SST39WF1601-90-4C-Y1QE - Silicon Storage Technology

Data Sheet

S71297-04-000 12/08

The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.

MPF is a trademark of Silicon Storage Technology, Inc.

These specifications are subject to change without notice.

16 Mbit (x16) Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FEATURES:

• Organized as 1M x16

• Single Voltage Read and Write Operations

– 1.65-1.95V

• Superior Reliability

– Endurance: 100,000 Cycles (Typical)

– Greater than 100 years Data Retention

• Low Power Consumption (typical values at 5 MHz)

– Active Current: 5 mA (typical)

– Standby Current: 5 µA (typical)

– Auto Low Power Mode: 5 µA (typical)

• Hardware Block-Protection/WP# Input Pin

– Top Block-Protection (top 32 KWord)

for SST39WF1602

– Bottom Block-Protection (bottom 32 KWord)

for SST39WF1601

• Sector-Erase Capability

– Uniform 2 KWord sectors

• Block-Erase Capability

– Uniform 32 KWord blocks

• Chip-Erase Capability

• Erase-Suspend/Erase-Resume Capabilities

• Hardware Reset Pin (RST#)

• Security-ID Feature

– SST: 128 bits; User: 128 bits

• Fast Read Access Time:

– 70 ns, 90 ns

• Latched Address and Data

• Fast Erase and Word-Program:

– Sector-Erase Time: 36 ms (typical)

– Block-Erase Time: 36 ms (typical)

– Chip-Erase Time: 140 ms (typical)

– Word-Program Time: 28 µs (typical)

• Automatic Write Timing

– Internal VPP Generation

• End-of-Write Detection

– Toggle Bits

– Data# Polling

• CMOS I/O Compatibility

• JEDEC Standard

– Flash EEPROM Pin Assignments and

Command Sets

• Packages Available

– 48-ball TFBGA (6mm x 8mm)

– 48-ball WFBGA (5mm x 6mm)

– 48-ball WFBGA (4mm x 6mm)

• All non-Pb (lead-free) devices are RoHS compliant

PRODUCT DESCRIPTION

The SST39WF1601/1602 devices are 1M x16 CMOS

Multi-Purpose Flash Plus (MPF+) manufactured with

SST’s proprietary, high-performance CMOS SuperFlash

technology. The split-gate cell design and thick-oxide tun-

neling injector attain better reliability and manufacturability

compared with alternate approaches. The SST39WF1601/

1602 write (Program or Erase) with a 1.65-1.95V power

supply. These devices conform to JEDEC standard pin

assignments for x16 memories.

Featuring high performance Word-Program, the

SST39WF1601/1602 devices provide a typical Word-Pro-

gram time of 28 µsec. These devices use Toggle Bit or

Data# Polling to indicate the completion of Program opera-

tion. To protect against inadvertent write, they have on-chip

hardware and Software Data Protection schemes.

Designed, manufactured, and tested for a wide spectrum of

applications, these devices are offered with a guaranteed

typical endurance of 100,000 cycles. Data retention is rated

at greater than 100 years.

The SST39WF1601/1602 devices are suited for applica-

tions that require convenient and economical updating of

program, configuration, or data memory. For all system

applications, they significantly improve performance and

reliability, while lowering power consumption. They inher-

ently use less energy during Erase and Program than

alternative flash technologies. The total energy consumed

is a function of the applied voltage, current, and time of

application. Since for any given voltage range, the Super-

Flash technology uses less current to program and has a

shorter erase time, the total energy consumed during any

Erase or Program operation is less than alternative flash

technologies. These devices also improve flexibility while

lowering the cost for program, data, and configuration stor-

age applications.

The SuperFlash technology provides fixed Erase and Pro-

gram times, independent of the number of Erase/Program

cycles that have occurred. Therefore the system software

or hardware does not have to be modified or de-rated as is

necessary with alternative flash technologies, whose

Erase and Program times increase with accumulated

Erase/Program cycles.

SST39WF160x2.7V 16Mb (x16) MPF+ memories

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

To meet high density, surface mount requirements, the

SST39WF1601/1602 are offered in both 48-ball TFBGA

and 48-ball WFBGA packages. See Figures 2 and 3 for

pin assignments.

Device Operation

Commands are used to initiate the memory operation func-

tions of the device. Commands are written to the device

using standard microprocessor write sequences. A com-

mand is written by asserting WE# low while keeping CE#

low. The address bus is latched on the falling edge of WE#

or CE#, whichever occurs last. The data bus is latched on

the rising edge of WE# or CE#, whichever occurs first.

The SST39WF1601/1602 also have the Auto Low Power

mode which puts the device in a near standby mode after

data has been accessed with a valid Read operation. This

reduces the IDD active read current from typically 9 mA to

typically 5 µA. The Auto Low Power mode reduces the typi-

cal IDD active read current to the range of 2 mA/MHz of

Read cycle time. The device exits the Auto Low Power

mode with any address transition or control signal transition

used to initiate another Read cycle, with no access time

penalty. Note that the device does not enter Auto-Low

Power mode after power-up with CE# held steadily low,

until the first address transition or CE# is driven high.

Read

The Read operation of the SST39WF1601/1602 is con-

trolled by CE# and OE#, both have to be low for the sys-

tem to obtain data from the outputs. CE# is used for

device selection. When CE# is high, the chip is dese-

lected and only standby power is consumed. OE# is the

output control and is used to gate data from the output

pins. The data bus is in high impedance state when

either CE# or OE# is high. Refer to the Read cycle timing

diagram for further details (Figure 4).

Word-Program Operation

The SST39WF1601/1602 are programmed on a word-by-

word basis. Before programming, the sector where the

word exists must be fully erased. The Program operation is

accomplished in three steps. The first step is the three-byte

load sequence for Software Data Protection. The second

step is to load word address and word data. During the

Word-Program operation, the addresses are latched on the

falling edge of either CE# or WE#, whichever occurs last.

