Application Specification
MICTOR* SB Vertical Connectors for
Surface Mount Technology (SMT) 114-13116
LOC B
1
of 16
E
2008 Tyco Electronics Corporation, Harrisburg, PA
All International Rights Reserved
TE logo and Tyco Electronics are trademarks.
*Trademark. Other products, logos, and company names used are the property of their respective owners.
TOOLING ASSISTANCE CENTER 1-800-722-1111
PRODUCT INFORMATION 1-800-522-6752 This controlled document is subject to change.
For latest revision and Regional Customer Service,
visit our website at
www.tycoelectronics.com
Printed Circuit (PC) Board Applications
16 JUN 08 Rev A
All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and
inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2
_
.
Figures and illustrations are for identification only and are not drawn to scale.
1. INTRODUCTION
Recommendations in this document are intended only for Tyco Electronics MICTOR SB product lines.
This specification covers requirements for application of MICTOR SB (Single Beam) Vertical Board–to–Board
Plug and Receptacle Connectors for Surface Mount Technology (SMT) Printed Circuit (PC) Board Applications.
The connectors have in–row contact centerline spacing of 0.50 mm [.0197 in.] and 0.80 mm [.0315 in.].
Depending on the contact centerline, the connectors are designed to accommodate 38 through 300 contact
positions. Connectors are designed for manual or robotic placement on pc boards of various thicknesses.
Plug connectors are available in various stack heights. The stack heights describe the board–to–board
distance when assembled with a standard vertical receptacle. Plugs and receptacles have polarized mating
faces, and are polarized for alignment to the pc boards by means of alignment pegs on the housing bottoms.
Date codes are marked on the sides of the housings.
Figure 1 provides connector features and terms used throughout this specification. Use these terms when
corresponding with Tyco Electronics Personnel to facilitate assistance.
Figure 1
MICTOR SB SMT Vertical Connectors
5.0 mm [.197 in.] Plug
11.0 mm [.433 in.] Plug
(0.50 mm CL Shown)
30.0 mm [1.181 in.] Plug
Receptacle
Assembly
(Typ)
Receptacle with
Guide Post Holes
Plug with
Guide Posts
NOTE
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MICTOR SB SMT Vertical Connectors 114-13116
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2. REFERENCE MATERIAL
2.1. Revision Summary
S
Updated document to corporate requirements
S
Corrected dimensions in Figure 4
2.2. Customer Assistance
Reference Part Number 1658012 and Product Code K052 are representative of MICTOR SB Vertical
Connectors for SMT PC Board Applications. These numbers are used in a service network of customer service
to access tooling and product application information. This service is provided by your local Tyco Electronics
Representative or, after purchase, by calling the Tooling Assistance Center or the Product Information number
at the bottom of page 1.
2.3. Customer Drawings
Customer Drawings for specific products are available from the responsible Tyco Electronics Engineering
Department via the service network. The information contained in the Customer Drawing takes priority if there
is a conflict with this specification or any other technical documentation supplied by Tyco Electronics.
2.4. Specifications
Product Specification 108–2139 and Design Objective 108–2140 provide product performance requirements
and test information. Solderability Specification 109–11–1 provides requirements and evaluation methods.
2.5. Manuals
Manual 402–40 is available upon request and can be used as a guide in soldering. This manual provides
information on various flux types and characteristics along with the commercial designation and flux removal
procedures. A checklist is included in the manual as a guide for information on soldering problems.
3. REQUIREMENTS
3.1. Product Materials
MICTOR SB SMT Connector Housings are constructed of a high temperature thermoplastic – Liquid Crystal
Polymer, UL94V–0. The plug and receptacle signal contacts, and the ground buses are made of phosphor
bronze. The mating interface of the signal contacts and ground buses are underplated with nickel and finished
with gold plating or with gold flash. The solder leads and tines have gold or gold flash plating.
3.2. Storage
Connectors are packaged and shipped in protective anti–static trays or pocket tape which can be used for
automated placement of the connector to the pc board. Connectors should remain in the containers until ready
for use to prevent physical damage to the housings and contacts. The connectors should be used on a first in,
first out basis to avoid storage contamination that could adversely affect signal transmissions and solderability
of the contact tines.
