HFBR-0500ETZ Series
Versatile Link
The Versatile Fiber Optic Connection
Data Sheet
Features
 Extended temperature range -40 to +85° C
 RoHS-compliant
 Low cost  ber optic components
 Enhanced digital links: dc-5 MBd
 Link distance up to 43m at 1MBd and 20m at 5MBd
 Low current link: 6 mA peak supply current
 Horizontal and vertical mounting
 Interlocking feature
 High noise immunity
 Easy connectoring: simplex, duplex, and latching
connectors
 Flame retardant
 Transmitters incorporate a 660 nm red LED for easy
visibility
 Compatible with standard TTL circuitry
Applications
Industrial Drives/Frequency Inverters
Renewable Energies (Wind Turbines, Solar PV farms)
Power electronics
Reduction of lightning/volt age transient susceptibility
 Motor controller triggering
 Data communications and local area networks
 Electromagnetic Compatibility (EMC) for regulated
systems: FCC, VDE, CSA, etc.
 Tempest-secure data processing equipment
 Isolation in test and measurement instruments
 Error free signalling for industrial and manufactur ing
equipment
 Automotive communica tions and control networks
 Noise immune communica tion in audio and video
equipment
Description
The Versatile Link series is a complete family of  ber
optic link components for applications requiring a low
cost solution. The HFBR-0500ETZ series includes trans-
mitters, receivers, connec tors and cable speci ed for
easy design. This series of compo nents is ideal for
solving problems with voltage isolation/insula tion,
EMI/RFI immunity or data security. The optical link
design is simpli ed by the logic compat ible receivers
and complete speci -cations for each component. The
key optical and electrical parameters of links con gured
with the HFBR-0500ETZ family are fully guaranteed from
-40° to 85° C.
A wide variety of package con g u ra tions and connectors
provide the designer with numerous mechanical solutions
to meet application requirements. The transmitter and
receiver compo nents have been designed for use in high
volume/low cost assembly processes such as auto inser-
tion and wave soldering.
Transmitters incorporate a 660 nm LED. Receivers
include a monolithic dc coupled, digital IC receiver
with open collector Schottky output transistor. An
internal pullup resistor is avail able for use in the
HFBR-25X1ETZ and HFBR-25X2ETZ receivers. A shield has
been integrated into the receiver IC to provide additional,
localized noise immunity.
Internal optics have been optim ized for use with 1 mm
diameter plastic optical  ber. Versatile Link speci cations
incorporate all connector interface losses. Therefore,
optical calculations for common link applications are
simpli ed.
2
Available option – Horizontal Package
HFBR-x521ETZ HFBR-x522ETZ
Available option – Vertical Package
HFBR-x531ETZ HFBR-x532ETZ
Available option – 30° Tilted Package
HFBR-x541ETZ HFBR-x542ETZ
Link Selection Guide
(Links speci ed from -40° to 85° C, for plastic optical  ber unless speci ed.)
Signal Rate Distance (m) 25° C Distance (m) Transmitter Receiver
1 MBd 67 43 HFBR-15x2ETZ HFBR-25x2ETZ
5 Mbd 38 20 HFBR-15x1ETZ HFBR-25x1ETZ
HFBR-0500ETZ Series Part Number Guide
HFBR-X5XXETZ
1 = Transmitter
2 = Receiver ET = extended temperature range
Z = RoHS compliant
5 = 600 nm Transmitter and
Receiver Products
1 = 5 MBd High Performance Link
2 = 1 MBd High Performance Link
2 = Horizontal Package 6 = 155 MBd Receiver
3 = Vertical Package 7 = 155 MBd Transmitter
4 = 30° Tilted Package
3
VALOX is a registered trademark of the General Electric Corporation.
Application Literature
Application Note 1035 (Versatile Link)
Package and Handling Information
The compact Versatile Link pack age is made of a  ame
retardant VALOX® UL 94 V-0 material (UL  le # E121562)
and uses the same pad layout as a standard, eight pin
dual-in-line package. Vertical and horizontal mountable
parts are available. These low pro le Versa tile Link pack-
ages are stackable and are enclosed to provide a dust
resistant seal. Snap action simplex, simplex latching,
duplex, and duplex latching connectors are o ered with
simplex or duplex cables.
Package Orientation
Performance and pinouts for the vertical and hori-
zontal packages are identical. To provide addi tional
attachment support for the vertical Versatile Link
housing, the designer has the option of using a self-
tapping screw through a printed circuit board into a
mounting hole at the bottom of the package. For most
applications this is not necessary.
