LTC2145-12/ LTC2144-12/LTC2143-12 12-Bit, 125Msps/105Msps/ 80Msps Low Power Dual ADCs FEATURES DESCRIPTION n The LTC(R)2145-12/LTC2144-12/LTC2143-12 are 2-channel simultaneous sampling 12-bit A/D converters designed for digitizing high frequency, wide dynamic range signals. They are perfect for demanding communications applications with AC performance that includes 70.6dB SNR and 89dB spurious free dynamic range (SFDR). Ultralow jitter of 0.08psRMS allows undersampling of IF frequencies with excellent noise performance. n n n n n n n n n n n n 2-Channel Simultaneously Sampling ADC 70.6dB SNR 89dB SFDR Low Power: 183mW/144mW/109mW Total 92mW/72mW/55mW per Channel Single 1.8V Supply CMOS, DDR CMOS, or DDR LVDS Outputs Selectable Input Ranges: 1VP-P to 2VP-P 750MHz Full Power Bandwidth S/H Optional Data Output Randomizer Optional Clock Duty Cycle Stabilizer Shutdown and Nap Modes Serial SPI Port for Configuration 64-Pin (9mm x 9mm) QFN Package DC specs include 0.3LSB INL (typ), 0.1LSB DNL (typ) and no missing codes over temperature. The transition noise is 0.3LSBRMS. The digital outputs can be either full rate CMOS, double data rate CMOS, or double data rate LVDS. A separate output power supply allows the CMOS output swing to range from 1.2V to 1.8V. APPLICATIONS n n n n n n The ENC+ and ENC- inputs may be driven differentially or single-ended with a sine wave, PECL, LVDS, TTL, or CMOS inputs. An optional clock duty cycle stabilizer allows high performance at full speed for a wide range of clock duty cycles. Communications Cellular Base Stations Software Defined Radios Portable Medical Imaging Multi-Channel Data Acquisition Nondestructive Testing L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. TYPICAL APPLICATION 1.8V VDD 2-Tone FFT, fIN = 70MHz and 69MHz 1.8V OVDD 0 -10 -20 CH 2 ANALOG INPUT D1_11 t t t D1_0 12-BIT ADC CORE S/H 12-BIT ADC CORE S/H OUTPUT DRIVERS D2_11 t t t D2_0 -30 CMOS, DDR CMOS OR DDR LVDS OUTPUTS AMPLITUDE (dBFS) CH 1 ANALOG INPUT -40 -50 -60 -70 -80 -90 -100 -110 -120 125MHz 0 CLOCK CONTROL CLOCK 10 30 20 40 FREQUENCY (MHz) 50 60 21854312 TA01b 21454312 TA01a GND OGND 21454312fa 1 LTC2145-12/ LTC2144-12/LTC2143-12 ABSOLUTE MAXIMUM RATINGS (Notes 1, 2) Supply Voltages (VDD, OVDD) ....................... -0.3V to 2V Analog Input Voltage (AIN+, AIN-, PAR/SER, SENSE) (Note 3) .......... -0.3V to (VDD + 0.2V) Digital Input Voltage (ENC+, ENC-, CS, SDI, SCK) (Note 4) .................................... -0.3V to 3.9V SDO (Note 4) ............................................ -0.3V to 3.9V Digital Output Voltage ................ -0.3V to (OVDD + 0.3V) Operating Temperature Range LTC2145C, LTC2144C, LTC2143C............. 0C to 70C LTC2145I, LTC2144I, LTC2143I ............ -40C to 85C Storage Temperature Range................... -65C to 150C PIN CONFIGURATIONS FULL RATE CMOS OUTPUT MODE DOUBLE DATA RATE CMOS OUTPUT MODE TOP VIEW 64 VDD 63 SENSE 62 VREF 61 SDO 60 OF1 59 OF2 58 D1_11 57 D1_10 56 D1_9 55 D1_8 54 D1_7 53 D1_6 52 D1_5 51 D1_4 50 D1_3 49 D1_2 64 VDD 63 SENSE 62 VREF 61 SDO 60 OF2_1 59 DNC 58 D1_10_11 57 DNC 56 D1_8_9 55 DNC 54 D1_6_7 53 DNC 52 D1_4_5 51 DNC 50 D1_2_3 49 DNC TOP VIEW VDD 1 VCM1 2 GND 3 AIN1+ 4 AIN1- 5 GND 6 REFH 7 REFL 8 REFH 9 REFL 10 PAR/SER 11 AIN2+ 12 AIN2- 13 GND 14 VCM2 15 VDD 16 65 GND 48 D1_0_1 47 DNC 46 DNC* 45 DNC* 44 DNC* 43 DNC* 42 OVDD 41 OGND 40 CLKOUT+ 39 CLKOUT- 38 D2_10_11 37 DNC 36 D2_8_9 35 DNC 34 D2_6_7 33 DNC VDD 17 ENC+ 18 ENC- 19 CS 20 SCK 21 SDI 22 DNC* 23 DNC* 24 DNC* 25 DNC* 26 DNC 27 D2_0_1 28 DNC 29 D2_2_3 30 DNC 31 D2_4_5 32 65 GND 48 D1_1 47 D1_0 46 DNC* 45 DNC* 44 DNC* 43 DNC* 42 OVDD 41 OGND 40 CLKOUT+ 39 CLKOUT- 38 D2_11 37 D2_10 36 D2_9 35 D2_8 34 D2_7 33 D2_6 VDD 17 ENC+ 18 ENC- 19 CS 20 SCK 21 SDI 22 DNC* 23 DNC* 24 DNC* 25 DNC* 26 D2_0 27 D2_1 28 D2_2 29 D2_3 30 D2_4 31 D2_5 32 VDD 1 VCM1 2 GND 3 AIN1+ 4 AIN1- 5 GND 6 REFH 7 REFL 8 REFH 9 REFL 10 PAR/SER 11 AIN2+ 12 AIN2- 13 GND 14 VCM2 15 VDD 16 UP PACKAGE 64-LEAD (9mm x 9mm) PLASTIC QFN TJMAX = 150C, JA = 20C/W EXPOSED PAD (PIN 65) IS GND, MUST BE SOLDERED TO PCB UP PACKAGE 64-LEAD (9mm x 9mm) PLASTIC QFN TJMAX = 150C, JA = 20C/W EXPOSED PAD (PIN 65) IS GND, MUST BE SOLDERED TO PCB 21454312fa 2 LTC2145-12/ LTC2144-12/LTC2143-12 PIN CONFIGURATIONS DOUBLE DATA RATE LVDS OUTPUT MODE 64 VDD 63 SENSE 62 VREF 61 SDO 60 OF2_1+ 59 OF2_1- 58 D1_10_11+ 57 D1_10_11- 56 D1_8_9+ 55 D1_8_9- 54 D1_6_7+ 53 D1_6_7- 52 D1_4_5+ 51 D1_4_5- 50 D1_2_3+ 49 D1_2_3- TOP VIEW VDD 1 VCM1 2 GND 3 AIN1+ 4 AIN1- 5 GND 6 REFH 7 REFL 8 REFH 9 REFL 10 PAR/SER 11 AIN2+ 12 AIN2- 13 GND 14 VCM2 15 VDD 16 48 D1_0_1+ 47 D1_0_1- 46 DNC* 45 DNC* 44 DNC* 43 DNC* 42 OVDD 41 OGND 40 CLKOUT+ 39 CLKOUT- 38 D2_10_11+ 37 D2_10_11- 36 D2_8_9+ 35 D2_8_9- 34 D2_6_7+ 33 D2_6_7- VDD 17 ENC+ 18 ENC- 19 CS 20 SCK 21 SDI 22 DNC* 23 DNC* 24 DNC* 25 DNC* 26 D2_0_1- 27 D2_0_1+ 28 D2_2_3- 29 D2_2_3+ 30 D2_4_5- 31 D2_4_5+ 32 65 GND UP PACKAGE 64-LEAD (9mm x 9mm) PLASTIC QFN TJMAX = 150C, JA = 20C/W EXPOSED PAD (PIN 65) IS GND, MUST BE SOLDERED TO PCB ORDER INFORMATION LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LTC2145CUP-12#PBF LTC2145CUP-12#TRPBF LTC2145UP-12 64-Lead (9mm x 9mm) Plastic QFN 0C to 70C LTC2145IUP-12#PBF LTC2145IUP-12#TRPBF LTC2145UP-12 64-Lead (9mm x 9mm) Plastic QFN -40C to 85C LTC2144CUP-12#PBF LTC2144CUP-12#TRPBF LTC2144UP-12 64-Lead (9mm x 9mm) Plastic QFN 0C to 70C LTC2144IUP-12#PBF LTC2144IUP-12#TRPBF LTC2144UP-12 64-Lead (9mm x 9mm) Plastic QFN -40C to 85C LTC2143CUP-12#PBF LTC2143CUP-12#TRPBF LTC2143UP-12 64-Lead (9mm x 9mm) Plastic QFN 0C to 70C LTC2143IUP-12#PBF LTC2143IUP-12#TRPBF LTC2143UP-12 64-Lead (9mm x 9mm) Plastic QFN -40C to 85C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. Consult LTC Marketing for information on non-standard lead based finish parts. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ 21454312fa 3 LTC2145-12/ LTC2144-12/LTC2143-12 CONVERTER CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 5) LTC2145-12 PARAMETER CONDITIONS Resolution (No Missing Codes) Integral Linearity Error MIN l LTC2144-12 TYP MAX MIN 0.3 0.9 -0.9 12 Differential Analog Input (Note 6) l -0.9 LTC2143-12 TYP MAX MIN 0.3 0.9 -0.9 12 TYP MAX UNITS 0.3 0.9 LSB 12 Bits Differential Linearity Error Differential Analog Input l -0.5 0.1 0.5 -0.5 0.1 0.5 -0.5 0.1 0.5 LSB Offset Error (Note 7) l -9 1.5 9 -9 1.5 9 -9 1.5 9 mV Gain Error Internal Reference External Reference l -2.1 1.5 -0.5 0.8 -1.7 1.5 -0.3 1.1 -1.7 1.5 -0.3 1.1 %FS %FS Offset Drift Full-Scale Drift Internal Reference External Reference Gain Matching 10 10 10 V/C 30 10 30 10 30 10 ppm/C ppm/C 0.2 0.2 0.2 %FS Offset Matching 1.5 1.5 1.5 mV Transition Noise 0.31 0.32 0.30 LSBRMS ANALOG INPUT The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 5) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VIN Analog Input Range (AIN+ - AIN-) VIN(CM) Analog Input Common Mode (AIN+ + AIN-)/2 VSENSE External Voltage Reference Applied to SENSE External Reference Mode IINCM Analog Input Common Mode Current Per Pin, 125Msps Per Pin, 105Msps Per Pin, 80Msps IIN1 Analog Input Leakage Current (No Encode) 0 < AIN+, AIN- < VDD l -1.5 1.5 A IIN2 PAR/SER Input Leakage Current 0 < PAR/SER < VDD l -3 3 A 0.625 < SENSE < 1.3V l -3 3 A IIN3 SENSE Input Leakage Current tAP Sample-and-Hold Acquisition Delay Time tJITTER Sample-and-Hold Acquisition Delay Jitter CMRR Analog Input Common Mode Rejection Ratio BW-3B Full-Power Bandwidth 1.7V < VDD < 1.9V l Differential Analog Input (Note 8) l 0.7 VCM 1.25 V l 0.625 1.250 1.300 V 1 to 2 155 130 100 0 Single-Ended Encode Differential Encode Figure 6 Test Circuit VP-P 0.08 0.10 A A A ns psRMS psRMS 80 dB 750 MHz 21454312fa 4 LTC2145-12/ LTC2144-12/LTC2143-12 DYNAMIC ACCURACY The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. AIN = -1dBFS. (Note 5) LTC2145-12 SYMBOL PARAMETER CONDITIONS SNR Signal-to-Noise Ratio 5MHz Input 70MHz Input 140MHz Input SFDR S/(N+D) MIN TYP l 69.4 Spurious Free Dynamic Range 5MHz Input 2nd Harmonic 70MHz Input 140MHz Input l Spurious Free Dynamic Range 5MHz Input 3rd Harmonic 70MHz Input 140MHz Input Spurious Free Dynamic Range 5MHz Input 4th Harmonic or Higher 70MHz Input 140MHz Input Signal-to-Noise Plus Distortion Ratio 5MHz Input 70MHz Input 140MHz Input Crosstalk 10MHz Input MAX LTC2144-12 MIN TYP 70.6 70.5 70.3 69.2 76 89 88 84 l 79 l l LTC2143-12 MIN TYP 70.5 70.4 70.2 69.6 70.8 70.7 70.5 dBFS dBFS dBFS 77 89 88 84 78 89 88 84 dBFS dBFS dBFS 89 88 84 79 89 88 84 80 89 88 84 dBFS dBFS dBFS 84 95 95 95 84 95 95 95 84 95 95 95 dBFS dBFS dBFS 69 70.5 70.4 70 68.9 70.4 70.3 69.9 69.4 70.7 70.6 70.2 dBFS dBFS dBFS -110 dBc -110 MAX -110 MAX UNITS INTERNAL REFERENCE CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 5) PARAMETER CONDITIONS VCM Output Voltage IOUT = 0 MIN TYP MAX 0.5 * VDD - 25mV 0.5 * VDD 0.5 * VDD + 25mV VCM Output Temperature Drift 25 VCM Output Resistance -600A < IOUT < 1mA VREF Output Voltage IOUT = 0 VREF Output Temperature Drift 1.250 25 VREF Output Resistance -400A < IOUT < 1mA VREF Line Regulation 1.7V < VDD < 1.9V 7 0.6 V ppm/C 4 1.225 UNITS 1.275 V ppm/C mV/V 21454312fa 5 LTC2145-12/ LTC2144-12/LTC2143-12 DIGITAL INPUTS AND OUTPUTS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 5) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS ENCODE INPUTS (ENC+, ENC- ) Differential Encode Mode (ENC- Not Tied to GND) VID Differential Input Voltage (Note 8) l 0.2 VICM Common Mode Input Voltage Internally Set Externally Set (Note 8) l 1.1 1.6 V V l 0.2 3.6 V V 1.2 VIN Input Voltage Range ENC+, ENC- to GND RIN Input Resistance (See Figure 10) 10 k CIN Input Capacitance (Note 8) 3.5 pF Single-Ended Encode Mode (ENC- Tied to GND) VIH High Level Input Voltage VDD = 1.8V l VIL Low Level Input Voltage VDD = 1.8V l VIN Input Voltage Range ENC+ to GND l RIN Input Resistance (See Figure 11) 30 k CIN Input Capacitance (Note 8) 3.5 pF 1.2 V 0.6 0 3.6 V V DIGITAL INPUTS (CS, SDI, SCK in Serial or Parallel Programming Mode. SDO in Parallel Programming Mode) VIH High Level Input Voltage VDD = 1.8V l VIL Low Level Input Voltage VDD = 1.8V l l IIN Input Current VIN = 0V to 3.6V CIN Input Capacitance (Note 8) 1.3 V -10 0.6 V 10 A 3 pF 200 SDO OUTPUT (Serial Programming Mode. Open-Drain Output. Requires 2k Pull-Up Resistor if SDO is Used) ROL Logic Low Output Resistance to GND VDD = 1.8V, SDO = 0V IOH Logic High Output Leakage Current SDO = 0V to 3.6V COUT Output Capacitance (Note 8) l -10 10 A 3 pF 1.790 V DIGITAL DATA OUTPUTS (CMOS MODES: FULL DATA RATE AND DOUBLE DATA RATE) OVDD = 1.8V VOH High Level Output Voltage IO = -500A l VOL Low Level Output Voltage IO = 500A l 1.750 0.010 0.050 V OVDD = 1.5V VOH High Level Output Voltage IO = -500A 1.488 V VOL Low Level Output Voltage IO = 500A 0.010 V OVDD = 1.2V VOH High Level Output Voltage IO = -500A 1.185 V VOL Low Level Output Voltage IO = 500A 0.010 V DIGITAL DATA OUTPUTS (LVDS MODE) VOD Differential Output Voltage 100 Differential Load, 3.5mA Mode 100 Differential Load, 1.75mA Mode l 247 350 175 454 VOS Common Mode Output Voltage 100 Differential Load, 3.5mA Mode 100 Differential Load, 1.75mA Mode l 1.125 1.250 1.250 1.375 RTERM On-Chip Termination Resistance Termination Enabled, OVDD = 1.8V 100 mV mV V V 21454312fa 6 LTC2145-12/ LTC2144-12/LTC2143-12 POWER REQUIREMENTS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 9) LTC2145-12 SYMBOL PARAMETER CONDITIONS LTC2144-12 LTC2143-12 MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS CMOS Output Modes: Full Data Rate and Double Data Rate VDD Analog Supply Voltage (Note 10) l 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V OVDD Output Supply Voltage (Note 10) l 1.1 1.8 1.9 1.1 1.8 1.9 1.1 1.8 1.9 V IVDD Analog Supply Current DC Input Sine Wave Input l 101.5 102.2 112 79.8 80.3 89 60.4 60.9 68 mA mA IOVDD Digital Supply Current Sine Wave Input, OVDD = 1.2V 7.3 PDISS Power Dissipation l DC Input Sine Wave Input, OVDD = 1.2V 183 193 202 6.2 4.7 144 152 161 mA 109 115 123 mW mW LVDS Output Mode VDD Analog Supply Voltage (Note 10) l 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V OVDD Output Supply Voltage (Note 10) l 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V IVDD Analog Supply Current Sine Input, 1.75mA Mode Sine Input, 3.5mA Mode l 103.4 104.6 119 81.6 82.8 94 62.1 63.4 73 mA mA Digital Supply Current (0VDD = 1.8V) Sine Input, 1.75mA Mode Sine Input, 3.5mA Mode l 30.6 57.9 69 30.3 57.6 68 30.1 57.3 68 mA mA Power Dissipation Sine Input, 1.75mA Mode Sine Input, 3.5mA Mode l 241 293 339 201 253 292 166 217 254 mW mW IOVDD PDISS All Output Modes PSLEEP Sleep Mode Power 1 1 1 mW PNAP Nap Mode Power 16 16 16 mW PDIFFCLK Power Increase with Differential Encode Mode Enabled (No increase for Nap or Sleep Modes) 20 20 20 mW TIMING CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 5) LTC2145-12 SYMBOL PARAMETER CONDITIONS MIN fS Sampling Frequency (Note 10) l 1 3.8 2 3.8 2 tL ENC Low Time (Note 8) Duty Cycle Stabilizer Off Duty Cycle Stabilizer On l l tH ENC High Time (Note 8) Duty Cycle Stabilizer Off Duty Cycle Stabilizer On l l tAP Sample-and-Hold Acquisition Delay Time SYMBOL PARAMETER TYP LTC2144-12 MAX MIN 125 1 4 4 500 500 4.52 2 4 4 500 500 4.52 2 0 TYP LTC2143-12 MAX MIN 105 1 4.76 4.76 500 500 5.93 2 4.76 4.76 500 500 5.93 2 0 CONDITIONS TYP MAX UNITS 80 MHz 6.25 6.25 500 500 ns ns 6.25 6.25 500 500 ns ns 0 ns MIN TYP MAX UNITS Digital Data Outputs (CMOS Modes: Full Data Rate and Double Data Rate) tD ENC to Data Delay CL = 5pF (Note 8) l 1.1 1.7 3.1 ns 1 1.4 2.6 ns 0 0.3 0.6 ns tC ENC to CLKOUT Delay CL = 5pF (Note 8) l tSKEW DATA to CLKOUT Skew tD - tC (Note 8) l Pipeline Latency Full Data Rate Mode Double Data Rate Mode 6 6.5 Cycles Cycles 21454312fa 7 LTC2145-12/ LTC2144-12/LTC2143-12 TIMING CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 5) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Digital Data Outputs (LVDS Mode) tD ENC to Data Delay CL = 5pF (Note 8) l 1.1 1.8 3.2 ns tC ENC to CLKOUT Delay CL = 5pF (Note 8) l 1 1.5 2.7 ns tSKEW DATA to CLKOUT Skew tD - tC (Note 8) l 0 0.3 0.6 ns Pipeline Latency 6.5 Cycles SPI Port Timing (Note 8) l l 40 250 ns ns CS to SCK Setup Time l 5 ns tH SCK to CS Setup Time l 5 ns tDS SDI Setup Time l 5 ns tDH SDI Hold Time l 5 tDO SCK Falling to SDO Valid tSCK SCK Period tS Write Mode Readback Mode, CSDO = 20pF, RPULLUP = 2k Readback Mode, CSDO = 20pF, RPULLUP = 2k Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: All voltage values are with respect to GND with GND and OGND shorted (unless otherwise noted). Note 3: When these pin voltages are taken below GND or above VDD, they will be clamped by internal diodes. This product can handle input currents of greater than 100mA below GND or above VDD without latchup. Note 4: When these pin voltages are taken below GND they will be clamped by internal diodes. When these pin voltages are taken above VDD they will not be clamped by internal diodes. This product can handle input currents of greater than 100mA below GND without latchup. Note 5: VDD = OVDD = 1.8V, fSAMPLE = 125MHz (LTC2145), 105MHz (LTC2144), or 80MHz (LTC2143), LVDS outputs, differential ENC+/ENC- = 2VP-P sine wave, input range = 2VP-P with differential drive, unless otherwise noted. l ns 125 ns Note 6: Integral nonlinearity is defined as the deviation of a code from a best fit straight line to the transfer curve. The deviation is measured from the center of the quantization band. Note 7: Offset error is the offset voltage measured from -0.5 LSB when the output code flickers between 0000 0000 0000 and 1111 1111 1111 in 2's complement output mode. Note 8: Guaranteed by design, not subject to test. Note 9: VDD = 1.8V, fSAMPLE = 125MHz (LTC2145), 105MHz (LTC2144), or 80MHz (LTC2143), CMOS outputs, ENC+ = single-ended 1.8V square wave, ENC- = 0V, input range = 2VP-P with differential drive, 5pF load on each digital output unless otherwise noted. The supply current and power dissipation specifications are totals for the entire IC, not per channel. Note 10: Recommended operating conditions. 