3.3. Polarization
Both the vertical plug and receptacle connectors are prevented from reverse mating by an orientation feature
located at the ends of the connector that interfaces with the orientation holes in the pc board. See Figure 1.
3.4. Circuit Identification
MICTOR SB SMT Vertical Plugs and Receptacles are not marked with a No. 1 pin identifier. Refer to Figure 1
and the following notes for recommendations regarding circuit identification.
There is no industry standard for the callout of the pin number numbering sequence for MICTOR SB SMT Connectors.
It is up to the customers' discretion. However, the most common method is to start with pin number 1 (reference
recommended pc board pad identification in Figure 5, with alignment pegs aligning connector to the pc board pattern)
and proceed to number 2 pin directly on the opposite side of the connector. Pin number 3 would then be adjacent pin
number 1, with pin number 4 adjacent to pin number 2, and so on.
The ground bus contacts of all MICTOR SB true SMT style connectors are internally commoned within each module,
with each module having four surface mount style leads. MICTOR SB SMT Connectors come in three contact
centerline versions, with each version having a different number of contacts per module as listed in the table in
Figure 2.
NOTE
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CENTERLINE
VERSION POSITIONS
PER MODULE MAXIMUM NUMBER
OF MODULES TOTAL NUMBER OF
SIGNAL POSITIONS
0.50 [.0197] 60 5 300
0.80 [.0315] 40 5 200
Figure 2
3.5. Spacing
A. Connector Alignment
To prevent solder joint damage, care should be used when mating connectors to ensure they have the freedom to self
align themselves to each other without binding in any manner that may result in axial forces being transferred through
the solder joints.
Tyco Electronics does NOT recommend the use of more than one mating connector between two pc boards. The use
of multiple connectors on one board mating to multiple connectors on another board may be plagued with issues
regarding connector-to-connector positional tolerances that may result in unfavorable solder joint stress.
B. Board-to-Board Spacing
Board–to–board stacking heights for the MICTOR SB SMT Vertical Connectors are provided in the table in
Figure 3.
The dimension provided does not include the paste thickness between the solder tines and solder pads of both
connectors.
VERTICAL CONNECTOR STACK HEIGHTS BOARD-TO-BOARD DISTANCES (SINGLE LEAD PITCH)
0.50 [.0197] CL 0.80 [.0315] CL
5.00 [.197] 5.00 [.197]
8.00 [.315] 8.00 [.315]
11.00 [.433] 11.00 [.433]
14.00 [.551] 14.00 [.551]
16.00 [.630] 16.00 [.630]
19.00 [.748] 19.00 [.748]
22.00 [.866] 22.00 [.866]
25.00 [.984] 25.00 [.984]
30.00 [1.181] 30.00 [1.181]
Figure 3
3.6. PC Boards for MICTOR SB SMT Connectors
A. Tolerance
At the time of connector placement, the coplanarity of the pad pattern must be held to 0.05 mm [.002 in.]
maximum. We recommend a solder mask to minimize solder bridging between pads. The mask must not
exceed the height of the pad by more than 0.05 mm [.002 in.]. Maximum allowable bow of the pc board
shall be 0.10 mm [.004 in.] over the length of the connector.
Since the connector housings may rest on top of the solder mask, an excessively high mask will allow too much space
between the solder tine and pad for a good solder joint. A solder joint under these conditions would be weak, and
would not provide long term performance for the connector.
CAUTION
!
CAUTION
!
NOTE
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CAUTION
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MICTOR SB SMT Vertical Connectors 114-13116
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B. Material and Thickness
Since MICTOR SB SMT Vertical Connectors for Surface Mount Technology are true SMT parts, the pc
board thickness is irrelevant. However, special caution should be taken to ensure the pc boards are at
least thick enough to ensure board stability, (flatness, etc.) throughout the reflow process and be rigid
enough to support mate and unmate cycling.
C. PC Board Layouts
The recommended pc board patterns depend on the appropriate connector centerline, (0.50 mm
[.0197 in.], 0.635 mm [.025 in.], or 0.80 mm [.0315 in.]), and type, (receptacle or plug) are provided in
Figure 4. These layouts are viewed from the connector side.
