XR2A0801N - OMRON - Product.Network

F-1

XR2IC Sockets

OMR ON’s IC Connectors Have Excell ent

Reliability and Can Tolerate Momentary

Interruptions in Power. Ideal for High-

speed Da t a Proces si ng.

■Round pins and 4-point (4-finger) contact construction

ensure long life and excellent shock and vibration dura-

bility.

■Contact entry holes are large for easy insertion.

■IC lead contacts placed high for solid connections.

■No flux rise.

■A wide product range: open-frame, closed-frame, sin-

gle- row, c arr ie r-ty pe DI P termi nal s, wrap t er min als, so l-

der-sleeve terminals, and low-profile DIP terminals.

■A new tin-plated product series offers more choice

when it comes to selecting the optimum IC Socket for

an application.

■Conform to UL standards (file no. E 103202) and CSA

standards (file no. LR 62678).

■Ratings and Characteristics

Note: The contact insertion force and contact removal force are for a test

gauge, t = 0.432 mm.

■Materials and Finish

Note: For non-sta nda rd plating, contact your OMRON representative.

■Applicable Wrap Post Wire Sizes

AWG 30, AWG28, AWG 26, AWG24

(Solid wire: 0.25 to 0.51 mm dia.)

■Wrap Post Length

3 wires

■Applicable IC Lead Dimensions

DIP, Wrap, and Solder-sleeve Terminals

Note: Do not use wire where the diagonal is more than 0.56 mm.

Low-profile DIP Terminals

Note: Do not use wire where the diagonal is more than 0.52 mm.

Inner clip Base

Outer sleeve

Carrier

Inner clip

Outer sleeve

1.83 dia.

0.51 dia.

1.83 dia.

0.635 × 0.635

1.83 dia.

0.79 dia.

1.83 dia.

1.35 dia.

■Construction ■Contact Dimensions

DIP Terminals Wrap

Terminals Low-pro file DIP

Terminals Solder-sleeve

Terminals

Item Gold plated Gold flash plated

Rated current 1 A

Rated voltage 300 VAC

Contact resistance 20 mΩ max. (at 20 mV, 100 mA max.)

Insulation resistance 1,000 MΩ min. (at 500 VDC)

Dielectric strength 1,000 VAC for 1 min (leakage current: 1 mA max.)

Contact inser tion (See not e.) 3.92 N max.

Contact removal (See note.) 0.64 N min. with gold plating, 0.64 N min. with solder

plating

Insertion durability 100 times (0.75-µm gold

plating), 50 times (0.25-

µm gold plating)

20 times

Ambient temperature Operating: − 55 to 125°C (with no icing)

Base Fiber-glass reinfo rced PBT resin (U L94V-0) /black

Carrier Aluminum

Inner clip Beryllium copper/nickel base, gold plated

Outer sleeve Brass/nickel base, gold flash plating

Depth × width (mm)

Flat lead 0.29 ±0.09 × 0.46 ±0.08 (See note.)

Round lead 0.53 dia. max. 0.41 dia. min.

Depth × width (mm)

Flat lead 0.29 ±0.09 × 0.46 ±0.08 (See note.)

Round lead 0.50 dia. max. 0.41 dia. min.

F-2 IC Sockets XR2

XR2A Open-frame Sockets

■Dimensions

■Ordering Information

Appearance Sockets with DIP terminals Sockets with wrap

terminals

No of

contacts Row pitch (A)