21454312fa 8 LTC2145-12/ LTC2144-12/LTC2143-12 TYPICAL PERFORMANCE CHARACTERISTICS LTC2145-12: Integral Non-Linearity (INL) LTC2145-12: Differential Non-Linearity (DNL) 1.0 0 0.8 0.8 -10 0.6 0.6 0.4 0.4 0.2 0.0 -0.2 -0.4 0 -0.2 -0.4 -0.6 -0.8 -0.8 -1.0 -1.0 1024 2048 3072 OUTPUT CODE 4096 -30 0.2 -0.6 0 -20 AMPLITUDE (dBFS) DNL ERROR (LSB) INL ERROR (LSB) 1.0 LTC2145-12: 64k Point FFT, fIN = 5MHz, -1dBFS, 125Msps -60 -70 -80 -90 -100 -110 -120 0 1024 2048 3072 OUTPUT CODE 21454312 G01 0 4096 0 -10 -20 -20 -20 -30 -30 -30 -70 -80 AMPLITUDE (dBFS) 0 -10 AMPLITUDE (dBFS) 0 -60 -40 -50 -60 -70 -80 -40 -60 -70 -80 -90 -100 -90 -100 -110 -120 -110 -120 -110 -120 10 20 30 40 FREQUENCY (MHz) 50 0 60 10 20 30 40 FREQUENCY (MHz) 50 0 60 10 20 30 40 FREQUENCY (MHz) 21454312 G05 21454312 G04 LTC2145-12: 64k Point 2-Tone FFT, fIN = 69MHz, 70MHz, -7dBFS, 125Msps 0 50 60 21454312 G06 LTC2145-12: Shorted Input Histogram LTC2145-12: SNR vs Input Frequency, -1dBFS, 125Msps, 2V Range 18000 -10 60 -50 -90 -100 0 50 LTC2145-12: 64k Point FFT, fIN = 140MHz, -1dBFS, 125Msps -10 -50 20 30 40 FREQUENCY (MHz) 21454312 G03 LTC2145-12: 64k Point FFT, fIN = 70MHz, -1dBFS, 125Msps -40 10 21454312 G02 LTC2145-12: 64k Point FFT, fIN = 30MHz, -1dBFS, 125Msps AMPLITUDE (dBFS) -40 -50 72 16000 -20 14000 71 SINGLE-ENDED ENCODE -50 -60 -70 SNR (dBFS) 12000 -40 COUNT AMPLITUDE (dBFS) -30 10000 8000 -80 6000 -90 -100 4000 70 DIFFERENTIAL ENCODE 69 2000 -110 -120 0 10 20 40 30 FREQUENCY (MHz) 50 60 21454312 G07 0 2043 2044 2045 2046 OUTPUT CODE 2047 21454312 G08 68 0 50 100 150 200 250 INPUT FREQUENCY (MHz) 300 21454312 G09 21454312fa 9 LTC2145-12/ LTC2144-12/LTC2143-12 TYPICAL PERFORMANCE CHARACTERISTICS LTC2145-12: 2nd, 3rd Harmonic vs Input Frequency, -1dBFS, 125Msps, 2V Range LTC2145-12: 2nd, 3rd Harmonic vs Input Frequency, -1dBFS, 125Msps, 1V Range 100 100 95 95 LTC2145-12: SFDR vs Input Level, fIN = 70MHz, 125Msps, 2V Range 110 90 3RD 85 80 2ND 75 70 dBFS 90 3RD 80 SFDR (dBc AND dBFS) 2ND AND 3RD HARMONIC (dBFS) 2ND AND 3RD HARMONIC (dBFS) 100 90 85 2ND 80 75 70 dBc 60 50 40 30 20 70 10 65 0 50 100 150 200 250 INPUT FREQUENCY (MHz) 65 300 0 50 100 150 200 250 INPUT FREQUENCY (MHz) 21454312 G10 21454312 G11 LTC2145-12: IVDD vs Sample Rate, 5MHz, -1dBFS Sine Wave Input on Each Channel LTC2145-12: SNR vs SENSE, fIN = 5MHz, -1dBFS 72 60 3.5mA LVDS 105 71 50 100 LVDS OUTPUTS 70 IOVDD (mA) 90 CMOS OUTPUTS 85 SNR (dBFS) 40 95 1.75mA LVDS 30 20 70 1.8V CMOS 10 0 25 50 75 100 SAMPLE RATE (Msps) 0 125 68 66 1.2V CMOS 0 25 50 75 100 SAMPLE RATE (Msps) 21454312 G13 65 125 0 0.8 -10 0.6 0.6 0.4 0.4 -0.4 0 -0.2 -0.4 -0.6 -0.8 -0.8 -1.0 -1.0 1024 2048 3072 OUTPUT CODE 4096 21454312 G16 1.2 1.3 -30 0.2 -0.6 0 0.9 1 1.1 SENSE PIN (V) -20 AMPLITUDE (dBFS) DNL ERROR (LSB) 1.0 0.8 -0.2 0.8 LTC2144-12: 64k Point FFT, fIN = 5MHz, -1dBFS, 105Msps 1.0 0.0 0.7 21454312 G15 LTC2144-12: Differential Non-Linearity (DNL) 0.2 0.6 21454312 G14 LTC2144-12: Integral Non-Linearity (INL) INL ERROR (LSB) 69 67 80 75 0 21454312 G12 LTC2145-12: IOVDD vs Sample Rate, 5MHz, -1dBFS, Sine Wave on Each Input 110 IVDD (mA) 0 -80 -70 -60 -50 -40 -30 -20 -10 INPUT LEVEL (dBFS) 300 -40 -50 -60 -70 -80 -90 -100 -110 -120 0 1024 2048 3072 OUTPUT CODE 4096 21454312 G17 0 10 20 30 40 FREQUENCY (MHz) 50 21454312 G18 21454312fa 21454312f 10 LTC2145-12/ LTC2144-12/LTC2143-12 TYPICAL PERFORMANCE CHARACTERISTICS LTC2144-12: 64k Point FFT, fIN = 140MHz, -1dBFS, 105Msps LTC2144-12: 64k Point FFT, fIN = 70MHz, -1dBFS, 105Msps 0 0 -10 -10 -20 -20 -20 -30 -30 -30 -40 -50 -60 -70 -80 AMPLITUDE (dBFS) 0 -10 AMPLITUDE (dBFS) AMPLITUDE (dBFS) LTC2144-12: 64k Point FFT, fIN = 30MHz, -1dBFS, 105Msps -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -100 -90 -100 -90 -100 -110 -120 -110 -120 -110 -120 0 10 20 30 40 FREQUENCY (MHz) 0 50 10 20 30 40 FREQUENCY (MHz) 21454312 G19 0 50 10 20 30 40 FREQUENCY (MHz) 21454312 G20 LTC2144-12: 64k Point 2-Tone FFT, fIN = 69MHz, 70MHz, -7dBFS, 105Msps 21454312 G21 LTC2144-12: SNR vs Input Frequency, -1dBFS, 105Msps, 2V Range LTC2144-12: Shorted Input Histogram 0 72 18000 -10 50 16000 -20 14000 71 SINGLE-ENDED ENCODE -50 -60 -70 SNR (dBFS) 12000 -40 COUNT AMPLITUDE (dBFS) -30 10000 8000 70 DIFFERENTIAL ENCODE 6000 -80 -90 -100 69 4000 2000 -110 -120 0 10 20 30 40 FREQUENCY (MHz) 0 2043 50 2044 2045 2046 OUTPUT CODE 21454312 G22 68 2047 0 50 100 150 200 250 INPUT FREQUENCY (MHz) 21454312 G24 21454312 G23 LTC2144-12: 2nd, 3rd Harmonic vs Input Frequency, -1dBFS, 105Msps, 2V Range LTC2144-12: 2nd, 3rd Harmonic vs Input Frequency, -1dBFS, 105Msps, 1V Range 100 100 95 95 300 LTC2144-12: SFDR vs Input Level, fIN = 70MHz, 105Msps, 2V Range 110 90 3RD 85 80 2ND 75 70 90 3RD SFDR (dBc AND dBFS) 2ND AND 3RD HARMONIC (dBFS) 2ND AND 3RD HARMONIC (dBFS) 100 90 85 2ND 80 75 80 70 dBFS dBc 60 50 40 30 20 70 10 65 0 50 100 150 200 250 INPUT FREQUENCY (MHz) 300 21454312 G25 65 0 50 100 150 200 250 INPUT FREQUENCY (MHz) 300 21454312 G26 0 -80 -70 -60 -50 -40 -30 -20 -10 INPUT LEVEL (dBFS) 0 21454312 G27 21454312fa 11 LTC2145-12/ LTC2144-12/LTC2143-12 TYPICAL PERFORMANCE CHARACTERISTICS LTC2144-12: IVDD vs Sample Rate, 5MHz, -1dBFS Sine Wave Input on Each Channel LTC2144-12: IOVDD vs Sample Rate, 5MHz, -1dBFS, Sine Wave on Each Input 70 85 80 3.5mA LVDS 71 50 70 CMOS OUTPUTS 65 40 1.75mA LVDS 30 60 20 55 10 0 25 50 75 SAMPLE RATE (Msps) 0 100 70 SNR (dBFS) IOVDD (mA) IVDD (mA) 72 60 LVDS OUTPUTS 75 50 68 1.8V CMOS 66 1.2V CMOS 0 25 50 75 SAMPLE RATE (Msps) 65 100 0 0.8 -10 0.6 0.6 0.4 0.4 -0.4 0 -0.2 -0.4 -0.6 -0.8 -0.8 -1.0 -1.0 1024 2048 3072 OUTPUT CODE 4096 -40 -50 -60 -70 -80 -110 -120 0 1024 2048 3072 OUTPUT CODE 4096 0 -20 -20 -20 -30 -30 -30 -80 AMPLITUDE (dBFS) 0 -10 AMPLITUDE (dBFS) 0 -10 -70 -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -100 -90 -100 -90 -100 -110 -120 -110 -120 -110 -120 0 10 20 30 FREQUENCY (MHz) 40 21454312 G34 0 10 20 30 FREQUENCY (MHz) 40 LTC2143-12: 64k Point FFT, fIN = 140MHz, -1dBFS, 80Msps 0 -60 20 30 FREQUENCY (MHz) 21454312 G33 -10 -50 10 21454312 G32 LTC2143-12: 64k Point FFT, fIN = 70MHz, -1dBFS, 80Msps -40 1.3 -90 -100 21454312 G31 LTC2143-12: 64k Point FFT, fIN = 30MHz, -1dBFS, 80Msps 1.2 -30 0.2 -0.6 0 0.9 1 1.1 SENSE PIN (V) -20 AMPLITUDE (dBFS) DNL ERROR (LSB) 1.0 0.8 0.2 0.8 LTC2143-12: 64k Point FFT, fIN = 5MHz, -1dBFS, 80Msps 1.0 0.0 0.7 21454312 G30 LTC2143-12: Differential Non-Linearity (DNL) 0.2 0.6 21454312 G29 LTC2143-12: Integral Non-Linearity (INL) INL ERROR (LSB) 69 67 21454312 G28 AMPLITUDE (dBFS) LTC2144-12: SNR vs SENSE, fIN = 5MHz, -1dBFS 40 21454312 G35 0 10 30 20 FREQUENCY (MHz) 40 21454312 G36 21454312fa 21454312f 12 LTC2145-12/ LTC2144-12/LTC2143-12 TYPICAL PERFORMANCE CHARACTERISTICS LTC2143-12: 64k Point 2-Tone FFT, fIN = 69MHz, 70MHz, -7dBFS, 80Msps 0 18000 -10 16000 -20 SINGLE-ENDED ENCODE 71 -50 -60 SNR (dBFS) 12000 -40 COUNT 10000 -70 8000 -80 6000 -90 -100 4000 70 DIFFERENTIAL ENCODE 69 2000 -110 -120 0 10 20 30 FREQUENCY (MHz) 0 2050 40 2051 2052 2053 OUTPUT CODE LTC2143-12: 2nd, 3rd Harmonic vs Input Frequency, -1dBFS, 80Msps, 2V Range 95 95 2ND AND 3RD HARMONIC (dBFS) 100 85 80 2ND 75 70 50 100 150 200 250 INPUT FREQUENCY (MHz) 300 21454312 G39 LTC2143-12: 2nd, 3rd Harmonic vs Input Frequency, -1dBFS, 80Msps, 1V Range 100 3RD 0 21454312 G38 21454312 G37 90 68 2054 LTC2143-12: SFDR vs Input Level, fIN = 70MHz, 80Msps, 2V Range 110 100 dBFS 90 3RD SFDR (dBc AND dBFS) AMPLITUDE (dBFS) 72 14000 -30 2ND AND 3RD HARMONIC (dBFS) LTC2143-12: SNR vs Input Frequency, -1dBFS, 80Msps, 2V Range LTC2143-12: Shorted Input Histogram 90 85 2ND 80 75 80 70 60 dBc 50 40 30 20 70 10 65 0 50 100 150 200 250 INPUT FREQUENCY (MHz) 65 300 0 50 100 150 200 250 INPUT FREQUENCY (MHz) 21454312 G40 0 -80 -70 -60 -50 -40 -30 -20 -10 INPUT LEVEL (dBFS) 300 21454312 G41 LTC2143-12: IVDD vs Sample Rate, 5MHz, -1dBFS Sine Wave Input on Each Input 21454312 G42 LTC2143-12: IOVDD vs Sample Rate, 5MHz, -1dBFS, Sine Wave on Each Channel 70 0 LTC2143-12: SNR vs SENSE, fIN = 5MHz, -1dBFS 72 60 3.5mA LVDS LVDS OUTPUTS IOVDD (mA) IVDD (mA) 60 55 50 71 40 70 1.75mA LVDS 30 10 0 20 40 60 SAMPLE RATE (Msps) 80 21454312 G43 0 69 68 20 CMOS OUTPUTS 45 40 50 SNR (dBFS) 65 67 1.8V CMOS 0 1.2V CMOS 20 40 60 80 SAMPLE RATE (Msps) 21454312 G44 66 0.6 0.7 0.8 0.9 1 1.1 SENSE PIN (V) 1.2 1.3 21454312 G45 21454312fa 13 LTC2145-12/ LTC2144-12/LTC2143-12 PIN FUNCTIONS PINS THAT ARE THE SAME FOR ALL DIGITAL OUTPUT MODES VDD (Pins 1, 16, 17, 64): Analog Power Supply, 1.7V to 1.9V. Bypass to ground with 0.1F ceramic capacitors. Adjacent pins can share a bypass capacitor. VCM1 (Pin 2): Common Mode Bias Output, Nominally Equal to VDD/2. VCM1 should be used to bias the common mode of the analog inputs to channel 1. Bypass to ground with a 0.1F ceramic capacitor. GND (Pins 3, 6, 14): ADC Power Ground. AIN1+ (Pin 4): Channel 1 Positive Differential Analog Input. AIN1- (Pin 5): Channel 1 Negative Differential Analog Input. REFH (Pins 7, 9): ADC High Reference. See the Applications Information section for recommended bypassing circuits for REFH and REFL. REFL (Pins 8, 10): ADC Low Reference. See the Applications Information section for recommended bypassing circuits for REFH and REFL. PAR/SER (Pin 11): Programming Mode Selection Pin. Connect to ground to enable the serial programming mode. CS, SCK, SDI, SDO become a serial interface that control the A/D operating modes. Connect to VDD to enable the parallel programming mode where CS, SCK, SDI, SDO become parallel logic inputs that control a reduced set of the A/D operating modes. PAR/SER should be connected directly to ground or VDD and not be driven by a logic signal. AIN2+ (Pin 12): Channel 2 Positive Differential Analog Input. AIN2- (Pin 13): Channel 2 Negative Differential Analog Input. VCM2 (Pin 15): Common Mode Bias Output, Nominally Equal to VDD/2. VCM2 should be used to bias the common mode of the analog inputs to channel 2. Bypass to ground with a 0.1F ceramic