VND600SPTR-E - STMicroelectronics

February 2011 Doc ID 10876 Rev 3 1/26

VND600SP-E

Double channel high-side driver

Features

■ECOPACK®: lead free and RoHS compliant

■Automotive Grade: compliance with AEC

Guidelines

■Very low standby current

■CMOS compatible input

■Proportional load current sense

■Current sense disable

■Thermal shutdown protection and diagnosis

■Undervoltage shutdown

■Overvoltage clamp

■Load current limitation

Description

The VND600SP-E is a monolithic device made

using STMicroelectronics™ VIPower™ M0-3

technology. It is intended for driving resistive or

inductive loads with one side connected to

ground. Active VCC pin voltage clamp protects the

device against low energy spikes (see ISO7637

transient compatibility table).

This device has two channels in high-side

configuration; each channel has an analog sense

output on which the sensing current is

proportional (according to a known ratio) to the

corresponding load current.

Built-in thermal shutdown and outputs current

limitation protect the chip from overtemperature

and short circuit. Device turns-off in case of

ground pin disconnections.

Type RDS(on) Ilim VCC

VND600SP-E 30 mΩ 25 A 36 V

PowerSO-10™

Table 1. Device summary

Package

Order codes

Tube Tape and reel

PowerSO-10™ VND600SP-E VND600SPTR-E

www.st.com

Contents VND600SP-E
2/26 Doc ID 10876 Rev 3
Contents
Block diagram and pin description  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical specifications  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1 Absolute maximum ratings  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  6
2 Thermal data   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  7
3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
4 Electrical characteristics curves  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  14
Application information   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
1 GND protection network against reverse battery  . . . . . . . . . . . . . . . . . . .  16
1.1 Solution 1: resistor in the ground line (RGND only)  . . . . . . . . . . . . . . . . 16
1.2 Solution 2: diode (DGND) in the ground line  . . . . . . . . . . . . . . . . . . . . . 17
2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  17
3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  17
4 PowerSO-10 maximum demagnetization energy
(VCC = 13.5 V) 18
Package and PCB thermal data  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1 PowerSO-10 thermal data   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  19
Package and packing information  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
1 ECOPACK® packages  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  22
2 PowerSO-10 mechanical data  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  22
3 PowerSO-10 packing information  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  24
Revision history   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

VND600SP-E List of tables
Doc ID 10876 Rev 3 3/26
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Suggested connections for unused and not connected pins  . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 7. VCC - output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 8. Current sense 9 V ≤VCC ≤16 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 9. Switching (VCC = 13 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 10. Logic input (channel 1, 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 11. Truth table (per each channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 12. Electrical transient requirements on VCC pin (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 13. Electrical transient requirements on VCC pin (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 14. Electrical transient requirements on VCC pin (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 15. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 16. PowerSO-10 mechanical data  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 17. Document revision history  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

List of figures VND600SP-E
4/26 Doc ID 10876 Rev 3
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Current and voltage conventions  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. Switching characteristics (resistive load RL=2.6Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. IOUT/ISENSE versus IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 9. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 10. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 11. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 12. Input hysteresis voltage  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 13. Overvoltage shutdown  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 14. ILIM vs Tcase  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 15. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 16. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 17. On-state resistance vs Tcase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 18. On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 19. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 20. Maximum turn- off current versus load inductance(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 21. PowerSO-10 PC board(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 22. Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 23. PowerSO-10 thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . 20
Figure 24. Thermal fitting model of a double channel HSD in PowerSO-10 . . . . . . . . . . . . . . . . . . . . 20
Figure 25. PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 26. PowerSO-10 suggested pad layout and tube shipment (no suffix). . . . . . . . . . . . . . . . . . . 24
Figure 27. Tape and reel shipment (suffix “TR”)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

VND600SP-E Block diagram and pin description

Doc ID 10876 Rev 3 5/26

1 Block diagram and pin description

Figure 1. Block diagram

Figure 2. Configuration diagram (top view)

Table 2. Suggested connections for unused and not connected pins

Connection / pin Current sense N.C. Output Input

Floating X X X

To ground Through 1 KΩ

resistor XThrough 10 KΩ

resistor

LOGIC

UNDERVOLTAGE

OVERVOLTAGE

OVERTEMP. 1

OVERTEMP. 2

ILIM2

PwCLAMP 2

IOUT2

ILIM1

PwCLAMP 1

IOUT1

INPUT 1

INPUT 2

GND

VCC

OUTPUT 1

CURRENT

SENSE 1

OUTPUT 2

CURRENT

SENSE 2

DRIVER 2

DRIVER 1

VCC CLAMP

Ot1

Ot2

Ot1

Ot2

Vdslim1

Vdslim2

OUTPUT 2

N.C.