Package Housing Color
Versatile Link components and simplex connectors are
color coded to eliminate confusion when making connec-
tions. Receivers are blue and transmit ters are gray.
Handling
Versatile Link components are auto-insertable. When
wave soldering is performed with Versatile Link compo-
nents, the optical port plug should be left in to prevent
contamination of the port. Do not use re ow solder
processes (i.e., infrared re ow or vapor-phase re ow).
Nonhalogenated water soluble  uxes (i.e., 0% chloride),
not rosin based  uxes, are recom mended for use with
Versatile Link components.
Versatile Link components are moisture sensitive
devices and are shipped in a moisture sealed bag. If the
components are exposed to air for an extended period of
time, they may require a baking step before the solder-
ing process. Refer to the special labeling on the shipping
tube for details.
Recommended Chemicals for Cleaning/Degreasing
Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane,
heptane. Other: soap solution, naphtha.
Do not use partially halogenated hydrocarbons such
as 1,1.1 trichloroethane, ketones such as MEK, acetone,
chloroform, ethyl acetate, methylene dichloride, phenol,
methylene chloride, or N-methylpyrolldone. Also, Avago
does not recommend the use of cleaners that use
halogenated hydrocarbons because of their potential
environmental harm.
4
Mechanical Dimensions
Horizontal Modules Vertical Modules
30° Tilted Modules
A
A
NOTES:
1) Dimensions: mm [in]
6.5
[0.26]
2
[0.08]
10.2
[0.40]
18.7
[0.74]
6.6
[0.26]
15.2
[0.60]
7.62
[0.300]
2.54
[0.100]
0.5
[0.02]
1.3
[0.05]
4.6
[0.18]
0.6
[0.03]
10.1
[0.40]
8.7
[0.34]
19.3
[0.76]
1.1
[0.05]
2.2
[0.09]
4.6
[0.18]
0.4
[0.02]
30°
0.7
[0.03]
2
[0.08]
18.9
[0.75]
3.3 [0.13] MAX
2.8 [0.11] MIN
0.5
[0.02]
2.54
[0.100]
1.3
[0.05]
7.6
[0.30]
1.7
[0.07]
0.6
[0.02]
3.8
[0.15]
3.8
[0.15]
7.62
[0.300]
2)
18.1
[0.71]
5.1
[0.20]
10.2
[0.40]
1
[0.04]
3.6
[0.14]
0.6
[
0.03]
NOTES:
1) Dimensions: mm [in]
2) Optional mounting hole for #2 self-tapping-screw
(metric equivalent M2.2 x 0.45)
6.5
[0.26]
2
[0.08]
6.5
[0.26]
0.6
[0.03]
7.7
[0.30]
7.6
[0.30]
18.8
[0.74]
2.8
[0.11]
3.8[0.15]MAX.
3.6[0.14]MIN.
5.1
[0.20]
4.2
[0.17]
1.3
[0.05]
2.54
[0.100]
1.7
[0.07]
0.5
[0.02]
NOTES:
1) Dimensions: mm [in]
0.6
[
0.03]
10.2
[0.40]
5
Versatile Link Printed Board Layout Dimensions
Horizontal Module Vertical Module
30° Tilted Modules
7.62
[0.300]
2.54
[0.100]
7.7
[0.30]
1.9
[0.07]
PCB EDGE
MIN.
123
4
8
5
Footprint - TOP VIEW
1
[

0.04]
NOTES:
1) Dimensions: mm [in]
7.62
[0.300]
3.8
[0.15]
3.8
[0.15]
7.62
[0.300]
2.54
[0.100]
2.25 [0.09] clearance hole
for optional vertical mount
self-tapping-screw #2
PCB EDGE
1.7
[0.07] MIN.
1
2
3
4
58
Footprint - TOP VIEW
1
[0.04]
NOTES:
1) Dimensions: mm [in]
2.54
[0.100]
7.62
[0.300]
8.7
[0.34]
PCB EDGE
4321
8
5
Footprint - TOP VIEW
2.2
[0.09] MIN.
1
[0.04]
NOTES:
1) Dimensions: mm [in]
6
Interlocked (Stacked) Assemblies (refer to Figure 1)
Horizontal packages may be stacked by placing units
with pins facing upward. Initially engage the inter -
locking mechanism by sliding the L bracket body from
above into the L slot body of the lower package. Use
a straight edge, such as a ruler, to bring all stacked
units into uniform alignment. This tech nique prevents
potential harm that could occur to  ngers and hands of
assemblers from the package pins. Stacked horizontal
packages can be disengaged if necessary. Repeated
stacking and unstack ing causes no damage to individual
units.