capacitor. ENC+ (Pin 18): Encode Input. Conversion starts on the rising edge. ENC- (Pin 19): Encode Complement Input. Conversion starts on the falling edge. Tie to GND for single-ended encode mode. CS (Pin 20): In Serial Programming Mode, (PAR/SER = 0V), CS Is the Serial Interface Chip Select Input. When CS is low, SCK is enabled for shifting data on SDI into the mode control registers. In the parallel programming mode (PAR/SER = VDD), CS controls the clock duty cycle stabilizer (See Table 2). CS can be driven with 1.8V to 3.3V logic. SCK (Pin 21): In Serial Programming Mode, (PAR/SER = 0V), SCK Is the Serial Interface Clock Input. In the parallel programming mode (PAR/SER = VDD), SCK controls the digital output mode (see Table 2). SCK can be driven with 1.8V to 3.3V logic. SDI (Pin 22): In Serial Programming Mode, (PAR/SER = 0V), SDI Is the Serial Interface Data Input. Data on SDI is clocked into the mode control registers on the rising edge of SCK. In the parallel programming mode (PAR/SER = VDD), SDI can be used together with SDO to power down the part (see Table 2). SDI can be driven with 1.8V to 3.3V logic. OGND (Pin 41): Output Driver Ground. Must be shorted to the ground plane by a very low inductance path. Use multiple vias close to the pin. OVDD (Pin 42): Output Driver Supply. Bypass to ground with a 0.1F ceramic capacitor. SDO (Pin 61): In Serial Programming Mode, (PAR/SER = 0V), SDO Is the Optional Serial Interface Data Output. Data on SDO is read back from the mode control registers and can be latched on the falling edge of SCK. SDO is an open-drain NMOS output that requires an external 2k pull-up resistor to 1.8V - 3.3V. If read back from the mode control registers is not needed, the pull-up resistor is not necessary and SDO can be left unconnected. In the parallel programming mode (PAR/SER = VDD), SDO can be used together with SDI to power down the part (see Table 2). When used as an input, SDO can be driven with 1.8V to 3.3V logic through a 1k series resistor. VREF (Pin 62): Reference Voltage Output. Bypass to ground with a 2.2F ceramic capacitor. The output voltage is nominally 1.25V. 21454312fa 14 LTC2145-12/ LTC2144-12/LTC2143-12 PIN FUNCTIONS SENSE (Pin 63): Reference Programming Pin. Connecting SENSE to VDD selects the internal reference and a 1V input range. Connecting SENSE to ground selects the internal reference and a 0.5V input range. An external reference between 0.625V and 1.3V applied to SENSE selects an input range of 0.8 * VSENSE. Ground (Exposed Pad Pin 65): The exposed pad must be soldered to the PCB ground. DNC* (Pins 23, 24, 25, 26, 43, 44, 45, 46): These pins are shorted to GND inside the package. For most applications they should be left unconnected. For pin compatibility with the 14-bit LTC2145-14 or the 16-bit LTC2185 they can be connected as digital outputs to make the bus width 14 or 16 bits. FULL RATE CMOS OUTPUT MODE All Pins Below Have CMOS Output Levels (OGND to OVDD) D2_0 to D2_11 (Pins 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38): Channel 2 Digital Outputs. D2_11 is the MSB. CLKOUT- (Pin 39): Inverted Version of CLKOUT+. CLKOUT+ (Pin 40): Data Output Clock. The digital outputs normally transition at the same time as the falling edge of CLKOUT+. The phase of CLKOUT+ can also be delayed relative to the Digital Outputs by programming the mode control registers. D1_0 to D1_11 (Pins 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58): Channel 1 Digital Outputs. D1_11 is the MSB. OF2 (Pin 59): Channel 2 Over/Underflow Digital Output. OF2 is high when an overflow or underflow has occurred. OF1 (Pin 60): Channel 1 Over/Underflow Digital Output. OF1 is high when an overflow or underflow has occurred. DOUBLE DATA RATE CMOS OUTPUT MODE All Pins Below Have CMOS Output Levels (OGND to OVDD) D2_0_1 to D2_10_11 (Pins 28, 30, 32, 34, 36, 38): Channel 2 Double Data Rate Digital Outputs. Two data bits are multiplexed onto each output pin. The even data bits (D0, D2, D4, D6, D8, D10) appear when CLKOUT+ is low. The odd data bits (D1, D3, D5, D7, D9, D11) appear when CLKOUT+ is high. DNC (Pins 27, 29, 31, 33, 35, 37, 47, 49, 51, 53, 55, 57, 59): Do not connect these pins. CLKOUT- (Pin 39): Inverted Version of CLKOUT+. CLKOUT+ (Pin 40): Data Output Clock. The Digital Outputs normally transition at the same time as the falling and rising edges of CLKOUT+. The phase of CLKOUT+ can also be delayed relative to the Digital Outputs by programming the mode control registers. D1_0_1 to D1_10_11 (Pins 48, 50, 52, 54, 56, 58): Channel 1 Double Data Rate Digital Outputs. Two data bits are multiplexed onto each output pin. The even data bits (D0, D2, D4, D6, D8, D10) appear when CLKOUT+ is low. The odd data bits (D1, D3, D5, D7, D9, D11) appear when CLKOUT+ is high. OF2_1 (Pin 60): Over/Underflow Digital Output. OF2_1 is high when an overflow or underflow has occurred. The over/under flow for both channels are multiplexed onto this pin. Channel 2 appears when CLKOUT+ is low, and Channel 1 appears when CLKOUT+ is high. DOUBLE DATA RATE LVDS OUTPUT MODE All Pins Below Have LVDS Output Levels. The Output Current Level Is Programmable. There Is an Optional Internal 100 Termination Resistor Between the Pins of Each LVDS Output Pair. D2_0_1-/D2_0_1+ to D2_10_11-/D2_10_11+ (Pins 27/28, 29/30, 31/32, 33/34, 35/36, 37/38): Channel 2 Double Data Rate Digital Outputs. Two data bits are multiplexed onto each differential output pair. The even data bits (D0, D2, D4, D6, D8, D10) appear when CLKOUT+ is low. The odd data bits (D1, D3, D5, D7, D9, D11) appear when CLKOUT+ is high. CLKOUT-/CLKOUT+ (Pins 39/40): Data Output Clock. The digital outputs normally transition at the same time as the falling and rising edges of CLKOUT+. The phase of CLKOUT+ can also be delayed relative to the digital outputs by programming the mode control registers. 21454312fa 15 LTC2145-12/ LTC2144-12/LTC2143-12 PIN FUNCTIONS D1_0_1-/D1_0_1+ to D1_10_11-/D1_10_11+ (Pins 47/48, 49/50, 51/52, 53/54, 55/56, 57/58): Channel 1 Double Data Rate Digital Outputs. Two data bits are multiplexed onto each differential output pair. The even data bits (D0, D2, D4, D6, D8, D10) appear when CLKOUT+ is low. The odd data bits (D1, D3, D5, D7, D9, D11) appear when CLKOUT+ is high. OF2_1-/OF2_1+ (Pins 59/60): Over/Underflow Digital Output. OF2_1+ is high when an overflow or underflow has occurred. The over/under flow for both channels are multiplexed onto this pin. Channel 2 appears when CLKOUT+ is low, and Channel 1 appears when CLKOUT+ is high. FUNCTIONAL BLOCK DIAGRAM OVDD CH 1 ANALOG INPUT OF1 12-BIT ADC CORE S/H OF2 CORRECTION LOGIC CH 2 ANALOG INPUT D1_11 t t t D1_0 12-BIT ADC CORE S/H OUTPUT DRIVERS CLKOUT + CLKOUT - VREF 2.2F D2_11 t t t D2_0 1.25V REFERENCE RANGE SELECT OGND REFH SENSE VCM1 REFL INTERNAL CLOCK SIGNALS REF BUF VDD/2 0.1F VDD DIFF REF AMP CLOCK/DUTY CYCLE CONTROL MODE CONTROL REGISTERS VCM2 0.1F GND REFH REFL ENC+ PAR/SER CS SCK SDI SDO 21454312 F01 2.2F 0.1F ENC- 0.1F Figure 1. Functional Block Diagram 21454312fa 16 LTC2145-12/ LTC2144-12/LTC2143-12 TIMING DIAGRAMS Full Rate CMOS Output Mode Timing All Outputs Are Single-Ended and Have CMOS Levels tAP CH 1 ANALOG INPUT A+3 tAP CH 2 ANALOG INPUT A+4 A+2 A A+1 B+4 B+2 B B+3 tH B+1 tL ENC- ENC+ tD D1_0 - D1_11, OF1 A-6 A-5 A-4 A-3 A-2 D2_0 - D2_11, OF2 B-6 B-5 B-4 B-3 B-2 CLKOUT + CLKOUT - tC 21454312 TD01 21454312fa 17 LTC2145-12/ LTC2144-12/LTC2143-12 TIMING DIAGRAMS Double Data Rate CMOS Output Mode Timing All Outputs Are Single-Ended and Have CMOS Levels tAP CH 1 ANALOG INPUT A+3 tAP CH 2 ANALOG INPUT A+4 A+2 A A+1 B+4 B+2 B B+3 tH B+1 tL ENC- ENC+ tD tD BIT 0 A-6 BIT 1 A-6 BIT 0 A-5 BIT 1 A-5 BIT 0 A-4 BIT 1 A-4 BIT 0 A-3 BIT 1 A-3 BIT 0 A-2 D1_10_11 BIT 10 A-6 BIT 11 A-6 BIT 10 A-5 BIT 11 A-5 BIT 10 A-4 BIT 11 A-4 BIT 10 A-3 BIT 11 A-3 BIT 10 A-2 D2_0_1 BIT 0 B-6 BIT 1 B-6 BIT 0 B-5 BIT 1 B-5 BIT 0 B-4 BIT 1 B-4 BIT 0 B-3 BIT 1 B-3 BIT 0 B-2 BIT 10 B-6 BIT 11 B-6 BIT 10 B-5 BIT 11 B-5 BIT 10 B-4 BIT 11 B-4 BIT 10 B-3 BIT 11 B-3 BIT 10 B-2 OF B-6 OF A-6 OF B-5 OF A-5 OF B-4 OF A-4 OF B-3 OF A-3 OF B-2 D1_0_1 ** * ** * D2_10_11 OF2_1 CLKOUT+ CLKOUT - tC tC 21454312 TD02 21454312fa 18 LTC2145-12/ LTC2144-12/LTC2143-12 TIMING DIAGRAMS Double Data Rate LVDS Output Mode Timing All Outputs Are Differential and Have LVDS Levels tAP CH 1 ANALOG INPUT A+4 A+2 A A+3 tAP CH 2 ANALOG INPUT A+1 B+4 B+2 B B+3 tH B+1 tL ENC- ENC+ tD D1_0_1+ D1_0_1- tD BIT 0 A-6 BIT 1 A-6 BIT 0 A-5 BIT 1 A-5 BIT 0 A-4 BIT 1 A-4 BIT 0 A-3 BIT 1 A-3 BIT 0 A-2 BIT 10 A-6 BIT 11 A-6 BIT 10 A-5 BIT 11 A-5 BIT 10 A-4 BIT 11 A-4 BIT 10 A-3 BIT 11 A-3 BIT 10 A-2 BIT 0 B-6 BIT 1 B-6 