The data is latched on the rising edge of either CE# or

WE#, whichever occurs first. The third step is the internal

Program operation which is initiated after the rising edge of

the fourth WE# or CE#, whichever occurs first. The Pro-

gram operation, once initiated, will be completed within 40

µs. See Figures 5 and 6 for WE# and CE# controlled Pro-

gram operation timing diagrams and Figure 20 for flow-

charts. During the Program operation, the only valid reads

are Data# Polling and Toggle Bit. During the internal Pro-

gram operation, the host is free to perform additional tasks.

Any commands issued during the internal Program opera-

tion are ignored. During the command sequence, WP#

should be statically held high or low.

Sector/Block-Erase Operation

The Sector- (or Block-) Erase operation allows the system

to erase the device on a sector-by-sector (or block-by-

block) basis. The SST39WF1601/1602 offer both Sector-

Erase and Block-Erase modes. The sector architecture is

based on uniform sector size of 2 KWord. The Block-Erase

mode is based on uniform block size of 32 KWord. The

Sector-Erase operation is initiated by executing a six-byte

command sequence with Sector-Erase command (30H)

and sector address (SA) in the last bus cycle. The Block-

Erase operation is initiated by executing a six-byte com-

mand sequence with Block-Erase command (50H) and

block address (BA) in the last bus cycle. The sector or block

address is latched on the falling edge of the sixth WE#

pulse, while the command (30H or 50H) is latched on the

rising edge of the sixth WE# pulse. The internal Erase

operation begins after the sixth WE# pulse. The End-of-

Erase operation can be determined using either Data#

Polling or Toggle Bit methods. See Figures 10 and 11 for

timing waveforms and Figure 24 for the flowchart. Any

commands issued during the Sector- or Block-Erase oper-

ation are ignored. When WP# is low, any attempt to Sector-

(Block-) Erase the protected block will be ignored. During

the command sequence, WP# should be statically held

high or low.

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

Erase-Suspend/Erase-Resume Commands

The Erase-Suspend operation temporarily suspends a

Sector- or Block-Erase operation thus allowing data to be

read from any memory location, or program data into any

sector/block that is not suspended for an Erase operation.

The operation is executed by issuing one byte command

sequence with Erase-Suspend command (B0H). The

device automatically enters read mode typically within 20

µs after the Erase-Suspend command had been issued.

Valid data can be read from any sector or block that is not

suspended from an Erase operation. Reading at address

location within erase-suspended sectors/blocks will output

DQ2 toggling and DQ6 at “1”. While in Erase-Suspend

mode, a Word-Program operation is allowed except for the

sector or block selected for Erase-Suspend.

To resume Sector-Erase or Block-Erase operation which has

been suspended the system must issue Erase Resume

command. The operation is executed by issuing one byte

command sequence with Erase Resume command (30H)

at any address in the last Byte sequence.

Chip-Erase Operation

The SST39WF1601/1602 provide a Chip-Erase operation,

which allows the user to erase the entire memory array to

the “1” state. This is useful when the entire device must be

quickly erased.

The Chip-Erase operation is initiated by executing a six-

byte command sequence with Chip-Erase command

(10H) at address 5555H in the last byte sequence. The

Erase operation begins with the rising edge of the sixth

WE# or CE#, whichever occurs first. During the Erase

operation, the only valid read is Toggle Bit or Data# Polling.

See Table 6 for the command sequence, Figure 10 for tim-

ing diagram, and Figure 24 for the flowchart. Any com-

mands issued during the Chip-Erase operation are

ignored. When WP# is low, any attempt to Chip-Erase will

be ignored. During the command sequence, WP# should

be statically held high or low.

Write Operation Status Detection

The SST39WF1601/1602 provide two software means to

detect the completion of a Write (Program or Erase) cycle,

in order to optimize the system write cycle time. The soft-

ware detection includes two status bits: Data# Polling

(DQ7) and Toggle Bit (DQ6). The End-of-Write detection

mode is enabled after the rising edge of WE#, which ini-

tiates the internal Program or Erase operation.

The actual completion of the nonvolatile write is asyn-

chronous with the system; therefore, either a Data# Poll-

ing or Toggle Bit read may be simultaneous with the

completion of the write cycle. If this occurs, the system

may possibly get an erroneous result, i.e., valid data may

appear to conflict with either DQ7 or DQ6. In order to pre-

vent spurious rejection, if an erroneous result occurs, the

software routine should include a loop to read the

accessed location an additional two (2) times. If both

reads are valid, then the device has completed the Write

cycle, otherwise the rejection is valid.

Data# Polling (DQ7)

When the SST39WF1601/1602 are in the internal Pro-

gram operation, any attempt to read DQ7 will produce the

complement of the true data. Once the Program operation

is completed, DQ7 will produce true data. Note that even

though DQ7 may have valid data immediately following the

completion of an internal Write operation, the remaining

data outputs may still be invalid: valid data on the entire

data bus will appear in subsequent successive Read

cycles after an interval of 1 µs. During internal Erase oper-

ation, any attempt to read DQ7 will produce a ‘0’. Once the

internal Erase operation is completed, DQ7 will produce a

‘1’. The Data# Polling is valid after the rising edge of fourth

WE# (or CE#) pulse for Program operation. For Sector-,

Block- or Chip-Erase, the Data# Polling is valid after the

rising edge of sixth WE# (or CE#) pulse. See Figure 7 for

Data# Polling timing diagram and Figure 21 for a flowchart.

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

Toggle Bits (DQ6 and DQ2)

During the internal Program or Erase operation, any con-

secutive attempts to read DQ6 will produce alternating “1”s

and “0”s, i.e., toggling between 1 and 0. When the internal

Program or Erase operation is completed, the DQ6 bit will

stop toggling. The device is then ready for the next opera-

tion. For Sector-, Block-, or Chip-Erase, the toggle bit (DQ6)

is valid after the rising edge of sixth WE# (or CE#) pulse.

DQ6 will be set to “1” if a Read operation is attempted on an

Erase-Suspended Sector/Block. If Program operation is ini-

tiated in a sector/block not selected in Erase-Suspend

mode, DQ6 will toggle.

An additional Toggle Bit is available on DQ2, which can be

used in conjunction with DQ6 to check whether a particular

sector is being actively erased or erase-suspended. Table 1

shows detailed status bits information. The Toggle Bit

(DQ2) is valid after the rising edge of the last WE# (or CE#)

pulse of Write operation. See Figure 8 for Toggle Bit timing

diagram and Figure 21 for a flowchart.

