Thick Film Resistor Array
www.vishay.com For technical questions, contact: filmresistors.thickfilmchip@vishay.com Document Number: 31047
256 Revision: 13-Oct-08
CRA06P
Vishay
CRA06P Thick Film resistor array is constructed on a high
grade ceramic body with concave terminations. A small
package enables the design of high density circuits. The
single component reduces board space, component counts
and assembly costs.
FEATURES
•Concave terminal array with square corners
•4 and 8 terminal package with isolated resistors
•Wide ohmic range: 10R to 1M0
•Lead (Pb)-free solder contacts on Ni barrier layer
•Pure tin plating provides compatibility with lead (Pb)-free
and lead containing soldering processes
•Compatible with "Restriction of the use of Hazardous
Substances" (RoHS) directive 2002/95/EC (issue 2004)
Notes
(1) Rated voltage:
(2) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
Notes
(3) Preferred way for ordering products is by use of the PART NUMBER
(4) Please refer to the table PACKAGING, see next page
STANDARD ELECTRICAL SPECIFICATIONS
MODEL CIRCUIT
POWER RATING
P70 °C
W
LIMITING ELEMENT
VOLTAGE MAX.
V≅
TEMPERATURE
COEFFICIENT
ppm/K
TOLERANCE
%
RESISTANCE
RANGE
Ω
E-SERIES
CRA06P 03 0.063 50 ± 100 ± 1 10R - 1M0 24 + 96
± 200 ± 2; ± 5 24
Zero-Ohm-Resistor: Rmax. = 50 mΩ, Imax. = 1 A
TECHNICAL SPECIFICATIONS
PARAMETER UNIT CRA06P
03 CIRCUIT
Rated Dissipation at 70 °C (2) W per element 0.063
Limiting Element Voltage (1) V≅50
Insulation Voltage (1 min) Vdc/ac peak 100
Category Temperature Range °C - 55 to + 155
Insulation Resistance Ω> 109
PART NUMBER AND PRODUCT DESPRIPTION
PART NUMBER: CRA06P08347K0JTA (3)
MODEL TERMINAL STYLE PIN CIRCUIT VALUE TOLERANCE PACKAGING (4) SPECIAL
CRA06 P 04
08
3 = 03 R = Decimal
K = Thousand
M = Million
0000 = 0 Ω Jumper
F = ± 1 %
G = ± 2 %
J = ± 5 %
Z = 0 Ω Jumper
TA
TC
Up to 2 digits
PRODUCT DESCRIPTION: CRA06P 08 03 473 J RT1 e3
CRA06P 08 03 473 J RT1 e3
MODEL TERMINAL COUNT CIRCUIT TYPE RESISTANCE VALUE TOLERANCE PACKAGING (4) LEAD (Pb)-FREE
CRA06P 04
08
03 473 = 47 kΩ
4702 = 47 kΩ
10R0 = 10 Ω
100 = 10 Ω
000 = 0 Ω Jumper
F = ± 1 %
G = ± 2 %
J = ± 5 %
Z = 0 Ω Jumper
RT1
RT6
e3 = Pure tin
Termination finish
First two digits (3 for 1 %)
are significant. Last digit
is the multiplier.
PR×
A06P 8340CR JAK0T7
Document Number: 31047 For technical questions, contact: filmresistors.thickfilmchip@vishay.com www.vishay.com
Revision: 13-Oct-08 257
CRA06P
Thick Film Resistor Array Vishay
CIRCUIT
DIMENSIONS
PACKAGING
MODEL TAPE WIDTH DIAMETER PITCH PIECES
/REEL
PACKAGING CODE
PAPER TAPE
PART NUMBER PRODUCT DESCRIPTION
CRA06P 8 mm
180 mm/7" 4 mm 5000 TA RT1
330 mm/13" 4 mm 20 000 TC RT6
- 55 - 25 0 25 50 75 100 125 155 175
120
100
80
60
40
20
0
70
Derating Ambient Temperature in °C
Rated Power in %
03 CIRCUIT
4 pin 8 pin
A
PB
L
w
C
T
c
b
pa
w
PIN
NO#
DIMENSIONS [in millimeters]
LABC P TW
41.60 0.30 0.40 0.40 0.80 0.60 1.60
83.20 0.30 0.40 0.40 0.80 0.60 1.60
Tol. ± 0.20 ± 0.20 ± 0.15 ± 0.20 - ± 0.10 ± 0.15
SOLDER PAD DIMENSIONS [in millimeters]
cwpab
WAVE 0.8 2.6 0.8 0.4 0.9
www.vishay.com For technical questions, contact: filmresistors.thickfilmchip@vishay.com Document Number: 31047
258 Revision: 13-Oct-08
CRA06P
Vishay Thick Film Resistor Array
Notes
(1) Figures are given for a single element
(2) Solderability is specified for 2 years after production or requalification. Permitted storage time is 20 years
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
TEST
(clause) CONDITIONS OF TEST
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR/R) (1)
STABILITY
CLASS 1 OR BETTER
STABILITY
CLASS 2 OR BETTER
Stability for product types:
10 Ω to 1 MΩ10 Ω to 1 MΩ
CRA06P
Resistance (4.5) - ± 1 % ± 2 %; ± 5 %
Temperature coefficient (4.8.4.2) 20/- 55/20 °C and
20/125/20 °C ± 100 ppm/K ± 200 ppm/K
Overload (4.13) U = 2.5 × (P70 x R)1/2
≤ 2 x Umax.; 0.5 s ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
Solderability (4.17.5) (2)
Aging 4 h at 155 °C, dryheat
Solder bath method; 235 °C; 2 s
Visual examination
Good tinning (≥ 95 % covered)
no visible damage
Resistance to soldering heat (4.18.2) Solder bath method;
(260 ± 5) °C; (10 ± 1) s ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
Rapid change of temperature (4.19) 30 min at LCT = - 55 °C;
30 min at UCT = 125 °C; 5 cycles ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
Damp heat, steady state (4.24) (40 ± 2) °C; 56 days;
(93 ± 3) % RH ± (1 % R + 0.05 Ω)± (2 % R + 0.1 Ω)
Climatic sequence (4.23)
16 h at UCT = 125 °C; 1 cycle at 55 °C;
2 h at LCT = - 55 °C;
1 h/1 kPa at 15 °C to 35 °C;
5 cycles at 55 °C
U = (P70 x R)1/2
U = Umax.; whichever is less severe
± (1 % R + 0.05 Ω)± (2 % R + 0.1 Ω)
Endurance at 70 °C (4.25.1)
U = (P70 x R)1/2
U = Umax.; whichever is less severe
1.5 h ON; 0.5 h OFF;
70 °C; 1000 h
± (1 % R + 0.05 Ω)± (2 % R + 0.1 Ω)
Extended endurance (4.25.1.8) Duration extended to 8000 h ± (2 % R + 0.1 Ω)± (4 % R + 0.1 Ω)
Endurance at upper category
temperature (4.25.3) UCT = 125 °C; 1000 h ± (1 % R + 0.05 Ω)± (2 % R + 0.1 Ω)
APPLICABLE SPECIFICATIONS
• EN 60115-1 Generic Specification
• EN 140400 Sectional Specification
• EN 140401-802 Detail Specification
• IEC 60068-2-X Variety of environmental test procedures
• EIA 481 Packaging of SMD components
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Revision: 12-Mar-12 1Document Number: 91000
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