BIT 0 B-5 BIT 1 B-5 BIT 0 B-4 BIT 1 B-4 BIT 0 B-3 BIT 1 B-3 BIT 0 B-2 BIT 10 B-6 BIT 11 B-6 BIT 10 B-5 BIT 11 B-5 BIT 10 B-4 BIT 11 B-4 BIT 10 B-3 BIT 11 B-3 BIT 10 B-2 OF B-6 OF A-6 OF B-5 OF A-5 OF B-4 OF A-4 OF B-3 OF A-3 OF B-2 ** * D1_10_11+ D1_10_11- D2_0_1+ D2_0_1- ** * D2_10_11+ D2_10_11- OF2_1+ OF2_1- tC tC CLKOUT+ CLKOUT - 21454312 TD03 SPI Port Timing (Readback Mode) tDS tS tDH tSCK tH CS SCK tDO SDI R/W A6 A5 A4 A3 A2 A1 A0 SDO XX D7 HIGH IMPEDANCE XX D6 XX D5 XX D4 XX D3 XX D2 XX XX D1 D0 SPI Port Timing (Write Mode) CS SCK SDI R/W SDO HIGH IMPEDANCE A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 21454312 TD04 21454312fa 19 LTC2145-12/ LTC2144-12/LTC2143-12 APPLICATIONS INFORMATION CONVERTER OPERATION The LTC2145-12/LTC2144-12/LTC2143-12 are low power, two-channel, 12-bit, 125Msps/105Msps/80Msps A/D converters that are powered by a single 1.8V supply. The analog inputs should be driven differentially. The encode input can be driven differentially, or single ended for lower power consumption. The digital outputs can be CMOS, double data rate CMOS (to halve the number of output lines), or double data rate LVDS (to reduce digital noise in the system.) Many additional features can be chosen by programming the mode control registers through a serial SPI port. The two channels are simultaneously sampled by a shared encode circuit (Figure 2). Single-Ended Input For applications less sensitive to harmonic distortion, the AIN+ input can be driven single-ended with a 1VP-P signal centered around VCM. The AIN- input should be connected to VCM and the VCM bypass capacitor should be increased to 2.2F. With a single-ended input the harmonic distortion and INL will degrade, but the noise and DNL will remain unchanged. INPUT DRIVE CIRCUITS ANALOG INPUT The analog inputs are differential CMOS sample-and-hold circuits (Figure 2). The inputs should be driven differentially around a common mode voltage set by the VCM1 or VCM2 output pins, which are nominally VDD/2. For the 2V input range, the inputs should swing from VCM - 0.5V to VCM + 0.5V. There should be 180 phase difference between the inputs. AIN RON 15 10 CSAMPLE 5pF CPARASITIC 1.8pF VDD RON 15 10 AIN- If possible, there should be an RC lowpass filter right at the analog inputs. This lowpass filter isolates the drive circuitry from the A/D sample-and-hold switching, and also limits wideband noise from the drive circuitry. Figure 3 shows an example of an input RC filter. The RC component values should be chosen based on the application's input frequency. Transformer Coupled Circuits LTC2145-12 VDD + Input Filtering CSAMPLE 5pF CPARASITIC 1.8pF Figure 3 shows the analog input being driven by an RF transformer with a center-tapped secondary. The center tap is biased with VCM, setting the A/D input at its optimal DC level. At higher input frequencies a transmission line balun transformer (Figure 4 to Figure 6) has better balance, resulting in lower A/D distortion. VDD 50 VCM 0.1F 0.1F 1.2V ANALOG INPUT 10k T1 1:1 25 25 AIN+ LTC2145-12 0.1F ENC+ 12pF 25 ENC- 10k 25 T1: MA/COM MABAES0060 RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE 1.2V AIN- 21454312 F03 21454312 F02 Figure 2. Equivalent Input Circuit. Only One of the Two Analog Channels Is Shown Figure 3. Analog Input Circuit Using a Transformer. Recommended for Input Frequencies from 5MHz to 70MHz 21454312fa 20 LTC2145-12/ LTC2144-12/LTC2143-12 APPLICATIONS INFORMATION Amplifier Circuits Reference Figure 7 shows the analog input being driven by a high speed differential amplifier. The output of the amplifier is ACcoupled to the A/D so the amplifier's output common mode voltage can be optimally set to minimize distortion. The LTC2145-12/LTC2144-12/LTC2143-12 has an internal 1.25V voltage reference. For a 2V input range using the internal reference, connect SENSE to VDD. For a 1V input range using the internal reference, connect SENSE to ground. For a 2V input range with an external reference, apply a 1.25V reference voltage to SENSE (Figure 9). At very high frequencies an RF gain block will often have lower distortion than a differential amplifier. If the gain block is single-ended, then a transformer circuit (Figure 4 to Figure 6) should convert the signal to differential before driving the A/D. 50 VCM 0.1F 0.1F ANALOG INPUT 12 T2 T1 25 AIN+ LTC2145-12 0.1F The input range can be adjusted by applying a voltage to SENSE that is between 0.625V and 1.30V. The input range will then be 1.6 * VSENSE. The VREF, REFH and REFL pins should be bypassed as shown in Figure 8. A low inductance 2.2F interdigitated capacitor is recommended for the bypass between REFH and REFL. This type of capacitor is available at a low cost from multiple suppliers. 8.2pF 0.1F 25 12 AIN- 50 VCM 0.1F 21454312 F04 T1: MA/COM MABA-007159-000000 T2: COILCRAFT WBC1-1TL RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE 0.1F 4.7nH ANALOG INPUT T1 25 LTC2145-12 0.1F 25 0.1F Figure 4. Recommended Front-End Circuit for Input Frequencies from 5MHz to 150MHz AIN+ 4.7nH AIN- T1: MA/COM ETC1-1-13 RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE 50 VCM Figure 6. Recommended Front-End Circuit for Input Frequencies Above 250MHz 0.1F 0.1F ANALOG INPUT AIN+ T2 T1 21454312 F06 25 LTC2145-12 0.1F 1.8pF 0.1F 25 VCM AIN- HIGH SPEED DIFFERENTIAL 0.1F AMPLIFIER 200 200 25 21454312 F05 T1: MA/COM MABA-007159-000000 T2: COILCRAFT WBC1-1TL RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE Figure 5. Recommended Front-End Circuit for Input Frequencies from 150MHz to 250MHz ANALOG INPUT + + - - 0.1F AIN+ 12pF 0.1F 25 LTC2145-12 AIN- 12pF 21454312 F07 Figure 7. Front-End Circuit Using a High Speed Differential Amplifier 21454312fa 21 LTC2145-12/ LTC2144-12/LTC2143-12 APPLICATIONS INFORMATION in some vendors' capacitors. In Figure 8d the REFH and REFL pins are connected by short jumpers in an internal layer. To minimize the inductance of these jumpers they can be placed in a small hole in the GND plane on the second board layer. LTC2145-12 VREF 1.25V 5 1.25V BANDGAP REFERENCE 2.2F 0.625V TIE TO VDD FOR 2V RANGE; TIE TO GND FOR 1V RANGE; 3"/(&t7SENSE FOR 0.625V < VSENSE < 1.300V RANGE DETECT AND CONTROL SENSE BUFFER INTERNAL ADC HIGH REFERENCE C2 0.1F - + + - REFH Figure 8c. Recommended Layout for the REFH/REFL Bypass Circuit in Figure 8a REFL 0.8x DIFF AMP C1 C3 0.1F - + + - REFH REFL INTERNAL ADC LOW REFERENCE C1: 2.2F LOW INDUCTANCE INTERDIGITATED CAPACITOR TDK CLLE1AX7S0G225M MURATA LLA219C70G225M AVX W2L14Z225M OR EQUIVALENT 21454312 F08a Figure 8d. Recommended Layout for the REFH/REFL Bypass Circuit in Figure 8b Figure 8a. Reference Circuit Alternatively, C1 can be replaced by a standard 2.2F capacitor between REFH and REFL (see Figure 8b). The capacitors should be as close to the pins as possible (not on the back side of the circuit board). VREF 2.2F LTC2145-12 1.25V EXTERNAL REFERENCE SENSE 1F 21454312 F09 Figure 8c and Figure 8d show the recommended circuit board layout for the REFH/REFL bypass capacitors. Note that in Figure 8c, every pin of the interdigitated capacitor (C1) is connected since the pins are not internally connected REFH C3 0.1F LTC2145-12 REFL C1 2.2F C2 0.1F REFH REFL 21454312 F08b CAPACITORS ARE 0402 PACKAGE SIZE Figure 8b. Alternative REFH/REFL Bypass Circuit Figure 9. Using an External 1.25V Reference Encode Input The signal quality of the encode inputs strongly affects the A/D noise performance. The encode inputs should be treated as analog signals - do not route them next to digital traces on the circuit board. There are two modes of operation for the encode inputs: the differential encode mode (Figure 10), and the single-ended encode mode (Figure 11). The differential encode mode is recommended for sinusoidal, PECL, or LVDS encode inputs (Figure 12 and Figure 13). The encode inputs are internally biased to 1.2V 21454312fa 22 LTC2145-12/ LTC2144-12/LTC2143-12 APPLICATIONS INFORMATION LTC2145-12 through 10k equivalent resistance. The encode inputs can be taken above VDD (up to 3.6V), and the common mode range is from 1.1V to 1.6V. In the differential encode mode, ENC- should stay at least 200mV above ground to avoid falsely triggering the single ended encode mode. For good jitter performance ENC+ and ENC- should have fast rise and fall times. VDD DIFFERENTIAL COMPARATOR VDD 15k ENC+ ENC- The single-ended encode mode should be used with CMOS encode inputs. To select this mode, ENC- is connected to ground and ENC+ is driven with a square wave encode input. ENC+ can be taken above VDD (up to 3.6V) so 1.8V to 3.3V CMOS logic levels can be used. The ENC+ threshold is 0.9V. For good jitter performance