Note: DQ7 and DQ2 require a valid address when reading

status information.

Data Protection

The SST39WF1601/1602 provide both hardware and soft-

ware features to protect nonvolatile data from inadvertent

writes.

Hardware Data Protection

Noise/Glitch Protection: A WE# or CE# pulse of less than 5

ns will not initiate a write cycle.

VDD Power Up/Down Detection: The Write operation is

inhibited when VDD is less than 1.5V.

Write Inhibit Mode: Forcing OE# low, CE# high, or WE#

high will inhibit the Write operation. This prevents inadvert-

ent writes during power-up or power-down.

Hardware Block Protection

The SST39WF1602 support top hardware block protec-

tion, which protects the top 32 KWord block of the device.

The SST39WF1601 support bottom hardware block pro-

tection, which protects the bottom 32 KWord block of the

device. The Boot Block address ranges are described in

Table 2. Program and Erase operations are prevented on

the 32 KWord when WP# is low. If WP# is left floating, it is

internally held high via a pull-up resistor, and the Boot

Block is unprotected, enabling Program and Erase opera-

tions on that block.

Hardware Reset (RST#)

The RST# pin provides a hardware method of resetting the

device to read array data. When the RST# pin is held low

for at least TRP, any in-progress operation will terminate and

return to Read mode. When no internal Program/Erase

operation is in progress, a minimum period of TRHR is

required after RST# is driven high before a valid Read can

take place (see Figure 16).

The Erase or Program operation that has been interrupted

needs to be reinitiated after the device resumes normal

operation mode to ensure data integrity.

Software Data Protection (SDP)

The SST39WF1601/1602 provide the JEDEC approved

Software Data Protection scheme for all data alteration

operations, i.e., Program and Erase. Any Program opera-

tion requires the inclusion of the three-byte sequence. The

three-byte load sequence is used to initiate the Program

operation, providing optimal protection from inadvertent

Write operations, e.g., during the system power-up or

power-down. Any Erase operation requires the inclusion of

six-byte sequence. These devices are shipped with the

Software Data Protection permanently enabled. See Table

6 for the specific software command codes. During SDP

command sequence, invalid commands will abort the

device to read mode within TRC. The contents of DQ15-DQ8

can be VIL or VIH, but no other value, during any SDP com-

mand sequence.

TABLE 1: Write Operation Status

Status DQ7DQ6DQ2

Normal

Operation

Standard

Program

DQ7# Toggle No Toggle

Standard

Erase

0 Toggle Toggle

Erase-

Suspend

Mode

Read from

Erase-Suspended

Sector/Block

1 1 Toggle

Read from

Non- Erase-Suspended

Sector/Block

Data Data Data

Program DQ7# Toggle N/A

T1.0 1297

TABLE 2: Boot Block Address Ranges

Product Address Range

Bottom Boot Block

SST39WF1601 000000H-007FFFH

Top Boot Block

SST39WF1602 0F8000H-0FFFFFH

T2.0 1297

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

Common Flash Memory Interface (CFI)

The SST39WF1601/1602 contain the CFI information to

describe the characteristics of the device. The

SST39WF1601/1602 support the original SST CFI Query

mode implementation for compatibility with existing SST

devices as well as the general CFI Query mode. Both will

be explained in subsequent paragraphs.

In order to enter the SST CFI Query mode, the system

must write the three-byte sequence, same as the product

ID entry command with 98H (CFI Query command) to

address 5555H in the last byte sequence. Once the device

enters CFI Query mode, the system can read CFI data at

the addresses given in Tables 7 through 9. The system

must write the CFI Exit command to return to Read mode

from the CFI Query mode.

In order to enter the general CFI Query mode, the system

must write a one-byte sequence with entry command with

98H to address 55H. Once the device enters the CFI

Query mode, the system can read CFI data at the

addresses given in Tables 7 through 9. The system must

write the CFI Exit command to return to Read mode from

the CFI Query mode.

Product Identification

The Product Identification mode identifies the devices as

the SST39WF1601, SST39WF1602 and manufacturer as

SST. This mode may be accessed software operations.

Users may use the Software Product Identification opera-

tion to identify the part (i.e., using the device ID) when

using multiple manufacturers in the same socket. For

details, see Table 6 for software operation, Figure 12 for

the Software ID Entry and Read timing diagram and Fig-

ure 22 for the Software ID Entry command sequence

flowchart.

Product Identification Mode Exit/

CFI Mode Exit

In order to return to the standard Read mode, the Software

Product Identification mode must be exited. Exit is accom-

plished by issuing the Software ID Exit command

sequence, which returns the device to the Read mode.

This command may also be used to reset the device to the

Read mode after any inadvertent transient condition that

apparently causes the device to behave abnormally, e.g.,

not read correctly. Please note that the Software ID Exit/

CFI Exit command is ignored during an internal Program or

Erase operation. See Table 6 for software command

codes, Figure 14 for timing waveform, and Figures 22 and

23 for flowcharts.

Security ID

The SST39WF1601/1602 devices offer a 256-bit Security

ID space. The Secure ID space is divided into two 128-bit

segments - one factory programmed segment and one

user programmed segment. The first segment is pro-

grammed and locked at SST with a random 128-bit num-

ber. The user segment is left un-programmed for the

customer to program as desired.

To program the user segment of the Security ID, the user

must use the Security ID Word-Program command. To

detect end-of-write for the SEC ID, read the toggle bits. Do

not use Data# Polling. Once this is complete, the Sec ID

should be locked using the User Sec ID Program Lock-Out.

This disables any future corruption of this space. Note that

regardless of whether or not the Sec ID is locked, neither

Sec ID segment can be erased.

The Secure ID space can be queried by executing a three-

byte command sequence with Enter Sec ID command

(88H) at address 5555H in the last byte sequence. To exit

this mode, the Exit Sec ID command should be executed.

