FQD12N20L / FQU12N20L 200V LOGIC N-Channel MOSFET General Description Features These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficiency switching DC/DC converters, switch mode power supply, motor control. * * * * * * * 9.0A, 200V, RDS(on) = 0.28 @VGS = 10 V Low gate charge ( typical 16 nC) Low Crss ( typical 17 pF) Fast switching 100% avalanche tested Improved dv/dt capability Low level gate drive requirement allowing direct opration from logic drivers D ! D " ! " " " G! G S I-PAK D-PAK FQD Series G D S FQU Series ! S Absolute Maximum Ratings Symbol VDSS ID TC = 25C unless otherwise noted Parameter Drain-Source Voltage - Continuous (TC = 25C) Drain Current FQD12N20L / FQU12N20L 200 Units V 9.0 A - Continuous (TC = 100C) IDM Drain Current - Pulsed (Note 1) 5.7 A 36 A VGSS Gate-Source Voltage 20 V EAS Single Pulsed Avalanche Energy (Note 2) 210 mJ IAR Avalanche Current (Note 1) 9.0 A EAR Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TA = 25C) * (Note 1) 5.5 5.5 2.5 mJ V/ns W 55 0.44 -55 to +150 W W/C C 300 C dv/dt PD (Note 3) Power Dissipation (TC = 25C) TJ, TSTG TL - Derate above 25C Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds Thermal Characteristics Symbol RJC Parameter Thermal Resistance, Junction-to-Case Typ -- Max 2.27 Units C/W RJA RJA Thermal Resistance, Junction-to-Ambient * -- 50 C/W Thermal Resistance, Junction-to-Ambient -- 110 C/W * When mounted on the minimum pad size recommended (PCB Mount) (c)2001 Fairchild Semiconductor Corporation Rev. A1, February 2001 FQD12N20L / FQU12N20L February 2001 Symbol TC = 25C unless otherwise noted Parameter Test Conditions Min Typ Max Units 200 -- -- V -- 0.14 -- V/C Off Characteristics BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 A BVDSS / TJ Breakdown Voltage Temperature Coefficient ID = 250 A, Referenced to 25C VDS = 200 V, VGS = 0 V -- -- 1 A VDS = 160 V, TC = 125C -- -- 10 A Gate-Body Leakage Current, Forward VGS = 20 V, VDS = 0 V -- -- 100 nA Gate-Body Leakage Current, Reverse VGS = -20 V, VDS = 0 V -- -- -100 nA Gate Threshold Voltage VDS = VGS, ID = 250 A 1.0 -- 2.0 V RDS(on) Static Drain-Source On-Resistance VGS = 10 V, ID = 4.5 A VGS = 5 V, ID = 4.5 A -- 0.22 0.25 0.28 0.32 gFS Forward Transconductance VDS = 30 V, ID = 4.5 A -- 11.6 -- S -- 830 1080 pF -- 120 155 pF -- 17 22 pF IDSS IGSSF IGSSR Zero Gate Voltage Drain Current On Characteristics VGS(th) (Note 4) Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance VDS = 25 V, VGS = 0 V, f = 1.0 MHz Switching Characteristics td(on) Turn-On Delay Time tr Turn-On Rise Time td(off) Turn-Off Delay Time tf Turn-Off Fall Time Qg Total Gate Charge Qgs Gate-Source Charge Qgd Gate-Drain Charge VDD = 100 V, ID = 11.6 A, RG = 25 (Note 4, 5) VDS = 160 V, ID = 11.6 A, VGS = 5 V (Note 4, 5) -- 15 40 ns -- 190 390 ns -- 60 130 ns -- 120 250 ns -- 16 21 nC -- 2.8 -- nC -- 7.6 -- nC Drain-Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain-Source Diode Forward Current -- -- 9.0 A ISM -- -- 36 A VSD Maximum Pulsed Drain-Source Diode Forward Current VGS = 0 V, IS = 9.0 A Drain-Source Diode Forward Voltage -- -- 1.5 V trr Reverse Recovery Time -- 128 -- ns Qrr Reverse Recovery Charge -- 0.56 -- C VGS = 0 V, IS = 11.6 A, dIF / dt = 100 A/s (Note 4) Notes: 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L = 3.9mH, IAS = 9.0A, VDD = 50V, RG = 25 , Starting TJ = 25C 3. ISD 11.6A, di/dt 300A/s, VDD BVDSS, Starting TJ = 25C 4. Pulse Test : Pulse width 300s, Duty cycle 2% 5. Essentially independent of operating temperature (c)2001 Fairchild Semiconductor Corporation Rev. A1, February 2001 FQD12N20L / FQU12N20L Electrical Characteristics FQD12N20L / FQU12N20L Typical Characteristics VGS 10 V 8.0 V 6.0 V 5.0 V 4.5 V 4.0 V 3.5 V Bottom : 3.0 V Top : ID , Drain Current [A] 1 10 ID, Drain Current [A] 1 10 0 10 Notes : 1. 250s Pulse Test 2. TC = 25 150 0 10 25 -55 Notes : 1. VDS = 30V 2. 250s Pulse Test -1 10 -1 -1 0 10 10 1 10 10 0 2 4 6 8 10 VGS, Gate-Source Voltage [V] VDS , Drain-Source Voltage [V] Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics 1.2 1 10 IDR, Reverse Drain Current [A] RDS(on) [ ], Drain-Source On-Resistance 1.5 VGS = 5 V 0.9 VGS = 10V 0.6 0.3 150 25 Notes : 1. VGS = 0V 2. 