For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
1
HMC1081
v01.0713
GaAs MMIC MIXER
50 - 75 GHz
General Description
Features
Functional Diagram
Passive: No DC Bias Required
Low LO Power: 12 dBm
High LO/RF Isolation: 28 dB
Wide IF Bandwidth: DC to 26 GHz
Upconversion & Downconversion Applications
Die Size: 1.23 x 1.21 x 0.1 mm
Electrical Specications, TA = +25° C, LO = 50 GHz, LO = +12 dBm, USB [1]
Typical Applications
The HMC1081 is ideal for:
• E-Band Communications Systems
• Test Equipment & Sensors
• Military End-Use
• Automotive Radar
The HMC1081 is a double balanced mixer. It can be
used as an upconverter or a downconverter, with DC
to 26 GHz at the IF port and 50 to 75 GHz at the RF
port. This passsive MMIC mixer is fabricated with
GaAs Shottky diode technology. All bond pads and
the die backside are Ti/Au metallized and the Shottky
devices are fully passivated for reliable operation. All
data shown herein is measured with the chip in a 50
Ohm environment and contacted with RF probes.
Parameter Min. Typ. Max. Units
RF Frequency Range 50 - 75 GHz
LO Frequency Range 40 - 85 GHz
IF Frequency Range DC - 26 GHz
Conversion Loss 7.5 10.5 dB
LO to RF Isolation 30 dB
LO to IF Isolation 20 dB
RF to IF Isolation 22 dB
IP3 (Input)[2] 16 dBm
1 dB Gain Compression (Input) [2] 10 dBm
[1] Unless otherwise noted , all measurements performed as an Upconverter with LO = 50 GHz and LO = +12 dBm.
[2] Measurements performed as an Upconverter with LO = 49 GHz and LO = +12 dBm.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
2
HMC1081
v01.0713
GaAs MMIC MIXER
50 - 75 GHz
Conversion Gain vs. Temperature
LO= 49 GHz, USB
Conversion Gain vs. LO Power
LO= 49 GHz, USB
Conversion Gain vs. Temperature
LO= 50 GHz, USB
Conversion Gain vs. LO Power
LO= 50 GHz, USB
Conversion Gain vs. Temperature
LO= 75 GHz, LSB
Conversion Gain vs. LO Power
LO= 75 GHz,LSB
-14
-12
-10
-8
-6
-4
-2
0
50 55 60 65 70 75
10 dBm 12 dBm 14 dBm
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-14
-12
-10
-8
-6
-4
-2
0
50 55 60 65 70 75
+25 C +85 C -55 C
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-14
-12
-10
-8
-6
-4
-2
0
50 55 60 65 70 75
+25 C +85 C -55 C
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-14
-12
-10
-8
-6
-4
-2
0
50 55 60 65 70 75
10 dBm 12 dBm 14 dBm
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-14
-12
-10
-8
-6
-4
-2
0
50 55 60 65 70 75
10 dBm 12 dBm 14 dBm
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-14
-12
-10
-8
-6
-4
-2
0
50 55 60 65 70 75
+25 C +85 C -55 C
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
3
HMC1081
v01.0713
GaAs MMIC MIXER
50 - 75 GHz
Conversion Gain vs. LO Power
LO= 40 GHz, USB
Conversion Gain vs. LO Power
LO= 44 GHz, USB
Conversion Gain vs. LO Power
LO= 48 GHz, USB
Conversion Gain vs. LO Power
IF= 10 GHz
Conversion Gain vs. LO Power
IF= 1 GHz
-14
-12
-10
-8
-6
-4
-2
0
50 55 60 65 70 75 80
10 dBm 12 dBm 14 dBm
CONVERSION GAIN (dB)
LO FREQUENCY (GHz)
-20
-16
-12
-8
-4
0
50 55 60 65 70 75
10 dBm 12 dBm 14 dBm
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-20
-16
-12
-8
-4
0
50 55 60 65 70 75
10 dBm 12 dBm 14 dBm
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-20
-16
-12
-8
-4
0
50 55 60 65 70 75
10 dBm 12 dBm 14 dBm
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-14
-12
-10
-8
-6
-4
-2
0
50 55 60 65 70 75
10 dBm 12 dBm 14 dBm
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
4
HMC1081
v01.0713
GaAs MMIC MIXER
50 - 75 GHz
RF Return Loss IF Return Loss
RF/IF IsolationLO Return Loss
LO/RF isolationLO/IF Isolation
-50
-40
-30
-20
-10
0
50 55 60 65 70 75
LO/RF
ISOLATION (dB)
LO FREQUENCY (GHz)
-50
-40
-30
-20
-10
0
50 55 60 65 70 75
LO/IF
ISOLATION (dB)
LO FREQUENCY (GHz)
-40
-30
-20
-10
0
50 55 60 65 70 75
RF/IF
ISOLATION (dB)
RF FREQUENCY (GHz)
-30
-25
-20
-15
-10
-5
0
5
40 45 50 55 60 65 70 75
LO-RL
RETURN LOSS (dB)
LO FREQUENCY (GHz)
-25
-20
-15
-10
-5
0
0 5 10 15 20 25
LO = 44 GHz LO = 50 GHz
RETURN LOSS (dB)
RF FREQUENCY (GHz)
-25
-20
-15