Refer to Table 6 for more details.TABLE 3: Product Identification

Address Data

Manufacturer’s ID 0000H BFH

Device ID

SST39WF1601 0001H BF274B

SST39WF1602 0001H BF274A

T3.0 1297

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FIGURE 1: Functional Block Diagram

FIGURE 2: Pin assignments for 48-ball TFBGA

Y-Decoder

I/O Buffers and Data Latches

1297 B1.0

Address Buffer & Latches

X-Decoder

DQ15 - DQ0

Memory Address

OE#

CE#

WE#

SuperFlash

Memory

Control Logic

WP#

RESET#

A13

WE#

A12

RST#

WP#

A17

A14

A10

A18

A15

A11

A19

A16

DQ7

DQ5

DQ2

DQ0

DQ14

DQ12

DQ10

DQ8

CE#

DQ15

DQ13

VDD

DQ11

DQ9

OE#

VSS

DQ6

DQ4

DQ3

DQ1

VSS

1297 48-tfbga B3K P1.1

TOP VIEW (balls facing down)

A B C D E F G H

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FIGURE 3: Pin assignments for 48-ball WFBGA

CE#

DQ8

OE#

DQ0

A18

DQ10

DQ9

DQ1

A17

WP#

A19

DQ2

DQ3

WE#

DQ12

RST#

DQ13

A10

DQ4

DQ5

DQ14

A11

A13

A12

DQ11

DQ6

DQ15

A14

A15

A16

DQ7

TOP VIEW (balls facing down)

A B C D E F G H J K L

1297 48-wfbga MBQ P02.0

SST39WF160x

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

TABLE 4: Pin Description

Symbol Pin Name Functions

AMS1-A0Address Inputs To provide memory addresses.

During Sector-Erase AMS-A11 address lines will select the sector.

During Block-Erase AMS-A15 address lines will select the block.

DQ15-DQ0Data Input/output To output data during Read cycles and receive input data during Write cycles.

Data is internally latched during a Write cycle.

The outputs are in tri-state when OE# or CE# is high.

WP# Write Protect To protect the top/bottom boot block from Erase/Program operation when grounded.

RST# Reset To reset and return the device to Read mode.

CE# Chip Enable To activate the device when CE# is low.

OE# Output Enable To gate the data output buffers.

WE# Write Enable To control the Write operations.

VDD Power Supply To provide power supply voltage: 1.65-1.95V

VSS Ground

NC No Connection Unconnected pins.

T4.0 1297

1. AMS = Most significant address

AMS = A19 for SST39WF1601/1602

TABLE 5: Operation Modes Selection

Mode CE# OE# WE# DQ Address

Read VIL VIL VIH DOUT AIN

Program VIL VIH VIL DIN AIN

Erase VIL VIH VIL X1

1. X can be VIL or VIH, but no other value.

Sector or block address,

XXH for Chip-Erase

Standby VIH X X High Z X

Write Inhibit X VIL X High Z/ DOUT X

XXV

IH High Z/ DOUT X

Product Identification

Software Mode VIL VIL VIH See Table 6

T5.0 1297

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

TABLE 6: Software Command Sequence

Command

Sequence

1st Bus

Write Cycle

2nd Bus

Write Cycle

3rd Bus

Write Cycle

4th Bus

Write Cycle

5th Bus

Write Cycle

6th Bus

Write Cycle

Addr1Data2Addr1Data2Addr1Data2Addr1Data2Addr1Data2Addr1Data2

Word-Program 5555H AAH 2AAAH 55H 5555H A0H WA3Data

Sector-Erase 5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H SAX430H

Block-Erase 5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H BAX450H

Chip-Erase 5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H 5555H 10H

Erase-Suspend XXXXH B0H

Erase-Resume XXXXH 30H

Query Sec ID55555H AAH 2AAAH 55H 5555H 88H

User Security ID

Word-Program

5555H AAH 2AAAH 55H 5555H A5H WA6Data

User Security ID

Program Lock-Out

5555H AAH 2AAAH 55H 5555H 85H XXH60000H

Software ID Entry7,8 5555H AAH 2AAAH 55H 5555H 90H

SST CFI Query Entry 5555H AAH 2AAAH 55H 5555H 98H

General CFI Query Mode 55H 98H

Software ID Exit9,10

/CFI Exit/Sec ID Exit

5555H AAH 2AAAH 55H 5555H F0H

Software ID Exit9,10

/CFI Exit/Sec ID Exit

XXH F0H

T6.0 1297

1. Address format A14-A0 (Hex).

Addresses A15-A19 can be VIL or VIH, but no other value, for Command sequence for SST39WF1601/1602.

2. DQ15-DQ8 can be VIL or VIH, but no other value, for Command sequence

3. WA = Program Word address

4. SAX for Sector-Erase; uses AMS-A11 address lines

BAX, for Block-Erase; uses AMS-A15 address lines

AMS = Most significant address

AMS = A19 for SST39WF1601/1602

5. With AMS-A4 = 0; Sec ID is read with A3-A0,

SST ID is read with A3 = 0 (Address range = 000000H to 000007H),

User ID is read with A3 = 1 (Address range = 000008H to 00000FH).

User ID Lock Status is read with A7-A0 = 0000FFH. Unlocked: DQ3 = 1 / Locked: DQ3 = 0.

6. Valid Word-Addresses for Sec ID are from 000000H-000007H and 000008H to 00000FH.

7. The device does not remain in Software Product ID Mode if powered down.

8. With AMS-A1 =0; SST Manufacturer ID = 00BFH, is read with A0 = 0,

SST39WF1601 Device ID = BF274BH, is read with A0 = 1,

SST39WF1602 Device ID = BF274AH, is read with A0 = 1.

AMS = Most significant address

AMS = A19 for SST39WF1601/1602

9. Both Software ID Exit operations are equivalent

10. If users never lock after programming, Sec ID can be programmed over the previously unprogrammed bits (data=1) using the Sec ID

mode again (the programmed “0” bits cannot be reversed to “1”). Valid Word-Addresses for Sec ID are from 000000H-000007H and

000008H to 00000FH.

