SILICON RFIC
LOW CURRENT AMPLIFIER
FOR MOBILE COMMUNICATIONS
UPC8178TB
DESCRIPTION
The UPC8178TB is a silicon monolithic integrated circuit
designed as an amplifier for mobile communications. This IC
can realize low current consumption with an external chip
inductor which cannot be realized on an internal 50 wideband
matched IC. This low current amplifier operates on 3.0 V. This
device is manufactured using NEC's 30 GHz fmax UHS0 (Ultra
High Speed Process) silicon bipolar process which uses direct
silicon nitride passivation film and gold electrodes. These
materials can protect the chip surface from pollution and
prevent corrosion/migration. Thus, this IC has excellent perfor-
mance, uniformity and reliability.
NEC's stringent quality assurance and test procedures ensure
the highest reliability and performance.
California Eastern Laboratories
APPLICATIONS
Buffer Amplifiers on 0.1 to 2.4 GHz mobile
communications system
PART NUMBER UPC8178TB
PACKAGE OUTLINE S06
SYMBOLS PARAMETERS AND CONDITIONS1UNITS MIN TYP MAX
ICC Circuit Current (no signal) mA 1.4 1.9 2.4
GPf = 1.0 GHz dB 9.0 11.0 13.0
Power Gain f = 1.9 GHz dB 9.0 11.5 13.5
f = 2.4 GHz dB 9.0 11.5 13.5
ISOL f = 1.0 GHz dB 34 39
Isolation f = 1.9 GHz dB 35 40
f = 2.4 GHz dB 33 38
PO(1dB) f = 1.0 GHz dBm -8.0 -4.0
1 dB Gain Compression Output Power f = 1.9 GHz dBm -11.0 -7.0
f = 2.4 GHz dBm -11.5 -7.5
NF f = 1.0 GHz dB 5.5 7.0
Noise Figure f = 1.9 GHz dB 5.5 7.0
f = 2.4 GHz dB 5.5 7.0
RLin f = 1.0 GHz dB 4 7
Input Return Loss f = 1.9 GHz dB 5 8
f = 2.4 GHz dB 6.5 9.5
ELECTRICAL CHARACTERISTICS
(TA = 25°C, VCC = VOUT = 3.0 V, ZS = ZL = 50 , at LC matched frequency unless otherwise specified))
LOW CURRENT CONSUMPTION
ICC = 1.9 mA TYP @ VCC = 3.0 V
SUPPLY VOLTAGE:
VCC = 2.4 to 3.3 V
EXCELLENT ISOLATION:
ISOL = 39 dB TYP @ f = 1.0 GHz
ISOL = 40 dB TYP @ f = 1.9 GHz
ISOL = 38 dB TYP @ f = 2.4 GHz
POWER GAIN:
GP = 11.0 dB TYP @ f = 1.0 GHz
GP = 11.5 dB TYP @ f = 1.9 GHz
GP = 11.5 dB TYP @ f = 2.4 GHz
OPERATING FREQUENCY:
0.1 to 2.4 GHz (Output port LC matching)
1 dB GAIN COMPRESSION OUTPUT POWER:
PO(1 dB) = -4.0 dBm TYP @ f = 1.0 GHz
PO(1 dB) = -7.0 dBm TYP @ f = 1.9 GHz
PO(1 dB) = -7.5 dBm TYP @ f = 2.4 GHz
HIGH-DENSITY SURFACE MOUNTING:
6-pin super minimold package (2.0 x 1.25 x 0.9 mm)
LOW WEIGHT:
7 mg (Standard Value)
FEATURES
+20
+10
0
-10
-20
-30
-400.1 1.00.3 3.0
T
A
= -40°C
T
A
= +85°C
T
A
= +25°C
V
CC
= 3.0 V
1.9 GHz
2.4 GHz
1.0 GHz
POWER GAIN vs. FREQUENCY
DISCONTINUED
SYMBOLS PARAMETERS UNITS MIN TYP MAX
VCC Supply Voltage1V 2.4 3.0 3.3
TAOperating
Ambient Temperature ˚C -40 +25 +85
ABSOLUTE MAXIMUM RATINGS1
(TA = +25°C unless otherwise specified)
UPC8178TB
RECOMMENDED
OPERATING CONDITIONS
Note:
1. Same voltage applied to pins 4 and 6.
SYMBOLS PARAMETERS UNITS RATINGS
VCC Supply Voltage2V 3.6
ICC Circuit Current mA 15
PDPower Dissipation3mW 270
TAOperating Ambient °C -40 to +85
Temperature
TSTG Storage Temperature °C -55 to +150
PIN Input Power dBm +5
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage.
2. Pins 4 and 6.
3. Mounted on a double-sided copper clad 50x50x1.6 mm epoxy
glass PWB, TA = +85°C.
Pin Pin Applied Pin Function and Applications Internal Equivalent Circuit
No. Name Voltage Voltage
(V) (V)
1 Input 0.91
2 GND 0
3
5
4 Output Voltage
same as
VCC
through
external
inductor
6VCC 2.4 to 3.3
PIN FUNCTIONS (Pin Voltage is measured at VCC = 3.0 V)
Ground pin. This pin should be connected to the
system ground with minimum inductance. Ground
pattern on the board should be formed as wide
as possible. All the ground pins must be
connected together with a wide ground pattern to
decrease impedance difference.
