THS1206
SLAS217H – MAY 1999 – REVISED JULY 2003#
12-BIT, 4 ANALOG INPUT, 6 MSPS, SIMULTANEOUS SAMPLINGANA-
LOG-TO-DIGITAL CONVERTERS
FEATURES
D
High-Speed 6 MSPS ADC
D
4 Analog Inputs
D
Simultaneous Sampling of 4 Single-Ended
Signals or 2 Differential Signals or
Combination of Both
D
Differential Nonlinearity Error: ±1 LSB
D
Integral Nonlinearity Error: ±1.5 LSB
D
Signal-to-Noise and Distortion Ratio: 68 dB
at fI = 2 MHz
D
Auto-Scan Mode for 2, 3, or 4 Inputs
D
3-V or 5-V Digital Interface Compatible
D
Low Power: 216 mW Max
D
5-V Analog Single Supply Operation
D
Internal Voltage References ...50 PPM/°C
and ±5% Accuracy
D
Glueless DSP Interface
D
Parallel µC/DSP Interface
D
Integrated FIFO
D
Available in TSSOP Package
D
Pin Compatible Upgrade to THS10064
APPLICATIONS
D
Radar Applications
D
Communications
D
Control Applications
D
High-Speed DSP Front-End
D
Automotive Applications
DESCRIPTION
The THS1206 is a CMOS, low-power, 12-bit, 6 MSPS
analog-to-digital converter (ADC). The speed, resolution,
bandwidth, and single-supply operation are suited for
applications in radar, imaging, high-speed acquisition, and
communications. A multistage pipelined architecture with
output error correction logic provides for no missing codes
over the full operating temperature range. Internal control
registers are used to program the ADC into the desired
mode. The THS1206 consists of four analog inputs, which
are sampled simultaneously. These inputs can be selected
individually and configured to single-ended or differential
inputs. An integrated 16 word deep FIFO allows the
storage of data in order to take the load off of the processor
connected to the ADC. Internal reference voltages for the
ADC (1.5 V and 3.5 V) are provided.
An external reference can also be chosen to suit the dc
accuracy and temperature drift requirements of the
application. Two different conversion modes can be
selected. In single conversion mode, a single and
simultaneous conversion of up to four inputs can be
initiated by using the single conversion start signal
(CONVST). The conversion clock in single conversion
mode is generated internally using a clock oscillator
circuit. In continuous conversion mode, an external clock
signal is applied to the CONV_CLK input of the THS1206.
The internal clock oscillator is switched off in continuous
conversion mode.
The THS1206C is characterized for operation from 0°C to
70°C while the THS1206I is characterized for operation
from –40°C to 85°C. The THS1206Q is characterized to
meet the rigorous requirements of the automotive
environment from –40°C to 125°C. The THS1206M is
characterized for operation over the full military
temperature range of –55°C to 125°C.
PRODUCT PREVIEW information concerns products in the formative or design
phase of development. Characteristic data and other specifications are design
goals. Texas Instruments reserves the right to change or discontinue these
products without notice.
Please be aware that an important notice concerning availability , standard warranty, and use in critical applications of T exas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
www.ti.com
Copyright 1999 – 2003, Texas Instruments Incorporated
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
www.ti.com
2
ORDERING INFORMATION
PACKAGED DEVICE
TATSSOP
(DA)
0°C to 70°C THS1206CDA
40°C to 85°C THS1206IDA
40°C to 125°C THS1206QDA
55°C to 125°C THS1206MDA
These devices have limited built-in ESD protection. The
leads should be shorted together or the device placed in
conductive foam during storage or handling to prevent
electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
THS1206
DGND to DVDD 0.3 V to 6.5 V
Supply voltage range BGND to BVDD 0.3 V to 6.5 V
AGND to AVDD 0.3 V to 6.5 V
Analog input voltage range AGND 0.3 V to AVDD + 1.5 V
Reference input voltage 0.3 V + AGND to AVDD + 0.3 V
Digital input voltage range 0.3 V to BVDD/DVDD + 0.3 V
Operating virtual junction temperature range, TJ55°C to 150°C
THS1206C 0°C to 70°C
O
p
erating free air tem
p
erature range TA
THS1206I 40°C to 85°C
Operating
free
-
air
temperat
u
re
range
,
T
ATHS1206Q 40°C to 125°C
THS1206M 55°C to 125°C
Storage temperature range, Tstg 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
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3
RECOMMENDED OPERATING CONDITIONS
POWER SUPPLY MIN NOM MAX UNIT
AVDD 4.75 5 5.25
Supply voltage DVDD 3 3.3 5.25 V
BVDD 3 3.3 5.25
ANALOG AND REFERENCE INPUTS MIN NOM MAX UNIT
Analog input voltage in single-ended configuration VREFM VREFP V
Common-mode input voltage VCM in differential configuration 1 2.5 4 V
External reference voltage,VREFP (optional) 3.5 AVDD1.2 V
External reference voltage, VREFM (optional) 1.4 1.5 V
Input voltage difference, REFP REFM 2 V
DIGITAL INPUTS MIN NOM MAX UNIT
High level in
p
ut voltage VIH
BVDD = 3.3 V 2 V
High
-
le
v
el
inp
u
t
v
oltage
,
V
IH BVDD = 5.25 V 2.6 V
Low level in
p
ut voltage VIL
BVDD = 3.3 V 0.6 V
Lo
w-
le
v
el
inp
u
t
v
oltage
,
V
IL BVDD = 5.25 V 0.6 V
Input CONV_CLK frequency DVDD = 3 V to 5.25 V 0.1 6 MHz
CONV_CLK pulse duration, clock high, tw(CONV_CLKH) DVDD = 3 V to 5.25 V 80 83 5000 ns
CONV_CLK pulse duration, clock low, tw(CONV_CLKL) DVDD = 3 V to 5.25 V 80 83 5000 ns
THS1206CDA 0 70
O
p
erating free air tem
p
erature TA
THS1206IDA 40 85
°C
Operating
free
-
air
temperat
u
re
,
T
ATHS1206QDA 40 125
°C
THS1206MDA 55 125
PACKAGE DISSIPATION RATINGS
PACKAGE TA 25°C
POWER RATING DERATING FACTOR
ABOVE TA = 25°C(1) TA = 70°C
POWER RATING TA = 85°C
POWER RATING TA = 125°C
POWER RATING
DA 1453 mW 11.62 mW/°C930 mW 756 mW 291 mW
(1) This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA). Thermal resistances are not production tested and are for
informational purposes only.