ENC+ should have fast rise and fall times. If the encode signal is turned off or drops below approximately 500kHz, the A/D enters nap mode. 30k 21454312 F10 Figure 10. Equivalent Encode Input Circuit for Differential Encode Mode LTC2145-12 ENC+ 1.8V TO 3.3V 0V ENC- 30k Clock Duty Cycle Stabilizer CMOS LOGIC BUFFER 21454312 F11 Figure 11. Equivalent Encode Input Circuit for Single-Ended Encode Mode 0.1F ENC+ T1 50 100 LTC2145-12 50 0.1F 0.1F ENC- 21454312 F12 T1 = MA/COM ETC1-1-13 RESISTORS AND CAPACITORS ARE 0402 PACKAGE SIZE For good performance the encode signal should have a 50% (5%) duty cycle. If the optional clock duty cycle stabilizer circuit is enabled, the encode duty cycle can vary from 30% to 70% and the duty cycle stabilizer will maintain a constant 50% internal duty cycle. If the encode signal changes frequency, the duty cycle stabilizer circuit requires one hundred clock cycles to lock onto the input clock. The duty cycle stabilizer is enabled by mode control register A2 (serial programming mode), or by CS (parallel programming mode). For applications where the sample rate needs to be changed quickly, the clock duty cycle stabilizer can be disabled. If the duty cycle stabilizer is disabled, care should be taken to make the sampling clock have a 50% (5%) duty cycle. The duty cycle stabilizer should not be used below 5Msps. Figure 12. Sinusoidal Encode Drive DIGITAL OUTPUTS 0.1F PECL OR LVDS CLOCK Digital Output Modes ENC+ LTC2145-12 0.1F ENC- 21454312 F13 The LTC2145-12/LTC2144-12/LTC2143-12 can operate in three digital output modes: full rate CMOS, double data rate CMOS (to halve the number of output lines), or double data rate LVDS (to reduce digital noise in the system.) The output mode is set by mode control register A3 (serial Figure 13. PECL or LVDS Encode Drive 21454312fa 23 LTC2145-12/ LTC2144-12/LTC2143-12 APPLICATIONS INFORMATION programming mode), or by SCK (parallel programming mode). Note that double data rate CMOS cannot be selected in the parallel programming mode. Full Rate CMOS Mode In full rate CMOS mode the data outputs (D1_0 to D1_11 and D2_0 to D2_11), overflow (OF2, OF1), and the data output clocks (CLKOUT+, CLKOUT-) have CMOS output levels. The outputs are powered by OVDD and OGND which are isolated from the A/D core power and ground. OVDD can range from 1.1V to 1.9V, allowing 1.2V through 1.8V CMOS logic outputs. For good performance the digital outputs should drive minimal capacitive loads. If the load capacitance is larger than 10pF a digital buffer should be used. Double Data Rate CMOS Mode In double data rate CMOS mode, two data bits are multiplexed and output on each data pin. This reduces the number of digital lines by thirteen, simplifying board routing and reducing the number of input pins needed to receive the data. The data outputs (D1_0_1, D1_2_3, D1_4_5, D1_6_7, D1_8_9, D1_10_11, D2_0_1, D2_2_3, D2_4_5, D2_6_7, D2_8_9, D2_10_11, overflow (OF2_1), and the data output clocks (CLKOUT+, CLKOUT-) have CMOS output levels. The outputs are powered by OVDD and OGND which are isolated from the A/D core power and ground. OVDD can range from 1.1V to 1.9V, allowing 1.2V through 1.8V CMOS logic outputs. Note that the overflow for both ADC channels is multiplexed onto the OF2_1 pin. For good performance the digital outputs should drive minimal capacitive loads. If the load capacitance is larger than 10pF a digital buffer should be used. When using double data rate CMOS at sample rates above 100Msps the SNR may degrade slightly, about 0.1dB to 0.3dB depending on load capacitance and board layout. Double Data Rate LVDS Mode In double data rate LVDS mode, two data bits are multiplexed and output on each differential output pair. There are six LVDS output pairs per ADC channel (D1_0_1+/D1_0_1- through D1_10_11+/D1_10_11- and D2_0_1+/D2_0_1- through D2_10_11+/D2_10_11-) for the digital output data. Overflow (OF2_1+/OF2_1-) and the data output clock (CLKOUT+/CLKOUT-) each have an LVDS output pair. Note that the overflow for both ADC channels is multiplexed onto the OF2_1+/OF2_1- output pair. By default the outputs are standard LVDS levels: 3.5mA output current and a 1.25V output common mode voltage. An external 100 differential termination resistor is required for each LVDS output pair. The termination resistors should be located as close as possible to the LVDS receiver. The outputs are powered by OVDD and OGND which are isolated from the A/D core power and ground. In LVDS mode, OVDD must be 1.8V. Programmable LVDS Output Current In LVDS mode, the default output driver current is 3.5mA. This current can be adjusted by serially programming mode control register A3. Available current levels are 1.75mA, 2.1mA, 2.5mA, 3mA, 3.5mA, 4mA and 4.5mA. Optional LVDS Driver Internal Termination In most cases using just an external 100 termination resistor will give excellent LVDS signal integrity. In addition, an optional internal 100 termination resistor can be enabled by serially programming mode control register A3. The internal termination helps absorb any reflections caused by imperfect termination at the receiver. When the internal termination is enabled, the output driver current is doubled to maintain the same output voltage swing. Overflow Bit The overflow output bit outputs a logic high when the analog input is either overranged or underranged. The overflow bit has the same pipeline latency as the data bits. In full rate CMOS mode each ADC channel has its own overflow pin (OF1 for channel 1, OF2 for channel 2). In DDR CMOS or DDR LVDS mode the overflow for both ADC channels is multiplexed onto the OF2_1 output. 21454312fa 24 LTC2145-12/ LTC2144-12/LTC2143-12 APPLICATIONS INFORMATION Phase Shifting the Output Clock DATA FORMAT In full rate CMOS mode the data output bits normally change at the same time as the falling edge of CLKOUT+, so the rising edge of CLKOUT+ can be used to latch the output data. In double data rate CMOS and LVDS modes the data output bits normally change at the same time as the falling and rising edges of CLKOUT+. To allow adequate set-up and hold time when latching the data, the CLKOUT+ signal may need to be phase shifted relative to the data output bits. Most FPGAs have this feature; this is generally the best place to adjust the timing. Table 1 shows the relationship between the analog input voltage, the digital data output bits and the overflow bit. By default the output data format is offset binary. The 2's complement format can be selected by serially programming mode control register A4. The LTC2145-12/LTC2144-12/LTC2143-12 can also phase shift the CLKOUT+/CLKOUT- signals by serially programming mode control register A2. The output clock can be shifted by 0, 45, 90, or 135. To use the phase shifting feature the clock duty cycle stabilizer must be turned on. Another control register bit can invert the polarity of CLKOUT+ and CLKOUT-, independently of the phase shift. The combination of these two features enables phase shifts of 45 up to 315 (Figure 14). Table 1. Output Codes vs Input Voltage AIN+ - AIN- (2V RANGE) OF D11-D0 (OFFSET BINARY) D11-D0 (2's COMPLEMENT) >+1.000000V 1 1111 1111 1111 0111 1111 1111 +0.999512V 0 1111 1111 1111 0111 1111 1111 +0.999024V 0 1111 1111 1110 0111 1111 1110 +0.000488V 0 1000 0000 0001 0000 0000 0001 0.000000V 0 1000 0000 0000 0000 0000 0000 -0.000488V 0 0111 1111 1111 1111 1111 1111 -0.000976V 0 0111 1111 1110 1111 1111 1110 -0.999512V 0 0000 0000 0001 1000 0000 0001 -1.000000V 0 0000 0000 0000 1000 0000 0000 -1.000000V 1 0000 0000 0000 1000 0000 0000 ENC+ D0-D11, OF MODE CONTROL BITS PHASE SHIFT CLKINV CLKPHASE1 CLKPHASE0 0 0 0 0 45 0 0 1 90 0 1 0 135 0 1 1 180 1 0 0 225 1 0 1 270 1 1 0 315 1 1 1 CLKOUT+ 21454312 F14 Figure 14. Phase Shifting CLKOUT 21454312fa 25 LTC2145-12/ LTC2144-12/LTC2143-12 APPLICATIONS INFORMATION Digital Output Randomizer CLKOUT Interference from the A/D digital outputs is sometimes unavoidable. Digital interference may be from capacitive or inductive coupling or coupling through the ground plane. Even a tiny coupling factor can cause unwanted tones in the ADC output spectrum. By randomizing the digital output before it is transmitted off chip, these unwanted tones can be randomized which reduces the unwanted tone amplitude. The digital output is randomized by applying an exclusiveOR logic operation between the LSB and all other data output bits. To decode, the reverse operation is applied; an exclusive-OR operation is applied between the LSB and all other bits. The LSB, OF and CLKOUT outputs are not affected. The output randomizer is enabled by serially programming mode control