-10
-5
0
40 45 50 55 60 65 70 75 80 85 90
LO = 44 GHz LO = 50 GHz
RETURN LOSS (dB)
RF FREQUENCY (GHz)
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
5
HMC1081
v01.0713
GaAs MMIC MIXER
50 - 75 GHz
P1dB, LO= 49 GHz, USB Input IP3, LO= 49 GHz, USB
0
4
8
12
16
20
50 55 60 65 70 75
LO = 12 dBm
P1dB (dBm)
RF FREQUENCY (GHz)
0
5
10
15
20
25
30
35
50 55 60 65 70 75
LO= 12 dBm LO= 14 dBm
IP3 (dBm)
RF FREQUENCY (GHz)
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
6
HMC1081
v01.0713
GaAs MMIC MIXER
50 - 75 GHz
Outline Drawing
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS 0.004”
3. BOND PADS 1, 2 & 3 are 0.0059” [0.150] X 0.0039” [0.099].
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
8. OVERALL DIE SIZE ± 0.002
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Standard Alternate
GP-1 (Gel Pack) [2]
[1] For more information refer to the “Packaging
information” Document in the Product Support Section of
our website.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
RF Input +3 dBm
LO Drive +20 dBm
IF Input 0 dBm
Maximum Junction Temperature 170 °C
Thermal Resistance (RTH)
(junction to die bottom) 823 °C/W
Operating Temperature -55 to +85 °C
Storage Temperature -65 to 150 °C
ESD Sensitivity (HBM) Class1A passed 250V
Absolute Maximum Ratings
Die Packaging Information [1]
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
7
HMC1081
v01.0713
GaAs MMIC MIXER
50 - 75 GHz
Pad Descriptions
Pad Number Function Description Pad Schematic
1LO This pad is AC coupled
and Matched to 50 Ohms.
2RF This pad is AC coupled
and Matched to 50 Ohms.
3IF This pad is DC coupled
and Matched to 50 Ohms.
Die Bottom GND Die bottom must be connected to RF/DC ground
Assembly Diagram
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - CHIP
8
HMC1081
v01.0713
GaAs MMIC MIXER
50 - 75 GHz
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina
thin lm substrates are recommended for bringing RF to and from the chip
(Figure 1). One way to accomplish this is to attach the 0.102mm (4 mil)
thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-
tab) which is then attached to the ground plane (Figure 2). Microstrip
substrates should be located as close to the die as possible in order to
minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to
0.152 mm (3 to 6 mils).
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protec-
tive containers, and then sealed in an ESD protective bag for shipment.
Once the sealed ESD protective bag has been opened, all die should be
stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt
to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against > ± 250V
ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is
applied. Use shielded signal and bias cables to minimize inductive pick-
up.
General Handling: Handle the chip along the edges with a vacuum collet
or with a sharp pair of bent tweezers. The surface of the chip may have
fragile air bridges and should not be touched with vacuum collet, tweezers,
or ngers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy.
The mounting surface should be clean and at.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool
temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO
NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of
scrubbing should be required for attachment.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy llet is observed
around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage
temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recom-
mended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on
the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils).
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
RF Ground Plane
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 1.
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
RF Ground Plane
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 2.
0.150mm (0.005”) Thick
Moly Tab
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