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

TABLE 7: CFI Query Identification String1

Address Data Data

10H 0051H Query Unique ASCII string “QRY”

11H 0052H

12H 0059H

13H 0002H Primary OEM command set

14H 0000H

15H 0000H Address for Primary Extended Table

16H 0000H

17H 0000H Alternate OEM command set (00H = none exists)

18H 0000H

19H 0000H Address for Alternate OEM extended Table (00H = none exits)

1AH 0000H

T7.0 1297

1. Refer to CFI publication 100 for more details.

TABLE 8: System Interface Information

Address Data Data

1BH 0016H VDD Min (Program/Erase)

DQ7-DQ4: Volts, DQ3-DQ0: 100 millivolts

1CH 0020H VDD Max (Program/Erase)

DQ7-DQ4: Volts, DQ3-DQ0: 100 millivolts

1DH 0000H VPP min. (00H = no VPP pin)

1EH 0000H VPP max. (00H = no VPP pin)

1FH 0005H Typical time out for Word-Program 2N µs (25 = 32 µs)

20H 0000H Typical time out for min. size buffer program 2N µs (00H = not supported)

21H 0005H Typical time out for individual Sector/Block-Erase 2N ms (25 = 30 ms)

22H 0007H Typical time out for Chip-Erase 2N ms (27 = 128 ms)

23H 0001H Maximum time out for Word-Program 2N times typical (21 x 25 = 64 µs)

24H 0000H Maximum time out for buffer program 2N times typical

25H 0001H Maximum time out for individual Sector/Block-Erase 2N times typical (21 x 25 = 64 ms)

26H 0001H Maximum time out for Chip-Erase 2N times typical (21 x 27 = 256 ms)

T8.0 1297

TABLE 9: Device Geometry Information

Address Data Data

27H 0015H Device size = 2N Bytes (15H = 21; 221 = 2 MByte)

28H 0001H Flash Device Interface description; 0001H = x16-only asynchronous interface

29H 0000H

2AH 0000H Maximum number of byte in multi-byte write = 2N (00H = not supported)

2BH 0000H

2CH 0002H Number of Erase Sector/Block sizes supported by device

2DH 00FFH Sector Information (y + 1 = Number of sectors; z x 256B = sector size)

2EH 0001H y = 511 + 1 = 512 sectors (01FF = 511)

2FH 0010H

30H 0000H z = 16 x 256 Bytes = 4 KByte/sector (0010H = 16)

31H 001FH Block Information (y + 1 = Number of blocks; z x 256B = block size)

32H 0000H y = 31 + 1 = 32 blocks (001F = 31)

33H 0000H

34H 0001H z = 256 x 256 Bytes = 64 KByte/block (0100H = 256)

T9.0 1297

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum

Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation

of the device at these conditions or conditions greater than those defined in the operational sections of this data

sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)

Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C

D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V

Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2.0V to VDD+2.0V

Voltage on A9 Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 13.2V

Package Power Dissipation Capability (TA = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W

Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds

Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA

1. Outputs shorted for no more than one second. No more than one output shorted at a time.

Operating Range

Range Ambient Temp VDD

Commercial

Industrial

0°C to +70°C

-40°C to +85°C

1.65-1.95V

AC Conditions of Test

Input Rise/Fall Time . . . . . . . . . . . . . . 5 ns

Output Load . . . . . . . . . . . . . . . . . . . . CL = 30 pF

See Figures 18 and 19

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

TABLE 10: DC Operating Characteristics VDD = 1.65-1.95V1

Symbol Parameter

Limits

Test ConditionsMin Max Units

IDD Power Supply Current Address input=VILT/VIHT, at f=5 MHz,

VDD=VDD Max

Read 10 mA CE#=VIL, OE#=WE#=VIH, all I/Os open

Program and Erase 25 mA CE#=WE#=VIL, OE#=VIH

ISB Standby VDD Current240 µA CE#=VIHC, VDD=VDD Max

IALP Auto Low Power 40 µA CE#=VILC, VDD=VDD Max

All inputs=VSS or VDD, WE#=VIHC

ILI Input Leakage Current 1 µA VIN=GND to VDD, VDD=VDD Max

ILIW Input Leakage Current

on WP# pin and RST#

10 µA WP#=GND to VDD or RST#=GND to VDD

ILO Output Leakage Current 1 µA VOUT=GND to VDD, VDD=VDD Max

VIL Input Low Voltage 0.2VDD VV

DD=VDD Min

VIH Input High Voltage 0.8VDD VV

DD=VDD Max

VOL Output Low Voltage 0.1 V IOL=100 µA, VDD=VDD Min

VOH Output High Voltage VDD-0.1 V IOH=-100 µA, VDD=VDD Min

T10.0 1297

1. Typical conditions for the Active Current shown on the front page of the data sheet are average values at 25°C

(room temperature), and VDD = 1.8V. Not 100% tested.

2. For all SST39WF160x commercial and industrial devices, ISB typical is under 5 µA.

TABLE 11: Recommended System Power-up Timings

Symbol Parameter Minimum Units

TPU-READ1

1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.

Power-up to Read Operation 100 µs

TPU-WRITE1Power-up to Program/Erase Operation 100 µs

T11.0 1297

TABLE 12: Capacitance (TA = 25°C, f=1 Mhz, other pins open)

Parameter Description Test Condition Maximum

CI/O1

1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.

I/O Pin Capacitance VI/O = 0V 12 pF

CIN1Input Capacitance VIN = 0V 6 pF

T12.0 1297

TABLE 13: Reliability Characteristics

Symbol Parameter Minimum Specification Units Test Method

NEND1,2

1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.

2. NEND endurance rating is qualified as a 10,000 cycle minimum for the whole device. A sector- or block-level rating would result in a

higher minimum specification.

Endurance 10,000 Cycles JEDEC Standard A117

TDR1Data Retention 100 Years JEDEC Standard A103

ILTH1Latch Up 100 + IDD mA JEDEC Standard 78

T13.0 1297

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

AC CHARACTERISTICS

TABLE 14: Read Cycle Timing Parameters VDD = 1.65-1.95V

Symbol Parameter

SST39WF1601/1602-70 SST39WF1601/1602-90

UnitsMin Max Min Max

TRC Read Cycle Time 70 90 ns

TCE Chip Enable Access Time 70 90 ns

TAA Address Access Time 70 90 ns

TOE Output Enable Access Time 35 50 ns

TCLZ1

1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.

