TOSHIBA April 1997 TIM5964-16SL-251 1. RF PERFORMANCE SPECIFICATIONS (Ta=25 C) CHARACTERISTICS | SYMBOL | CONDITION | MIN. | TYP. |MAX.| UNIT Output Power at 1dB P1dB 41.5|42.5| |dBm Compression Point Power Gain at 1dB G1dB VDs= 10V 8.0 | | | dB Compression Point f= 5.9- 6.75GHz Drain Current IDS |44]50] A Power Added Efficiency Nada 34 % 3rd Order Intermodulation IM3 NOTE -42 | -45 | dBc Distortion Gain Flatness AG +0.8 | dB NOTE: Two Tone Test, Po=31.5dBm (Single Carrier Level) 2. ELECTRICAL CHARACTERISTICS (Ta= 25 C) CHARACTERISTICS | SYMBOL | CONDITION | MIN. | TYP. |MAX.| UNIT Transconductance gm Vpbs= 3V |3600| | mS IDS= 6A Pinch-off Voltage VGSoff |VDS= 3V -1.0 |-2.5 |-40] V IDS= 60mA Saturated Drain Current lIpss Vps= 3V |10.5;140] A VGs= 0V Gate-Source Vaso |ias= -200 pA -5 | V Breakdown Voltage Thermal Resistance Rth(c-c) _|Channel to Case] | 1.5 | 2.0 |C/W Channel-Temperature ATch VDSxIDSxRth(c-c) | | | 80 | C Rise Applications Engineering Solid-State Engineering Department TOSHIBA CORPORATION, Komukai Works ABSOLUTE MAXIMUM RATINGS (Ta = 25C) CHARACTERISTICS SYMBOL UNIT RATING Drain-Source Voitage Vos v 15 Gate-Source Voltage Ves Vv -5 Drain Current los A 14 Total Power Dissipation (Te = 25C) Py Ww 75 Channel Temperature Ton c 175 Storage Temperature Tg c 65~175 PACKAGE OUTLINE (2-16G1B) 0.7 +0.15 Unit in mm Cc C10 Oc ate i LL iN @ Source _ @ OCrain So a = | @ 3 2 < ~ a} | =f NN LITT x @U S Ns 20.4 +0.3 24.5 max. 16.4 max. 5.5 max. HANDLING PRECAUTIONS FOR PACKAGED TYPE Soldering iron should be grounded and the operating time should not exceed 10 seconds at 260C.