HLMP-Y801-JPPxx T-1 (3 mm) AlInGaP LED Lamps Datasheet Description This family of T-1 lamps is widely used in general purpose indicator and back lighting applications. The optical design is balanced to yield superior light output and wide viewing angles. Several intensity choices are available in each color for increased design flexibility. * Popular T-1 diameter package * Reliable and rugged * RoHS compliant Features * High luminous intensity output Applications * Low power consumption * Status indicator * High efficiency * Backlighting front panels * Versatile mounting on PCB or panel * Light pipe sources * I.C. Compatible/low current requirement * Lighted switches Package Dimension Notes: 1. All dimensions are in millimeter (inches). 2. Tolerance is 0.25mm (.010) unless otherwise stated. 3. Lead spacing is measured where the leads emerge from the package. Revision 1-Feb 10, 2009 Selection Guide Color Part Number Package Description Green HLMP-Y801-JPPxx Untinted, Non-diffused Luminous Intensity, Iv (mcd) @ 20 mA Min. Typ. Max. 240 310 1150 Part Numbering System HLMP - Y x x x - x x x xx Mechanical Options 00: Bulk 01: Tape & Reel, Crimped Leads 02: Tape & Reel, Straight Leads DD: Ammo Pack Color Bin Options 0: Full Color Bin Distribution Maximum IV Bin Options 0: Open (no max. limit) Others: Please refer to the IV Bin Table Minimum IV Bin Options Please refer to the IV Bin Table Absolute Maximum Ratings at TA = 25C Parameter DC Forward Current Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) Reverse Voltage (IR = 100A) Junction Temperature Power Dissipation Storage Temperature Range Operating Temperature Range Solder Temperature Revision 1-Feb 10, 2009 HLMP-Y801-JPPxx 20 60 Units mA mA 5 110 48 -40 to +100 -40 to +100 260C 5 sec V C mW C C Viewing angle, 21/2() 30 Electrical /Optical Characteristic at TA = 25C Description Peak Wavelength Dominant Wavelength Spectrum Half Width Forward Voltage Symbol PEAK d VF Min. Typ. 575 564.5 Max. 572.0 11 2.1 2.4 Units nm nm nm V Test Conditions Measurement at peak Note 1 IF = 20mA (Figure 1) Notes: 1. The dominant wavelength, d, is derived from the Chromaticity Diagram and represents the color of the lamp. Figure 1: Forward Current vs. Forward Voltage. Revision 1-Feb 10, 2009 Figure 2: Relative Luminous Intensity vs. Forward Current. Figure 3: Ambient Temperature vs. Maximum DC Forward Current. Figure 5: Wavelength vs. Relative Luminous Intensity. Revision 1-Feb 10, 2009 Figure 4: Relative Luminous Intensity vs. Angular Displacement. Intensity Bin Limits Bin J K L M N P Intensity Range (mcd) Min. Max. 240.0 310.0 310.0 400.0 400.0 520.0 520.0 680.0 680.0 880.0 880.0 1150.0 Tolerance for each bin limit is 15%. Revision 1-Feb 10, 2009 Color Bin Limits Table Color Green Category # 1 2 3 Lambda (nm) Min. 564.5 567.0 569.5 Tolerance for each bin limit is 1.0 nm. Max. 567.0 569.5 572.0 Precautions: Assembly method: This product is not meant for auto-insertion. Lead Forming: * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. * If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. * During lead forming, the leads should be bent at a point at least 3mm from the base of the lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering at normal temperature. * It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. * Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. * If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. * Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. * Therefore, the soldered PCB must be allowed to cool to room temperature, 25C, before handling. Soldering Conditions: * Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. * Care must be taken during PCB assembly and soldering process to prevent damage to LED component. * Recommended PC board plated through-hole sizes for LED component leads: * The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. * Recommended soldering conditions: Wave Soldering Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time 105C Max. 60 sec Max. 250C Max. 3 sec Max. Figure 5: Recommended Wave Soldering Profile. Revision 1-Feb 10, 2009 Manual Solder Dipping 260C Max. 5 sec Max. LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED component. DISCLAIMER AVAGO'S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENENACE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FO ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. Revision 1-Feb 10, 2009