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
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4
ELECTRICAL CHARACTERISTICS
over recommended operating conditions, VREF = internal (unless otherwise noted)
DIGITAL SPECIFICATIONS
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Digital inputs
IIH High-level input current DVDD = digital inputs 50 50 µA
IIL Low-level input current Digital input = 0 V 50 50 µA
CiInput capacitance 5 pF
Digital outputs
VOH
High level out
p
ut voltage
BVDD0.5 V
V
OH
High
-
le
v
el
o
u
tp
u
t
v
oltage
IOH = 50 µA
BV
DD
= 3.3 V
,
BVDD0.5 V
VOL
Low level out
p
ut voltage
I
OH =
50
µ
A
BVDD
3.3
V,
BVDD = 5 V 0.4 V
V
OL
Lo
w-
le
v
el
o
u
tp
u
t
v
oltage
0.4 V
IOZ High-impedance-state output current CS1 = DGND, CS0 = DVDD 10 10 µA
COOutput capacitance 5 pF
CLLoad capacitance at databus D0 D11 30 pF
DC SPECIFICATIONS
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Resolution 12 Bits
Accuracy
Integral nonlinearity INL
C and I suffix ±1.5
Integral
nonlinearit
y,
INL
Q and M suffix ±1.8
Differential nonlinearity, DNL ±1 LSB
Offset error
After calibration in single-ended mode 20 LSB
Offset
error
After calibration in differential mode 20 20 LSB
Gain error 20 20 LSB
Analog input
Input capacitance 15 pF
Input leakage current VAIN = VREFM to VREFP ±10 µA
Internal voltage reference
Accuracy VREFP
C and I suffix 3.3 3.5 3.7
Acc
u
rac
y,
V
REFP Q and M suffix 3.3 3.5 3.7
Accuracy VREFM
C and I suffix 1.4 1.5 1.6
Acc
u
rac
y,
V
REFM Q and M suffix 1.3 1.5 1.7
Temperature coefficient 50 PPM/°C
Reference noise 100 µV
Accuracy REFOUT
C and I suffix 2.475 2.5 2.525
Acc
u
rac
y,
REFOUT
Q and M suffix 2.3 2.5 2.7
Power supply
IDDA Analog supply current AVDD = 5 V, DVDD = BVDD =3.3 V 36 40 mA
IDDD Digital supply current AVDD = 5 V, DVDD = BVDD =3.3 V 0.5 1 mA
IDDB Buffer supply current AVDD = 5 V, DVDD = BVDD =3.3 V 1.5 4 mA
IDD P
Su
pp
ly current in
p
ower down mode
AV
DD
= 5 V
,
C and I suffix 7 mA
I
DD_P
S
u
ppl
y
c
u
rrent
in
po
w
er
-
do
w
n
mode
AVDD
5
V,
BVDD = DVDD = 3.3 V Q and M suffix 10 mA
Power dissipation AVDD = 5 V, DVDD = BVDD = 3.3 V 186 216 mW
Power dissipation in power down AVDD = 5 V, DVDD = BVDD = 3.3 V 30 mW
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
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5
ELECTRICAL CHARACTERISTICS
over recommended operating conditions, VREF = internal, fx = 6 MHz, fI = 2 MHz at 1 dBFS (unless otherwise noted)
AC SPECIFICATIONS, AVDD = 5 V, BVDD = DVDD = 3.3 V, CL = <30 pF
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SINAD
Signal to noise ratio + distortion
Differential mode 63 65 dB
SINAD
Signal
-
to
-
noise
ratio
+
distortion
Single-ended mode(1) 64 dB
SNR
Signal to noise ratio
Differential mode 64 69 dB
SNR
Signal
-
to
-
noise
ratio
Single-ended mode(1) 68 dB
Differential mode
C and I suffix 70 67
THD
Total harmonic distortion
Differential
mode
Q and M suffix 70 67
dB
THD
Total
harmonic
distortion
Single ended mode
C and I suffix 68
dB
Single
-
ended
mode
Q and M suffix 68
ENOB
Effective number of bits
Differential mode 10.17 11 Bits
(SNR)
Effecti
v
e
n
u
mber
of
bits
Single-ended mode(1) 10.4 Bits
SFDR
S
p
urious free dynamic range
Differential mode 67 71 dB
SFDR
Sp
u
rio
u
s
free
d
y
namic
range
Single-ended mode 69 dB
Analog Input
Full-power bandwidth with a source impedance of
150 in dif ferential configuration. FS sinewave, 3 dB 96 MHz
Full-power bandwidth with a source impedance of
150 in single-ended configuration. FSl sinewave, 3 dB 54 MHz
Small-signal bandwidth with a source impedance of
150 in dif ferential configuration. 100 mVpp sinewave, 3 dB 96 MHz
Small-signal bandwidth with a source impedance of
150 in single-ended configuration. 100 mVpp sinewave, 3 dB 54 MHz
TIMING SPECIFICATIONS(1)
AVDD = 5 V, BVDD = DVDD = 3.3 V, VREF = internal, CL < 30 pF
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
td(DATA_AV) Delay time 5 ns
td(o) Delay time 5 ns
tpipe Latency 5 CONV
CLK
(1) See Figure 25.
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
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6
TIMING SPECIFICATION OF THE SINGLE CONVERSION MODE(1) (2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tcClock cycle of the internal clock oscillator 151 167 175 ns
1 analog input 1.5×tcns
t1
Pulse width CONVST
2 analog inputs 2.5×tc
t
1
P
u
lse
w
idth
,
CONVST
3 analog inputs 3.5×tc
4 analog inputs 4.5×tc
tdA Aperture time 1 ns
1 analog input 2×tc
ns
t2
T ime between consecutive start of sin
g
le con- 2 analog inputs 3×tc
ns
t
2
g
version 3 analog inputs 4×tc
ns
4 analog inputs 5×tc
ns
1 analog input, TL = 1 6.5×tc + 15
ns
Dela
y
time, DATA_AV becomes active for the 2 analog inputs, TL = 2 7.5×tc +15
ns
y, _
trigger level condition: TRIG0 = 0, TRIG1 = 0 3 analog inputs, TL = 3 8.5×tc +15
ns
4 analog inputs, TL = 4 9.5×tc +15
ns
1 analog input, TL = 4 3×t2 +6.5×tc+15
ns
td(DATA AV)
Dela
y
time, DATA_AV becomes active for the 2 analog inputs, TL = 4 t2 +7.5×tc+15
ns
t
d(DATA_AV)
y, _
trigger level condition: TRIG0 = 1, TRIG1 = 0 3 analog inputs, TL = 6 t2 +8.5×tc+15
ns
4 analog inputs, TL = 8 t2 +9.5×tc+15
ns
1 analog input, TL = 8 7×t2 +6.5×tc+15
ns
Dela
y
time, DATA_AV becomes active for the 2 analog inputs, TL = 8 3×t2 +7.5×tc+15
ns
y, _
trigger level condition: TRIG0 = 0, TRIG1 = 1 3 analog inputs, TL = 9 2×t2 +8.5×tc+15
ns
4 analog inputs, TL = 12 2×t2 +9.5×tc+15
ns
D l ti DATA AV b ti f th
1 analog input, TL = 14 13×t2 +6.5×tc+15
ns
td
(
DATA_AV
)
Delay time, DATA_AV becomes active for the
trigger level condition: TRIG0 = 1 TRIG1 = 1
2 analog inputs, TL = 12 5×t2 +7.5×tc+15
ns
(
_
)
trigger
level
condition:
TRIG0
=
1
,
TRIG1
=
1
3 analog inputs, TL = 12 3×t2 +8.5×tc+15 ns
(1) T iming parameters are ensured by design but are not tested.
(2) See Figure 24.
PIN ASSIGNMENTS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
D0
D1
D2
D3
D4
D5
BVDD
BGND
D6
D7
D8
D9
D10/RA0
D11/RA1
CONV_CLK (CONVST)
DATA_AV
AINP
AINM
BINP
BINM
REFIN
REFOUT
REFP
REFM
AGND
AVDD
CS0
CS1
WR (R/W)
RD
DVDD
DGND
DA PACKAGE
(TOP VIEW)
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
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7
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME NO.
I/O
DESCRIPTION
AINP 32 I Analog input, single-ended or positive input of dif ferential channel A
AINM 31 I Analog input, single-ended or negative input of differential channel A
BINP 30 I Analog input, single-ended or positive input of differential channel B
BINM 29 I Analog input, single-ended or negative input of differential channel B
AVDD 23 I Analog supply voltage
AGND 24 I Analog ground
BVDD 7 I Digital supply voltage for buffer
BGND 8 I Digital ground for buffer
CONV_CLK
(CONVST)15 I Digital input. This input is used to apply an external conversion clock in continuous conversion mode. In single
conversion mode, this input functions as the conversion start (CONVST) input. A high to low transition on this
input holds simultaneously the selected analog input channels and initiates a single conversion of all selected
analog inputs.
CS0 22 I Chip select input (active low)
CS1 21 I Chip select input (active high)
DATA_AV 16 O Data available signal, which can be used to generate an interrupt for processors and as a level information of
the internal FIFO. This signal can be configured to be active low or high and can be configured as a static level or
pulse output. See Table 14.
DGND 17 I Digital ground. Ground reference for digital circuitry.
DVDD 18 I Digital supply voltage
D0 D9 16,
912 I/O/Z Digital input, output; D0 = LSB
D10/RA0 13 I/O/Z Digital input, output. The data line D10 is also used as an address line (RA0) for the control register . This is
required for writing to the control register 0 and control register 1. See Table 8.
D11/RA1 14 I/O/Z Digital input, output (D11 = MSB). The data line D11 is also used as an address line (RA1) for the control
register. This is required for writing to control register 0 and control register 1. See Table 8.
REFIN 28 I Common-mode reference input for the analog input channels. It is recommended that this pin be connected to
the reference output REFOUT.
REFP 26 I Reference input, requires a bypass capacitor of 10 µF to AGND in order to bypass the internal reference
voltage. An external reference voltage at this input can be applied. This option can be programmed through
control register 0. See Table 9.
REFM 25 I Reference input, requires a bypass capacitor of 10 µF to AGND in order to bypass the internal reference
voltage. An external reference voltage at this input can be applied. This option can be programmed through
control register 0. See Table 9.
REFOUT 27 O Analog fixed reference output voltage of 2.5 V. Sink and source capability of 250 µA. The reference output
requires a capacitor of 10 µF to AGND for filtering and stability.
RD(1) 19 I The RD input is used only if the WR input is configured as a write only input. In this case, it is a digital input, active
low as a data read select from the processor. See timing section.
WR (R/W)(1) 20 I This input is programmable. It functions as a read-write input R/W and can also be configured as a write-only
input WR, which is active low and used as data write select from the processor. In this case, the RD input is used
as a read input from the processor. See timing section.
