TCD1304DG(8Z,AW) - TOSHIBA - Product.Network

TCD1304DG

2004-01-06

TOSHIBA CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device)

TCD1304DG

The TCD1304DG is a high sensitive and low dark current 3648

−elements linear image sensor. The sensor can be used for POS

scanner.

The device consist of sensitivity CCD chip.

The TCD1304DG has electronic shutter function (ICG).

Electronic shutter funtion can keep always output voltage

constant that vary with intensity of lights.

FEATURES

 Pixel Number : 3648

 Pixel Size : 8µm×200µm

 Photo Sensing Region

: High Sensitive & Low Dark Current pn Photodiode

 Internal Circuit : CCD Drive Circuit

 Power Supply : Only 3.0V Drive (MIN.)

 Function : Electronic Shutter

Sample and Hold Circuit

 Package : 22 Pin CERDIP PACKAGE

MAXIMUM RATINGS (Note 1)

CHARACTERISTIC SYMBOL RATING UNIT

Master Clock Pulse Voltage VφM

SH Pulse Voltage VSH

ICG Pulse Voltage VICG

Digital Power Supply VDD

Analog Power Supply VAD

−0.3~7 V

Operating Temperature Topr −25~60 °C

Storage Temperature Tstg −40~100 °C

Note: All voltage are with respect to SS terminals. (Ground)

Weight: (3.5g (Typ.))

PIN CONNECTION

(TOP VIEW)

Preliminary

PreliminaryPreliminary

Preliminary

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CIRCUIT DIAGRAM

PIN NAMES

φM Master Clock

SH Shift Gate

ICG Integration Clear Gate

VAD Power (Analog)

VDD Power (Digital)

SS Ground

NC Non Connection

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OPTICAL / ELECTRICAL CHARACTERISTICS

(Ta = 25°C, Vφ = 4.0V (PULSE), f φ = 0.5MHz, tINT (INTEGRATION TIME) = 10ms, LOAD

RESISTANCE = 100kΩ, VAD = VDD = 4.0V, LIGHT SOURCE = DAYLIGHT FLUORESCENT

LAMP)

CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT NOTE

Sensitivity R 110 160 ― V / lx·s

Photo Response Non Uniformity PRNU ― ― 10 % (Note 2)

Saturation Output Voltage VSAT 450 600 ― mV VOD

= 3.0V

(Note 4)

Dark Signal Voltage VMDK ― 2 5 mV (Note 5)

Total Transfer Effeiciency TTE 92 95 ― %

Dynamic Range DR ― 300 ― ― (Note 6)

Saturation Exposure SE ― 0.004 ― lx·s (Note 7)

DC Power Dissipation PD ― 25 75 mW

DC Signal Output Voltage VOS 1.5 2.5 3.5 V (Note 8)

Output Impedance Zo ― 0.5 1.0 kΩ

Image Lag of Electronic Shutter VLAGICG ― ― 10 mV Tint=100µs

Note 2: Measured at 50% of SE (Typ.)

Definition of PRNU: PRNU =

( )

%100×

χ∆

Where χ is average of total signal outputs and χ∆ is the maximum deviation from χ under uniform

illumination.

Note 3: Measured at 50% of SE (Typ.)

RI is defined as follows:

RI =

( )

%100

·3647

3647

1nn

∑

+χ−χ

Where χ n and χ n+1 are signal outputs of each pixel. χis average of total signal outputs.

Note 4: VSAT is defined as minimum saturation output voltage of all effective pixels.

Note 5: VMDK is defined as maximum dark signal voltage of all effective pixels.

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2004-01-06

Note 6: Definition of DR : DR =

MDK

SAT

VMDK is proportional to tINT (Integration time).

So the shorter tINT condition makes wider DR value.