To stack vertical packages, hold one unit in each hand,
with the pins facing away and the optical ports on the
bottom. Slide the L bracket unit into the L slot unit. The
straight edge used for horizontal package alignment is
not needed.
Stacking Horizontal Modules
Figure 1. Interlocked (stacked) horizontal, vertical or 30° tilted packages
Stacking Vertical Modules
Stacking 30° Tilted Modules
7
Figure 2. Typical 5 MBd interface circuit
5 MBd Link (HFBR-15X1ETZ/25X1ETZ)
System Performance -40 ° to 85 °C, unless otherwise speci ed.
Parameter Symbol Min. Typ. Max. Units Conditions Ref.
High Data Rate dc 5 MBd BER ≤10-9, PRBS:27-1
Link Distance d 17 m IFdc = 60 mA Notes 3, 4
(Standard Cable) 33 m IFdc = 60 mA, 25° C
Link Distance d 20 m IFdc = 60 mA Notes 3, 4
(Improved Cable) 38 m IFdc = 60 mA, 25° C
Propagation tPLH 90 140 ns RL = 560 , CL = 30 pF Fig. 3, 6
Delay tPHL 50 140 ns ber length = 0.5 m Notes 1, 2, 4
-21.6 ≤PR ≤-9.5 dBm
Pulse Width tD 40 ns PR = -15 dBm Fig. 3, 5
Distortion tPLH-tPHL R
L = 560 , CL = 30 pF Note 4
Notes:
1. The propagation delay for one metre of cable is typically 5 ns.
2. Typical propagation delay is measured at PR = -15 dBm.
3. Estimated typical link life expectancy at 40° C exceeds 10 years at 60 mA.
4. Optical link performance is guaranteed only with transmitter HFBR-15x1ETZ and receiver HFBR-25x1ETZ.
Performance
5 MBd
Figure 3. 5 MBd propagation delay test circuit
8
Figure 6. Typical link propagation delay vs. optical powerFigure 5. Typical link pulse width distortion vs. optical power
Figure 4. Propagation delay test waveforms
0
10
20
30
40
50
60
70
-27 -24 -21 -18 -15 -12 -9 -6
PR - INPUT OPTICAL POWER - dBm
tD - PULSE WIDTH DISTORTION - ns
X5X1ETZ -40° C
X5X1ETZ 25° C
X5X1ETZ 85° C
0
20
40
60
80
100
-27 -24 -21 -18 -15 -12 -9 -6
PR - INPUT OPTICAL POWER - dBm
tP - PROPAGATION DELAY - ns
tPLH X5X1ETZ
tPHL X5X1ETZ
9
HFBR-15X1ETZ Transmitter
All HFBR-15XXETZ LED transmitters are classi ed as IEC 825-1 Accessible Emission Limit (AEL) Class 1 based upon the current proposed
draft scheduled to go into e ect on January 1, 1997. AEL Class 1 LED devices are considered eye safe. Contact your local Avago sales
representative for more information.
Absolute Maximum Ratings
Parameter Symbol Min. Max. Units Reference
Storage Temperature TS –40 +85 °C
Operating Temperature T
A –40 +85 °C
Lead Soldering Cycle Temp. 260 °C Note 1, 4
Time 10 sec
Forward Input Current IFPK 1000 mA Note 2, 3
I
Fdc 80
Reverse Input Voltage VBR 5 V
Notes:
1. 1.6 mm below seating plane.
2. Recommended operating range between 10 and 750 mA.
3. 1 s pulse, 20 s period.
4. Moisture sensitivity level is MSL-3
Pin # Function
1 Anode
2 Cathode
3 Ground
4 Ground
5 Ground
8 Ground
Note: Pins 5 and 8 are for mounting and retaining purposes
only. Do not electrically connect these pins.
ANODE 1
CATHODE 2
GROUND 3
GROUND 4
8 GROUND
5 GROUND
10
Figure 7. Typical forward voltage vs. drive current Figure 8. Normalized typical output power vs. drive current
Transmitter Electrical/Optical Characteristics -40° to 85° C unless otherwise speci ed.
Parameter Symbol Min. Typ.[5] Max. Units Conditions Ref.