(1) The start-conditions of RD and WR (R/W) are unknown. The first access to the ADC has to be a write access to initialize the ADC.
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
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8
FUNCTIONAL BLOCK DIAGRAM
Logic
and
Control
12 Bit
Pipeline
ADC
S/H
S/H
S/H
S/H
Single
Ended
and/or
Differential
MUX
+
VREFP
VREFM
1.5 V
3.5 V
1.225 V
REF
FIFO
16 × 12
12 12
Buffers
2.5 V
Control
Register
AVDD DVDD
AGND DGND
REFOUT
DATA_AV
BVDD
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10/RA0
D11/RA1
BGND
REFP
REFM
AINP
AINM
BINP
BINM
CONV_CLK (CONVST)
CS0
CS1
RD
WR (R/W)
REFIN
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
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9
TYPICAL CHARACTERISTICS
Figure 1
40
45
50
55
60
65
70
75
80
01234567
TOTAL HARMONIC DISTORTION
vs
SAMPLING FREQUENCY (SINGLE-ENDED)
AVDD = 5 V, DVDD = BVDD = 3 V,
fIN = 500 kHz, AIN = 0.5 dB FS
fs Sampling Frequency MHz
THD Total Harmonic Distortion dB
Figure 2
40
45
50
55
60
65
70
01234567
SIGNAL-TO-NOISE AND DISTORTION
vs
SAMPLING FREQUENCY (SINGLE-ENDED)
fs Sampling Frequency MHz
SINAD Signal-to-Noise and Distortion dB
AVDD = 5 V, DVDD = BVDD = 3 V,
fIN = 500 kHz, AIN = 0.5 dB FS
Figure 3
40
45
50
55
60
65
70
75
80
85
90
01234567
SPURIOUS FREE DYNAMIC RANGE
vs
SAMPLING FREQUENCY (SINGLE-ENDED)
fs Sampling Frequency MHz
SFDR Spurious Free Dynamic Range dB
AVDD = 5 V, DVDD = BVDD = 3 V,
fIN = 500 kHz, AIN = 0.5 dB FS
Figure 4
SIGNAL-TO-NOISE
vs
SAMPLING FREQUENCY (SINGLE-ENDED)
fs Sampling Frequency MHz
SNR Signal-to-Noise dB
40
45
50
55
60
65
70
01234567
AVDD = 5 V, DVDD = BVDD = 3 V,
fIN = 500 kHz, AIN = 0.5 dB FS
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
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10
TYPICAL CHARACTERISTICS
Figure 5
40
45
50
55
60
65
70
75
80
85
01234567
TOTAL HARMONIC DISTORTION
vs
SAMPLING FREQUENCY (DIFFERENTIAL)
AVDD = 5 V, DVDD = BVDD = 3 V,
fIN = 500 kHz, AIN = 0.5 dB FS
fs Sampling Frequency MHz
THD Total Harmonic Distortion dB
Figure 6
40
45
50
55
60
65
70
75
80
01234567
SIGNAL-TO-NOISE AND DISTORTION
vs
SAMPLING FREQUENCY (DIFFERENTIAL)
fs Sampling Frequency MHz
SINAD Signal-to-Noise and Distortion dB
AVDD = 5 V, DVDD = BVDD = 3 V,
fIN = 500 kHz, AIN = 0.5 dB FS
Figure 7
40
45
50
55
60
65
70
75
80
85
90
95
100
01234567
SPURIOUS FREE DYNAMIC RANGE
vs
SAMPLING FREQUENCY (DIFFERENTIAL)
fs Sampling Frequency MHz
SFDR Spurious Free Dynamic Range dB
AVDD = 5 V, DVDD = BVDD = 3 V,
fIN = 500 kHz, AIN = 0.5 dB FS
Figure 8
SIGNAL-TO-NOISE
vs
SAMPLING FREQUENCY (DIFFERENTIAL)
fs Sampling Frequency MHz
SNR Signal-to-Noise dB
40
45
50
55
60
65
70
75
80
01234567
AVDD = 5 V, DVDD = BVDD = 3 V,
fIN = 500 kHz, AIN = 0.5 dB FS
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
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11
TYPICAL CHARACTERISTICS
Figure 9
40
45
50
55
60
65
70
75
80
85
0 0.5 1.0 1.5 2.0 2.5 3.0
TOTAL HARMONIC DISTORTION
vs
INPUT FREQUENCY (SINGLE-ENDED)
AVDD = 5 V, DVDD = BVDD = 3 V,
fs = 6 MHz, AIN = 0.5 dB FS
fi Input Frequency MHz
THD Total Harmonic Distortion dB
Figure 10
40
45
50
55
60
65
70
75
80
0 0.5 1.0 1.5 2.0 2.5 3.0
SIGNAL-TO-NOISE AND DISTORTION
vs
INPUT FREQUENCY (SINGLE-ENDED)
AVDD = 5 V, DVDD = BVDD = 3 V,
fs = 6 MHz, AIN = 0.5 dB FS
SINAD Signal-to-Noise and Distortion dB
fi Input Frequency MHz
Figure 11
40
45
50
55
60
65
70
75
80
85
90
95
100
0 0.5 1.0 1.5 2.0 2.5 3.0
SPURIOUS FREE DYNAMIC RANGE
vs
INPUT FREQUENCY (SINGLE-ENDED)
SFDR Spurious Free Dynamic Range dB
AVDD = 5 V, DVDD = BVDD = 3 V,
fs = 6 MHz, AIN = 0.5 dB FS
fi Input Frequency MHz
Figure 12
SIGNAL-TO-NOISE
vs
INPUT FREQUENCY (SINGLE-ENDED)
SNR Signal-to-Noise dB
40
45
50
55
60
65
70
75
80
0 0.5 1.0 1.5 2.0 2.5 3.0
AVDD = 5 V, DVDD = BVDD = 3 V,
fs = 6 MHz, AIN = 0.5 dB FS
fi Input Frequency MHz
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
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12
TYPICAL CHARACTERISTICS
Figure 13
20
30
40
50
60
70
80
90
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
TOTAL HARMONIC DISTORTION
vs
INPUT FREQUENCY (DIFFERENTIAL)
AVDD = 5 V, DVDD = BVDD = 3 V,
fs = 6 MHz, AIN = 0.5 dB FS
fi Input Frequency MHz
THD Total Harmonic Distortion dB
Figure 14
20
30
40
50
60
70
80
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
SIGNAL-TO-NOISE AND DISTORTION
vs
INPUT FREQUENCY (DIFFERENTIAL)
SINAD Signal-to-Noise and Distortion dB
AVDD = 5 V, DVDD = BVDD = 3 V,
fs = 6 MHz, AIN = 0.5 dB FS
fi Input Frequency MHz
Figure 15
20
30
40
50
60
70
80
90
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
SPURIOUS FREE DYNAMIC RANGE
vs
INPUT FREQUENCY (DIFFERENTIAL)
SFDR Spurious Free Dynamic Range dB
AVDD = 5 V, DVDD = BVDD = 3 V,
fs = 6 MHz, AIN = 0.5 dB FS
fi Input Frequency MHz
20
30
40
50
60
70
80
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Figure 16
AVDD = 5 V, DVDD = BVDD = 3 V,
fs = 6 MHz, AIN = 0.5 dB FS
fi Input Frequency MHz
SIGNAL-TO-NOISE
vs
INPUT FREQUENCY (DIFFERENTIAL)
SNR Signal-to-Noise dB
THS1206
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13
TYPICAL CHARACTERISTICS
Figure 17
6
7
8
9
10
11
12
01234567
ENOB Effective Number of Bits Bits
EFFECTIVE NUMBER OF BITS
vs
SAMPLING FREQUENCY (SINGLE-ENDED)
AVDD = 5 V, DVDD = BVDD = 3 V,
fs = 6 MHz, AIN = 0.5 dB FS
fs Sampling Frequency MHz Figure 18
6
7
8
9
10
11
12
01234567
ENOB Effective Number of Bits Bits
EFFECTIVE NUMBER OF BITS
vs
SAMPLING FREQUENCY (DIFFERENTIAL)
AVDD = 5 V, DVDD = BVDD = 3 V,
fs = 6 MHz, AIN = 0.5 dB FS
fs Sampling Frequency MHz
Figure 19
6
7
8
9
10
11
12
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
ENOB Effective Number of Bits Bits
EFFECTIVE NUMBER OF BITS
vs
INPUT FREQUENCY (SINGLE-ENDED)
AVDD = 5 V, DVDD = BVDD = 3 V,
fs = 6 MHz, AIN = 0.5 dB FS
fi Input Frequency MHz Figure 20
6
7
8
9
10
11
12
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
ENOB Effective Number of Bits Bits
EFFECTIVE NUMBER OF BITS
vs
INPUT FREQUENCY (DIFFERENTIAL)
AVDD = 5 V, DVDD = BVDD = 3 V,
fs = 6 MHz, AIN = 0.5 dB FS
fi Input Frequency MHz
THS1206
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14
TYPICAL CHARACTERISTICS
Figure 21
30
25
20
15
10
5
0
5
0 102030405060708090100110120
G Gain dB
GAIN
vs
INPUT FREQUENCY (SINGLE-ENDED)
AVDD = 5 V, DVDD = BVDD = 3 V,
fs = 6 MHz, AIN = 0.5 dB FS
fi Input Frequency MHz
THS1206
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TYPICAL CHARACTERISTICS
Figure 22
140
120
100
80
60
40
20
0
20
0 500000 1000000 1500000 2000000 2500000 3000000 3500000
Magnitude dB
f Frequency Hz
FAST FOURIER TRANSFORM (4096 POINTS)
(SINGLE-ENDED)
vs
FREQUENCY
AVDD = 5 V, DVDD = BVDD = 3 V,
fs = 6 MHz, AIN = 0.5 dB FS
140
120
100
80
60
40
20
0
20
0 500000 1000000 1500000 2000000 2500000 3000000 3500000
Figure 23
Magnitude dB
f Frequency Hz
FAST FOURIER TRANSFORM (4096 POINTS)
(DIFFERENTIAL)
vs
FREQUENCY
AVDD = 5 V, DVDD = BVDD = 3 V,
fs = 6 MHz, AIN = 0.5 dB FS
THS1206
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DETAILED DESCRIPTION
Reference Voltage
The THS1206 has a built-in reference, which provides the reference voltages for the ADC. VREFP is set to 3.5 V and
VREFM is set to 1.5 V. An external reference can also be used through two reference input pins, REFP and REFM, if the
reference source is programmed as external. The voltage levels applied to these pins establish the upper and lower limits
of the analog inputs to produce a full-scale and zero-scale reading respectively.