(mm) With 0.25-µm gold

plating With 0.75-µm gold

plating With gold flash plating With 0.75-µm gold

plating

8 7.62 XR2A-0811-N XR2A-0801-N XR2A-0821-N XR2A-0802

14 7.62 XR2A-1411-N XR2A-1401-N XR2A-1421-N XR2A-1402

16 7.62 XR2A-1611-N XR2A-1601-N XR2A-1621-N XR2A-1602

18 7.62 XR2A-1811-N XR2A-1801-N XR2A-1821-N XR2A-1802

20 7.62 XR2A-2011-N XR2A-2001-N XR2A-2021-N XR2A-2002

22 10.16 XR2A-2211-N XR2A-2201-N XR2A-2221-N XR2A-2202

24 15.24 XR2A-2411-N XR2A-2401-N XR2A-2421-N XR2A-2402

24 10.16 XR2A-2463-N XR2A-2461-N XR2A-2467-N ---

24 7.62 XR2A-2473-N XR2A-2471-N XR2A-2477-N XR2A-2472

28 15.24 XR2A-2811-N XR2A-2801-N XR2A-2821-N XR2A-2802

32 15.24 XR2A-3211-N XR2A-3201-N XR2A-3221-N XR2A-3202

40 15.24 XR2A-4011-N XR2A-4001-N XR2A-4021-N XR2A-4002

42 15.24 XR2A-4211-N XR2A-4201-N XR2A-4221-N XR2A-4202

48 15.24 XR2A-4811-N XR2A-4801-N --- XR2A-4802

50 22.86 XR2A-5011-N XR2A-5001-N --- ---

64 22.86 XR2A-6411-N XR2A-6401-N --- XR2A-6402

0.51 dia.

1.33 dia. 0.635 × 0.635

Wrap terminalsDIP terminals

Mounting holes (bottom view)

0.8 ±0.05 dia. (DIP terminals)

1.0 ±0.05 dia. (Wrap terminals)

XR2A-@@11-N

XR2A-2463-N

XR2A-2473-N

XR2A-@@01-N

XR2A-2461-N

XR2A-2471-N

XR2A-@@21-N

XR2A-2467-N

XR2A-2477-N

(With DIP terminals)

Dimensions

Note: 1. XR2A-2401-N/XR2A-2402/

XR2A-2411N/XR2A-2421-N

2. XR2A-2461-N/XR2A-2463-N/

XR2A-2467-N

3. XR2A-2471-N/XR2A-2473-N/

XR2A-2477-N

No. of contacts Dimensions (mm)

87.627.62

14 7.62 15.24

16 7.62 17.78

18 7.62 20.32

20 7.62 22.86

22 10.16 25.40

(See note 1.) 15.24 27.94

(See note 2.) 10.16 27.94

(See note 3.) 7.62 27.94

28 15.24 33.02

32 15.24 38.10

40 15.24 48.26

42 15.24 50.80

48 15.24 58.42

50 22.86 60.96

64 22.86 78.74

XR2A-@@02

(With wrap terminals)

IC Sockets XR2 F-3

XR2A Open-frame Sockets (w ith Low-profile DIP Terminals)

■Dimensions

■Ordering Information

Appearance Sockets with DIP terminals

No. of

contacts Row pitc h (A)

(mm) With 0.25-µm gold

plating With 0.75-µm gold

plating With gold flash plating

8 7.62 XR2A-0815 XR2A-0805 XR2A-0825

14 7.62 XR2A-1415 XR2A-1405 XR2A-1425

16 7.62 XR2A-1615 XR2A-1605 XR2A-1625

18 7.62 XR2A-1815 XR2A-1805 XR2A-1825

20 7.62 XR2A-2015 XR2A-2005 XR2A-2025

22 10.16 XR2A-2215 XR2A-2205 XR2A-2225

24 15.24 XR2A-2415 XR2A-2405 XR2A-2425

24 10.16 XR2A-2466 XR2A-2465 XR2A-2468

24 7.62 XR2A-2476 XR2A-2475 XR2A-2478

28 15.24 XR2A-2815 XR2A-2805 XR2A-2825

32 15.24 XR2A-3215 XR2A-3205 XR2A-3225

40 15.24 XR2A-4015 XR2A-4005 XR2A-4025

42 15.24 XR2A-4215 XR2A-4205 ---

48 15.24 XR2A-4815 XR2A-4805 ---

64 22.86 XR2A-6415 XR2A-6405 ---

Mounting holes (bottom view)

0.79 dia.

0.9 ±0.05 dia.