CE# Low to Active Output 0 0 ns

TOLZ1OE# Low to Active Output 0 0 ns

TCHZ1CE# High to High-Z Output 40 40 ns

TOHZ1OE# High to High-Z Output 40 40 ns

TOH1Output Hold from Address Change 0 0 ns

TRP1RST# Pulse Width 500 500 ns

TRHR1RST# High before Read 50 50 ns

TRY1,2

2. This parameter applies to Sector-Erase, Block-Erase and Program operations.

This parameter does not apply to Chip-Erase operations.

RST# Pin Low to Read Mode 203

3. This parameter is 100 µs if reset after an Erase operation.

203µs

T14.0 1297

TABLE 15: Program/Erase Cycle Timing Parameters

Symbol Parameter Min Max Units

TBP Word-Program Time 40 µs

TAS Address Setup Time 0 ns

TAH Address Hold Time 50 ns

TCS WE# and CE# Setup Time 0 ns

TCH WE# and CE# Hold Time 0 ns

TOES OE# High Setup Time 0 ns

TOEH OE# High Hold Time 10 ns

TCP CE# Pulse Width 50 ns

TWP WE# Pulse Width 50 ns

TWPH1

1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.

WE# Pulse Width High 30 ns

TCPH1CE# Pulse Width High 30 ns

TDS Data Setup Time 50 ns

TDH1Data Hold Time 0 ns

TIDA1Software ID Access and Exit Time 150 ns

TSE Sector-Erase 50 ms

TBE Block-Erase 50 ms

TSCE Chip-Erase 200 ms

T15.0 1297

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FIGURE 4: Read Cycle Timing Diagram

FIGURE 5: WE# Controlled Program Cycle Timing Diagram

1297 F03.1

ADDRESS A19-0

DQ15-0

WE#

OE#

CE#

TCE

TRC TAA

TOE

TOLZ

VIH

HIGH-Z

TCLZ TOH TCHZ

HIGH-Z

DATA VALIDDATA VALID

TOHZ

1297 F04.1

ADDRESS A19-0

DQ15-0

TDH

TWPH

TDS

TWP

TAH

TAS

TCH

TCS

CE#

SW0 SW1 SW2

5555 2AAA 5555 ADDR

XXAA XX55 XXA0 DATA

INTERNAL PROGRAM OPERATION STARTS

WORD

(ADDR/DATA)

OE#

WE#

TBP

Note: WP# must be held in proper logic state (VIL or VIH) 1 µs prior to and 1µs after the command sequence.

X can be VIL or VIH, but no other value.

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FIGURE 6: CE# Controlled Program Cycle Timing Diagram

FIGURE 7: Data# Polling Timing Diagram

1297 F05.1

ADDRESS A19-0

DQ15-0

TDH

TCPH

TDS

TCP

TAH

TAS

TCH

TCS

WE#

SW0 SW1 SW2

5555 2AAA 5555 ADDR

XXAA XX55 XXA0 DATA

INTERNAL PROGRAM OPERATION STARTS

WORD

(ADDR/DATA)

OE#

CE#

TBP

Note: WP# must be held in proper logic state (VIL or VIH) 1 µs prior to and 1µs after the command sequence.

X can be VIL or VIH, but no other value.

1297 F06.1

ADDRESS A19-0

DQ7DATA DATA# DATA# DATA

WE#

OE#

CE#

TOEH

TOE

TCE

TOES

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FIGURE 8: Toggle Bits Timing Diagram

FIGURE 9: WE# Controlled Chip-Erase Timing Diagram

1297 F07.1

ADDRESS A19-0

DQ6 and DQ2

WE#

OE#

CE#

TOE

TOEH

TCE

TOES

TWO READ CYCLES

WITH SAME OUTPUTS

1297 F08.1

ADDRESS A19-0

DQ15-0

WE#

SW0 SW1 SW2 SW3 SW4 SW5

5555 2AAA 2AAA5555 5555

XX55 XX10XX55XXAA XX80 XXAA

5555

OE#

CE#

SIX-BYTE CODE FOR CHIP-ERASE

TSCE

TWP

Note: This device also supports CE# controlled Chip-Erase operation.

The WE# and CE# signals are interchangeable as long as minimum timings are met. (See Table 15.)

WP# must be held in proper logic state (VIH) 1 µs prior to and 1µs after the command sequence.

X can be VIL or VIH, but no other value.

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FIGURE 10: WE# Controlled Block-Erase Timing Diagram

FIGURE 11: WE# Controlled Sector-Erase Timing Diagram

1297 F09.1

ADDRESS A19-0

DQ15-0

WE#

SW0 SW1 SW2 SW3 SW4 SW5

5555 2AAA 2AAA5555 5555

XX55 XX50XX55XXAA XX80 XXAA

BAX

OE#

CE#

SIX-BYTE CODE FOR BLOCK-ERASE

TBE

TWP

Note: This device also supports CE# controlled Block-Erase operation.

The WE# and CE# signals are interchangeable as long as minimum timings are met. (See Table 15.)

BAX = Block Address

WP# must be held in proper logic state (VIH) 1 µs prior to and 1µs after the command sequence.

X can be VIL or VIH, but no other value.

1297 F10.1

ADDRESS A19-0

DQ15-0

WE#

SW0 SW1 SW2 SW3 SW4 SW5

5555 2AAA 2AAA5555 5555

XX55 XX30XX55XXAA XX80 XXAA

SAX

OE#

CE#

SIX-BYTE CODE FOR SECTOR-ERASE

TSE

TWP

Note: This device also supports CE# controlled Sector-Erase operation.

The WE# and CE# signals are interchangeable as long as minimum timings are met. (See Table 15.)

SAX = Sector Address

WP# must be held in proper logic state (VIH) 1 µs prior to and 1µs after the command sequence.

X can be VIL or VIH, but no other value.