Figure 4 (cont’d)
0.50 [.0197] CL Receptacles with Guide Post Features
(Omit 3.68 [.145] Diameter Holes for Parts without Guide Post Features)
0.50 [.0197] CL Plugs
MICTOR SB SMT Vertical Connectors 114-13116
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Figure 4 (cont’d)
0.80 [.0315] CL Receptacles with Guide Post Features
(Omit 3.68 [.145] Diameter Holes for Parts without Guide Post Features)
0.80 [.0315] CL Plugs
(5.0, 8.0, 11.0, 14.0, 25.0, and 30.0 [.197, .315, .433, .551, .984, and 1.181] Stack Height Parts)
MICTOR SB SMT Vertical Connectors 114-13116
Rev
A6
of 16 Tyco Electronics Corporation
0.80 [.0315] CL Plugs
(16.0, 19.0, and 22.0 [.630, .748, and .866] Stack Height Parts)
MICTOR SB TRUE SMT VERTICAL CONNECTORS RECOMMENDED PC BOARD LAYOUT DIMENSION TABLE
CL
STYLE TYPE STACK
HEIGHT POSN
SIZE B C E F H
60 14.50 [.571] 20.13 [.793] 0 0 25.72 [1.013]
120 34.51 [1.359] 40.13 [1.580] 1 20.00 [.787] 45.72 [1.800]
Recept All 180 54.51 [2.146] 60.13 [2.367] 2 40.00 [1.575] 65.72 [2.587]
240 74.51 [2.934] 80.14 [3.155] 3 60.00 [2.362] 85.72 [3.375]
0.50 300 94.51 [3.721] 100.14 [3.943] 4 80.00 [3.150] 105.73 [4.163]
[.020] 60 14.50 [.571] 18.49 [.728] 0 0 ---
120 34.51 [1.359] 38.48 [1.515] 1 20.00 [.787] ---
Plug All 180 54.51 [2.146] 58.48 [2.302] 2 40.00 [1.575] ---
240 74.51 [2.934] 78.49 [3.090] 3 60.00 [2.362] ---
300 94.51 [3.721] 98.49 [3.878] 4 80.00 [3.150] ---
40 15.20 [.599] 20.13 [.793] 0 0 25.72 [1.013]
80 35.20 [1.386] 40.13 [1.580] 1 20.00 [.787] 45.72 [1.800]
Recept All 120 55.21 [2.174] 60.13 [2.367] 2 40.00 [1.575] 65.72 [2.587]
160 75.21 [2.961] 80.14 [3.155] 3 60.00 [2.362] 85.72 [3.375]
0.80 200 95.21 [3.749] 100.14 [3.943] 4 80.00 [3.150] 105.73 [4.163]
[.031] 40 15.20 [.599] 18.49 [.728] 0 0 ---
80 35.20 [1.386] 38.48 [1.515] 1 20.00 [.787] ---
Plug All 120 55.21 [2.174] 58.48 [2.302] 2 40.00 [1.575] ---
160 75.21 [2.961] 78.49 [3.090] 3 60.00 [2.362] ---
200 95.21 [3.749] 98.49 [3.878] 4 80.00 [3.150] ---
Figure 4 (end)
Holes for processing hold-down fixtures or pc board spacer hardware should be placed along the sides of connectors,
biased toward the middle of the connector's length. Placing holes at the ends of the connectors may cause the ends of
the connectors to act as fulcrum points to pry apart the opposite end or mid-portion of the connector as the hold-down
or spacer hardware is tightened.
CAUTION
!
MICTOR SB SMT Vertical Connectors 114-13116
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Tyco Electronics Corporation
Tyco Electronics does NOT recommend the use of more than one mating connector between two pc boards; if such a
configuration is necessary to meet design requirements, consult the Product Information number located at the bottom
of page 1.
3.7. Mechanical Supports
To ensure the pc board does not bow during placement and a misapplication occurs, the pc board should be
supported along the full length of the connector.
3.8. Processing
PC Boards must meet the solderability requirements of IEC 60512–12–1 (512–6: 1984 Test 12a).
