Functional description I IA CE
SIPLUS RIC IEC on S7 V1.5 Page 6 of 235 ©SIEMENS AG 2013
4.4. Message buffering ..................................................................................................................... 68
4.4.1. Use of the Message Memory ................................................................................................ 68
4.4.2. T104-Confirmation buffer ...................................................................................................... 69
4.4.3. Projection .............................................................................................................................. 69
4.5. Improvement of the IEC-Master performance ......................................................................... 71
5. Multiple channel / Redundancy ....................................................................................................... 73
5.1. Implementation ........................................................................................................................... 73
5.1.1. Cascade_Mode_0: Multiple Channel on basis of Layer 2 .................................................... 75
5.1.2. Cascade_Mode_1: Multiple Channel on basis of Layer 7 .................................................... 76
5.1.3. Cascade_Mode_2: Multiple Channel on basis of Layer 7 .................................................... 76
5.1.4. Cascade_Mode_3: Extension of the T104-Redundancy group ............................................ 77
6. Application blocks ............................................................................................................................ 78
6.1. Slave blocks SL .......................................................................................................................... 79
6.1.1. Organization block - SL_Org_ASDU_1 (FB121) .................................................................. 80
6.1.2. Blocks for process data capture SLi ..................................................................................... 83
6.1.2.1. Single point and double point information - SLi_SP_DP_s128 (FB130) ....................... 84
6.1.2.2. Step position information - SLi_ST_s8 (FB131) ............................................................ 90
6.1.2.3. Bit pattern messages - SLi_BO_s8 (FB132) ................................................................. 96
6.1.2.4. Measured values - SLi_ME_ABC_s32 (FB133) .......................................................... 103
6.1.2.5. Integrated totals - SLi_IT_s8 (FB134) ......................................................................... 111
6.1.3. Blocks for the process output SLo ...................................................................................... 118
6.1.3.1. Single, double and regulating step commands - SLo_SC_DC_RC_sx (FB135) ........ 119
6.1.3.2. Setpoint commands - SLo_SE_ABC_sx (FB136) ....................................................... 127
6.1.3.3. Bit pattern commands - SLo_BO_sx (FB137) ............................................................. 134
6.1.3.4. Return_Values of the Slo-Blocks ................................................................................. 140
6.1.4. Individual IEC-Addressing .................................................................................................. 141
6.2. Calling Sli-Blocks from time interrupts (Cyclic Interrupts) ................................................. 143
6.3. Master Blocks MA .................................................................................................................... 144
6.3.1. Organization block - MA_Org_ASDU_n (FB122) ............................................................... 145
6.3.2. ASDU-Address Parameter-DB ........................................................................................... 148
6.3.3. Output blocks - MAo_xyz_pDB ........................................................................................... 151
6.3.3.1. Single point information - MAo_SP_IM_pDB (FC140) ................................................ 157
6.3.3.2. Double point information - MAo_DP_IM_pDB (FC141) .............................................. 162
6.3.3.3. Step position information - MAo_ST_IM_pDB (FC142) .............................................. 166
6.3.3.4. Bit pattern messages - MAo_BO_IM_pDB (FC143) ................................................... 170
6.3.3.5. Measured values - MAo_ME_NA_IM_pDB (FC144) ................................................... 175
6.3.3.6. Measured values - MAo_ME_NB_IM_pDB (FC145) ................................................... 179
6.3.3.7. Measured values - MAo_ME_NC_IM_pDB (FC146) .................................................. 183
6.3.3.8. Integrated totals - MAo_IT_IM_pDB (FC147).............................................................. 188
6.3.4. Input blocks - MAi_xyz_pDB ............................................................................................... 193
6.3.4.1. Single, double and regulating step commands - MAi_SC_DC_RC_pDB (FB148) ..... 195
6.3.4.2. Setpoint commands - MAi_SE_ABC_1 (FB149) ......................................................... 200
6.3.4.3. Bit pattern commands - MAi_BO (FB150) ................................................................... 203
7. Using the NON_Retain Memory ..................................................................................................... 205
7.1.1. FC100 Description .............................................................................................................. 206
7.1.1.1. Adaption of the DB-length from automatically generated DBs: ................................... 206
7.1.1.2. Read out of DB-Number and DB_Length of internal Buffer-DB .................................. 206
8. SIPLUS RIC IEC on S7 in SIMATIC H-Systems ............................................................................ 208
8.1. Configurations .......................................................................................................................... 208
8.1.1. IEC60870-5-101 Master ..................................................................................................... 209
8.1.2. IEC60870-5-101 Slave ....................................................................................................... 209
8.1.3. IEC60870-5-104 Master ..................................................................................................... 210
8.1.4. IEC60870-5-104 Slave ....................................................................................................... 210
8.1.5. H-CPUs V6 – Use of the integrated PN-Interface .............................................................. 211
8.2. Licensing in the H-System ...................................................................................................... 212
9. SIPLUS RIC IEC on S7 in S7-1500 – Systems .............................................................................. 213