Analog Inputs
The THS1206 consists of 4 analog inputs, which are sampled simultaneously. These inputs can be selected individually
and configured as single-ended or differential inputs. The desired analog input channel can be programmed.
Converter
The THS1206 uses a 12-bit pipelined multistaged architecture with 4 1-bit stages followed by 4 2-bit stages, which achieves
a high sample rate with low power consumption. The THS1206 distributes the conversion over several smaller ADC
sub-blocks, refining the conversion with progressively higher accuracy as the device passes the results from stage to stage.
This distributed conversion requires a small fraction of the number of comparators used in a traditional flash ADC. A
sample-and-hold amplifier (SHA) within each of the stages permits the first stage to operate on a new input sample while
the second through the eighth stages operate on the seven preceding samples.
Conversion Modes
The conversion can be performed in two different conversion modes. In the single conversion mode, the conversion is
initiated by an external signal (CONVST). An internal oscillator controls the conversion time. In the continuous conversion
mode, an external clock signal is applied to the clock input (CONV_CLK). A new conversion is started with every falling
edge of the applied clock signal.
DATA_AV
In continuous conversion mode, the first DATA_AV signal is delayed by (7+TL) cycles of CONV_CLK after a FIFO reset
command. This is due to the latency of the pipe line architecture of the THS1206.
Sampling Rate
The maximum possible conversion rate per channel is dependent on the selected analog input channels. Table 1 shows
the maximum conversion rate in the continuous conversion mode for different combinations.
Table 1. Maximum Conversion Rate in Continuous Conversion Mode
CHANNEL CONFIGURATION NUMBER OF
CHANNELS MAXIMUM CONVERSION
RATE PER CHANNEL
1 single-ended channel 16 MSPS
2 single-ended channels 23 MSPS
3 single-ended channels 32 MSPS
4 single-ended channels 41.5 MSPS
1 differential channel 16 MSPS
2 differential channels 23 MSPS
1 single-ended and 1 differential channel 23 MSPS
2 single-ended and 1 differential channels 32 MSPS
The maximum conversion rate in the continuous conversion mode per channel, is given by:
fc
+
6MSPS
# channels
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Table 2 shows the maximum conversion rate in the single conversion mode.
Table 2. Maximum Conversion Rate in Single Conversion Mode(1)
CHANNEL CONFIGURATION NUMBER OF
CHANNELS MAXIMUM CONVERSION
RATE PER CHANNEL
1 single-ended channel 13 MSPS
2 single-ended channels 22 MSPS
3 single-ended channels 31.5 MSPS
4 single-ended channels 41.2 MSPS
1 differential channel 13 MSPS
2 differential channels 22 MSPS
1 single-ended and 1 differential channel 22 MSPS
2 single-ended and 1 differential channels 31.5 MSPS
(1) Maximum conversion rate with respect to the typical internal oscillator speed (i.e.: 6 MSPS * (tc/t2).
SINGLE CONVERSION MODE
In single conversion mode, a single conversion of the selected analog input channels is performed. The single conversion
mode is selected by setting bit 1 of control register 0 to 1.
A single conversion is initiated by pulsing the CONVST input. On the falling edge of CONVST , the sample and hold stages
of the selected analog inputs are placed into hold simultaneously , and the conversion sequence for the selected channels
is started.
The conversion clock in single conversion mode is generated internally using a clock oscillator circuit. The signal DATA_AV
(data available) becomes active when the trigger level is reached and indicates that the converted sample(s) is (are) written
into the FIFO and can be read out. The trigger level in the single conversion mode can be selected according to Table 13.
Figure 1 shows the timing of the single conversion mode. In this mode, up to four analog input channels can be selected
to be sampled simultaneously (see Table 2).
CONVST
AIN
Sample N
t1t1
td(A)
t2
tDATA_AV
DATA_AV,
Trigger Level = 1
Figure 24. Timing of Single Conversion Mode
The time (t2) between consecutive starts of single conversions is dependent on the number of selected analog input
channels. The time tDATA_AV, until DA T A_A V becomes active is given by: tDATA_AV = tpipe + n ×tc. This equation is valid for
a trigger level which is equivalent to the number of selected analog input channels. For all other trigger level conditions refer
to the timing specifications of single conversion mode.
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CONTINUOUS CONVERSION MODE
The internal clock oscillator used in the single-conversion mode is switched off in continuous conversion mode. In
continuous conversion mode, (bit 1 of control register 0 set to 0) the ADC operates with a free running external clock signal
CONV_CLK. With every rising edge of the CONV_CLK signal a new converted value is written into the FIFO.
Figure 25 shows the timing of continuous conversion mode when one analog input channel is selected. The maximum
throughput rate is 6 MSPS in this mode. The timing of the DAT A_AV signal is shown here in the case of a trigger level set
to 1 or 4.
Sample N
Channel 1 Sample N+1
Channel 1 Sample N+2
Channel 1 Sample N+3
Channel 1 Sample N+4
Channel 1 Sample N+5
Channel 1 Sample N+6
Channel 1 Sample N+7
Channel 1 Sample N+8
Channel 1
Data N5
Channel 1 Data N4
Channel 1 Data N3
Channel 1 Data N2
Channel 1 Data N1
Channel 1 Data N
Channel 1 Data N+1
Channel 1 Data N+2
Channel 1 Data N+3
Channel 1
td(A)
tw(CONV_CLKH) tw(CONV_CLKL)
tctd(O)
td(DATA_AV)
td(DATA_AV)
AIN
CONV_CLK
Data Into
FIFO
DATA_AV,
Trigger Level = 1
DATA_AV,
Trigger Level = 4
td(pipe)
50% 50%
Figure 25. Timing of Continuous Conversion Mode (1-channel operation)
Figure 26 shows the timing of continuous conversion mode when two analog input channels are selected. The maximum
throughput rate per channel is 3 MSPS in this mode. The data flow in the bottom of the figure shows the order the converted
data is written into the FIFO. The timing of the DATA_AV signal shown here is for a trigger level set to 2 or 4.
AIN
CONV_CLK
Data Into
FIFO
DATA_AV,
Trigger Level = 2
DATA_AV,
Trigger Level = 4
Data N3
Channel 2 Data N2
Channel 1 Data N2
Channel 2 Data N1
Channel 1 Data N1
Channel 2 Data N
Channel 1 Data N
Channel 2 Data N+1
Channel 1 Data N+1
Channel 2
td(DATA_AV)
tw(CONV_CLKH) tw(CONV_CLKL)
td(A)
Sample N
Channel 1,2 Sample N+1
Channel 1,2 Sample N+2
Channel 1,2 Sample N+3
Channel 1,2 Sample N+4
Channel 1,2
tctd(O)
td(Pipe)
td(DATA_AV)
50% 50%
Figure 26. Timing of Continuous Conversion Mode (2-channel operation)
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Figure 27 shows the timing of continuous conversion mode when three analog input channels are selected. The maximum
throughput rate per channel is 2 MSPS in this mode. The data flow in the bottom of the figure shows in which order the
converted data is written into the FIFO. The timing of the DATA_AV signal shown here is for a trigger level set to 3.