XR2A-@@15

XR2A-2466

XR2A-2476

XR2A-@@05

XR2A-2465

XR2A-2475

XR2A-@@25

XR2A-2468

XR2A-2478

(With lo w-profi le DIP t ermi nal s)

Dimensions

Note: 1. XR2A-2415/XR2A-2405/

XR2A-2425

2. XR2A-2466/XR2A-2465/

XR2A-2468

3. XR2A-2476/XR2A-2475/

XR2A-2478

No. of contacts Dimensions (mm)

8 7.62 7.62

14 7.62 15.24

16 7.62 17.78

18 7.62 20.32

20 7.62 22.86

22 10.16 25.40

(See note 1.) 15.24 27.94

(See note 2.) 10.16 27.94

(See note 3.) 7.62 27.94

28 15.24 33.02

32 15.24 38.10

40 15.24 48.26

42 15.24 50.80

48 15.24 58.42

64 22.86 78.74

F-4 IC Sockets XR2

XR2B Closed-frame Sockets

■Dimensions

■Ordering Information

Appearance Sockets with DIP terminals

No. of

contacts Row pitch (A)

(mm) With 0.25-µm gold

plating With 0.75-µm gold

plating

16 7.62 XR2B-1611-N XR2B-1601-N

24 15.24 XR2B-2411-N XR2B-2401-N

28 15.24 XR2B-2811-N XR2B-2801-N

32 15.24 XR2B-3211-N XR2B-3201-N

40 15.24 XR2B-4011-N XR2B-4001-N

0.51 dia.

1.33 dia.

0.51 dia.

1.33 dia.

Mounting holes (bottom view)

0.8 ±0.05 dia. (DIP terminals)

XR2B-1611-N

XR2B-1601-N

Dimensions

No. of

contacts Dimensi ons (mm)

16 7.62 17.78

24 15.24 27.94

28 15.24 33.02

32 15.24 38.10

40 15.24 48.26

XR2B-@@11-N

XR2B-@@01-N

IC Sockets XR2 F-5

XR2T Open-frame Sockets with Seal Tape

•Equipped with seal tape to prevent flux cleaning liquids from entering the Socket.

•The same round-pin, 4-point contact structure as the RX2A is used for the contacts.

•The seal tape is made of transparent polyethyle (adhesive portion) and yellow polypropolyene (non-adhesive portion).

■Dimensions

■Ordering Information

Appearance Sockets with DIP t ermin als

No. of

contacts Row pitch (A)

(mm) With 0.25-µm gold

plating With 0.75-µm gold

plating With gold flash plating

8 7.62 XR2T-0811-N XR2T-0801-N XR2T-0821-N

14 7.62 XR2T-1411-N XR2T-1401-N XR2T-1421-N

16 7.62 XR2T-1611-N XR2T-1601-N XR2T-1621-N

18 7.62 XR2T-1811-N XR2T-1801-N XR2T-1821-N

20 7.62 XR2T-2011-N XR2T-2001-N XR2T-2021-N

22 10.16 XR2T-2211-N XR2T-2201-N XR2T-2221-N

24 15.24 XR2T-2411-N XR2T-2401-N XR2T-2421-N

24 10.16 XR2T-2463-N XR2T-2461-N XR2T-2467-N

24 7.62 XR2T-2473-N XR2T-2471-N XR2T-2477-N

28 15.24 XR2T-2811-N XR2T-2801-N XR2T-2821-N

32 15.24 XR2T-3211-N XR2T-3201-N XR2T-3221-N

40 15.24 XR2T-4011-N XR2T-4001-N XR2T-4021-N

48 15.24 XR2T-4811-N XR2T-4801-N ---

Adhesive side

Non-adhesive side

Seal tape

0.51 dia.

1.33 dia.

Mounting holes (bottom view)

0.8 ±0.05 dia. (DIP terminals)

XR2T-@@11-N

XR2T-2463-N

XR2T-2473-N

XR2T-@@01-N

XR2T-2461-N

XR2T-2471-N

XR2T-@@21-N

XR2T-2467-N

XR2T-2477-N

Dimensions

Note: 1. XR2T-2411-N/XR2T-2401-N/

XR2A-2421-N

2. XR2T-2463-N/XR2T-2461-N/

XR2T-2467-N

3. XR2T-2473-N/XR2T-2471-N/

XR2T-2477-N

No. of contacts Dimensions (mm)

8 7.62 7.62

14 7.62 15.24

16 7.62 17.78

18 7.62 20.32

20 7.62 22.86

22 10.16 25.40

(See note 1.) 15.24 27.94

(See note 2.) 10.16 27.94

(See note 3.) 7.62 27.94

28 15.24 33.02

32 15.24 38.10

40 15.24 48.26

48 15.24 58.42

F-6 IC Sockets XR2

XR2C Single-row Sockets

■Dimensions

■Ordering Information

Appearance No. of

contacts With 0.25-µm gold plating With 0.75-µm gold plating With gold flash plating