register A4. Alternate Bit Polarity Another feature that reduces digital feedback on the circuit board is the alternate bit polarity mode. When this mode is enabled, all of the odd bits (D1, D3, D5, D7, D9, D11) are inverted before the output buffers. The even bits (D0, D2, D4, D6, D8, D10), OF and CLKOUT are not affected. This can reduce digital currents in the circuit board ground plane and reduce digital noise, particularly for very small analog input signals. When there is a very small signal at the input of the A/D that is centered around mid-scale, the digital outputs toggle between mostly 1's and mostly 0's. This simultaneous switching of most of the bits will cause large currents in the ground plane. By inverting every other bit, the alternate bit polarity mode makes half of the bits transition high while half of the bits transition low. This cancels current flow in the ground plane, reducing the digital noise. The digital output is decoded at the receiver by inverting the odd bits (D1, D3, D5, D7, D9, D11). The alternate bit polarity mode is independent of the digital output randomizer - either, both or neither function can be on at the same time. The alternate bit polarity mode is enabled by serially programming mode control register A4. CLKOUT OF OF D11 D11/D0 D10 D2 D10/D0 * * * D2/D0 RANDOMIZER ON D1 D1/D0 D0 D0 21454312 F15 Figure 15. Functional Equivalent of Digital Output Randomizer PC BOARD CLKOUT FPGA OF D11/D0 D11 D10/D0 LTC2145-12 D10 D2/D0 t t t D2 D1/D0 D1 D0 D0 21454312 F16 Figure 16. Unrandomizing a Randomized Digital Output Signal 21454312fa 26 LTC2145-12/ LTC2144-12/LTC2143-12 APPLICATIONS INFORMATION Digital Output Test Patterns To allow in-circuit testing of the digital interface to the A/D, there are several test modes that force the A/D data outputs (OF, D11-D0) to known values: All 1s: All outputs are 1 All 0s: All outputs are 0 Alternating: Outputs change from all 1s to all 0s on alternating samples. Checkerboard: Outputs change from 1010101010101 to 0101010101010 on alternating samples. The digital output test patterns are enabled by serially programming mode control register A4. When enabled, the Test Patterns override all other formatting modes: 2's complement, randomizer, alternate bit polarity. Output Disable The digital outputs may be disabled by serially programming mode control register A3. All digital outputs including OF and CLKOUT are disabled. The high-impedance disabled state is intended for in-circuit testing or long periods of inactivity - it is too slow to multiplex a data bus between multiple converters at full speed. When the outputs are disabled both channels should be put into either sleep or nap mode. Sleep and Nap Modes The A/D may be placed in sleep or nap modes to conserve power. In sleep mode the entire device is powered down, resulting in 1mW power consumption. The amount of time required to recover from sleep mode depends on the size of the bypass capacitors on VREF, REFH, and REFL. For the suggested values in Fig. 8, the A/D will stabilize after 2ms. In nap mode the A/D core is powered down while the internal reference circuits stay active, allowing faster wakeup than from sleep mode. Recovering from nap mode requires at least 100 clock cycles. If the application demands very accurate DC settling then an additional 50s should be allowed so the on-chip references can settle from the slight temperature shift caused by the change in supply current as the A/D leaves nap mode. Either channel 2 or both channels can be placed in nap mode; it is not possible to have channel 1 in nap mode and channel 2 operating normally. Sleep mode and nap mode are enabled by mode control register A1 (serial programming mode), or by SDI and SDO (parallel programming mode). DEVICE PROGRAMMING MODES The operating modes of the LTC2145-12/LTC2144-12/ LTC2143-12 can be programmed by either a parallel interface or a simple serial interface. The serial interface has more flexibility and can program all available modes. The parallel interface is more limited and can only program some of the more commonly used modes. Parallel Programming Mode To use the parallel programming mode, PAR/SER should be tied to VDD. The CS, SCK, SDI and SDO pins are binary logic inputs that set certain operating modes. These pins can be tied to VDD or ground, or driven by 1.8V, 2.5V, or 3.3V CMOS logic. When used as an input, SDO should be driven through a 1k series resistor. Table 2 shows the modes set by CS, SCK, SDI and SDO. Table 2. Parallel Programming Mode Control Bits (PAR/SER = VDD) PIN DESCRIPTION CS Clock Duty Cycle Stabilizer Control Bit 0 = Clock Duty Cycle Stabilizer Off 1 = Clock Duty Cycle Stabilizer On SCK Digital Output Mode Control Bit 0 = Full Rate CMOS Output Mode 1 = Double Data Rate LVDS Output Mode (3.5mA LVDS Current, Internal Termination Off) SDI/SDO Power Down Control Bit 00 = Normal Operation 01 = Channel 1 in Normal Operation, Channel 2 in Nap Mode 10 = Channel 1 and Channel 2 in Nap Mode 11 = Sleep Mode (Entire Device Powered Down) 21454312fa 27 LTC2145-12/ LTC2144-12/LTC2143-12 APPLICATIONS INFORMATION Serial Programming Mode GROUNDING AND BYPASSING To use the serial programming mode, PAR/SER should be tied to ground. The CS, SCK, SDI and SDO pins become a serial interface that program the A/D mode control registers. Data is written to a register with a 16-bit serial word. Data can also be read back from a register to verify its contents. The LTC2145-12/LTC2144-12/LTC2143-12 requires a printed circuit board with a clean unbroken ground plane. A multilayer board with an internal ground plane in the first layer beneath the ADC is recommended. Layout for the printed circuit board should ensure that digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track or underneath the ADC. Serial data transfer starts when CS is taken low. The data on the SDI pin is latched at the first 16 rising edges of SCK. Any SCK rising edges after the first 16 are ignored. The data transfer ends when CS is taken high again. The first bit of the 16-bit input word is the R/W bit. The next seven bits are the address of the register (A6:A0). The final eight bits are the register data (D7:D0). If the R/W bit is low, the serial data (D7:D0) will be written to the register set by the address bits (A6:A0). If the R/W bit is high, data in the register set by the address bits (A6:A0) will be read back on the SDO pin (see the timing diagrams). During a read back command the register is not updated and data on SDI is ignored. The SDO pin is an open drain output that pulls to ground with a 200 impedance. If register data is read back through SDO, an external 2k pull-up resistor is required. If serial data is only written and read back is not needed, then SDO can be left floating and no pull-up resistor is needed. Table 3 shows a map of the mode control registers. Software Reset If serial programming is used, the mode control registers should be programmed as soon as possible after the power supplies turn on and are stable. The first serial command must be a software reset which will reset all register data bits to logic 0. To perform a software reset, bit D7 in the reset register is written with a logic 1. After the reset SPI write command is complete, bit D7 is automatically set back to zero. High quality ceramic bypass capacitors should be used at the VDD, OVDD, VCM, VREF, REFH and REFL pins. Bypass capacitors must be located as close to the pins as possible. Size 0402 ceramic capacitors are recommended. The traces connecting the pins and bypass capacitors must be kept short and should be made as wide as possible. Of particular importance is the capacitor between REFH and REFL. This capacitor should be on the same side of the circuit board as the A/D, and as close to the device as possible. The analog inputs, encode signals, and digital outputs should not be routed next to each other. Ground fill and grounded vias should be used as barriers to isolate these signals from each other. HEAT TRANSFER Most of the heat generated by the LTC2145-12/LTC2144-12/ LTC2143-12 is transferred from the die through the bottomside exposed pad and package leads onto the printed circuit board. For good electrical and thermal performance, the exposed pad must be soldered to a large grounded pad on the PC board. This pad should be connected to the internal ground planes by an array of vias. 21454312fa 28 LTC2145-12/ LTC2144-12/LTC2143-12 APPLICATIONS INFORMATION Table 3. Serial Programming Mode Register Map (PAR/SER = GND) REGISTER A0: RESET REGISTER (ADDRESS 00h) D7 D6 D5 D4 D3 D2 D1 D0 RESET X X X X X X X Bit 