OUTPUT 1

GROUND

INPUT 2

INPUT 1

C.SENSE1

C.SENSE2

PowerSO-10

Electrical specifications VND600SP-E

6/26 Doc ID 10876 Rev 3

2 Electrical specifications

Figure 3. Current and voltage conventions

1) VFn = VCCn - VOUTn during reverse battery condition

2.1 Absolute maximum ratings

Stressing the device above the rating listed in Ta b l e 3 may cause permanent damage to the

device. These are stress ratings only and operation of the device at these or any other

conditions above those indicated in the operating sections of this specification is not implied.

Exposure to absolute maximum rating conditions for extended periods may affect device

reliability. Refer also to the STMicroelectronics sure program and other relevant quality

document.

GND

OUTPUT2

OUT2

SENSE2

CURRENT SENSE 1

SENSE1

OUT2

OUTPUT1

OUT1

CURRENT SENSE 2

SENSE2

SENSE1

OUT1

INPUT2

IN2

INPUT1

IN1

IN2

IN1

GROUND

F1 (1)

Table 3. Absolute maximum ratings

Symbol Parameter Value Unit

VCC DC supply voltage 41 V

-VCC Reverse supply voltage -0.3 V

- IGND DC reverse ground pin current -200 mA

IOUT Output current Internally limited A

IR Reverse output current -21 A

IIN Input current +/- 10 mA

VCSENSE Current sense maximum voltage -3

+15

VND600SP-E Electrical specifications

Doc ID 10876 Rev 3 7/26

2.2 Thermal data

VESD

Electrostatic discharge (Human Body Model:

R=1.5KΩ; C=100pF)

– INPUT

– CURRENT SENSE

–OUTPUT

–V

4000

2000

5000

EMAX

Maximum switching energy

(L = 0.13 mH; RL=0Ω; Vbat=13.5V;

Tjstart = 150 °C; IL=40A)

145 mJ

Ptot Power dissipation at Tc= 25 °C 96.1 W

TjJunction operating temperature Internally limited °C

TcCase operating temperature -40 to 150 °C

TSTG Storage temperature -55 to 150 °C

Table 3. Absolute maximum ratings (continued)

Symbol Parameter Value Unit

Table 4. Thermal data

Symbol Parameter Value Unit

Rthj-case Thermal resistance junction-case (max) 1.3 °C/W

Rthj-amb Thermal resistance junction-ambient (max) 51.3(1)

1. When mounted on a standard single sided FR-4 board with 0.5 cm2 of Cu (at least 35 μm thick).

37(2)

2. When mounted on a standard single-sided FR-4 board with 6 cm2 of Cu (at least 35 μm thick).

°C/W

Electrical specifications VND600SP-E

8/26 Doc ID 10876 Rev 3

2.3 Electrical characteristics

Values specified in this section are for 8 V < VCC < 36 V; -40 °C < Tj < 150 °C, unless

otherwise stated. (Per each channel).

Table 5. Power

Symbol Parameter Test conditions Min. Typ. Max. Unit

VCC (1)

1. Per device.

Operating supply

voltage 5.5 13 36 V

VUSD (1) Undervoltage shutdown 3 4 5.5 V

VOV (1)(2) Overvoltage shutdown 36 V

RON On-state resistance

IOUT =5A; T

j=25°C 30 mΩ

IOUT =5A; T

j= 150 °C 60 mΩ

IOUT =3A; V

CC =6V 100 mΩ

Vclamp Clamp voltage ICC =20mA

(2)

2. Vclamp and VOV are correlated. Typical difference is 5 V.

41 48 55 V

IS (1) Supply current

Off-state; VCC =13V;

VIN =V

OUT =0V 12 40 µA

Off-state; VCC=13V;

VIN =V

OUT =0V; T

j=25°C 12 25 mA

On-state; VIN =5V; V

CC =13V;