Transmitter Output PT -16.8 -7.1 dBm IFdc = 60 mA Notes 1, 2
-14.3 -8.0 dBm IFdc = 60 mA, 25° C
Output Optical Power PT/T -0.85 %/°C
Temperature Coe cient
Peak Emission PK 660 nm
Wavelength
Forward Voltage VF 1.43 1.67 2.05 V IFdc = 60 mA
Forward Voltage VF/T -1.37 mV/°C Fig. 7
Temperature Coe cient
E ective Diameter D 1 mm
Reverse Input Breakdown VBR 5.0 11.0 V IFdc = 10 A,
Voltage T
A = 25° C
Diode Capacitance CO 86 pF VF = 0, f = MHz
Rise Time tr 20 ns 10% to 90%, Note 3
Fall Time tf 20 ns
Notes:
1. Optical power measured at the end of 0.5 m of 1 mm diameter POF (NA = 0.5) with a large area detector.
2. Optical power, P (dBm) = 10 Log [P(W)/1000 W].
3. Rise and fall times are measured with a voltage pulse driving the transmitter driver IC (75451). A wide bandwidth optical to electrical waveform
analyzer, terminated to a 50 input of a wide bandwidth oscilloscope, is used for this response time measurement.
Optical Power
IF = 60 mA
1.4
1.45
1.5
1.55
1.6
1.65
1.7
1.75
1.8
1 10 100
IFdc - TRANSMITTER DRIVE CURRENT (mA)
VF - VORWARD VOLTAGE - V
-40° C
25° C
85° C
-20
-15
-10
-5
0
5
1 10 100
IFdc - TRANSMITTER DRIVE CURRENT (mA)
PT - NORMALIZED OUTPUT POWER - dB
-40° C
25° C
85° C
11
HFBR-25X1ETZ Receiver
Absolute Maximum Ratings
Parameter Symbol Min. Max. Units Reference
Storage Temperature TS –40 +85 ° C
Operating Temperature T
A –40 +85 ° C
Lead Soldering Cycle Temp. 260 ° C Note 1, 3
Time 10 sec
Supply Voltage VCC –0.5 7 V Note 2
Output Collector Current IOAV 25 mA
Output Collector Power Dissipation POD 40 mW
Output Voltage VO –0.5 18 V
Pull-up Voltage VP –5 VCC V
Fan Out (TTL) N 5
Receiver Electrical/Optical Characteristics -40° to 85° C, 4.75 V ≤VCC ≤5.25 V, unless otherwise speci ed.
Parameter Symbol Min. Typ. Max. Units Conditions Ref.
Input Optical Power PR(L) –21.6 –9.5 dBm V
OL = 0.5 V Notes 1,
Level for Logic “0” IOL = 8 mA 2, 4, 5
–21.6 –8.7 V
OL = 0.5 V
I
OL = 8 mA, 25° C
Input Optical Power PR(H) –43 dBm VOL = 5.25 V Notes 1, 5
Level for Logic “1” IOH ≤250 μA
High Level Output Current IOH 5 250 A V
O = 18 V, PR = 0 Notes 3, 5
Low Level Output Voltage V
OL 0.4 0.5 V IOL = 8 mA, Notes 3, 5
P
R = PR(L)MIN
High Level Supply ICCH 3.5 6.3 mA V
CC = 5.25 V, Notes 3, 5
Current PR = 0
Low Level Supply Current ICCL 6.2 10 mA V
CC = 5.25 V Notes 3, 5
P
R = -12.5 dBm
E ective Diameter D 1 mm
Internal Pull-up Resistor RL 680 1000 1700
4
3
2
1
D
O NOT CONNECT 5
D
O NOT CONNECT 8
RL
VCC
GROUN
D
VO
1000 Ω
Pin # Function
1V
O
2 Ground
3V
CC
4R
L
5 Ground
8 Ground
Note: Pins 5 and 8 are for mounting and retaining purposes
only. Do not electrically connect these pins.
Notes:
1. 1.6 mm below seating plane.
2. It is essential that a bypass capacitor 0.1 F be connected from pin 2 to pin 3 of the receiver. Total lead length between both ends of the capacitor
and the pins should not exceed 20 mm.
3. Moisture sensitivity level is MSL-3
Notes:
1. Optical  ux, P (dBm) = 10 Log [P (μW)/1000 μW].
2. Optical power measured at the end of 1 mm diameter POF (NA = 0.5) with a large area detector.
3. RL is open.
4. Pulsed LED operation at IF > 80 mA will cause increased link tPLH propagation delay time. This extended tPLH time contributes to increased pulse
width distortion of the receiver output signal.