AIN
CONV_CLK
Data Into
FIFO
DATA_AV,
Trigger Level = 3
td(DATA_AV)
Sample N
Channel 1,2,3 Sample N+1
Channel 1,2,3 Sample N+2
Channel 1,2,3
td(O)
Data N2
Channel 2 Data N2
Channel 3 Data N1
Channel 2 Data N1
Channel 2 Data N1
Channel 3 Data N
Channel 1 Data N
Channel 2 Data N+1
Channel 3
tc
td(A)
tw(CONV_CLKH) tw(CONV_CLKL)
td(Pipe)
50% 50%
Figure 27. Timing of Continuous Conversion Mode (3-channel operation)
Figure 28 shows the timing of continuous conversion mode when four analog input channels are selected. The maximum
throughput rate per channel is 1.5 MSPS in this mode. The data flow in the bottom of the figure shows in which order the
converted data is written into the FIFO. The timing of the DATA_AV signal shown here is for a trigger level of 4.
AIN
CONV_CLK
Data Into
FIFO
DATA_AV,
Trigger Level = 4
tw(CONV_CLKH)
Sample N
Channel 1,2,3,4 Sample N+1
Channel 1,2,3,4 Sample N+2
Channel 1,2,3,4
td(Pipe)
tw(CONV_CLKL)
tctd(O)
Data N2
Channel 4 Data N1
Channel 1 Data N1
Channel 2 Data N1
Channel 3 Data N1
Channel 4 Data N
Channel 1 Data N
Channel 2 Data N
Channel 3 Data N
Channel 4
td(DATA_AV)
td(A)
50% 50%
Figure 28. Timing of Continuous Conversion Mode (4-channel operation)
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DIGITAL OUTPUT DATA FORMAT
The digital output data format of the THS1206 can either be in binary format or in twos complement format. The following
tables list the digital outputs for the analog input voltages.
Table 3. Binary Output Format for Single-Ended Configuration
SINGLE-ENDED, BINARY OUTPUT
ANALOG INPUT VOLTAGE DIGITAL OUTPUT CODE
AIN = VREFP FFFh
AIN = (VREFP + VREFM)/2 800h
AIN = VREFM 000h
Table 4. Twos Complement Output Format for Single-Ended Configuration
SINGLE-ENDED, TWOS COMPLEMENT
ANALOG INPUT VOLTAGE DIGITAL OUTPUT CODE
AIN = VREFP 7FFh
AIN = (VREFP + VREFM)/2 000h
AIN = VREFM 800h
Table 5. Binary Output Format for Differential Configuration
DIFFERENTIAL, BINARY OUTPUT
ANALOG INPUT VOLTAGE DIGITAL OUTPUT CODE
Vin = AINP AINM
VREF = VREFP VREFM
Vin = VREF FFFh
Vin = 0 800h
Vin = VREF 000h
Table 6. Twos Complement Output Format for Differential Configuration
DIFFERENTIAL, BINARY OUTPUT
ANALOG INPUT VOLTAGE DIGITAL OUTPUT CODE
Vin = AINP AINM
VREF = VREFP VREFM
Vin = VREF 7FFh
Vin = 0 000h
Vin = VREF 800h
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FIFO DESCRIPTION
In order to facilitate an efficient connection to todays processors, the THS1206 is supplied with a FIFO. This integrated
FIFO enables a problem-free processing of data with todays processors. The FIFO is provided as a flexible circular buffer .
The circular buffer integrated in the THS1206 can store up to 16 conversion values. Therefore, the amount of interrupts
to be served by a processor can be reduced significantly.
8
9
10
11
12
13
14
15 16 12
3
4
5
6
7
Read Pointer
Trigger Pointer
Write Pointer
Data in FIFO
Free
Figure 29. Circular Buffer
The converted data of the THS1206 is automatically written into the FIFO. To control the writing and reading process, a
write pointer , a read pointer and a trigger pointer are used. The read pointer always shows the location which is read next.
The write pointer indicates the location which contains the last written sample. With a selection of multiple analog input
channels, the converted values are written in a predefined sequence to the circular buffer (autoscan mode). In this way,
the channel information for the reading processor is continually maintained.
The FIFO can be programmed through the control register of the ADC. The user has the ability to select a specific trigger
level according to T able 13 in order to choose the configuration which best fits the application. The FIFO provides the signal
DA TA_AV , which signals the processor to read the amount of data equal to the trigger level selected in T able 13. The signal
DATA_AV becomes active when the trigger condition is satisfied. The trigger condition is satisfied when as many values
as selected for the trigger level are written into the FIFO.
The signal DATA_AV could be connected to an interrupt input of a processor. In every interrupt service routine call, the
processor must read the amount of data equal to the trigger level from the ADC. The first data represents the first channel
according to the autoscan mode, which is shown in Table 10. The channel information is therefore always maintained.
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READING DATA FROM THE FIFO
The THS1206 informs the connected processor via the digital output DA T A_A V (data available) that a block of conversion
values are ready to be read. The block size to be read is always equal to the setting of the trigger level. The selectable trigger
levels depend on the number of selected analog input channels. For example, when choosing one analog input, a trigger
level of 1, 4, 8 and 14 can be selected. The following figures demonstrate the principle of reading the data.
In Figure 30, a trigger level of 1 is selected. The control signal DA TA_A V is set to an active low pulse. This means that the
connected processor has the task to read 1 value from the ADC after every DATA_AV low pulse.
CONV_CLK
DATA_AV
READ
Figure 30. Trigger Level 1 Selected
In Figure 31, a trigger level of 4 is selected. The control signal DA TA_A V is set to an active low pulse. This means that the
connected processor has the task to read 4 values from the ADC after every DATA_AV low pulse.
CONV_CLK
DATA_AV
READ
Figure 31. Trigger Level 4 Selected
In Figure 32, a trigger level of 8 is selected. The control signal DA TA_A V is set to an active low pulse. This means that the
connected processor has the task to read 8 values from the ADC after every DATA_AV low pulse.
CONV_CLK
DATA_AV
READ
Figure 32. Trigger Level 8 Selected
In Figure 33, a trigger level of 14 is selected. The control signal DATA_AV is set to an active low pulse. This means that
the connected processor has the task to read 14 values from the ADC after every DATA_AV low pulse.
CONV_CLK
DATA_AV
READ
Figure 33. Trigger Level 14 Selected
READ is always the logical combination of CS0, CS1, and RD.
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ADC CONTROL REGISTER
The THS1206 contains two 10-bit wide control registers (CR0, CR1) in order to program the device into the desired mode.
The bit definitions of both control registers are shown in Table 7.
Table 7. Bit Definitions of Control Register CR0 and CR1
REG BIT 9 BIT 8 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
CR0 TEST1 TEST0 SCAN DIFF1 DIFF0 CHSEL1 CHSEL0 PD MODE VREF
CR1 RBACK OFFSET BIN/2s R/W DATA_P DATA_T TRIG1 TRIG0 OVFL/FRST RESET
Writing to Control Register 0 and Control Register 1
The 10-bit wide control register 0 and control register 1 can be programmed by addressing the desired control register and
writing the register value to the ADC. The addressing is performed with the upper data bits D10 and D11, which function
in this case as address lines RA0 and RA1. During this write process, the data bits D0 to D9 contain the desired control
register value. Table 8 shows the addressing of each control register.
Table 8. Control Register Addressing
D0 D9 D10/RA0 D11/RA1 Addressed Control Register
Desired register value 0 0 Control register 0
Desired register value 1 0 Control register 1
Desired register value 0 1 Reserved for future
Desired register value 1 1 Reserved for future
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INITIALIZATION OF THE THS1206
The initialization of the THS1206 should be done according to the configuration flow shown in Figure 34.
Start
Use Default
Values?