IOUT =0A; R

SENSE =3.9kΩ6mA

IL(off1) Off-state output current VIN =V

OUT = 0 V 0 50 µA

IL(off2) Off-state output current VIN =0V; V

OUT =3.5V -75 0 µA

IL(off3) Off-state output current VIN =V

OUT =0V;

VCC =13V; T

j =125°C 5µA

IL(off4) Off-state output current VIN =V

OUT =0V; V

CC =13V;

Tj =25°C 3µA

Table 6. Protection(1)

Symbol Parameter Test conditions Min. Typ. Max. Unit

Ilim DC short circuit current VCC = 13 V 25 40 70 A

5.5 V < VCC <36V 70 A

TTSD

Thermal shutdown

temperature 150 175 200 °C

TRThermal reset temperature 135 °C

THYST Thermal hysteresis 7 15 °C

VND600SP-E Electrical specifications

Doc ID 10876 Rev 3 9/26

Vdemag

Turn-off output voltage

clamp

IOUT =2A; V

IN =0V;

L=6mH VCC-41 VCC-

VCC-

55 V

VON

Output voltage drop

limitation

IOUT =0.5A

Tj= -40 °C...+150 °C 50 mV

1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related

diagnostic signals must be used together with a proper software strategy. If the device is subjected to

abnormal conditions, this software must limit the duration and number of activation cycles

Table 7. VCC - output diode

Symbol Parameter Test conditions Min Typ Max Unit

VFForward on voltage -IOUT = 2.6 A; Tj= 150 °C - - 0.6 V

Table 6. Protection(1) (continued)

Symbol Parameter Test conditions Min. Typ. Max. Unit

Table 8. Current sense 9 V ≤VCC ≤16 V

Symbol Parameter Test conditions Min Typ Max Unit

K1IOUT/ISENSE

IOUT1 or IOUT2 =0.5A;

VSENSE = 0.5 V; other channels

open; Tj= -40 °C...150 °C

3300 4400 6000

dK1/K1Current sense ratio drift

IOUT1 or IOUT2 =0.5A;

VSENSE = 0.5 V; other channels

open; Tj= -40 °C...150 °C

-10 +10 %

K2IOUT/ISENSE

IOUT1 or IOUT2 =5A; V

SENSE =4V;

other channels open; Tj=-40°C

Tj= 25 °C...150 °C

4200

4400

4900

6000

5750

dK2/K2Current sense ratio drift

IOUT1 or IOUT2 =5A; V

SENSE =4V;

other channels open;

Tj= - 40 °C...150 °C

-6 +6 %

K3IOUT/ISENSE

IOUT1 or IOUT2 =15A; V

SENSE =4V;

other channels open; Tj=- 40 °C

Tj= 25 °C...150 °C

4200

4400

4900

5500

5250

dK3/K3Current sense ratio drift

IOUT1 or IOUT2 =15A; V

SENSE =4V;

other channels open;

Tj= -40 °C...150 °C

-6 +6 %

VSENSE1,2

Max analog sense output

voltage

VCC = 5.5 V; IOUT1,2 =2.5A;

RSENSE =10kΩ2V

VCC >8V, I

OUT1,2 =5A;

RSENSE =10kΩ4V

VSENSEH

Analog sense output

voltage in overtemperature

condition

VCC =13V; R

SENSE =3.9kΩ5.5 V

Electrical specifications VND600SP-E

10/26 Doc ID 10876 Rev 3

RVSENSEH

Analog sense output

impedance in

overtemperature condition

VCC =13V; T

j>T

TSD;

All channels open 400 Ω

tDSENSE

Current sense delay

response to 90% ISENSE (1) 500 µs

1. Current sense signal delay after positive input slope.

Table 8. Current sense 9 V ≤VCC ≤16 V (continued)

Symbol Parameter Test conditions Min Typ Max Unit

Table 9. Switching (VCC =13V)

Symbol Parameter Test conditions Min Typ Max Unit

td(on) Turn-on delay time RL=2.6Ω (seeFigure 4)- 30-µs

td(off) Turn-on delay time RL=2.6Ω (seeFigure 4)- 30-µs

(dVOUT/dt)on Turn-on voltage slope RL=2.6Ω (see Figure 4)-Figure 15 -V/µs

(dVOUT/dt)off Turn-off voltage slope RL=2.6Ω (see Figure 4)-Figure 16 -V/µs

Table 10. Logic input (channel 1, 2)