250s Pulse Test -1 10 0.0 0 6 12 18 24 30 0.2 36 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 ID , Drain Current [A] VSD, Source-Drain voltage [V] Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperature 12 1800 Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd 1200 Ciss 900 Coss Notes : 1. VGS = 0 V 2. f = 1 MHz 600 Crss 300 10 VGS, Gate-Source Voltage [V] 1500 Capacitance [pF] 0 10 VDS = 40V VDS = 100V 8 VDS = 160V 6 4 2 Note : ID = 11.6 A 0 -1 10 0 10 1 10 VDS, Drain-Source Voltage [V] Figure 5. Capacitance Characteristics (c)2001 Fairchild Semiconductor Corporation 0 0 5 10 15 20 25 30 QG, Total Gate Charge [nC] Figure 6. Gate Charge Characteristics Rev. A1, February 2001 FQD12N20L / FQU12N20L Typical Characteristics (Continued) 1.2 3.0 RDS(ON) , (Normalized) Drain-Source On-Resistance BV DSS , (Normalized) Drain-Source Breakdown Voltage 2.5 1.1 1.0 Notes : 1. VGS = 0 V 2. ID = 250 A 0.9 0.8 -100 -50 0 50 100 150 2.0 1.5 1.0 Notes : 1. VGS = 10 V 2. ID = 5.8 A 0.5 0.0 -100 200 -50 0 50 100 150 200 o o TJ, Junction Temperature [ C] TJ, Junction Temperature [ C] Figure 7. Breakdown Voltage Variation vs. Temperature Figure 8. On-Resistance Variation vs. Temperature 9.0 2 10 Operation in This Area is Limited by R DS(on) 7.5 ID, Drain Current [A] ID, Drain Current [A] 100 s 10 s 1 10 1 ms 10 ms DC 0 10 Notes : o 1. TC = 25 C 6.0 4.5 3.0 1.5 o 2. TJ = 150 C 3. Single Pulse -1 10 0 1 10 0.0 25 2 10 10 50 100 125 150 Figure 10. Maximum Drain Current vs. Case Temperature D = 0 .5 0 N o te s : 1 . Z J C ( t ) = 2 . 2 7 /W M a x . 2 . D u ty F a c t o r , D = t 1 /t 2 3 . T JM - T C = P D M * Z JC(t) 0 .2 0 .1 0 .0 5 10 PDM -1 0 .0 2 JC ( t) , T h e r m a l R e s p o n s e Figure 9. Maximum Safe Operating Area 10 75 TC, Case Temperature [] VDS, Drain-Source Voltage [V] t1 Z 0 .0 1 t2 s in g le p u ls e 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 t 1 , S q u a r e W a v e P u ls e D u r a t io n [ s e c ] Figure 11. Transient Thermal Response Curve (c)2001 Fairchild Semiconductor Corporation Rev. A1, February 2001 FQD12N20L / FQU12N20L Gate Charge Test Circuit & Waveform VGS Same Type as DUT 50K Qg 200nF 12V 5V 300nF VDS VGS Qgs Qgd DUT 3mA Charge Resistive Switching Test Circuit & Waveforms VDS RL VDS 90% VDD VGS RG VGS DUT 5V 10% td(on) tr td(off) t on tf t off Unclamped Inductive Switching Test Circuit & Waveforms BVDSS 1 EAS = ---- L IAS2 -------------------2 BVDSS - VDD L VDS BVDSS IAS ID RG VDD DUT 10V tp (c)2001 Fairchild Semiconductor Corporation ID (t) VDS (t) VDD tp Time Rev. A1, February 2001 FQD12N20L / FQU12N20L Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT + VDS _ I SD L Driver RG VGS VGS ( Driver ) Same Type as DUT VDD * dv/dt controlled by RG * ISD controlled by pulse period Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current I SD ( DUT ) di/dt IRM Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt VSD VDD Body Diode Forward Voltage Drop (c)2001 Fairchild Semiconductor Corporation Rev. A1, February 2001 DPAK MIN0.55 0.91 0.10 9.50 0.30 0.50 0.10 0.76 0.10 0.50 0.10 1.02 0.20 2.30TYP [2.300.20] (1.00) (3.05) (2XR0.25) (0.10) 2.70 0.20 6.10 0.20 9.50 0.30 6.60 0.20 (5.34) (5.04) (1.50) (0.90) 2.30 0.20 (0.70) 2.30TYP [2.300.20] (0.50) 2.30 0.10 0.89 0.10 MAX0.96 (4.34) 2.70 0.20 0.80 0.20 0.60 0.20 (0.50) 6.10 0.20 5.34 0.30 0.70 0.20 6.60 0.20 0.76 0.10 (c)2001 Fairchild Semiconductor Corporation Rev. A1, February 2001 FQD12N20L / FQU12N20L Package Dimensions (Continued) IPAK 2.30 0.20 6.60 0.20 5.34 0.20 0.76 0.10 2.30TYP [2.300.20] (c)2001 Fairchild Semiconductor Corporation 0.50 0.10 16.10 0.30 6.10 0.20 0.70 0.20 (0.50) 9.30 0.30 MAX0.96 (4.34) 1.80 0.20 0.80 0.10 0.60 0.20 (0.50) 2.30TYP [2.300.20] 0.50 0.10 Rev. A1, February 2001 FQD12N20L / FQU12N20L Package Dimensions TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DOMETM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM MICROWIRETM OPTOLOGICTM OPTOPLANARTM PACMANTM POPTM PowerTrench(R) QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM LILENT SWITCHER(R) SMART STARTTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM VCXTM UHCTM DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. (c)2001 Fairchild Semiconductor Corporation Rev. G