Revision 1-Feb 10, 2009
HLMP-Y801-JPPxx
T-1 (3 mm) AlInGaP LED Lamps
Datasheet
Description
This family of T-1 lamps is widely used in general purpose
indicator and back lighting applications. The optical design is
balanced to yield superior light output and wide viewing angles.
Several intensity choices are available in each color for
increased design flexibility.
Features
• High luminous intensity output
• Low power consumption
• High efficiency
• Versatile mounting on PCB or panel
• I.C. Compatible/low current requirement
• Popular T-1 diameter package
• Reliable and rugged
• RoHS compliant
Applications
• Status indicator
• Backlighting front panels
• Light pipe sources
• Lighted switches
Package Dimension
Notes:
1. All dimensions are in millimeter (inches).
2. Tolerance is ±0.25mm (.010) unless otherwise stated.
3. Lead spacing is measured where the leads emerge from the package.
Revision 1-Feb 10, 2009
Selection Guide
Luminous Intensity, Iv (mcd) @ 20 mA Colo
r
Part Numbe
r
Packa
g
e Description
Min. Typ. Max.
Viewing angle,
2θ½(°)
Green HLMP-Y801-JPPxx Untinted, Non-diffused 240 310 1150 30
Part Numbering System
HLMP – Y x x x - x x x xx
Absolute Maximum Ratings at TA = 25°C
Parameter HLMP-Y801-JPPxx Units
DC Forward Current 20 mA
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
60 mA
Reverse Voltage (IR = 100μA) 5 V
Junction Temperature 110 °C
Power Dissipation 48 mW
Storage Temperature Range -40 to +100 °C
Operating Temperature Range -40 to +100 °C
Solder Temperature 260°C 5 sec
Maximum IV Bin Options
0: Open (no max. limit)
Others: Please refer to the IV Bin Table
Minimum IV Bin Options
Please refer to the IV Bin Table
Color Bin Options
0: Full Color Bin Distribution
Mechanical Options
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
DD: Ammo Pack
Revision 1-Feb 10, 2009
Electrical /Optical Characteristic at TA = 25°C
Description Symbol Min. Typ. Max. Units Test Conditions
Peak Wavelength λPEAK 575 nm Measurement at peak
Dominant Wavelength λd 564.5 572.0 nm Note 1
Spectrum Half Width Δλ 11 nm
Forward Voltage VF
2.1 2.4 V IF = 20mA
(Figure 1)
Notes:
1. The dominant wavelength, λd, is derived from the Chromaticity Diagram and represents the color of the lamp.
Figure 1: Forward Current vs. Forward Voltage. Figure 2: Relative Luminous Intensity vs. Forward Current.
Revision 1-Feb 10, 2009
Figure 3: Ambient Temperature vs. Maximum DC Forward Current. Figure 4: Relative Luminous Intensity vs. Angular Displacement.
Figure 5: Wavelength vs. Relative Luminous Intensity.
Revision 1-Feb 10, 2009
Intensity Bin Limits
Intensity Range (mcd)
Bin Min. Max.
J 240.0 310.0
K 310.0 400.0
L 400.0 520.0
M 520.0 680.0
N 680.0 880.0
P 880.0 1150.0
Tolerance for each bin limit is 15%.
Color Bin Limits Table
Lambda (nm)
Color Category # Min. Max.
1 564.5 567.0
2 567.0 569.5
Green
3 569.5 572.0
Tolerance for each bin limit is ±1.0 nm.
Revision 1-Feb 10, 2009
Precautions:
Assembly method: This product is not meant for auto-insertion.
Lead Forming:
• The leads of an LED lamp may be preformed or cut to length
prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must be taken to
avoid any excessive mechanical stress induced to LED package.
Otherwise, cut the leads of LED to length after soldering process
at room temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to the LED
chip die attach and wirebond.
• During lead forming, the leads should be bent at a point at least
3mm from the base of the lens. Do not use the base of the lead
frame as a fulcrum during forming. Lead forming must be done
before soldering at normal temperature.
• It is recommended that tooling made to precisely form and cut the
leads to length rather than rely upon hand operation.
Soldering Conditions:
• Care must be taken during PCB assembly and soldering process
to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59 mm below
the body (encapsulant epoxy) for those parts without standoff.
• Recommended soldering conditions:
Wave Soldering Manual Solder
Dipping
Pre-heat Temperature 105°C Max. -
Pre-heat Time 60 sec Max. -
Peak Temperature 250°C Max. 260°C Max.
Dwell Time 3 sec Max. 5 sec Max.
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell time in the
solder wave. Customer is advised to periodically check on the
soldering profile to ensure the soldering profile used is always
conforming to recommended soldering condition.
• If necessary, use fixture to hold the LED component in proper
orientation with respect to the PCB during soldering process.
• Proper handling is imperative to avoid excessive thermal
stresses to LED components when heated.
• Therefore, the soldered PCB must be allowed to cool to room
temperature, 25°C, before handling.
• Special attention must be given to board fabrication, solder
masking, surface plating and lead holes size and component
orientation to assure solderability.
• Recommended PC board plated through-hole sizes for LED
component leads:
LED Component
Lead Size
Diagonal Plated Through
Hole Diameter
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
0.718 mm
(0.028 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information
on soldering LED component.
Figure 5: Recommended Wave Soldering Profile.
Revision 1-Feb 10, 2009
DISCLAIMER
AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENENACE OR DIRECT
OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY
RESPONSIBLE AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FO ALL LOSS,
DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
