2N7334
IRFG110
VGS Gate – Source Voltage
IDContinuous Drain Current (VGS = 10V , Tcase = 25°C)
IDContinuous Drain Current (VGS = 10V , Tcase = 100°C)
IDM Pulsed Drain Current
PDPower Dissipation @ Tcase = 25°C
Linear Derating Factor
EAS Single Pulse Avalanche Energy 2
dv/dt Peak Diode Recovery 3
TJ, Tstg Operating and Storage Temperature Range
RθJC Thermal Resistance Junction to Case
RθJCA Thermal Resistance Junction-to-Ambient
±20V
1.A
0.6A
4A
1.4W
0.011W/°C
75mJ
5.5V/ns
–55 to 150°C
6.25°C/W
175°C/W
MECHANICAL DATA
Dimensions in mm (inches)
14
1
8
7
2.134
(0.084)
6.426 ± 0.305
(0.253 ± 0.012)
9.525 ± 0.635
(0.375 ± 0.025)
1.422 ± 0.102
(0.056 ± 0.004) 2.54
(0.100)
0.457 ± 0.102
(0.018 ± 0.004)
19.507 ± 0.432
(0.768 ± 0.017)
ABSOLUTE MAXIMUM RATINGS(Tcase = 25°C unless otherwise stated)
14 LEAD MOULDED DIP PACKAGE
Notes
1) Pulse Test: Pulse Width ≤300µs, δ≤2%
2) @ VDD = 25V , L ≥112mH , RG= 25Ω, Peak IL= 1A , Starting TJ= 25°C
3) @ ISD ≤1A , di/dt ≤75A/µs , VDD ≤BVDSS , TJ≤150°C , Suggested RG= 24Ω
14 LEAD DUAL IN LINE QUAD
N-CHANNEL
POWER MOSFETS
FEATURES
• AVALANCHE ENERGY RATED
• HERMETICALLY SEALED
• DYNAMIC dv/dt RATING
• SIMPLE DRIVE REQUIREMENTS
• FOR AUTOMATIC INSERTION
• SIMPLE DRIVE REQUIREMENTS
• EASE OF PARALLELING
• 4 N-CHANNEL CO-PACKAGED HEXFETS
• LIGHTWEIGHT
N-CHANNEL
1—Drain 1
2—Source 1
3—Gate 1
N-CHANNEL
5—Gate 2
6—Source 2
7—Drain 2
N-CHANNEL
8—Drain 3
9—Source3
10—Gate 3
N-CHANNEL
12—Gate 4
13—Source 4
14—Drain 4
BVDSS ±100V
ID(cont) 1A
RDS(on) 0.7ΩΩ
11,4—NC
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk Website: http://www.semelab.co.uk
Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed
to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use.
Semelab encourages customers to verify that datasheets are current before placing orders.
Document Number 5829
Issue 1
2N7334
IRFG110
Parameter Test Conditions Min. Typ. Max. Unit
100
0.13
0.70
0.80
24
0.86 25
250
100
–100
180
82
15 15
7.5
7.5
20
25
40
40
1
4
1.5
200
0.83
Negligible
4.0
6.0
VGS = 0 ID= 1mA
Reference to 25°C
ID= 1mA
VGS = 10V ID= 0.6A
VGS = 10V ID= 1A
VDS = VGS ID= 250µA
VDS ≥15V IDS = 0.60A
VGS = 0 VDS = 0.8VDSS
TJ= 125°C
VGS = 20V
VGS = –20V
VGS = 0
VDS = 25V
f = 1MHz
VGS = 10V ID= 1A
VDS = 0.5VDS
VDD = 50V
ID= 1A
RG= 24Ω
IS= 1.0A TJ= 25°C
VGS = 0
IF= 1A TJ= 25°C
di/ dt≤100A/µsV
DD ≤50V
ELECTRICAL CHARACTERISTICS (Tamb = 25°C unless otherwise stated)
Drain – Source Breakdown Voltage
Temperature Coefficient of
Breakdown Voltage
Static Drain – Source On–State
Resistance
Gate Threshold Voltage
Forward Transconductance
Zero Gate Voltage Drain Current
Forward Gate
– Source Leakage
Reverse Gate
– Source Leakage
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate – Source Charge
Gate – Drain (“Miller”) Charge
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
Fall Time
Continuous Source Current
Pulse Source Current 2
Diode Forward Voltage 1
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn–On Time
V
V/°C
Ω
V
S(Ω
µA
nA
pF
nC
ns
A
V
ns
µC
nH
BVDSS
∆BVDSS
∆TJ
RDS(on)
VGS(th)
gfs
IDSS
IGSS
IGSS
Ciss
Coss
Crss
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
IS
ISM
VSD
trr
Qrr
ton
LD
LS
STATIC ELECTRICAL RATINGS
Notes
1) Pulse Test: Pulse Width ≤300µs, δ≤2%
2) Repetitive Rating – Pulse width limited by maximum junction temperature.
DYNAMIC CHARACTERISTICS
SOURCE – DRAIN DIODE CHARACTERISTICS
Internal Drain Inductance (from centre of drain pad to die)
Internal Source Inductance (from centre of source pad to end of source bond wire)
PACKAGE CHARACTERISTICS
(Ω)
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk Website: http://www.semelab.co.uk
Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed
to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use.
Semelab encourages customers to verify that datasheets are current before placing orders.
Document Number 5829
Issue 1