A. Stencil
The recommended stencil aperture is determined by the circuit pad size and stencil thickness. It may be
any shape as long as it prevents solder bridging from one pad to another. Generally, the thinner stencil will
need a larger aperture to maintain the given volume of solder paste. The formulas for calculating the
apertures for the MICTOR SB SMT Connector pads are as follows. Refer to Figure 6.
Vertical Receptacles
0.50 mm [.0197 in.] CL
Volume of solder paste deposit per pad for signal contacts = 0.08776 mm3 [.000005 in3]
Volume of solder paste deposit per pad for ground bus contacts:
Mid–module pads = 0.3086 mm3 [.000019 in3]
End–module pads = 0.1668 mm3 [.000010 in3]
Width of signal contact circuit pads = 0.279 mm [.0110 in.]
Width of ground bus contact pads = 0.432 mm [.0170 in.]
Area of stencil aperture for signal contact pads 0.5675 mm2 [.0009 in2]
Area of stencil aperture for ground bus contact pads:
Mid–module pads = 2.02 mm2 [.0031 in2]
End–module pads = 1.092 mm2 [.0017 in2]
Length of stencil aperture for signal contact pads = 2.27 mm [.0895 in.]
Length of stencil aperture for ground bus contact pads:
Mid–module pads = 4.70 mm [.185 in.]
End–module pads = 2.54 mm [.100 in.]
Width of stencil aperture for signal contact pads = 0.25 mm [.010 in.]
Vertical Receptacles
0.80 mm [.0315 in.] CL
Volume of solder paste deposit per pad for signal contacts = 0.1086 mm3 [.000007 in3]
Volume of solder paste deposit per pad for ground bus contacts:
Mid–module pads = 0.3086 mm3 [.000019 in3]
End–module pads = 0.1835 mm3 [.000011 in3]
Width of signal contact circuit pads = 0.406 mm [.0160 in.]
Width of ground bus contact pads = 0.432 mm [.0170 in.]
Area of stencil aperture for signal contact pads 0.4879 mm2 [.0007 in2]
Area of stencil aperture for ground bus contact pads:
Mid–module pads = 2.02 mm2 [.0031 in2]
End–module pads = 1.200 mm2 [.0019 in2]
Length of stencil aperture for signal contact pads = 2.00 mm [.0795 in.]
Length of stencil aperture for ground bus contact pads:
Mid–module pads = 4.70 mm [.185 in.]
End–module pads = 2.79 mm [.110 in.]
Width of stencil aperture for signal contact pads = 0.36 mm [.014 in.]
CAUTION
!
NOTE
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MICTOR SB SMT Vertical Connectors 114-13116
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Vertical Plugs
0.50 mm [.0197 in.] CL
Volume of solder paste deposit per pad for signal contacts = 0.05590 mm3 [.000003 in3]
Volume of solder paste deposit per pad for ground bus contacts:
Mid–module pads = 0.4535 mm3 [.000028 in3]
End–module pads = 0.2452 mm3 [.000015 in3]
Width of signal contact circuit pads = 0.305 mm [.0120 in.]
Width of ground bus contact pads = 0.635 mm [.0250 in.]
Area of stencil aperture for signal contact pads 0.3678 mm2 [.005 in2]
Area of stencil aperture for ground bus contact pads:
Mid–module pads = 2.968 mm2 [.0046 in2]
End–module pads = 1.613 mm2 [.0025 in2]
Length of stencil aperture for signal contact pads = 1.448 mm [.0570 in.]
Length of stencil aperture for ground bus contact pads:
Mid–module pads = 4.70 mm [.185 in.]
End–module pads = 2.54 mm [.100 in.]
Width of stencil aperture for signal contact pads = 0.25 mm [.010 in.]
Vertical Plugs
0.80 mm [.0315 in.] CL (5.0–14.0, 25.0, and 30.0 mm [.197–.551, .984, and 1.181 in.]
Stack Height Versions)
Volume of solder paste deposit per pad for signal contacts = 0.0737 mm3 [.000005 in3]
Volume of solder paste deposit per pad for ground bus contacts:
Mid–module pads = 0.4535 mm3 [.000028 in3]
End–module pads = 0.2452 mm3 [.000015 in3]
Width of signal contact circuit pads = 0.457 mm [.0180 in.]