Yes
Write 0x401 to
THS1206
(Set Reset Bit in CR1)
No
Write 0x401 to
THS1206
(Set Reset Bit in CR1)
Clear RESET By
Writing 0x400 to
CR1
Write The User
Configuration to
CR0
Write The User
Configuration to
CR1 (Can Include
FIFO Reset, Must
Exclude RESET)
Continue
Clear RESET By
Writing 0x400 to
CR1
Figure 34. THS1206 Configuration Flow
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ADC CONTROL REGISTERS
Control Register 0 (see Table 8)
BIT 11 BIT 10 BIT 9 BIT 8 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
0 0 TEST1 TEST0 SCAN DIFF1 DIFF0 CHSEL1 CHSEL0 PD MODE VREF
Table 9. Control Register 0 Bit Functions
BITS RESET
VALUE NAME FUNCTION
0 0 VREF Vref select:
Bit 0 = 0 The internal reference is selected
Bit 0 = 1 The external reference voltage is selected
1 0 MODE Continuous conversion mode/single conversion mode
Bit 1 = 0 Continuous conversion mode is selected
An external clock signal is applied to the CONV_CLK input in this mode. With every falling edge of the
CONV_CLK signal a new converted value is written into the FIFO.
Bit 1 = 1 Single conversion mode is selected
In this mode, the CONV_CLK input functions as a CONVST input. A single conversion is initiated on the
THS1206 by pulsing the CONVST input. On the falling edge of CONVST , the sample and hold stages of the
selected analog inputs are placed into hold simultaneously , and the conversion sequence for the selected
channels is started. The signal DATA_AV (data available) becomes active when the trigger condition is
satisfied.
2 0 PD Power down.
Bit 2 = 0 The ADC is active
Bit 2 = 1 Power down
The reading and writing to and from the digital outputs is possible during power down. It is also possible to
read out the FIFO.
3, 4 0,0 CHSEL0,
CHSEL1 Channel select
Bit 3 and bit 4 select the analog input channel of the ADC. Refer to Table 10.
5,6 1,0 DIFF0, DIFF1 Number of differential channels
Bit 5 and bit 6 contain information about the number of selected differential channels. Refer to Table 10.
7 0 SCAN Autoscan enable
Bit 7 enables or disables the autoscan function of the ADC. Refer to Table 10.
8,9 0,0 TEST0,
TEST1 Test input enable
Bit 8 and bit 9 control the test function of the ADC. Three different test voltages can be measured. This
feedback allows the check of all hardware connections and the ADC operation.
Refer to T able 11 for selection of the three different test voltages. The control signal DATA_AV is disabled in
the test mode. Test voltage readings have to be done independent from DATA_AV. To get the THS1206 back
to the normal operating mode, apply the the initialization routine.
THS1206
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ANALOG INPUT CHANNEL SELECTION
The analog input channels of the THS1206 can be selected via bits 3 to 7 of control register 0. One single channel
(single-ended or differential) is selected via bit 3 and bit 4 of control register 0. Bit 5 controls the selection between
single-ended and differential configuration. Bit 6 and bit 7 select the autoscan mode, if more than one input channel is
selected. Table 10 shows the possible selections.
Table 10. Analog Input Channel Configurations
BIT 7
SCAN BIT 6
DIFF1 BIT 5
DIFF0 BIT 4
CHSEL1 BIT 3
CHSEL0 DESCRIPTION OF THE SELECTED INPUTS
0 0 0 0 0 Analog input AINP (single ended)
0 0 0 0 1 Analog input AINM (single ended)
0 0 0 1 0 Analog input BINP (single ended)
0 0 0 1 1 Analog input BINM (single ended)
0 0 1 0 0 Differential channel (AINPAINM)
0 0 1 0 1 Differential channel (BINPBINM)
1 0 0 0 1 Autoscan two single ended channels: AINP, AINM, AINP,
1 0 0 1 0 Autoscan three single ended channels: AINP, AINM, BINP, AINP,
1 0 0 1 1 Autoscan four single ended channels: AINP, AINM, BINP, BINM, AINP,
1 0 1 0 1 Autoscan one differential channel and one single ended channel AINP, (BINPBINM),
AINP, (BINPBINM),
1 0 1 1 0 Autoscan one differential channel and two single ended channel AINP, AINM, (BINP
BINM), AINP,
1 1 0 0 1 Autoscan two differential channels (AINPAINM), (BINPBINM), (AINPAINM),
0 0 1 1 0 Reserved
0 0 1 1 1 Reserved
1 0 0 0 0 Reserved
1 0 1 0 0 Reserved
1 0 1 1 1 Reserved
1 1 0 0 0 Reserved
1 1 0 1 0 Reserved
1 1 0 1 1 Reserved
1 1 1 0 0 Reserved
1 1 1 0 1 Reserved
1 1 1 1 0 Reserved
1 1 1 1 1 Reserved
Test Mode
The test mode of the ADC is selected via bit 8 and bit 9 of control register 0. The different selections are shown in Table 1 1.
Table 11. Test Mode
BIT 9
TEST1 BIT 8
TEST0 OUTPUT RESULT
0 0 Normal mode
0 1 VREFP
1 0 ((VREFM)+(VREFP))/2
1 1 VREFM
Three different options can be selected. This feature allows support testing of hardware connections between the ADC and
the processor.
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Control Register 1 (see Table 8)
BIT 11 BIT 10 BIT 9 BIT 8 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
0 1 RBACK OFFSET BIN/2s R/W DATA_P DATA_T TRIG1 TRIG0 OVFL/FRST RESET
Table 12. Control Register 1 Bit Functions
BITS RESET
VALUE NAME FUNCTION
0 0 RESET Reset
Writing a 1 into this bit resets the device and sets the control register 0 and control register 1 to the reset values.
In addition the FIFO pointer and offset register is reset. After reset, it takes 5 clock cycles until the first value is
converted and written into the FIFO.
1 0 OVFL
(read only)
FRST
(write only)
Overflow flag (read only)
Bit 1 of control register 1 indicates an overflow in the FIFO.
Bit 1 = 0 no overflow occurred.
Bit 1 = 1 an overflow occurred. This bit is reset to 0, after this control register is read from the processor.
FRST: FIFO reset (write only)
By writing a 1 into this bit, the FIFO is reset.
2, 3 0,0 TRIG0,
TRIG1 FIFO trigger level
Bit 2 and bit 3 of control register 1 are used to set the trigger level for the FIFO. If the trigger level is reached, the
signal DATA_AV (data available) becomes active according to the settings of DATA_T and DATA_P. This
indicates to the processor that the ADC values can be read. Refer to Table 13.
4 1 DATA_T DATA_AV type
Bit 4 of control register 1 controls whether the DATA_AV signal is a pulse or static (e.g for edge or level sensitive
interrupt inputs). If it is set to 0, the DATA_AV signal is static. If it is set to 1, the DATA_AV signal is a pulse. Refer
to Table 14.
5 1 DATA_P DATA_AV polarity
Bit 5 of control register 1 controls the polarity of DATA_AV . If it is set to 1, DATA_AV is active high. If it is set to 0,
DATA_AV is active low. Refer to Table 14.
6 0 R/W R/W, RD/WR selection
Bit 6 of control register 1 controls the function of the inputs RD and WR. When bit 6 in control register 1 is set to
1, WR becomes a R/W input and RD is disabled. From now on a read is signalled with R/W high and a write with
R/W as a low signal. If bit 6 in control register 1 is set to 0, the input RD becomes a read input and the input WR
becomes a write input.
7 0 BIN/2s Complement select
If bit 7 of control register 1 is set to 0, the output value of the ADC is in twos complement. If bit 7 of
control register 1 is set to 1, the output value of the ADC is in binary format. Refer to Table 3 through T able 6.
8 0 OFFSET Offset cancellation mode
Bit 8 = 0 normal conversion mode
Bit 8 = 1 offset calibration mode
If a 1 is written into bit 8 of control register 1, the device internally sets the inputs to zero and does a conver-
sion. The conversion result is stored in an offset register and subtracted from all conversions in order to
reduce the offset error.
9 0 RBACK Debug mode
Bit 9 = 0 normal conversion mode
Bit 9 = 1 enable debug mode
When bit 9 of control register 1 is set to 1, debug mode is enabled. In this mode, the contents of control register 0
and control register 1 can be read back. The first read after bit 9 is set to 1 contains the value of control register 0.
The second read after bit 9 is set to 1 contains the value of control register 1. To get the THS1206 back to the
normal operating mode, apply the the initialization routine.
THS1206
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28
FIFO TRIGGER LEVEL
Bit 2 and bit 3 (TRIG1, TRIG0) of control register 1 are used to set the trigger level of the FIFO (see T able 13). If the trigger
level is reached, the DATA_AV (data available) signal becomes active according to the setting of the signal DATA_AV to
indicate to the processor that the ADC values can be read.
Table 13 shows four different programmable trigger levels for each configuration. The FIFO trigger level, which can be
selected, is dependent on the number of input channels. Both, a differential or a single-ended input is considered as one
channel. The processor therefore always reads the data from the FIFO in the same order and is able to distinguish between
the channels.