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FIGURE 12: Software ID Entry and Read

FIGURE 13: CFI Query Entry and Read

1297 F11.1

ADDRESS A14-0

TIDA

DQ15-0

WE#

SW0 SW1 SW2

5555 2AAA 5555 0000 0001

OE#

CE#

Three-Byte Sequence for Software ID Entry

TWP

TWPH TAA

00BF

Device ID

XX55XXAA XX90

Note: WP# must be held in proper logic state (VIL or VIH) 1 µs prior to and 1µs after the command sequence.

Device ID - See Table 3

X can be VIL or VIH, but no other value.

1297 F12.1

ADDRESS A14-0

TIDA

DQ15-0

WE#

SW0 SW1 SW2

5555 2AAA 5555

OE#

CE#

Three-Byte Sequence for CFI Query Entry

TWP

TWPH TAA

XX55XXAA XX98

Note: WP# must be held in proper logic state (VIL or VIH) 1 µs prior to and 1µs after the command sequence.

X can be VIL or VIH, but no other value.

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FIGURE 14: Software ID Exit/CFI Exit

FIGURE 15: Sec ID Entry

1297 F13.1

ADDRESS A14-0

DQ15-0

TIDA

TWP

TWHP

WE#

SW0 SW1 SW2

5555 2AAA 5555

THREE-BYTE SEQUENCE FOR

SOFTWARE ID EXIT AND RESET

OE#

CE#

XXAA XX55 XXF0

Note: WP# must be held in proper logic state (VIL or VIH) 1 µs prior to and 1µs after the command sequence.

X can be VIL or VIH, but no other value.

1297 F20.1

ADDRESS A19-0

TIDA

DQ15-0

WE#

SW0 SW1 SW2

5555 2AAA 5555

OE#

CE#

THREE-BYTE SEQUENCE FOR

CFI QUERY ENTRY

TWP

TWPH TAA

XX55XXAA XX88

Note: WP# must be held in proper logic state (VIL or VIH) 1 µs prior to and 1µs after the command sequence.

X can be VIL or VIH, but no other value.

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FIGURE 16: RST# Timing Diagram (When no internal operation is in progress)

FIGURE 17: RST# Timing Diagram (During Program or Erase operation)

1297 F22.0

RST#

CE#/OE#

TRP

TRHR

1297 F23.1

RST#

CE#/OE#

TRP

TRY

End-of-Write Detection

(Toggle-Bit)

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FIGURE 18: AC Input/Output Reference Waveforms

FIGURE 19: A Test Load Example

1297 F14.1

REFERENCE POINTS OUTPUTINPUT VIT

VIHT

VILT

VOT

AC test inputs are driven at VIHT (0.9 VDD) for a logic “1” and VILT (0.1 VDD) for a logic “0”. Measurement reference points

for inputs and outputs are VIT (0.5 VDD) and VOT (0.5 VDD). Input rise and fall times (10% ↔ 90%) are <5 ns.

Note: VIT - VINPUT Te s t

VOT - VOUTPUT Tes t

VIHT - VINPUT HIGH Test

VILT - VINPUT LOW Test

1297 F15.1

TO TESTER

TO DUT

VDD

25K

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FIGURE 20: Word-Program Algorithm

1297 F16.0

Start

Load data: XXAAH

Address: 5555H

Load data: XX55H

Address: 2AAAH

Load data: XXA0H

Address: 5555H

Load Word

Address/Word

Data

Wait for end of

Program (TBP,

Data# Polling

bit, or Toggle bit

operation)

Program

Completed

X can be VIL or VIH, but no other value

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FIGURE 21: Wait Options

1297 F17.0

Wait TBP,

TSCE, TSE

or TBE

Program/Erase

Initiated

Internal Timer Toggle Bit

Ye s

Program/Erase

Completed

Does DQ6

match?

Read same

word

Data# Polling

Program/Erase

Completed

Program/Erase

Completed

Read word

Is DQ7 =

true data?

Read DQ7

Program/Erase

Initiated

Program/Erase

Initiated

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FIGURE 22: Software ID/CFI Entry Command Flowcharts

1297 F21.0

Load data: XXAAH

Address: 5555H

Software Product ID Entry

Command Sequence

Load data: XX55H

Address: 2AAAH

Load data: XX90H

Address: 5555H

Wait TIDA

Read Software ID

Load data: XXAAH

Address: 5555H

CFI Query Entry

Command Sequence

Load data: XX55H

Address: 2AAAH

Load data: XX98H

Address: 5555H

Wait TIDA

Read CFI data

Load data: XXAAH

Address: 5555H

Sec ID Query Entry

Command Sequence

Load data: XX55H

Address: 2AAAH

Load data: XX88H

Address: 5555H

Wait TIDA

Read Sec ID

X can be VIL or VIH, but no other value

Load data: XX98H

Address: 55H

General

CFI Query Entry

Command Sequence

Wait TIDA

Read CFI data

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FIGURE 23: Software ID/CFI Exit Command Flowcharts

1297 F18.0

Load data: XXAAH

Address: 5555H

Software ID Exit/CFI Exit/Sec ID Exit

Command Sequence

Load data: XX55H

Address: 2AAAH

Load data: XXF0H

Address: 5555H

Load data: XXF0H

Address: XXH

Return to normal

operation

Wait TIDA

Return to normal

operation

X can be VIL or VIH, but no other value

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FIGURE 24: Erase Command Sequence