Width of ground bus contact pads = 0.635 mm [.0250 in.]
Area of stencil aperture for signal contact pads 0.4879 mm2 [.0007 in2]
Area of stencil aperture for ground bus contact pads:
Mid–module pads = 3.01 mm2 [.0046 in2]
End–module pads = 1.63 mm2 [.0025 in2]
Length of stencil aperture for signal contact pads = 1.19 mm [.047 in.]
Length of stencil aperture for ground bus contact pads:
Mid–module pads = 4.70 mm [.185 in.]
End–module pads = 2.54 mm [.100 in.]
Width of stencil aperture for signal contact pads = 0.41 mm [.016 in.]
Vertical Plugs
0.80 mm [.0315 in.] CL (16.0–22.0 mm [.630–.866 in.] Stack Height Versions)
Volume of solder paste deposit per pad for signal contacts = 0.0964 mm3 [.000006 in3]
Volume of solder paste deposit per pad for ground bus contacts:
Mid–module pads = 0.4535 mm3 [.000028 in3]
End–module pads = 0.2452 mm3 [.000015 in3]
Width of signal contact circuit pads = 0.457 mm [.0180 in.]
Width of ground bus contact pads = 0.635 mm [.0250 in.]
Area of stencil aperture for signal contact pads 0.640 mm2 [.0010 in2]
Area of stencil aperture for ground bus contact pads:
Mid–module pads = 3.01 mm2 [.0046 in2]
End–module pads = 1.63 mm2 [.0025 in2]
Length of stencil aperture for signal contact pads = 1.56 mm [.0615 in.]
Length of stencil aperture for ground bus contact pads:
Mid–module pads = 4.70 mm [.1850 in.]
End–module pads = 2.54 mm [.1000 in.]
Width of stencil aperture for signal contact pads = 0.41 mm [.016 in.]
MICTOR SB SMT Vertical Connectors 114-13116
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All traces must be covered by solder mask in the solder deposit area. Exposed traces could cause bridging and create
a short, or wick solder away from the solder tines, producing a weak solder joint.
If a hold-down aperture is required other than that specified, the design must ensure that the connector housing will
not sit on the solder deposit.
The recommended aperture width is 0.43 mm [.017 in.] for the vertical connector circuit contact pads. It may be wider;
however, care must be given to ensure against solder bridging during processing.
The recommended solder stencil layouts for MICTOR SMT Connectors are shown in Figure 5.
Figure 5 (cont’d)
Solder Stencil Layouts for 0.50 [.0197] CL Receptacles
Solder Stencil Layouts for 0.50 [.0197] CL Plugs
CAUTION
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CAUTION
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MICTOR SB SMT Vertical Connectors 114-13116
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Solder Stencil Layouts for 0.80 [.0315] CL Receptacles
Figure 5 (end)
Solder Stencil Layouts for 0.80 [.0315] CL Plugs
(5.0, 8.0, 11.0, 14.0, 25.0, and 30.0 [.197, .315, .433, .551, .984, and .1.181] Stack Height Parts)
Solder Stencil Layouts for 0.80 [.0315] CL Plugs
(16.0, 19.0, and 22.0 [.630, .748, and .866] Stack Height Parts)
MICTOR SB SMT Vertical Connectors 114-13116
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B. Solder Mask
Solder mask is recommended between all pads, ground bus vias, and angular rings. If a trace is run
between adjacent pads on the solder side of the pc board, a solder mask MUST be applied over the trace
to prevent bridging and wicking of solder away from the contact solder tines. Additionally, there should be
solder mask covering any traces in the area surrounding the bus lead solder deposit. Liquid photo
imageable or dry film solder masks, in step with modern processing techniques are recommended.