Signal input pin. An internal matching circuit,
configured with resistors, enables a 50
connection over a wide band. This pin must be
coupled to the signal source with the capacitor for
DC out.
Signal output pin. This pin is designed as the
collector output. Due to the high impedance
output, this pin should be externally equipped
with LC matching circuit to next stage. For L, a
size 1005 chip inductor can be used.
Power supply pin. This pin should be externally
equipped with a bypass capacitor to minimize it's
impedance.
1
4
6
35
2
Parameter 1.0 GHz output port 1.66 GHz output port 1.9 GHz output port 2.4 GHz output port Marking
matching frequency matching frequency matching frequency matching frequency
ICC GPISOL PO(1 dB) GPISOL PO(1 dB) GPISOL PO(1 dB) GPISOL PO(1 dB)
Part No. (mA) (dB) (dB) (dBm) (dB) (dB) (dBm) (dB) (dB) (dBm) (dB) (dB) (dBm)
UPC8178TB 1.9 11 39 -4.0 11.5 40 -7.0 11.5 38 -7.5 C3B
UPC8179TB 4.0 13.5 44 +3.0 15.5 42 +1.5 15.5 41 +1.0 C3C
UPC8128TB 2.8 12.5 39 -4.0 13 39 -4.0 13 37 -4.0 C2P
UPC8151TB 4.2 12.5 38 +2.5 15 36 +1.5 15 34 +0.5 C2U
UPC8152TB 5.6 23 40 -4.5 19.5 38 -8.5 17.5 35 -8.5 C2V
SERIES PRODUCTS1 (TA = +25°C, VCC = Vout = 3.0 V, ZS = ZL = 50 )
Note:
1. Typical performance.
DISCONTINUED
TEST CIRCUIT 1 (f = 1.0 GHz)
UPC8178TB
EXAMPLE OF TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD
1.0 GHz Output Port Matching
C1, C3, C51000 pF
C20.75 pF
C410 pF
L112 nH
COMPONENT LIST
VCC
C3
C1
C4
C2C3
1
6
4
L1
Output port matching circuit
50
OUT
50
IN
2, 3, 5
C1
C4
C2
C5
C3
L1
C3B
Connector
Top View
AMP. 4
Connector
IN
OUT
Mounting direction
f = 1.0 GHz
DISCONTINUED
TEST CIRCUIT 2 (f = 1.9 GHz)
EXAMPLE OF TEST CIRCUIT 2 ASSEMBLED ON EVALUATION BOARD
UPC8178TB
1.9 GHz Output Port Matching
C1, C3, C5, C61000 pF
C20.5 pF
C410 pF
L13.9 nH
COMPONENT LIST
V
CC
C
4
C
5
C
1
C
6
C
2
C
3
1
6
4
L
1
Output port matching circuit
50
OUT
50
IN
2, 3, 5
C1
C4
C2
C6
C5
C3
L1
C3B
Connector
Top View
Mounting direction
AMP. 4
Connector
IN
OUT
f = 1.9 GHz
DISCONTINUED
TEST CIRCUIT 3 (f = 2.4 GHz)
EXAMPLE OF TEST CIRCUIT 3 ASSEMBLED ON EVALUATION BOARD
UPC8178TB
2.4 GHz Output Port Matching
C1, C3, C4, C51000 pF
C310 pF
L11.8 nH
L22.7 nH
COMPONENT LIST
V
CC
C
3
C
4
C
1
C
5
C
2
1
6
4
L
1
L
2
Output port matching circuit
50
OUT
50
IN
2, 3, 5
C3B
Connector
Top View
Mounting direction
AMP. 4
Connector
C1
IN
L1
L2
C4
C5
C3
C2
OUT
f = 2.4 GHz
NOTES:
1. 42 x 35 x 0.4 mm double sided copper clad polyimide board.
2. Solder plated on pattern.
3. Back side: GND pattern.
4. Through holes.
DISCONTINUED
UPC8178TB
OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE S06
Note:
All dimensions are typical unless otherwise specified.
EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES Headquarters 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 (408) 988-3500 Telex 34-6393 FAX (408) 988-0279
24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) Internet: http://WWW.CEL.COM
06/20/2001
DATA SUBJECT TO CHANGE WITHOUT NOTICE
0 to 0.1
0.2
+0.10
-0.05
0.15
1.3
2.1 ±0.1
1.25 ±0.1
0.1 MIN
+0.10
-0.05
2.0 ±0.2 0.65
0.65
0.9 ± 0.1
0.7
PIN CONNECTIONS
PIN NO. PIN NAME
1Input
2 GND
3 GND
4Output
5 GND
6VCC
4
5
6
4
5
6
1
2
3
1
2
3
C3B
(Top View) (Bottom View)
SYSTEM APPLICATION EXAMPLE
Location examples in digital cellular
I
Q
0˚
90˚
DEMOD
Q
÷N PLL
PLL
I
RX
TX
PA
LNA
φ
SW
Part Number Quantity
UPC8178TB-E3-A 3 K pcs/reel
ORDERING INFORMATION
Note: Embossed tape, 8 mm wide. Pins 1, 2 and 3 face the tape
perforation side.
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
DISCONTINUED
5-146
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile:
(
408
)
988-0279
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per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A -AZ
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DISCONTINUED
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Authorized Distributor
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UPC8178TB-EV09 UPC8178TB-EV24 UPC8178TB-EV19