5. Guaranteed only if optical input signal to the receiver is generated by HFBR-15x1ETZ, with ideal alignment to photo diode using 1mm POF
(NA=0.5).
12
1 MBd Link
(High Performance HFBR-15X2ETZ/25X2ETZ)
System Performance Under recommended operating conditions, unless otherwise speci ed.
Parameter Symbol Min. Typ. Max. Units Conditions Ref.
High Data Rate dc 1 MBd BER ≤10-9, PRBS:27-1
Link Distance d 37 m IFdc = 60 mA Notes 1,
(Standard Cable) 58 m IFdc = 60 mA, 25° C 3, 4, 5
Link Distance d 43 m IFdc = 60 mA Notes 1,
(Improved Cable) 67 m IFdc = 60 mA, 25° C 3, 4, 5
Propagation tPLH 100 250 ns RL = 560 , CL = 30 pF Fig. 10, 12
Delay tPHL 80 140 ns I = 0.5 metre Notes 2, 4, 5
P
R = -24 dBm
Pulse Width tD 20 ns PR = -24 dBm Fig. 10, 11
Distortion tPLH-tPHL R
L = 560 , CL = 30 pF Notes 4, 5
Notes:
1. For IFPK > 80 mA, the duty factor must be such as to keep IFdc ≤80 mA. In addition, for IFPK > 80 mA, the following rules for pulse width apply:
I
FPK ≤160 mA: Pulse width ≤1 ms
I
FPK > 160 mA: Pulse width ≤1 S, period ≥20 S.
2. The propagation delay for one meter of cable is typically 5 ns.
3. Estimated typical link life expectancy at 40° C exceeds 10 years at 60 mA.
4. Pulsed LED operation at IFPK > 80 mA will cause increased link tPLH propagation delay time. This extended tPLH time contributes to increased
pulse width distortion of the receiver output signal.
5. Optical link performance is guaranteed only with transmitter HFBR-15x2ETZ and receiver HFBR-25x2ETZ.
Performance
1 MBd
Figure 9. Required 1 MBd interface circuit
The HFBR-25X2ETZ receiver cannot be overdriven when using the required
interface circuit shown in Figure 9
13
Figure 11. Typical link pulse width distortion vs. optical power
Figure 10. 1 MBd propagation delay test circuit
Figure 13. Propagation delay test waveforms
Figure 12. Typical link propagation delay vs. optical power
0
10
20
30
40
50
60
70
80
90
-27 -24 -21 -18 -15 -12 -9 -6
PR - INPUT OPTICAL POWER - dBm
tD - PULSE WIDTH DISTORTION - ns
X5X2ETZ -40° C
X5X2ETZ 25° C
X5X2ETZ 85° C
0
20
40
60
80
100
120
-27 -24 -21 -18 -15 -12 -9 -6
PR - INPUT OPTICAL POWER - dBm
tP - PROPAGATION DELAY - ns
tPLH X5X2ETZ
tPHL X5X2ETZ
14
HFBR-15X2ETZ Transmitters
All HFBR15XXETZ LED transmitters are classi ed as IEC 825-1 Accessible Emission Limit (AEL) Class 1 based upon the current proposed
draft scheduled to go into e ect on January 1, 1997. AEL Class 1 LED devices are considered eye safe. Contact your Avago sales
representative for more information.
Absolute Maximum Ratings
Parameter Symbol Min. Max. Units Reference
Storage Temperature TS –40 +85 ° C
Operating Temperature T
A –40 +85 ° C
Lead Soldering Cycle Temp. 260 ° C Note 1, 4
Time 10 sec
Forward Input Current IFPK 1000 mA Note 2, 3
I
Fdc 80
Reverse Input Voltage VBR 5 V
Notes:
1. 1.6 mm below seating plane.
2. Recommended operating range between 10 and 750 mA.
3. 1 s pulse, 20 s period.
4. Moisture sensitivity level is MSL-3
Transmitter Electrical/Optical Characteristics -40° to 85° C unless otherwise speci ed.
For forward voltage and output power vs. drive current graphs.
Parameter Symbol Min. Typ. Max. Units Conditions Ref.