Table 13. FIFO Trigger Level
BIT 3
TRIG1 BIT 2
TRIG0
TRIGGER LEVEL
FOR 1 CHANNEL
(ADC values)
TRIGGER LEVEL
FOR 2 CHANNELS
(ADC values)
TRIGGER LEVEL
FOR 3 CHANNEL
(ADC values)
TRIGGER LEVEL
FOR 4 CHANNELS
(ADC values)
0 0 01 02 03 04
0 1 04 04 06 08
1 0 08 08 09 12
1 1 14 12 12 Reserved
TIMING AND SIGNAL DESCRIPTION OF THE THS1206
The reading from the THS1206 and writing to the THS1206 is performed by using the chip select inputs (CS0, CS1), the
write input WR and the read input RD. The write input is configurable to a combined read/write input (R/W). This is desired
in cases where the connected processor consists of a combined read/write output signal (R/W). The two chip select inputs
can be used to interface easily to a processor.
Reading from the THS1206 takes place by an internal RDint signal, which is generated from the logical combination of the
external signals CS0, CS1 and RD (see Figure 35). This signal is then used to strobe the words out of the FIFO and to
enable the output buffers. The last external signal (either CS0, CS1 or RD) to become valid will make RDint active while
the write input (WR) is inactive. The first of those external signals going to its inactive state then deactivates RDint again.
Writing to the THS1206 takes place by an internal WRint signal, which is generated from the logical combination of the
external signals CS0, CS1 and WR. This signal is then used to strobe the control words into the control registers 0 and
1. The last external signal (either CS0, CS1 or WR) to become valid makes WRint active while the read input (RD) is inactive.
The first of those external signals going to its inactive state then deactivates WRint again.
Read Enable
Write Enable
Control/Data
Registers
CS0
CS1
RD
WR
Data Bits
Figure 35. Logical Combination of CS0, CS1, RD, and WR
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
www.ti.com
29
DATA_AV TYPE
Bit 4 and bit 5 (DA TA_T, DAT A_P) of control register 1 are used to program the signal DAT A_AV . Bit 4 of control register 1
determines whether the DATA_AV signal is static or a pulse. Bit 5 of the control register determines the polarity of
DATA_AV. This is shown in Table 14.
Table 14. DATA_AV Type
BIT 5
DATA_P BIT 4
DATA_T DATA_AV TYPE
0 0 Active low level
0 1 Active low pulse
1 0 Active high level
1 1 Active high pulse
The signal DA T A_A V is set to active when the trigger condition is satisfied. It is set back inactive dependent of the DAT A_T
selection (pulse or level).
If level mode is chosen, DAT A_AV is set inactive after the first of the TL (TL = trigger level) reads (with the falling edge of
READ). The trigger condition is checked again after TL reads. For single conversion mode, DATA_AV type should be
programmed to active level mode (set bit 4 of CR1 to zero).
If pulse mode is chosen, the signal DATA_AV is a pulse with a width of one half of a CONV_CLK cycle in continuous
conversion mode. The next DATA_AV pulse (when the trigger condition is satisfied) is sent out the earliest, when the TL
values, written into the FIFO before, were read out by the processor.
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
www.ti.com
30
TIMING AND SIGNAL DESCRIPTION OF THE THS1206
Read Timing (using R/W, CS0-controlled)
Figure 36 shows the read-timing behavior when the WR(R/W) input is programmed as a combined read-write input R/W .
The RD input has to be tied to high-level in this configuration. This timing is called CS0-controlled because CS0 is the last
external signal of CS0, CS1, and R/W, which becomes valid.
ÓÓÓ
ÓÓÓ
ÓÓÓ
ÔÔÔ
ÔÔÔ
ÔÔÔ
90%90%
90%
90%
90%
90%
10%
10%
tw(CS)
tsu(R/W)th(R/W)
tath
td(CSDAV)
CS0
CS1
R/W
RD
D(011)
DATA_AV
Figure 36. Read Timing Diagram Using RD (CS0-controlled)
Read Timing Parameter (CS0-controlled)
PARAMETER MIN TYP MAX UNIT
tsu(R/W)Setup time, R/W high to last CS valid 0 ns
taAccess time, last CS valid to data valid 0 10 ns
td(CSDAV) Delay time, last CS valid to DATA_AV inactive 12 ns
thHold time, first CS invalid to data invalid 0 5 ns
th(R/W)Hold time, first external CS invalid to R/W change 5 ns
tw(CS) Pulse duration, CS active 10 ns
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
www.ti.com
31
Write Timing (using R/W, CS0-controlled)
Figure 37 shows the write-timing behavior when the WR(R/W) input is programmed as a combined read-write input R/W .
The RD input has to be tied to high-level in this configuration. This timing is called CS0-controlled because CS0 is the last
external signal of CS0, CS1, and R/W, which becomes valid.
ÓÓÓ
ÓÓÓ
ÓÓÓ
ÓÓÓÓ
ÓÓÓÓ
ÓÓÓÓ
ÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖ
ÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖ
ÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖ
90%
90% 90%
10%
tw(CS)
tsu(R/W)th(R/W)
CS0
CS1
WR
RD
D(011)
DATA_AV
10%
tsu th
Figure 37. Write Timing Diagram Using R/W (CS0-controlled)
Write T iming Parameter (RD-controlled)
PARAMETER MIN TYP MAX UNIT
tsu(R/W)Setup time, R/W stable to last CS valid 0 ns
tsu Setup time, data valid to first CS invalid 5 ns
thHold time, first CS invalid to data invalid 2 ns
th(R/W)Hold time, first CS invalid to R/W change 5 ns
tw(CS) Pulse duration, CS active 10 ns
INTERFACING THE THS1206 TO THE TMS320C30/31/33 DSP
The following application circuit shows an interface of the THS1206 to the TMS320C30/31/33 DSPs. The read and write
timings (using R/W, CS0-controlled) shown before are valid for this specific interface.
CS0
CS1
R/W
DATA_AV
CONV_CLK
DATA
RD
DVDD THS1206 TMS320C30/31/33
STRB
A23
R/W
INTX
TOUT
DATA
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
www.ti.com
32
INTERFACING THE THS1206 TO THE TMS320C54X USING I/O STROBE
The following application circuit shows an interface of the THS1206 to the TMS320C54x. The read and write timings (using
R/W, CS0-controlled) shown before are valid for this specific interface.
CS0
CS1
R/W
DATA_AV
CONV_CLK
DATA
RD
DVDD THS1206 TMS320C54x
I/O STRB
A15
R/W
INTX
BCLK
DATA
Read Timing (using RD, RD-controlled)
Figure 38 shows the read-timing behavior when the WR(R/W) input is programmed as a write-input only. The input RD acts
as the read-input in this configuration. This timing is called RD-controlled because RD is the last external signal of CS0,
CS1, and RD, which becomes valid.
ÓÓÓÓÓ
ÓÓÓÓÓ
ÔÔÔÔ
ÔÔÔÔ
90%90%
90%
10%
tw(RD)
tsu(CS) th(CS)
tath
td(CSDAV)
CS0
CS1
WR
RD
D(011)
DATA_AV
10%
Figure 38. Read Timing Diagram Using RD (RD-controlled)
Read Timing Parameter (RD-controlled)
PARAMETER MIN TYP MAX UNIT
tsu(CS) Setup time, RD low to last CS valid 0 ns
taAccess time, last CS valid to data valid 0 10 ns
td(CSDAV) Delay time, last CS valid to DATA_AV inactive 12 ns
thHold time, first CS invalid to data invalid 0 5 ns
th(CS) Hold time, RD change to first CS invalid 5 ns
tw(RD)Pulse duration, RD active 10 ns
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
www.ti.com
33
Write Timing (using WR, WR-controlled)
Figure 39 shows the write-timing behavior when the WR(R/W) input is programmed as a write input WR only. The input
RD acts as the read input in this configuration. This timing is called WR-controlled because WR is the last external signal
of CS0, CS1, and WR, which becomes valid.
90%90%
10%
tsu th
D(011)
DATA_AV
10%
ÓÓÓÓ
ÓÓÓÓ
ÔÔÔÔ
ÔÔÔÔ
tw(WR)
tsu(CS) th(CS)
CS0
CS1
WR
RD
ÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖ
ÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖÖ
Figure 39. Write Timing Diagram Using WR (WR-controlled)
Write T iming Parameter Using WR (WR-controlled)
PARAMETER MIN TYP MAX UNIT
tsu(CS) Setup time, CS stable to last WR valid 0 ns
tsu Setup time, data valid to first WR invalid 5 ns
thHold time, WR invalid to data invalid 2 ns
th(CS) Hold time, WR invalid to CS change 5 ns
tw(WR)Pulse duration, WR active 10 ns
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
www.ti.com
34
INTERFACING THE THS1206 TO THE TMS320C6201 DSP
The following application circuit shows an interface of the THS1206 to the TMS320C6201. The read (using RD,
RD-controlled) and write timings (using WR, WR-controlled) shown before are valid for this specific interface.