C. Recommended Solder Paste Characteristics
1. Alloy type shall be either 63 Sn/37Pb or 60 Sn/40Pb.
2. Flux shall be RMA type.
3. Solids by weight shall be 85% minimum.
4. Mesh designation –200 to +325 (74 to 44 square micron openings, respectively).
5. Minimum viscosity of screen print shall be 5 x 105 cp (centipoise).
6. Minimum viscosity of stencil print shall be 7.5 x 105 cp (centipoise).
D. Solder Volume
Solder volume for each circuit pad and bus tine opening is calculated by multiplying the pad length by the
pad width by the stencil thickness (Volume=LxWxT). The recommended volume for these connectors is
determined with a mean stencil thickness of 0.15 mm [.006 in.]. Refer to the table in Figure 6.
SOLDER PASTE VOLUMES
TYPE CL SIZE TYPE PAD LENGTH WIDTH THICKNESS VOLUME
mm3[in3]
Vertical
Receptacle 0.50 [.0197] Signal Contact 2.273 [.0895] 0.254 [.0100] 0.152 [.0060] 0.08776 [.000005]
p
Signal Contact
Pads 0.80 [.0315] Signal Contact 2.007 [.0790] 0.356 [.0140] 0.152 [.0060] 0.1086 [.000007]
Vti l
0 50 [ 0197]
Mid-Module 4.699 [.1850] 0.432 [.0170] 0.152 [.0060] 0.3086 [.000019]
Vertical
Receptacle
0
.
50 [
.
0197]
End-Module 2.540 [.1000] 0.432 [.0170] 0.152 [.0060] 0.1668 [.000010]
p
Ground Bus
Contact Pads
0 80 [ 0315]
Mid-Module 4.699 [.1850] 0.432 [.0170] 0.152 [.0060] 0.3086 [.000019]
Contact Pads
0
.
80 [
.
0315]
End-Module 2.794 [.1100] 0.432 [.0170] 0.152 [.0060] 0.1835 [.000011]
Vertical Plug
0.50 [.0197] Signal Contact 1.448 [.0570] 0.254 [.0100] 0.152 [.0060] 0.0559 [.000003]
Vertical Plug
Signal Contact
Pads
0.80 [.0315]
{
Signal Contact 1.194 [.0470] 0.406 [.0160] 0.152 [.0060] 0.0737 [.000005]
P
a
d
s0.80 [.0315]
}
Signal Contact 1.562 [.0615] 0.406 [.0160] 0.152 [.0060] 0.0964 [.000006]
0 50 [ 0197]
Mid-Module 4.699 [.1850] 0.635 [.0250] 0.152 [.0060] 0.4535 [.000028]
Vti l
0
.
50 [
.
0197]
End-Module 2.540 [.1000] 0.635 [.0250] 0.152 [.0060] 0.2452 [.000015]
Vertical
Plug Ground
0 80 [ 0315]
{
Mid-Module 4.699 [.1850] 0.635 [.0250] 0.152 [.0060] 0.4535 [.000028]
g
Bus Contact
Pads
0
.
80 [
.
0315]
{
End-Module 2.540 [.1000] 0.635 [.0250] 0.152 [.0060] 0.2452 [.000015]
Pads
0 80 [ 0315]
}
Mid-Module 4.699 [.1850] 0.635 [.0250] 0.152 [.0060] 0.4535 [.000028]
0
.
80 [
.
0315]
}
End-Module 2.540 [.1000] 0.635 [.0250] 0.152 [.0060] 0.2452 [.000015]
{
5.0, 8.0, 11.0, 14.0, 25.0, and 30.0 mm [.197, .315, .433, .551, .984, and 1.181 in.] Stack Height Versions
}
16.0–22.0 mm [.630–1.866 in.] Stack Height Versions
Figure 6
MICTOR SB SMT Vertical Connectors 114-13116
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Paste volumes in excess of those recommended could result in excessive solder wicking onto the solder tine, resulting
in reduction of tine compliance and/or solder joint failure.
More technical information may be available from the manufacturer of the stencil.
E. Connector Placement
Vertical Connectors
The vertical plugs and receptacles are positioned on the pc board by matching the orientation feature on
the bottom of the housing to the unplated holes.
The pc board should be firmly supported in the area directly beneath the connector during placement to prevent the pc
board from flexing. Refer to Paragraph 5.1.