Transmitter Output PT –13.9 –4.0 dBm IFdc = 60 mA Note 1
Optical Power –11.2 –5.1 IFdc = 60 mA, 25° C
Output Optical Power PT/T –0.85 %/° C
Temperature Coe cient
Peak Emission Wavelength PK 660 nm
Forward Voltage VF 1.43 1.67 2.05 V IFdc = 60 mA
Forward Voltage VF/T –1.37 mV/° C Fig. 09
Temperature Coe cient
E ective Diameter DT 1 mm
Reverse Input Breakdown VBR 5.0 11.0 V IFdc = 10 μA,
Voltage T
A = 25° C
Diode Capacitance CO 86 pF VF = 0, f = 1 MHz
Rise Time tr 20 ns 10% to 90%, Note 2
Fall Time tf 20 ns IF = 60 mA
Note:
1. Optical power measured at the end of 0.5 m of 1 mm diameter POF (NA = 0.5) with a large area detector.
2. Rise and fall times are measured with a voltage pulse driving the transmitter driver IC (75451). A wide bandwidth optical to electrical waveform
analyzer, terminated to a 50 input of a wide bandwidth oscilloscope, is used for this response time measurement.
ANODE 1
CATHODE 2
GROUND 3
GROUND 4
8 GROUND
5 GROUND
Pin # Function
1 Anode
2 Cathode
3 Ground
4 Ground
5 Ground
8 Ground
Note: Pins 5 and 8 are for mounting and retaining purposes
only. Do not electrically connect these pins.
15
HFBR-25X2ETZ Receivers
Absolute Maximum Ratings
Parameter Symbol Min. Max. Units Reference
Storage Temperature TS –40 +85 ° C
Operating Temperature T
A –40 +85 ° C
Lead Soldering Cycle Temp. 260 ° C Note 1, 3
Time 10 sec
Supply Voltage VCC –0.5 7 V Note 2
Output Collector Current IOAV 25 mA
Output Collector Power Dissipation POD 40 mW
Output Voltage VO –0.5 18 V
Pull-up Voltage VP –5 VCC V
Fan Out (TTL) N 5
Notes:
1. 1.6 mm below seating plane.
2. It is essential that a bypass capacitor 0.1 F be connected from pin 2 to pin 3 of the receiver. Total lead length between both ends of the capacitor
and the pins should not exceed 20 mm.
3. Moisture sensitivity level is MSL-3
Receiver Electrical/Optical Characteristics -40° to 85° C, 4.75 V ≤VCC ≤5.25 V unless otherwise speci ed.
Parameter Symbol Min. Typ. Max. Units Conditions Ref.
Receiver Optical Input PR(L) –24 -9.5 dBm V
OL 0.5 V Notes 1, 2, 3, 6
Power Level Logic 0 IOL = 8 mA
Optical Input Power PR(H) -43 dBm V
OH = 5.25 V Notes 4, 6
Level Logic 1 IOH = ≤250 μA
High Level Output Current IOH 5 250 A VO = 18 V, PR = 0 Notes 5, 6
Low Level Output Voltage V
OL 0.4 0.5 V IOL = 8 mA Notes 5, 6
P
R = PR(L)MIN
High Level Supply Current ICCH
3.5 6.3 mA VCC = 5.25 V, Notes 5, 6
P
R = 0
Low Level Supply Current ICCL
6.2 10 mA V
CC = 5.25 V, Notes 5, 6
P
R = -12.5 dBm
E ective Diameter D 1 mm
Internal Pull-up Resistor RL 680 1000 1700
Notes:
1. Optical power measured at the end of 1 mm diameter POF (NA = 0.5) with a large area detector.
2. Pulsed LED operation at IF > 80 mA will cause increased link tPLH propagation delay time. This extended tPLH time contributes to increased pulse
width distortion of the receiver output signal.
3. The LED drive circuit of Figure 11 is required for 1 MBd operation of the HFBR-25X2ETZ.
4. Optical  ux, P (dBm) = 10 Log [P(W)/1000 W].
5. RL is open.
6. Guaranteed only if optical input signal to the receiver is generated by HFBR-15x2ETZ, with ideal alignment to photodiode using 1 mm POF
(NA=0.5).
4
3
2
1
D
O NOT CONNECT 5
D
O NOT CONNECT 8
RL
VCC
GROUN
D
VO
1000 Ω
Pin # Function
1V
O
2 Ground
3V
CC
4R
L
5 Ground
8 Ground
Note: Pins 5 and 8 are for mounting and retaining purposes
only. Do not electrically connect these pins.
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AV02-3283EN - July 25, 2016