Symbol Parameter Test conditions Min Typ Max Unit

VIL Input low level voltage 1.25 V

IIL Low level input current VIN =1.25V 1 µA

VIH Input high level voltage 3.25 V

IIH High level input current VIN = 3.25 V 10 µA

VI(hyst) Input hysteresis voltage 0.5 V

VICL Input clamp voltage IIN =1mA 6 6.8 8 V

IIN =-1mA -0.7 V

VND600SP-E Electrical specifications

Doc ID 10876 Rev 3 11/26

Figure 4. Switching characteristics (resistive load RL=2.6Ω)

Figure 5. IOUT/ISENSE versus IOUT

OUT

/dt

(on)

80%

10% t

OUT

/dt

(off)

SENSE

90%

d(off)

INPUT

90%

d(on)

DSENSE

0246810121416

3000

3500

4000

4500

5000

5500

6000

6500

min.Tj=-40°C

max.Tj=-40°C

min.Tj=25...150°C

max.Tj=25...150°C

typical value

OUT

SENSE

OUT

(A)

Electrical specifications VND600SP-E

12/26 Doc ID 10876 Rev 3

Table 11. Truth table (per each channel)

Conditions Input Output Sense

Normal operation L

Nominal

Overtemperature L

VSENSEH

Undervoltage L

Overvoltage L

Short circuit to GND

(Tj<TTSD) 0

(Tj>TTSD) VSENSEH

Short circuit to VCC

< Nominal

Negative output voltage

clamp LL0

VND600SP-E Electrical specifications

Doc ID 10876 Rev 3 13/26

Table 12. Electrical transient requirements on VCC pin (part 1)

ISO T/R 7637/1

test pulse

Test levels

I II III IV Delays and

impedance

1 -25 V -50 V -75 V -100 V 2 ms, 10 Ω

2 +25 V +50 V +75 V +100 V 0.2 ms, 10 Ω

3a -25 V -50 V -100 V -150 V 0.1 µs, 50 Ω

3b +25 V +50 V +75 V +100 V 0.1 µs, 50 Ω

4 -4 V -5 V -6 V -7 V 100 ms, 0.01 Ω

5 +26.5 V +46.5 V +66.5 V +86.5 V 400 ms, 2 Ω

Table 13. Electrical transient requirements on VCC pin (part 2)

ISO T/R 7637/1

Test pulse

Test levels results

I II III IV

1CCCC

2CCCC

3aCCCC

3bCCCC

4CCCC

5C E E E

Table 14. Electrical transient requirements on VCC pin (part 3)

Class Contents

CAll functions of the device are performed as designed after exposure to

disturbance.

One or more functions of the device is not performed as designed after exposure

to disturbance and cannot be returned to proper operation without replacing the

device.

Electrical specifications VND600SP-E

14/26 Doc ID 10876 Rev 3

Figure 6. Waveforms

SENSE

INPUT

NORMAL OPERATION

UNDERVOLTAGE

USD

USDhyst

INPUT

OVERVOLTAGE

SENSE

INPUT

SENSE

LOAD CURRENT

OVERTEMPERATURE

INPUT

SENSE

TSD

LOAD CURRENT

> V

< V

SHORT TO GROUND

INPUT

LOAD CURRENT

SENSE

LOAD VOLTAGE

INPUT

LOAD VOLTAGE

SENSE

LOAD CURRENT

<Nominal <Nominal

SHORT TO V

SENSE

SENSEH

VND600SP-E Electrical specifications

Doc ID 10876 Rev 3 15/26

2.4 Electrical characteristics curves

Figure 7. Off-state output current Figure 8. High level input current

Figure 9. Input low level Figure 10. Input high level

Figure 11. Input clamp voltage Figure 12. Input hysteresis voltage

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

0.5

1.5

2.5

3.5

4.5

IL(off1) (uA)

Off state

Vcc=36V

Vin=Vout=0V

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

0.5

1.5

2.5

3.5

4.5

Iih (uA)

Vin=3.25V

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

1.2

1.4

1.6

1.8

2.2

2.4

2.6

Vil (V)

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

2.2

2.4

2.6

2.8

3.2

3.4

3.6

Vih (V)