Sockets with DIP terminals 10 XR2C-1011-N --- ---

16 XR2C-1611-N --- ---

20 XR2C-2011-N XR2C-2001-N XR2C-2021-N

32 XR2C-3211-N XR2C-3201-N XR2C-3221-N

Sockets with low-profile DIP terminals 20 XR2C-2015 XR2C-2005 XR2C-2025

32 XR2C-3215 XR2C-3205 XR2C-3225

Sockets with wrap terminals 20 --- XR2C-2002 - --

32 --- XR2C-3202 ---

0.51 dia.

1.33 dia.

0.79 dia.

0.64 × 0.64

Mounting holes (bottom view)

0.8 ±0.05 dia. (DIP terminals)

1.0 ±0.05 dia. (Wrap terminals)

0.9 ±0.05 dia. (Low-profile DIP terminals)

XR2C-@@11-N

XR2C-@@01-N

XR2C-@@21-N

(With DIP terminals)

XR2C-@@15

XR2C-@@05

XR2C-@@25

(With low-p rofile DI P t er m inals)

XR2C-@@02

(With wrap terminals)

Dimensions

No. of

contacts A (mm)

20 48.26

32 78.74

IC Sockets XR2 F-7

XR2D Double-row Carrier Sockets

■Dimensions

■Ordering Information

Appearance Sockets with DIP

terminals Sockets with solder-

sleeve terminals

No. of

contacts Row pitch (A)

(mm) With 0.75-µm gold

plating With 0.75-µm gold

plating

8 7.62 XR2D-0801-N XR2D-0804

14 7.62 XR2D-1401-N XR2D-1404

16 7.62 XR2D-1601-N XR2D-1604

18 7.62 XR2D-1801-N XR2D-1804

20 7.62 XR2D-2001-N XR2D-2004

24 15.24 XR2D-2401-N XR2D-2404

28 15.24 XR2D-2801-N XR2D-2804

32 15.24 XR2D-3201-N XR2D-3204

40 15.24 XR2D-4001-N XR2D-4004

1.5 dia.

0.51 dia.

1.83 dia. 1.83 dia.

1.36 dia.

Solder-sleeve terminalsDIP terminals

Mounting holes (bottom view)

0.8 ±0.05 dia. (DIP terminals)

1.5 ±0.05 dia. (Solder-sleeve terminals)

XR2D-@@01-N

(With DIP terminals)

XR2D-@@04

(With solder-sleeve terminals) Dimensions

No. of cont act s Dimens ion s (m m )

8 7.62 7.62

14 7.62 15.24

16 7.62 17.78

18 7.62 20.32

20 7.62 22.86

24 15.24 27.94

28 15.24 33.02

32 15.24 38.10

40 15.24 48.26

F-8 IC Sockets XR2

XR2E Single-row Carrier Sockets

■Dimensions

■Ordering Information

Appear-

ance Sockets with DIP

Terminals Sockets with Solder-

sleeve Term inals

No. of

contacts With 0.75-µm gold

plating With 0.75-µm gold

plating

32 XR2E-3201-N XR2E-3204

2 dia.

0.51 dia.

1.8 dia. 1.36 dia.

1.83 dia.

(Solder-sleeve terminals)(DIP terminals)

Mounting holes (bottom view)

0.8 ±0.05 dia. (DIP terminals)

1.5 ±0.05 dia. (Solder-sleeve terminals)

XR2E-3201-N

(With DIP terminals)

XR2E-3204

(With solder-sleeve terminals)

IC Sockets XR2 F-9

XR2H ZIP (Zigzag) So ckets

■Dimensions

■Ordering Information

Appear-

ance Sockets with DIP

terminals

No. of

contacts With 0.25-µm gold

plating

16 XR2H-1611-N

20 XR2H-2011-N

24 XR2H-2411-N

28 XR2H-2811-N

Mounting holes (bottom view)

0.8 ±0.05 dia.