CS0
CS1
RD
WR
DATA_AV
DATA
CONV_CLK
THS12061
CS0
CS1
RD
WR
DATA_AV
DATA
CONV_CLK
THS12062
TMS320C6201
CE1
EA20
ARE
AWE
EXT_INT6
DATA
TOUT1
TOUT2
EA21
EXT_INT7
ANALOG INPUT CONFIGURATION AND REFERENCE VOLTAGE
The THS1206 features four analog input channels. These can be configured for either single-ended or differential
operation. Best performance is achieved in differential mode. Figure 40 shows a simplified model, where a single-ended
configuration for channel AINP is selected. The reference voltages for the ADC itself are VREFP and VREFM (either internal
or external reference voltage). The analog input voltage range goes from VREFM to VREFP. This means that VREFM defines
the minimum voltage, which can be applied to the ADC. VREFP defines the maximum voltage, which can be applied to the
ADC. The internal reference source provides the voltage VREFM of 1.5 V and the voltage VREFP of 3.5 V. The resulting
analog input voltage swing of 2 V can be expressed by:
VREFM
v
AINP
v
VREFP
12-Bit
ADC
VREFP
VREFM
AINP
Figure 40. Single-Ended Input Stage
(1)
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
www.ti.com
35
A differential operation is desired for many applications. Figure 41 shows a simplified model for the analog inputs AINM
and AINP, which are configured for differential operation. This configuration has a few advantages, which are discussed
in the following paragraphs.
12-Bit
ADC
VREFP
VREFM
AINP
ΣVADC
AINM
+
Figure 41. Differential Input Stage
In comparison to the single-ended configuration it can be seen that the voltage, V ADC, which is applied at the input of the
ADC is the difference between the input AINP and AINM. This means that VREFM defines the minimum voltage (VADC)
which can be applied to the ADC. VREFP defines the maximum voltage (VADC), which can be applied to the ADC. The
voltage VADC can be calculated as follows:
VADC
+
ABS(AINPAINM)
An advantage to single-ended operation is that the common-mode voltage
VCM
+
AINM
)
AINP
2
can be rejected in the differential configuration, if the following condition for the analog input voltages is true:
AGND
v
AINM, AINP
v
AVDD
1V
v
VCM
v
4V
In addition to the common-mode voltage rejection, the differential operation allows a dc-of fset rejection which is common
to both analog inputs. See also Figure 45.
SINGLE-ENDED MODE OF OPERATION
The THS1206 can be configured for single-ended operation using dc- or ac-coupling. In either case, the input of the
THS1206 must be driven from an operational amplifier that does not degrade the ADC performance. Because the THS1206
operates from a 5-V single supply, it is necessary to level-shift ground-based bipolar signals to comply with its input
requirements. This can be achieved with dc- and ac-coupling. An application example is shown for dc-coupled level shifting
in the following section, dc-coupling.
(2)
(3)
(4)
(5)
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
www.ti.com
36
DC COUPLING
An operational amplifier can be configured to shift the signal level according to the analog input voltage range of the
THS1206. The analog input voltage range of the THS1206 goes from 1.5 V to 3.5 V. An op-amp specified for 5-V single
supply can be used as shown in Figure 42.
Figure 42 shows an application example where the analog input signal in the range from 1 V up to 1 V is shifted by an
op-amp to the analog input range of the THS1206 (1.5 V to 3.5 V). The op-amp is configured as an inverting amplifier with
a gain of 1. The required dc voltage of 1.25 V at the noninverting input is derived from the 2.5-V output reference REFOUT
of the THS1206 by using a resistor divider. Therefore, the op-amp output voltage is centered at 2.5 V. The use of ratio
matched, thin-film resistor networks minimizes gain and offset errors.
_
+
5 V
R
RRS
3.5 V
2.5 V
1.5 V THS1206
AINP
REFOUT
R
R
1.25 V
1 V
0 V
1 V REFIN
Figure 42. Level-Shift for DC-Coupled Input
DIFFERENTIAL MODE OF OPERATION
For the differential mode of operation, a conversion from single-ended to differential is required. A conversion to differential
signals can be achieved by using an RF-transformer, which provides a center tap. Best performance is achieved in
differential mode.
THS1206
AINP
AINM
REFOUT
C
C
R
R
200
49.9
Mini Circuits
T41
Figure 43. Transformer Coupled Input
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
www.ti.com
37
DEFINITIONS OF SPECIFICATIONS AND TERMINOLOGY
Integral Nonlinearity
Integral nonlinearity refers to the deviation of each individual code from a line drawn from zero through full scale. The point
used as zero occurs 1/2 LSB before the first code transition. The full-scale point is defined as level 1/2 LSB beyond the
last code transition. The deviation is measured from the center of each particular code to the true straight line between these
two points.
Differential Nonlinearity
An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. A differential
nonlinearity error of less than ±1 LSB ensures no missing codes.
Zero Offset
The major carry transition should occur when the analog input is at zero volts. Zero error is defined as the deviation of the
actual transition from that point.
Gain Error
The first code transition should occur at an analog value 1/2 LSB above negative full scale. The last transition should occur
at an analog value 1 1/2 LSB below the nominal full scale. Gain error is the deviation of the actual difference between first
and last code transitions and the ideal difference between first and last code transitions.
Signal-to-Noise Ratio + Distortion (SINAD)
SINAD is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components below
the Nyquist frequency, including harmonics but excluding dc. The value for SINAD is expressed in decibels.
Effective Number of Bits (ENOB)
For a sine wave, SINAD can be expressed in terms of the number of bits. Using the following formula,
N
+
(SINAD
*
1.76)
6.02
it is possible to get a measure of performance expressed as N, the effective number of bits. Thus, the ef fective number of
bits for a device for sine wave inputs at a given input frequency can be calculated directly from its measured SINAD.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first six harmonic components to the rms value of the measured input signal and is
expressed as a percentage or in decibels.
Spurious Free Dynamic Range (SFDR)
SFDR is the difference in dB between the rms amplitude of the input signal and the peak spurious signal.
THS1206
SLAS217H MAY 1999 REVISED JULY 2003#
www.ti.com
38
MECHANICAL DATA
DA (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
38 PINS SHOWN
4040066/D 11/98
0,25
0,75
0,50
0,15 NOM
Gage Plane
6,20
NOM 8,40
7,80
32
11,10
11,10
30
Seating Plane
10,9010,90
20
0,19
19
A
0,30
38
1
PINS **
A MAX
A MIN
DIM
1,20 MAX
9,60
9,80
28
M
0,13
0°8°
0,10
0,65
38
12,60
12,40
0,15
0,05
NOTES:A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-153
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
5962-9957701NXD ACTIVE TSSOP DA 32 1 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
THS1206CDA ACTIVE TSSOP DA 32 46 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
THS1206CDAG4 ACTIVE TSSOP DA 32 46 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
THS1206CDAR ACTIVE TSSOP DA 32 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
THS1206CDARG4 ACTIVE TSSOP DA 32 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
THS1206IDA ACTIVE TSSOP DA 32 46 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
THS1206IDAG4 ACTIVE TSSOP DA 32 46 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
THS1206IDAR ACTIVE TSSOP DA 32 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
THS1206IDARG4 ACTIVE TSSOP DA 32 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
THS1206QDA ACTIVE TSSOP DA 32 46 TBD CU NIPDAU Level-2-220C-1 YEAR
THS1206QDAR ACTIVE TSSOP DA 32 2000 TBD CU NIPDAU Level-2-220C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 6-Dec-2006
Addendum-Page 1
TAPE AND REEL INFORMATION
PACKAGE MATERIALS INFORMATION
www.ti.com 7-May-2007
Pack Materials-Page 1
Device Package Pins Site Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
THS1206CDAR DA 32 TAI 330 24 8.6 11.5 1.6 12 24 Q1
THS1206IDAR DA 32 TAI 330 24 8.6 11.5 1.6 12 24 Q1
TAPE AND REEL BOX INFORMATION
Device Package Pins Site Length (mm) Width (mm) Height (mm)
THS1206CDAR DA 32 TAI 535.4 346.0 48.3
THS1206IDAR DA 32 TAI 535.4 346.0 48.3
PACKAGE MATERIALS INFORMATION
www.ti.com 7-May-2007
Pack Materials-Page 2
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