Connectors are available in shipping trays or on tape reels and should be placed directly from the package to the pc
board. Tyco Electronics does NOT recommend emptying them from the package into piles or in bowl feeders prior to
placement.
Connectors should be handled only by the ends. DO NOT touch the solder tines, as moisture from the hands will
contaminate the soldering process and lead position or coplanarity may be compromised.
Optimally, the connector solder tines should be centered on the pc board pads. However, slight misalignment is
permissible. See Figure 7.
Typical for MICTOR SB
SMT Vertical Connectors
Solder Tine
PC Board Pad
PC Board
Tine Centered on PC
Board Pad is Preferable
Tine Overhang up to 50% Max is
Acceptable Per ANSI J-STD 001A
(Class 2)
Figure 7
F. Soldering
Manual 402-40 provides some guidelines for establishing soldering practices.
CAUTION
!
NOTE
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NOTE
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NOTE
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CAUTION
!
NOTE
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NOTE
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1. Techniques
It is recommended that the connector be soldered using convection, vapor phase (VPR), double sided
non–focused infrared (IR), or equivalent soldering technique provided the temperatures and exposure
time are within the ranges specified in Figure 8.
SOLDERING TEMPERATURE TIME
PROCESS CELSIUS FAHRENHEIT (At Max Temp)
VAPOR PHASE SOLDERING 260 500 30 Seconds
INFRARED REFLOW SOLDERING 260 500 30 Seconds
CONVECTION 260 500 30 Seconds
Figure 8
2. Connector Capacity
Connectors will withstand the maximum temperature time limits specified in Figure 8.
3. Reflow Parameters
Due to the many variables involved with the reflow process (ie, component density, orientation, etc), we
recommend that the user conduct trial runs under actual manufacturing conditions to ensure product and
process compatibility.
G. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the
solder paste and flux for recommended cleaning solvents. The following is a listing of common cleaning
solvents that will not affect the connectors. The connectors will be unaffected by any of these solvents for
5 minutes at 105
_
C [221
_
F]. See Figure 9.
Cleaners must be free of dissolved flux and other contaminants. We recommend cleaning with the pc
board on its edge. If using an aqueous cleaner, we recommend standard equipment such as a soak–tank
or an automatic in–line machine
Even when using no clean" solder paste, it is imperative that the contact interface be kept clean of flux and residue,
since it acts as an insulator. Flux may migrate under certain conditions with elevated temperatures and, therefore,
cleaning is necessary even with no clean" paste.
CLEANER TIME
(Mi )
TEMPERATURES (Maximum)
NAME TYPE (Minutes) CELSIUS FAHRENHEIT
Alpha 2110
H
Aqueous 1 132 270
Bioact EC-7
z
Solvent 5 100 212
Butyl Carbitol
D
Solvent 1 Room Ambient
Isopropyl Alcohol Solvent 5 100 212
Kester 5778
s
Aqueous 5 100 212
Kester 5779
s
Aqueous 5 100 212
Loncoterge 520
D
Aqueous 5 100 212
Loncoterge 530
D
Aqueous 5 100 212
Terpene Solvent Solvent 5 100 212
H
Product of Fry’s Metals, Inc.
z
Product of Petroferm, Inc.
D
Product of Union Carbide Corp.
s
Product of Litton Systems, Inc.
Figure 9
MICTOR SB SMT Connectors are not designed to function as pc board stiffeners. Thermal flexing of the pc board will
result in either the connector body following the pc board contour or lifting off the board.
CAUTION
!
CAUTION
!
MICTOR SB SMT Vertical Connectors 114-13116
Rev
A14
of 16 Tyco Electronics Corporation
Consideration must be given to toxicity and other safety requirements recommended by the solvent
manufacturer. Trichloroethylene and Methylene Chloride can be used with no harmful affect to the connectors;
however, Tyco Electronics does NOT recommend them because of the harmful occupational and environmental
effects. Both are carcinogenic (cancer-causing) and Trichloroethylene is harmful to the earth's ozone layer.
If you have a particular solvent that is not listed, contact the Product Information number at the bottom of page 1.