XR2H-@@11-N

(With DIP terminals)

Dimensions

No. of

contacts Dimensions (mm)

16 17.78 21.5

20 22.86 26.5

24 27.94 31.6

28 33.02 36.7

F-10 IC Sockets XR2

XR2P Single-row Round Pin Plugs

Single-row Round Pins for Low-profile Stacking

• Single row with 2.54-mm pitch.

• Low-profile stacking possible in combination with Single-row IC Sockets (XR2C).

• Easily divided into the desired number of contacts.

■Rati ng s an d Ch aracteristic s

Note: The contact and vibration resistance are the values when the

Plug is mated with an XR2C.

■Mate ria l s an d Finish

■Applicable Sockets

■Dimensions

Rated current 1 A

Rated voltag e 300 VAC

Contact resistance

(See note.) 20 mΩ max. (at 20 mV, 10 mA max. )

Insulation resistance 1,000 MΩ min. (at 500 VDC)

Dielectric strength 1,000 VAC for 1 min (leakage current:

1mA max.)

Ambient operating

temperature − 55 to 125°C (with no icing at low temper-

ature)

Base Fiber-glass reinforced PBT resin

(UL94V-0)/black

Contacts Mating end Brass/nick el base with 0.25-µm gold plat-

ing

Terminal

XR2C-@@11-N IC Sockets (single row)

XR2C-3215 IC Socket (single row, low profile)

1.8 dia.

0.45 dia.

0.45 dia. Terminals (board side)

Mounting holes (bottom view)

Thirty-two, 0.8 ±0.05 dia.

XR2P-@@41

XR2C-@@11-N

XR2P-3241

XR2C-3215

XR2P-3241

XR2E-3204

XR2P-@@41

(With DIP straight terminals)

Ordering Information

No. of

contacts Model

10 XR2P-1041

16 XR2P-1641

20 XR2P-2041

32 XR2P-3241

■Mated Dimensions

XR2P-@@41 with XR2C-@@11-N

Single-row IC Socket XR2P-3241 with XR2C-3215

Single-row Low-profile IC Socket XR2P-324 1 with XR2E-32 04 Single -

row Carrier Socket with Solder-

sleeve Terminals

Dimensions

No. of

contacts A (mm)

10 22.86

16 38.1

20 48.26

32 78.74

IC Sockets XR2 F-11

■Tools and Accessories

■Precautions

XR2Z-11

IC Holder (made from PBT) XR2Z-13

Note: Order the following models in multiples of the minimum order.

Model No. of IC Socket contacts IC socket width Order in multiples of

XR2Z-11 14, 16, 18, 20, 24 7.62 m 100

XR2Z-13 24, 28, 32, 40, 42, 48 15.24 mm 500

Note: This Holder protects the IC

from falling out due to shock.

The IC will not fall out even

with a 980 m/s2 shock. Appli-

cable IC height: 2.7 to 5.6 mm.

XY2C-0101

XY2C-0103

IC Removal Tool

Model No. of IC Socket contacts IC socket width

XY2C-0101 14, 16, 18, 20 7.62 m

XY2C-0103 24, 28, 32, 40 15.24 mm

Correct Use

Soldering

•When soldering, make sure that the outer

sleeve o f the IC Socket does not stick out

of the circuit board through-holes.

•Make sure that no flux enters the IC

Socket fr o m th e to p.

Removing ICs

•Use the XY2C-0101 or XY2C-0103 IC

Remov al Tool to remove ICs.

•Do not use a screwdriver to remove the

IC. It may damage the circuit board.

•Do not use a testing rod or check pin to

check contacts or circuits. This may dam-

age the inner clips or plating and may

lead to improper contact.

•F our-point contact construction is used for

plated products to make them mo re toler-

ant of momentary power interruptions.

We recommend using gold-plated con-

tacts in areas subject to vibration and

shock.

Automated Sold ering

Conditions (Jet Flow)

1. Soldering temperature: 250±5°C

2. Continuous soldering time: Within 5 s

Applicable IC Lead

Dimensions

1. Use leads that are within the range

shown here. For details, refer to page F-

1. Use an IC with leads longer than 3

mm. If the leads are too long, the IC will

not sit flush on the board.

2. Use an IC with tapered leads for easy

insertion, a minimum amount of bend-

ing, and minimum damage to the leads.

NG OK