

1.20 (0.047)

2.65 (0.104)

2.10 (0.083)

3.06 (0.120)

2.80 (0.110)

2.04 (0.080)

1.78 (0.070)

1.02 (0.041)

0.85 (0.033)

0.152 (0.006)

0.066 (0.003)

0.10 (0.004)

0.013 (0.0005)

0.69 (0.027)

0.45 (0.018)

0.54 (0.021)

0.37 (0.015)

X X X

PACKAGE

MARKING

CODE (XX)

DATE CODE (X)

Tape Dimensions and Product Orientation

For Outline SOT-23

Note: "AB" represents package marking code.

"C" represents date code.

END VIE

8 mm

4 mm

TOP VIEW

ABC ABC ABC ABC

Device Orientation

For Outlines SOT-23/323

USER

FEED

DIRECTION

COVER TAPE

CARRIER

TAPE

REEL

9° MAX

Ko 8° MAX

13.5° MAX

DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)

LENGTH

WIDTH

DEPTH

PITCH

BOTTOM HOLE DIAMETER

3.15 ± 0.10

2.77 ± 0.10

1.22 ± 0.10

4.00 ± 0.10

1.00 + 0.05

0.124 ± 0.004

0.109 ± 0.004

0.048 ± 0.004

0.157 ± 0.004

0.039 ± 0.002

CAVITY

DIAMETER

PITCH

POSITION

1.50 + 0.10

4.00 ± 0.10

1.75 ± 0.10

0.059 + 0.004

0.157 ± 0.004

0.069 ± 0.004

PERFORATION

WIDTH

THICKNESS

8.00 + 0.30 – 0.10

0.229 ± 0.013

0.315 + 0.012 – 0.004

0.009 ± 0.0005

CARRIER TAPE

CAVITY TO PERFORATION

(WIDTH DIRECTION)

CAVITY TO PERFORATION

(LENGTH DIRECTION)

3.50 ± 0.05

2.00 ± 0.05

0.138 ± 0.002

0.079 ± 0.002

DISTANCE

BETWEEN

CENTERLINE

www.agilent.com/semiconductors

For product information and a complete list of

distributors, please go to our web site.

For technical assistance call:

Americas/Canada: +1 (800) 235-0312 or

(916) 788-6763

Europe: +49 (0) 6441 92460

China: 10800 650 0017

Hong Kong: (65) 6756 2394

India, Australia, New Zealand: (65) 6755 1939

Japan: (+81 3) 3335-8152(Domestic/International), or

0120-61-1280(Domestic Only)

Korea: (65) 6755 1989

Singapore, Malaysia, Vietnam, Thailand, Philippines,

Indonesia: (65) 6755 2044

Taiwan: (65) 6755 1843

Data subject to change.

Obsoletes 5988-3145EN

March 24, 2004

5989-0483EN

(CARRIER TAPE THICKNESS) T

(COVER TAPE THICKNESS)

DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)

LENGTH

WIDTH

DEPTH

PITCH

BOTTOM HOLE DIAMETER

2.40 ± 0.10

1.20 ± 0.10

4.00 ± 0.10

1.00 + 0.25

0.094 ± 0.004

0.047 ± 0.004

0.157 ± 0.004

0.039 + 0.010

CAVITY

DIAMETER

PITCH

POSITION

1.55 ± 0.05

4.00 ± 0.10

1.75 ± 0.10

0.061 ± 0.002

0.157 ± 0.004

0.069 ± 0.004

PERFORATION

WIDTH

THICKNESS

8.00 ± 0.30

0.254 ± 0.02

0.315 ± 0.012

0.0100 ± 0.0008

CARRIER TAPE

CAVITY TO PERFORATION

(WIDTH DIRECTION)

CAVITY TO PERFORATION

(LENGTH DIRECTION)

3.50 ± 0.05

2.00 ± 0.05

0.138 ± 0.002

0.079 ± 0.002

DISTANCE

FOR SOT-323 (SC70-3 LEAD) An 8°C MAX

FOR SOT-363 (SC70-6 LEAD) 10°C MAX

ANGLE

WIDTH

TAPE THICKNESS

5.4 ± 0.10

0.062 ± 0.001

0.205 ± 0.004

0.0025 ± 0.00004

COVER TAPE

Tape Dimensions and Product Orientation

For Outline SOT-323