1297 F19.0

Load data: XXAAH

Address: 5555H

Chip-Erase

Command Sequence

Load data: XX55H

Address: 2AAAH

Load data: XX80H

Address: 5555H

Load data: XX55H

Address: 2AAAH

Load data: XX10H

Address: 5555H

Load data: XXAAH

Address: 5555H

Wait TSCE

Chip erased

to FFFFH

Load data: XXAAH

Address: 5555H

Sector-Erase

Command Sequence

Load data: XX55H

Address: 2AAAH

Load data: XX80H

Address: 5555H

Load data: XX55H

Address: 2AAAH

Load data: XX30H

Address: SAX

Load data: XXAAH

Address: 5555H

Wait TSE

Sector erased

to FFFFH

Load data: XXAAH

Address: 5555H

Block-Erase

Command Sequence

Load data: XX55H

Address: 2AAAH

Load data: XX80H

Address: 5555H

Load data: XX55H

Address: 2AAAH

Load data: XX50H

Address: BAX

Load data: XXAAH

Address: 5555H

Wait TBE

Block erased

to FFFFH

X can be V

or V

IH,

but no other value

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

PRODUCT ORDERING INFORMATION

Valid Combinations for SST39WF1601

SST39WF1601-70-4C-B3KE SST39WF1601-70-4C-MBQE SST39WF1601-70-4C-Y1QE

SST39WF1601-70-4I-B3KE SST39WF1601-70-4I-MBQE SST39WF1601-70-4I-Y1QE

SST39WF1601-90-4C-B3KE SST39WF1601-90-4C-MBQE SST39WF1601-90-4C-Y1QE

SST39WF1601-90-4I-B3KE SST39WF1601-90-4I-MBQE SST39WF1601-90-4I-Y1QE

Valid Combinations for SST39WF1602

SST39WF1602-70-4C-B3KE SST39WF1602-70-4C-MBQE SST39WF1602-70-4C-Y1QE

SST39WF1602-70-4I-B3KE SST39WF1602-70-4I-MBQE SST39WF1602-70-4I-Y1QE

SST39WF1602-90-4C-B3KE SST39WF1602-90-4C-MBQE SST39WF1602-90-4C-Y1QE

SST39WF1602-90-4I-B3KE SST39WF1602-90-4I-MBQE SST39WF1602-90-4I-Y1QE

Note: Valid combinations are those products in mass production or will be in mass production. Consult your SST sales

representative to confirm availability of valid combinations and to determine availability of new combinations.

Environmental Attribute

E1 = non-Pb

Package Modifier

K = 48 balls

Q = 48 balls (66 possible positions)

Package Type

B3 = TFBGA (6mm x 8mm)

MB = WFBGA (5mm x 6mm)

Y1 = WFBGA (4mm x 6mm)

Temperature Range

C = Commercial = 0°C to +70°C

I = Industrial = -40°C to +85°C

Minimum Endurance

4 = 10,000 cycles

Read Access Speed

70 = 70 ns

90 = 90 ns

Hardware Block Protection

1 = Bottom Boot-Block

2 = Top Boot-Block

Device Density

160 = 16 Mbit

Voltage

W = 1.65-1.95V

Product Series

39 = Multi-Purpose Flash

1. Environmental suffix “E” denotes non-Pb solder.

SST non-Pb solder devices are “RoHS Compliant”.

SST 39 WF 1602 - 70 - 4C - B3K E

XX XXXXXX- XXX -XX-XXX X

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

PACKAGING DIAGRAMS

FIGURE 25: 48-ball Thin-Profile, Fine-pitch Ball Grid Array (TFBGA) 6mm x 8mm

SST Package Code: B3K

FIGURE 26: 48-ball Very-Very-Thin-Profile, Fine-pitch Ball Grid Array (WFBGA) 5mm x 6mm

SST Package Code MBQ

A1 CORNER

H G F E D C B A

A B C D E F G H

BOTTOM VIEWTOP VIEW

SIDE VIEW

SEATING PLANE

0.35 ± 0.05

1.10 ± 0.10

0.12

6.00 ± 0.20

0.45 ± 0.05

(48X)

A1 CORNER

8.00 ± 0.20

0.80

4.00

0.80

5.60

48-tfbga-B3K-6x8-450mic-4

Note: 1. Complies with JEDEC Publication 95, MO-210, variant 'AB-1', although some dimensions may be more stringent.

2. All linear dimensions are in millimeters.

3. Coplanarity: 0.12 mm

4. Ball opening size is 0.38 mm (± 0.05 mm)

1mm

L K J H G F E D C B A

ABCDEFGHJKL

0.50

BOTTOM VIEW

5.00 ± 0.08

0.32 ± 0.05

(48X)

6.00 ± 0.08

2.50

5.00

A1 CORNER

TOP VIEW

48-wfbga-MBQ-5x6-32mic-0

1mm

DETAIL SIDE VIEW

SEATING PLANE

0.20 ± 0.06

0.73 max.

0.636 nom.

0.08

A1 INDICATOR

Note: 1. Although many dimensions are similar to those of JEDEC Publication 95, MO-225,

this specific package is not registered.

2. All linear dimensions are in millimeters.

3. Coplanarity: 0.08 mm

4. Ball opening size is 0.29 mm (± 0.05 mm)

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Data Sheet

16 Mbit Multi-Purpose Flash Plus

SST39WF1601 / SST39WF1602

FIGURE 27: 48-ball Very-Very-Thin-Profile, Fine-pitch Ball Grid Array (WFBGA) 4mm x 6mm

SST Package Code Y1Q

TABLE 16: Revision History

Number Description Date

00 •Initial release Oct 2005

01 •Added MBQ package information including product numbers.

•Migrated document to Preliminary Specifications

•Updated Table 10 on page 12

Jul 2006

02 •Added 70 ns to Features: Fast Read Access Time

•Added 70 ns columns to Table 14

•Edited Product Ordering Information and Valid Combination to include 70 ns and

remove leaded parts.

Aug 2007

03 •Added YIQE package Jul 2008

04 •Changed 000010H to 000017H to 000008H to 00000FH three places in footnotes

of Table 6 on page 9.

Dec 2008

L K J H G F E D C B A

ABCDEFGHJKL

0.50

BOTTOM VIEW

0.32

±0.05

(48X)

A1 INDICATOR4

2.50

5.00

A1 CORNER

TOP VIEW

48-wfbga-Y1Q-4x6-320mic-5-2.0

Note: 1. Complies with JEDEC Publication 95, MO-207, variant CZB-4, dimensions except nominal ball width

is larger.

2. All linear dimensions are in millimeters.

3. Coplanarity: 0.08 mm

4. No ball is present in position A1; a gold-colored indicator is present.

5. Ball width at interface to package body surface is 0.29 mm.

1mm

DETAIL SIDE VIEW

SEATING PLANE

0.23 ±0.06

0.61 ±0.10

0.08

4.00

±0.08

6.00

±0.08

Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone 408-735-9110 • Fax 408-735-9036

www.SuperFlash.com or www.sst.com

http://store.iiic.cc/