7 RESET Software Reset Bit 0 = Not Used 1 = Software Reset. All Mode Control Registers Are Reset to 00h. The ADC Is Momentarily Placed in SLEEP Mode. This Bit Is Automatically Set Back to Zero at the End of the SPI write command. The Reset Register Is Write-only. Data Read Back from the Reset Register Will Be Random. Bits 6-0 Unused, Don't Care Bits. REGISTER A1: POWER-DOWN REGISTER (ADDRESS 01h) D7 D6 D5 D4 D3 D2 D1 D0 X X X X X X PWROFF1 PWROFF0 Bits 7-2 Unused, Don't Care Bits. Bits 1-0 PWROFF1:PWROFF0 Power Down Control Bits 00 = Normal Operation 01 = Channel 1 in Normal Operation, Channel 2 in Nap Mode 10 = Channel 1 and Channel 2 in Nap Mode 11 = Sleep Mode REGISTER A2: TIMING REGISTER (ADDRESS 02h) D7 D6 D5 D4 D3 D2 D1 D0 X X X X CLKINV CLKPHASE1 CLKPHASE0 DCS Bits 7-4 Unused, Don't Care Bits. Bit 3 CLKINV Output Clock Invert Bit 0 = Normal CLKOUT Polarity (As Shown in the Timing Diagrams) 1 = Inverted CLKOUT Polarity Bits 2-1 CLKPHASE1:CLKPHASE0 Output Clock Phase Delay Bits 00 = No CLKOUT Delay (As Shown in the Timing Diagrams) 01 = CLKOUT+/CLKOUT- Delayed by 45 (Clock Period * 1/8) 10 = CLKOUT+/CLKOUT- Delayed by 90 (Clock Period * 1/4) 11 = CLKOUT+/CLKOUT- Delayed by 135 (Clock Period * 3/8) Note: If the CLKOUT Phase Delay Feature Is Used, the Clock Duty Cycle Stabilizer Must Also Be Turned On Bit 0 DCS Clock Duty Cycle Stabilizer Bit 0 = Clock Duty Cycle Stabilizer Off 1 = Clock Duty Cycle Stabilizer On 21454312fa 29 LTC2145-12/ LTC2144-12/LTC2143-12 APPLICATIONS INFORMATION REGISTER A3: OUTPUT MODE REGISTER (ADDRESS 03h) D7 D6 D5 D4 D3 D2 D1 D0 X ILVDS2 ILVDS1 ILVDS0 TERMON OUTOFF OUTMODE1 OUTMODE0 Bit 7 Unused, Don't Care Bit. Bits 6-4 ILVDS2:ILVDS0 LVDS Output Current Bits 000 = 3.5mA LVDS Output Driver Current 001 = 4.0mA LVDS Output Driver Current 010 = 4.5mA LVDS Output Driver Current 011 = Not Used 100 = 3.0mA LVDS Output Driver Current 101 = 2.5mA LVDS Output Driver Current 110 = 2.1mA LVDS Output Driver Current 111 = 1.75mA LVDS Output Driver Current Bit 3 TERMON LVDS Internal Termination Bit 0 = Internal Termination Off 1 = Internal Termination On. LVDS Output Driver Current is 2x the Current Set by ILVDS2:ILVDS0 Bit 2 OUTOFF Output Disable Bit 0 = Digital Outputs Are Enabled 1 = Digital Outputs Are Disabled and Have High Output Impedance Note: If the Digital Outputs Are Disabled the Part Should Also Be Put in Sleep or Nap Mode (Both Channels). Bits 1-0 OUTMODE1:OUTMODE0 Digital Output Mode Control Bits 00 = Full Rate CMOS Output Mode 01 = Double Data Rate LVDS Output Mode 10 = Double Data Rate CMOS Output Mode 11 = Not Used REGISTER A4: DATA FORMAT REGISTER (ADDRESS 04h) D7 D6 D5 D4 D3 D2 D1 D0 X X OUTTEST2 OUTTEST1 OUTTEST0 ABP RAND TWOSCOMP Bit 7-6 Unused, Don't Care Bits. Bits 5-3 OUTTEST2:OUTTEST0 Digital Output Test Pattern Bits 000 = Digital Output Test Patterns Off 001 = All Digital Outputs = 0 011 = All Digital Outputs = 1 101 = Checkerboard Output Pattern. OF, D11-D0 Alternate Between 1 0101 0101 0101 and 0 1010 1010 1010 111 = Alternating Output Pattern. OF, D11-D0 Alternate Between 0 0000 0000 0000 and 1 1111 1111 1111 Note: Other Bit Combinations Are not Used Bit 2 ABP Alternate Bit Polarity Mode Control Bit 0 = Alternate Bit Polarity Mode Off 1 = Alternate Bit Polarity Mode On. Forces the Output Format to Be Offset Binary Bit 1 RAND Data Output Randomizer Mode Control Bit 0 = Data Output Randomizer Mode Off 1 = Data Output Randomizer Mode On Bit 0 TWOSCOMP Two's Complement Mode Control Bit 0 = Offset Binary Data Format 1 = Two's Complement Data Format 21454312fa 30 LTC2145-12/ LTC2144-12/LTC2143-12 TYPICAL APPLICATIONS Silkscreen Top Top Side 21454312fa 31 LTC2145-12/ LTC2144-12/LTC2143-12 TYPICAL APPLICATIONS Inner Layer 2 GND Inner Layer 3 21454312fa 32 LTC2145-12/ LTC2144-12/LTC2143-12 TYPICAL APPLICATIONS Inner Layer 4 Inner Layer 5 Power 21454312fa 33 LTC2145-12/ LTC2144-12/LTC2143-12 TYPICAL APPLICATIONS Bottom Side 21454312fa 34 LTC2145-12/ LTC2144-12/LTC2143-12 TYPICAL APPLICATIONS SDO C23 2.2F SENSE C17 1F 9 CN1 + - 11 12 13 14 15 16 60 59 58 57 56 55 54 53 52 51 50 49 OF2_1- D1_10_11+ D1_10_11- D1_8_9+ D1_8_9- D1_6_7+ D1_6_7- D1_4_5+ D1_4_5- D1_2_3+ D1_2_3- OF2_1 61 SDO 62 VREF REFH OVDD REFL OGND LTC2145-12 45 44 43 42 40 39 PAR/SER D2_10_11+ 38 + D2_10_11- 37 AIN2- D2_8_9+ 36 GND D2_8_9- 35 VCM2 D2_6_7+ 34 VDD D2_6_7- 33 AIN2 DNC D2_0_1 27 DNC DNC DNC 26 25 24 23 SCK CS SDI 22 21 ENC- 19 AIN2- 20 ENC+ VDD AIN2+ PAD C37 0.1F 41 CLKOUT- REFL DIGITAL OUTPUTS 46 CLKOUT+ REFH - PAR/SER DNC 17 C21 0.1F - + 10 GND D2_4_5+ 8 DNC 32 + - - + DNC AIN1- D2_4_5- 7 AIN1 18 C15 0.1F 6 DNC + 31 AIN1 GND D2_2_3+ 5 47 30 - AIN1 D1_0_1- D2_2_3- 4 VCM1 VDD 29 + 48 D2_0_1+ 3 D1_0_1+ 28 2 + 1 SENSE VDD 64 C19 C20 0.1F 0.1F 63 VDD OVDD DIGITAL OUTPUTS 65 VDD C67 0.1F C18 0.1F C78 0.1F C79 0.1F R51 100 ENCODE CLOCK SPI BUS 21454312 TA02 LTC2145-12 Schematic 21454312fa 35 LTC2145-12/ LTC2144-12/LTC2143-12 PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. UP Package 64-Lead Plastic QFN (9mm w 9mm) (Reference LTC DWG # 05-08-1705 Rev C) 0.70 0.05 7.15 0.05 7.50 REF 8.10 0.05 9.50 0.05 (4 SIDES) 7.15 0.05 PACKAGE OUTLINE 0.25 0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 9 .00 0.10 (4 SIDES) 0.75 0.05 R = 0.10 TYP R = 0.115 TYP 63 64 0.40 0.10 PIN 1 TOP MARK (SEE NOTE 5) 1 2 PIN 1 CHAMFER C = 0.35 7.15 0.10 7.50 REF (4-SIDES) 7.15 0.10 (UP64) QFN 0406 REV C 0.200 REF 0.00 - 0.05 NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5 2. ALL DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT 4. EXPOSED PAD SHALL BE SOLDER PLATED 5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 6. DRAWING NOT TO SCALE 0.25 0.05 0.50 BSC BOTTOM VIEW--EXPOSED PAD 21454312fa 36 LTC2145-12/ LTC2144-12/LTC2143-12 REVISION HISTORY REV DATE DESCRIPTION A 07/12 Corrected Channel 1 Data Bus (D1_*) Pin Description to state "Channel 1" PAGE NUMBER 16 21454312fa Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 37 LTC2145-12/ LTC2144-12/LTC2143-12 TYPICAL APPLICATION 1.8V 2-Tone FFT, fIN = 70MHz and 69MHz 1.8V VDD OVDD 0 -10 CH 2 ANALOG INPUT D1_11 t t t D1_0 12-BIT ADC CORE S/H 12-BIT ADC CORE S/H 125MHz D2_11 t t t D2_0 OUTPUT DRIVERS -30 CMOS, DDR CMOS OR DDR LVDS OUTPUTS -40 -50 -60 -70 -80 -90 -100 -110 -120 CLOCK CONTROL CLOCK -20 AMPLITUDE (dBFS) CH 1 ANALOG INPUT 0 10 20 30 40 FREQUENCY (MHz) 50 21854312 TA03 21454312 TA01a GND 60 OGND RELATED PARTS PART NUMBER DESCRIPTION COMMENTS 16-Bit, 125Msps/105Msps/80Msps 1.8V Dual ADCs 370mW/308mW/200mW, 76.8dB SNR, 90dB SFDR, DDR LVDS/DDR CMOS/CMOS Outputs, 9mm x 9mm QFN-64 ADCs LTC2185/LTC2184/ LTC2183 LTC2145-14/LTC2144-14/ 14-Bit, 125Msps/105Msps/80Msps 1.8V/ 190mW/160mW/120mW, 73dB SNR, 90dB SFDR, DDR LVDS/DDR CMOS/CMOS LTC2143-14 Dual ADCs Outputs, 9mm x 9mm QFN-64 LTC2259-14/LTC2260-14/ 14-Bit, 80Msps/105Msps/125Msps LTC2261-14 1.8V ADCs, Ultralow Power 89mW/106mW/127mW, 73.4dB SNR, 85dB SFDR, DDR LVDS/DDR CMOS/CMOS Outputs, 6mm x 6mm QFN-40 LTC2262-14 149mW, 72.8dB SNR, 88dB SFDR, DDR LVDS/DDR CMOS/CMOS Outputs, 6mm x 6mm QFN-40 14-Bit, 150Msps 1.8V ADC, Ultralow Power LTC2266-14/LTC2267-14/ 14-Bit, 80Msps/105Msps/125Msps LTC2268-14 1.8V Dual ADCs, Ultralow Power 216mW/250mW/293mW, 73.4dB SNR, 85dB SFDR, Serial LVDS Outputs, 6mm x 6mm QFN-40 LTC2266-12/LTC2267-12/ 12-Bit, 80Msps/105Msps/125Msps LTC2268-12 1.8V Dual ADCs, Ultralow Power 216mW/250mW/293mW, 70.5dB SNR, 85dB SFDR, Serial LVDS Outputs, 6mm x 6mm QFN-40 RF Mixers/Demodulators LTC5517 40MHz to 900MHz Direct Conversion Quadrature Demodulator High IIP3: 21dBm at 800MHz, Integrated LO Quadrature Generator LTC5557 400MHz to 3.8GHz High Linearity Downconverting Mixer 23.7dBm IIP3 at 2.6GHz, 23.5dBm IIP3 at 3.5GHz, NF = 13.2dB, 3.3V Supply Operation, Integrated Transformer LTC5575 800MHz to 2.7GHz Direct Conversion Quadrature Demodulator High IIP3: 28dBm at 900MHz, Integrated LO Quadrature Generator, Integrated RF and LO Transformer Amplifiers/Filters LTC6412 800MHz, 31dB Range, Analog-Controlled Continuously Adjustable Gain Control, 35dBm OIP3 at 240MHz, 10dB Noise Figure, Variable Gain Amplifier 4mm x 4mm QFN-24 LTC6605-7/LTC6605-10/ LTC6605-14 Dual Matched 7MHz/10MHz/14MHz Filters with ADC Drivers Dual Matched 2nd Order Lowpass Filters with Differential Drivers, Pin-Programmable Gain, 6mm x 3mm DFN-22 14-Bit Dual Channel IF/Baseband Receiver Subsystem Integrated High Speed ADC, Passive Filters and Fixed Gain Differential Amplifiers Signal Chain Receivers LTM9002 21454312fa 38 Linear Technology Corporation LT 0712 REV A * PRINTED IN USA 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 FAX: (408) 434-0507 www.linear.com (c) LINEAR TECHNOLOGY CORPORATION 2011