H. Drying
Air drying of cleaned connectors is recommended. Temperature for the connectors should not exceed –55
to 105
_
C [–67 to 221
_
F]. Degradation of the housings could result from extreme temperatures.
3.9. Mating and Unmating
Uneven or off-angle forces during mating and unmating of MICTOR SB SMT Connectors may cause overstress and
damage to the contacts, housings or solder joints. Severe side-to-side rocking motions should be prohibited.
Unmating MICTOR SB SMT Connectors by lifting one end of the connector (peeling) is permitted. However,
this should only be done to initiate separation of the mated contacts at one end of the connector. The
separation angle should be kept as low as possible as the contacts continue to unmate, thereby spreading out
the unmating forces over the length of the connectors. The connectors should not be “peeled” beyond a 20°
angle.
Miniaturization is a design feature of these connectors and the systems in which they are used. Component
density, connector location, and pc board size may make it difficult to remove the connector. Two methods are
recommended to facilitate removal. If unmating board–to–board connectors, the preferred method is to have
one of the pc boards securely fastened and adequately supported to withstand the pulling force applied to the
other pc board. The second method is to construct a tool for your system design that will produce a
straight–away separation of the connectors. See Figure 10.
Application of unmating forces to the pc boards should be done within close proximity of the connector (preferably
within 25.4 mm [1.000 in.] on 1.57 mm [.062 in.] thick pc boards). Stress on the solder joints will increase as the force
is applied further from the connector.
Figure 10
Preferred Permissible
20
_
Max.
Lift Evenly
4
_
Max.
3.10. Repair/Removal
Connectors may be removed from the pc board by standard SMT de–soldering methods. Damaged connectors
must be replaced.
4. QUALIFICATIONS
MICTOR SB SMT Connectors have been Recognized by Underwriters Laboratories (UL) in file No. E28476,
and Certified by CSA International in Certificate No. 218602.
DANGER
NOTE
i
CAUTION
!
CAUTION
!
MICTOR SB SMT Vertical Connectors 114-13116
Rev
A 15
of 16
Tyco Electronics Corporation
5. TOOLING
5.1. PC Board Support
A pc board support must be used to prevent bowing of the pc board during the placement of a connector on
the board.
5.2. Robotic Equipment
MICTOR SB SMT Connectors are pick–and–place compatible. They are normally packaged in trays, but
vertical receptacles and plugs are also available in pocket tape (with or without vacuum pick–up dots).
MICTOR SB SMT Vertical Receptacles and Plugs may be applied using robotic grippers or vacuum heads.
Robotic placement equipment should be capable of accurately locating connectors for pc board insertion using
the connector datum surfaces detailed on the customer drawing. Several robotic companies have experience
with placing MICTOR SB SMT Connectors and can be called upon for assistance. They are:
Universal Instruments Corporation Panasonic Factory Automation
P.O. Box 825 9377 West Grand Ave.
Binghamton, NY 13902 Franklin Park IL 60131
(607) 779–7522 (847) 288–4400
www.uic.com www.panasonicfa.com
Robodyne Fuji America Corporation
2818 Anthony Lane South 171 Corporate Woods Parkways
Minneapolis, MN 55418 Vernon Hills, IL 60061
(612) 789–5277 (847) 913–0162
www.robodyne.com www.fujiamerica.com
MICTOR SB SMT Vertical Connectors 114-13116
Rev
A16
of 16 Tyco Electronics Corporation
6. VISUAL AID
Figure 11 shows a typical application of MICTOR SB SMT Connectors. This illustration should be used by
production personnel to visually ensure suitable applications. Installations which appear visually incorrect
should be inspected using the dimensional information given in the preceding pages of this application
specification.
FIGURE 11. VISUAL AID
SOLDER FILLET
SHOULD BE FORMED
AROUND SOLDER TINE
NOTE: PIN NUMBER 1 AND THE
NUMBER 1 PAD ON THE PC
BOARD FOOTPRINT MUST BE
ALIGNED PRIOR TO MOUNTING.
THIS SHOULD BE DONE BY
PROPERLY ALIGNING THE HOUSING
ALIGNMENT PEGS WITH THE
APPROPRIATE PC BOARD PATTERN
HOLES.
