\"HT1MOA2S30/E/3,118\" - NXP SEMICONDUCTORS

1. General description

HITAG 1 based transponders are highly integrated and do not need any additional

components beside the external coil.

Data between Key (RWD) and transponder is transmitted bidirectionally, in Half Duplex

Mode. The HITAG 1 transponder IC offers also an encrypted data transmission.

The AntiCollision (AC) Mode, which is used mainly in long range operation, allows to

handle several transponders that are at the same time in the communication field of the

antenna, thus achieving highest operating reliability and permitting to handle several

transponders quickly and simultaneously.

The HITAG 1 transponder IC provides two protocol modes, Standard and Advanced

Mode. The Advanced Protocol Mode operates compared to the Standard Protocol Mode

with an increased number of Startbits and a 8-bit Cyclic Redundancy Check (CRC) sent

by the transponder IC at read operations.

HITAG 1 transponder IC offer a memory of 2 kbit.

2. Features and benefits

Identification transponder for use in contactless applications

Operating frequency 125 kHz

Data transmission and energy supply via RF link, no internal battery

Non-volatile memory of 2 kbit

Organized in 64 pages, 4 bytes each

10 years non-volatile data retention

100000 erase/write cycles

Selective read/write protection of memory content

Mutual authentication function

3. Applications

Logistics

Asset tracking

Gas cylinder ID

Industrial automation

HT1x

HITAG 1 transponder IC

Rev. 3.0 — 16 September 2011

210530 Product short data sheet

COMPANY PUBLIC

Product short data sheet

COMPANY PUBLIC Rev. 3.0 — 16 September 2011

210530 2 of 9

NXP Semiconductors HT1x

HITAG 1 transponder IC

4. Quick reference data

5. Ordering information

[1] This package is also known as MOA2

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Wafer EEPROM characteristics

tret retention time Tamb 55 C10 - - year

Nendu(W) write endurance 100000 - - cycle

Interface characteristics

Ciinput capacitance between LA and LB

HT1ICS3002W/V6F 189 210 231 pF

Table 2. Ordering information

Type number Package

Name Description Version

HT1ICS3002W/V6F W afer sawn wafer on FFC, 150 m, 8 inch, UV, inkless -

HT1MOA2S30/E/3 PLLMC plastic leadless module carrier package; 35 mm

wide tape SOT500-2[1]

Product short data sheet

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210530 3 of 9

NXP Semiconductors HT1x

HITAG 1 transponder IC

6. Block diagram

The HITAG 1 transponder IC require s no external power supply. The contactless interface

generates the power supply and the system clock via the resonant circuitry by inductive

coupling to the RWD. The interface also demodulates data transmitted from the RWD to

the HITAG 1 transponder IC, and modula tes the mag netic field for data transm ission from

the HITAG 1 transponder IC to the RWD.

Data are stored in a non-volatile memory (EEPROM). The memory has a capacity of

2 kbit and is organized in blocks.

Fig 1. Block diag ram of HITAG 1 transponder IC

001aai334

CLK

MOD

DEMOD

VREG

VDD

data

out

clock

R/W

ANALOGUE

RF INTERFACE

PAD

RECT

Cres

DIGITAL CONTROL

TRANSPONDER

ANTICOLLISION

READ/WRITE

CONTROL

ACCESS CONTROL

EEPROM INTERFACE

CONTROL

RF INTERFACE

CONTROL

EEPROM

SEQUENCER

CHARGE PUMP

Product short data sheet

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NXP Semiconductors HT1x

HITAG 1 transponder IC

7. Functional description

7.1 Memory map

The 2 kbit memory area of the HITAG 1 transponder IC is divided into 16 blocks. Each

block comprises 4 pages with 4 bytes (1 byte = 8 bits) each. A page is the smalle st access

unit.

Addressing is done p agewise (p age 0 to 63) whereas acce ss is gained eith er pa gewise or

blockwise by entering the respective start address.