Note 7: Definition of SE : SE =

( )

s·lx

SAT

Note 8: DC signal output voltage is defined as follows:

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OPERATING CONDITION

CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT

“H” Level 3.0 4.0 5.5

Master Clock Pulse Voltage

“L” Level

VφM

0 0 0.44

“H” Level 3.0 4.0 5.5

SH Pulse Voltage

“L” Level

VSH 0 0 0.44

“H” Level 3.0 4.0 5.5

ICG Pulse Voltage

“L” Level

VICG 0 0 0.44

Digital Power Supply VDD 3.0 4.0 5.5 V

Analog Power Supply VAD 3.0 4.0 5.5 V

Note: VAD = VDD

MAX. Voltage of Pulse Voltage “H” Level = VDD

MIN. Voltage of Pulse Voltage “H” Level = VDD−0.5V

CLOCK CHARACTERISTICS (Ta = 25°C) (VAD = VDD≥4.0V)

CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT

Master Clock Frequency fφM 0.8 2 4 MHz

Data Rate fDATA 0.2 0.5 1 MHz

Master Clock Capacitance CφM ― 10 ― pF

Shift Pulse Capacitance CSH ― 600 ― pF

ICG Pulse Capacitance CICG ― 250 ― pF

CLOCK CHARACTERISTICS (Ta = 25°C) (4.0V>VAD = VDD≥3.0V)

CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT

Master Clock Frequency fφM 0.8 2 2.4 MHz

Data Rate fDATA 0.2 0.5 0.6 MHz

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TIMING CHART

TCD1304DG−6

TCD1304DG

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TCD1304DG−7

TIMING CHART

(Use electric shutter function)

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TIMING REQUIREMENTS

CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT

ICG Pulse DELAY t1 1000 5000 ― ns

Pulse Timing of ICG and S H t2 100 500 1000 ns

SH Pulse Width t3 1000 ― ― ns

Pulse Timing of ICG and φ M t4 0 20 * ns

*: You keep φM “High” Level.

Note: If you use electronic shutter function. tINT (MIN.) = 10µs

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USE ELECTRONIC SHUTTER

Pulse Timing of SH and ICG

• SH cycle = Tint

tINT (MIN.) = 10µs

You have always same SH pulse width (t3).

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TYPICAL PERFOMANCE CURVES

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TYPICAL PERFOMANCE CURVES

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TYPICAL DRIVE CIRCUIT

TCD1304D

TCD1304DTCD1304D

TCD1304D

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CAUTION

1. Window Glass

The dust and stain on the glass window of the package degrade optical performance of CCD sensor.

Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and

allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or

thermal shock because the glass window is easily to damage.

2. Electrostatic Breakdown

Store in shorting clip or in conductive foam to avoid electrostatic breakdown.

CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static

electricity is sometimes detected. In handing the device, it is necessary to execute the following static

electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system

due to static electricity.

a. Prevent the generation of static electricity due to friction by making the work with bare hands or by

putting on cotton gloves and non-charging working clothes.

b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the

work room.

c. Ground the tools such as soldering iron, radio cutting pliers of or pincer.

It is not necessarily required to execute all precaution items for static electricity.

It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed

range.

3. Incident Light

CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and

PRNU of CCD sensor.

4. Lead Frame Forming

Since this package is not strong against mechanical stress, you should not reform the lead frame.

We recommend to use a IC-inserter when you assemble to PCB.

5. Soldering

Soldering by the solder flow method cannot be guaranteed because this method may have deleterious

effects on prevention of window glass soiling and heat resistance.

Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260°C, or

within three seconds for lead temperatures of up to 350°C.

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PACKAGE DIMENSIONS

Note 1: No. 1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE.

Note 2: TOP OF CHIP TO BOTTOM OF PACKAGE.

Note 3: GLASS THICKNES (n = 1.5)

Weight: (3.5g (Typ.))

Unit : mm

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2004-01-06

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor

devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical

stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of

safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of

such TOSHIBA products could cause loss of human life, bodily injury or damage to property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as

set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and

conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability

Handbook” etc..

• The TOSHIBA products listed in this document are intended for usage in general electronics applications

(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,

etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires

extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or

bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or

spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,

medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this

document shall be made at the customer’s own risk.

• The products described in this document are subject to the foreign exchange and foreign trade laws.

• The information contained herein is presented only as a guide for the applications of our products. No

responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other

rights of the third parties which may result from its use. No license is granted by implication or otherwise under

any intellectual property or other rights of TOSHIBA CORPORATION or others.

• The information contained herein is subject to change without notice.

000707EBA

RESTRICTIONS ON PRODUCT USE