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

6.2

6.4

6.6

6.8

7.2

7.4

7.6

7.8

Vicl (V)

Iin=1mA

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

0.5

0.6

0.7

0.8

0.9

1.1

1.2

1.3

1.4

1.5

Vhyst (V)

Electrical specifications VND600SP-E

16/26 Doc ID 10876 Rev 3

Figure 13. Overvoltage shutdown Figure 14. ILIM vs Tcase

Figure 15. Turn-on voltage slope Figure 16. Turn-off voltage slope

Figure 17. On-state resistance vs Tcase Figure 18. On-state resistance vs VCC

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

Vov (V)

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

Ilim (A)

Vcc=13V

-50 -25 0 25 50 75 100 125 150 175

Tc (ºC)

250

300

350

400

450

500

550

600

650

700

750

dVout/dt(on) (V/ms)

Vcc=13V

Rl=2.6Ohm

-50 -25 0 25 50 75 100 125 150 175

Tc (ºC)

100

150

200

250

300

350

400

450

500

dVout/dt(off) (V/ms)

Vcc=13V

Rl=2.6Ohm

-75 -50 -25 0 25 50 75 100 125 150 175

Tc (°C)

100

Ron (mOhm)

Iout=5A

Vcc=8V & 36V

5 10152025303540

Vcc (V)

Ron (mOhm)

Iout=5A

Tc= 150°C

Tc= 25°C

Tc= - 40°C

VND600SP-E Application information

Doc ID 10876 Rev 3 17/26

3 Application information

Figure 19. Application schematic

3.1 GND protection network against reverse battery

3.1.1 Solution 1: resistor in the ground line (RGND only)

This can be used with any type of load.

The following is an indication on how to dimension the RGND resistor.

1. RGND ≤ 600 mV / IS(on)max

2. RGND ≥ (-VCC) / (-IGND)

where -IGND is the DC reverse ground pin current and can be found in the absolute

maximum rating section of the device’s datasheet.

Power dissipation in RGND (when VCC < 0: during reverse battery situations) is:

PD= (-VCC)2/ RGND

This resistor can be shared amongst several different HSDs. Please note that the value of

this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the

maximum on-state currents of the different devices.

Please note that if the microprocessor ground is not shared by the device ground then the

RGND produces a shift (IS(on)max * RGND) in the input thresholds and the status output

values. This shift varies depending on how many devices are ON in the case of several

high-side drivers sharing the same RGND.

If the calculated power dissipation leads to a large resistor or several devices have to share

the same resistor then ST suggests to utilize solution 2 (see Section 3.1.2).

GND OUTPUT2

CURRENT SENSE1

+5V

prot

SENSE2

OUTPUT1

SENSE1

INPUT1

GND

CURRENT SENSE2

INPUT2

prot

Application information VND600SP-E

18/26 Doc ID 10876 Rev 3

3.1.2 Solution 2: diode (DGND) in the ground line

A resistor (RGND = 1 kΩ) should be inserted in parallel to DGND if the device drives an

inductive load.

This small signal diode can be safely shared amongst several different HSDs. Also in this

case, the presence of the ground network produces a shift (∼600 mV) in the input threshold

and in the status output values if the microprocessor ground is not common to the device

ground. This shift does not vary if more than one HSD shares the same diode/resistor

network.

Series resistor in INPUT and STATUS lines are also required to prevent that, during battery

voltage transient, the current exceeds the absolute maximum rating.

Safest configuration for unused INPUT and STATUS pin is to leave them unconnected, while

unused SENSE pin has to be connected to ground pin.

3.2 Load dump protection

Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the

VCC max DC rating. The same applies if the device is subject to transients on the VCC line

that are greater than the ones shown in Ta bl e 1 2 .

3.3 MCU I/Os protection

If a ground protection network is used and negative transient are present on the VCC line,

the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent

the microcontroller I/Os pins to latch-up.

The value of these resistors is a compromise between the leakage current of microcontroller

and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of

microcontroller I/Os.

-VCCpeak/Ilatchup ≤ Rprot ≤ (VOHµC-VIH-VGND) / IIHmax

Calculation example:

For VCCpeak = -100 V and Ilatchup ≥ 20 mA; VOHµC ≥ 4.5 V

5kΩ ≤ Rprot ≤ 65 kΩ.

Recommended values:

Rprot =10 kΩ.