Block access is only available for blocks 2 to 15, page access is available for pages 0 to

63.

Areas (or settings) with light dark background can be configured by the customer within

the Configuration Page (page 1 of block 0).

Fig 2. Memory map

aaa-000324

read only

read/write

write only

one time programmable

neither read nor write

Serial Number ro

r/w or ro

Logdata 1B

Logdata 0A

Logdata 1A

Logdata 0B

Configuration

Key A

Key B

Block 1

Block 4

Block 7

Block 8

Block 15

user data

Block 0

Configuration of the memory is

done in the configuration page

secret

public

r/w

OTP

r/w

wo or 0

r/w

secret

r/w

OTP

Product short data sheet

COMPANY PUBLIC Rev. 3.0 — 16 September 2011

210530 5 of 9

NXP Semiconductors HT1x

HITAG 1 transponder IC

8. Limiting values

[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only

and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical

Characteristics section of this specification is not implied.

[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only

and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical

Characteristics section of this specification is not implied.

9. Abbreviations

Table 3. Limiting values - HT1ICS3002W/V6F[1]

Symbol Parameter Conditions Min Max Unit

VDD supply voltage 0.5 6.5 V

VESD electrostatic discharge voltage MIL-STD 883D, Method

3015.7, Human Body 2- kV

Ilu latch-up current MIL-STD 883D, Method 3023 100 - mA

Ii(max) maximum input current IN1-IN2 - 30 mA

Tjjunction temperature 55 +140 C

Table 4. Limiting values - HT1MOA2S30/E/3[1]

Symbol Parameter Conditions Min Max Unit

Tstg storage temperature 55 +125 C

Tamb ambient temperature Rth(j-a)  30 K/W @ Iin = 30 mA 25 +85 C

Table 5. Abbreviations

Acronym Description

AC AntiCollision

CRC Cyclic Redundancy Check

EEPROM Electrically Erasable Programmable Read-Only Memory

IC Integrated Circuit

RF Radio Frequency

RWD Read Write Device

Product short data sheet

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NXP Semiconductors HT1x

HITAG 1 transponder IC

10. Revision history

Table 6. Revision history

Document ID Release date Data sheet status Change notice Supersedes

HT1X_SDS v.3.0 20110916 Product short data sheet - -

Product short data sheet

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11. Legal information

11.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of device (s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

11.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond tho se described in the

Product data sheet.

11.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liabili ty towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Te rms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by cust omer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product develop ment.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product short data sheet

COMPANY PUBLIC Rev. 3.0 — 16 September 2011

210530 8 of 9

NXP Semiconductors HT1x

HITAG 1 transponder IC

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for aut omotive use. It i s neither qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in au tomotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive appl ications beyond NXP Semi conductors’

standard warrant y and NXP Semiconductors’ product specifications.

11.4 Licenses

11.5 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

HITAG — is a trademark of NXP B.V.

12. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

ICs with HITAG functionality

NXP Semiconductors owns a worldwide perpetual license for the patents

US 5214409, US 5499017, US 5235326 and for any foreign counterparts

or equivalents of t hese patents. The license is granted for the Field-of-Use

covering: (a) all non-animal applicat ions, and (b) any application for animals

raised for human consumption (includin g but not limited to dairy animals),

including without limitation livestock and f i sh.

Please note that the license doe s not include rights outside the specified

Field-of-Use, and that NXP Semiconduc tors does not provide indemnity for

the foregoing patents outside the Field-of -Use.

NXP Semiconductors HT1x

HITAG 1 transponder IC

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 16 September 2011

210530

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

13. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Functional description . . . . . . . . . . . . . . . . . . . 4

7.1 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5

9 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 5

10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6

11 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7

11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7

11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

11.4 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

11.5 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

12 Contact information. . . . . . . . . . . . . . . . . . . . . . 8

13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9