Technical Data 4328 Effective October 2015 Supersedes May 2008 HC1 High current inductor Applications Product description * Distributed power systems DC-DC converters * General-purpose low voltage supplies * Computer systems * Servers * Industrial Equipment * Data networking and storage systems Environmental data * Designed for high current, low voltage applications * Storage temperature range (component): -40C to +125C * Low DCR, high efficiency * * Foil construction for higher frequency circuit designs Operating temperature range: -40C to +125C (ambient + self-temperature rise). * Solder reflow temperature: J-STD-020D * Frequency range 1kHz to 1MHz * Ferrite core material Pb HC1 High current inductor Technical Data 4328 Effective October 2015 Product specifications Part number OCL1 (H) 15% lrms2 amps (approx.) lsat3 amps (approx.) DCR () maximum @ 20C Volt-sec4 (V s) ref. HC1-R22-R 0.218 51.42 40.5 0.00036 1.83 HC1-R30-R 0.291 51.42 31.8 0.00036 1.83 HC1-R57-R 0.572 37.83 33.4 0.00068 3.66 HC1-R87-R 0.866 28.01 31.0 0.00123 5.49 HC1-1R0-R 1.12 28.01 25.4 0.00123 5.49 HC1-1R7-R 1.66 22.30 22.2 0.0020 7.33 HC1-2R3-R 2.29 22.30 16.7 0.0020 7.33 HC1-3R6-R 3.59 16.76 13.4 0.0035 9.16 HC1-5R1-R 5.15 12.79 11.2 0.0057 10.99 HC1-7R8-R 7.85 12.79 6.7 0.0057 10.99 HC1-100-R 10.5 12.79 5.3 0.0057 10.99 1. OCL (Open Circuit Inductance) Test parameters: 300kHz, .25Vrms, 0.0Adc & Isat. 2. Irms Amps for approximately T of 40C. DC current for an approximate T of 40C without core loss. Derating is necessary for AC currents. It is recommended that the temperature of the part not exceed 125C under worst case operating conditions verified in the end application. 3. Isat Amps Peak for approximately 30% rolloff @ 20C. 4. Applied Volt-Time product (V-s) across the inductor. This value represents the applied V-s at 200kHz necessary to generate a core loss equal to 10% of the total losses for 40C temperature rise. See Core Loss Graph. 5. Part number definition - HC1-xxx-R: HC1 = Product code and size -xxx = Inductance value R = Decimal point (if no "R" is present, last character equals number of zeros ) -R Suffix = RoHS compliant Dimensions-mm Top View Side View Recommended Pad Layout Front View 4.5 4.5 13.0 Max. 1 10.0 Max. 4.9 Typ. 1 10.0 2 2 14.5 2.2 Typ. 13.0 Max. Schematic (Componenet Side) xxx = Inductance value wwllyy = Date code R = Revision level Packaging information (mm) Supplied in tape and reel packaging, 250 parts per reel, 13" diameter reel. 4.0 1.5 dia +0.1/-0.0 2.0 1.5 dia min A 1.7 1 11.5 HC1-XXX wwllyyR 13.4 24.0 +/-0.3 2 2.0 10.3 SECTION A-A 20.0 A 13.4 User direction of feed 2 www.eaton.com/elx HC1 High current inductor Technical Data 4328 Effective October 2015 Core loss Irms Derating With Core Loss 0 20 40 50 70 Hz 50 k 100 k Hz 80 400 k 300 Hz kH z 200 kH z % of Losses from Irms (maximum) 60 90 92 94 95 96 97 98 99 10 20 30 40 50 60 70 80 90 100 200 300 400 500 600 800 1000 % of Applied Volt--Seconds www.eaton.com/elx 3 HC1 High current inductor Technical Data 4328 Effective October 2015 Inductance characteristics HC1 Inductor (R22, 7R8) 100 100 90 90 80 80 OCL (%) OCL (%) HC1 Inductor (R87) 70 70 60 60 50 0 10 20 30 40 50 60 70 80 90 100 110 50 120 0 10 20 30 40 50 % of I sat 100 90 90 80 80 OCL (%) OCL (%) 100 70 0 10 20 30 40 50 60 70 80 90 100 110 50 120 0 10 20 30 40 50 60 70 % of I sat % of I sat HC1 Inductor (R30, 100) HC1 Inductor (1R0) 100 110 120 80 90 100 110 120 80 90 100 110 120 100 90 90 80 OCL (%) OCL (%) 90 60 100 70 80 70 60 60 0 10 20 30 40 50 60 % of Isat 4 80 70 60 50 70 HC1 Inductor (R57, 2R3, 3R6, 5R1) HC1 Inductor (1R7) 50 60 % of I sat www.eaton.com/elx 70 80 90 100 110 120 50 0 10 20 30 40 50 60 % of I sat 70 HC1 High current inductor Technical Data 4328 Effective October 2015 Solder reflow profile TP TC -5C tP Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 <2.5mm) 235C 220C 2.5mm 220C 220C Table 2 - Lead (Pb) Free Solder (Tc) Tsmin 25C ts Time 25C to Peak Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260C 260C 260C 1.6 - 2.5mm 260C 250C 245C >2.5mm 250C 245C 245C Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder * Temperature min. (Tsmin) 100C 150C * Temperature max. (Tsmax) 150C 200C * Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3C/ Second Max. 3C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183C 60-150 Seconds 217C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6C/ Second Max. 6C/ Second Max. Time 25C to Peak Temperature 6 Minutes Max. 8 Minutes Max. Preheat and Soak * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx (c) 2015 Eaton All Rights Reserved Printed in USA Publication No. 4328 BU-SB08064 October 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners.