Technical Data 4328 Effective October 2015
Supersedes May 2008
Product description
• Designed for high current, low voltage
applications
• Low DCR, high efficiency
• Foil construction for higher frequency circuit
designs
• Frequency range 1kHz to 1MHz
• Ferrite core material
Applications
• Distributed power systems DC-DC converters
• General-purpose low voltage supplies
• Computer systems
• Servers
• Industrial Equipment
• Data networking and storage systems
Environmental data
• Storage temperature range (component):
-40°C to +125°C
• Operating temperature range: -40°C to +125°C
(ambient + self-temperature rise).
• Solder reflow temperature: J-STD-020D
HC1
High current inductor
Pb
2
Technical Data 4328
Effective October 2015
HC1
High current inductor
www.eaton.com/elx
Product specifications
Part number OCL1 (μH) ±15% lrms
2 amps (approx.) lsat
3 amps (approx.) DCR (Ω) maximum @ 20°C Volt-μsec4 (V μs) ref.
HC1-R22-R 0.218 51.42 40.5 0.00036 1.83
HC1-R30-R 0.291 51.42 31.8 0.00036 1.83
HC1-R57-R 0.572 37.83 33.4 0.00068 3.66
HC1-R87-R 0.866 28.01 31.0 0.00123 5.49
HC1-1R0-R 1.12 28.01 25.4 0.00123 5.49
HC1-1R7-R 1.66 22.30 22.2 0.0020 7.33
HC1-2R3-R 2.29 22.30 16.7 0.0020 7.33
HC1-3R6-R 3.59 16.76 13.4 0.0035 9.16
HC1-5R1-R 5.15 12.79 11.2 0.0057 10.99
HC1-7R8-R 7.85 12.79 6.7 0.0057 10.99
HC1-100-R 10.5 12.79 5.3 0.0057 10.99
1. OCL (Open Circuit Inductance) Test parameters: 300kHz, .25Vrms, 0.0Adc & Isat.
2. Irms Amps for approximately ΔT of 40°C. DC current for an approximate ΔT of 40°C without
core loss. Derating is necessary for AC currents. It is recommended that the temperature of the part
not exceed 125°C under worst case operating conditions verified in the end application.
3. Isat Amps Peak for approximately 30% rolloff @ 20°C.
4. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at 200kHz
necessary to generate a core loss equal to 10% of the total losses for 40°C temperature rise.
See Core Loss Graph.
5. Part number definition - HC1-xxx-R:
HC1 = Product code and size
-xxx = Inductance value
R = Decimal point (if no “R” is present, last character equals number of zeros )
-R Suffix = RoHS compliant
Dimensions–mm
Packaging information (mm)
Supplied in tape and reel packaging, 250 parts per reel, 13” diameter reel.
xxx = Inductance value
wwllyy = Date code R = Revision level
Top View Side View Recommended Pad Layout
(Componenet Side)
Front View Schematic
10.0
Max.
2
1
4.9 Typ.
2.2
Typ.
13.0
Max.
4.5
14.5
10.0
1
2
4.5
13.0
Max.
2.
0
1
2
A
A
H
C
1-XXX
wwlly
yR
E
TI
N A-
1
0
.
3
1.5 di
a
+
0
.1/-
0
.
0
1.5 di
a
min
4.
0
2.
0
2
0
.
0
1.7
11.5
24.
0
+/-0.3
User direction of feed
1
3
.
4
1
3
.
4
3
Technical Data 4328
Effective October 2015
HC1
High current inductor
www.eaton.com/elx
Core loss
Core loss
10
99
98
3020
97
96
95
94
92
90
80
70
60
50
40
20
0
300400 500600 800
1000
1009080706050 04020
200 k Hz
400 k Hz
300 k Hz
100 k Hz
50 k Hz
I
rms
Derating With Core Loss
% of Losses from I
rms
(maximum)
% of Applied Volt-μ-Seconds
4
Technical Data 4328
Effective October 2015
HC1
High current inductor
www.eaton.com/elx
Inductance characteristics
HC1 Inductor (R87)
50
60
70
80
90
100
0102030405060708090100 110 120
%of I
OCL(%)
HC1 Inductor (R22, 7R8)
50
60
70
80
90
100
0102030405060708090100 110
120
%of I
OCL(%)
HC1 Inductor (1R7)
50
60
70
80
90
100
0102030405060708090100 110 120
%of I
OCL(%)
HC1 Inductor (R57, 2R3, 3R6, 5R1)
50
60
70
80
90
100
0102030405060708090100 11
0120
%of I
OCL(%)
HC1 Inductor (R30, 100)
50
60
70
80
90
100
0102030405060708090100 110 120
%of I
OCL(%)
HC1 Inductor (1R0)
50
60
70
80
90
100
0102030405060708090100 110
120
%of I
OCL (%)
sat sat
sat
sat
sat
sat
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2015 Eaton
All Rights Reserved
Printed in USA
Publication No. 4328 BU-SB08064
October 2015
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Technical Data 4328
Effective October 2015
HC1
High current inductor
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25
°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Solder reflow profile
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (tL)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm) 235°C 220°C
≥2.5mm 220°C 220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C