VND600SP-E Application information

Doc ID 10876 Rev 3 19/26

3.4 PowerSO-10 maximum demagnetization energy

(VCC = 13.5 V)

Figure 20. Maximum turn- off current versus load inductance(1)

1. Values are generated with RL=0

In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed

the temperature specified above for curves B and C.

C: Repetitive pulse at Tjstart =125°C

A: A single pulse at Tjstart = 150 °C

B: Repetitive pulse at Tjstart = 100 °C

Condition:

VCC = 13.5 V

VIN, IL

Demagnetization Demagnetization Demagnetization

Package and PCB thermal data VND600SP-E

20/26 Doc ID 10876 Rev 3

4 Package and PCB thermal data

4.1 PowerSO-10 thermal data

Figure 21. PowerSO-10 PC board(1)

1. Layout condition of Rth and Zth measurements (PCB FR4 area= 58 mm x 58 mm, PCB thickness=2 mm,

Cu thickness = 35 µm, Copper areas: from minimum pad lay-out to 8 cm2).

Figure 22. Rthj-amb vs PCB copper area in open box free air condition

0246810

PCB Cu heatsink area (cm^2)

RTHj_amb (°C/W)

Tj-Tamb=50°C

VND600SP-E Package and PCB thermal data

Doc ID 10876 Rev 3 21/26

Figure 23. PowerSO-10 thermal impedance junction ambient single pulse

Equation 1: pulse calculation formula

Figure 24. Thermal fitting model of a double channel HSD in PowerSO-10

ZTHδRTH δZTHtp 1δ–()+⋅=

where

δtpT⁄=

T_amb

Pd1

C3 C4

R3R1 R6R5R2

C5 C6C2

Pd2

C1 C2

Tj_1

Tj_2

Package and PCB thermal data VND600SP-E

22/26 Doc ID 10876 Rev 3

Table 15. Thermal parameter

Area/island (cm2) Footprint 6

R1 (°C/ W) 0.05

R2 (°C/ W) 0.3

R3 (°C/ W) 0.3

R4 (°C/ W) 0.8

R5 (°C/ W) 12

R6 (°C/ W) 37 22

C1 (W.s/ °C) 0.001

C2 (W.s /°C) 5.00E-03

C3 (W.s/ °C) 0.02

C4 (W.s/ °C) 0.3

C5 (W.s/ °C) 0.75

C6 (W.s/ °C) 3 5

VND600SP-E Package and packing information

Doc ID 10876 Rev 3 23/26

5 Package and packing information

5.1 ECOPACK® packages

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

5.2 PowerSO-10 mechanical data

Figure 25. PowerSO-10 package dimensions

DETAIL "A"

PLANE

SEATING

= =

0.10 A

DETAIL "A"

SEATING

PLANE

0.25

Package and packing information VND600SP-E

24/26 Doc ID 10876 Rev 3

Table 16. PowerSO-10 mechanical data

Dim.

Millimeters

Min. Typ. Max.

A 3.35 3.65

A(1)

1. Muar only POA P013P.

3.4 3.6

A1 0 0.10

B 0.40 0.60

B(1) 0.37 0.53

C 0.35 0.55

C(1) 0.23 0.32

D 9.40 9.60

D1 7.40 7.60

E 9.30 9.50

E2 7.20 7.60

E2(1) 7.30 7.50

E4 5.90 6.10

E4(1) 5.90 6.30

e1.27

F 1.25 1.35

F(1) 1.20 1.40

H 13.80 14.40

H(1) 13.85 14.35

h0.50

L 1.20 1.80

L(1) 0.80 1.10

a0° 8°

α(1) 2° 8°

VND600SP-E Package and packing information

Doc ID 10876 Rev 3 25/26

5.3 PowerSO-10 packing information

Figure 26. PowerSO-10 suggested pad layout and tube shipment (no suffix)

Figure 27. Tape and reel shipment (suffix “TR”)

6.30

10.8 - 11

14.6 - 14.9

9.5

1.27

0.67 - 0.73

0.54 - 0. 6

All dimensions are in mm.

Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1)

Casablanca 50 1000 532 10.4 16.4 0.8

Muar 50 1000 532 4.9 17.2 0.8

REEL DIMENSIONS

All dimensions are in mm.

Base Q.ty 600

Bulk Q.ty 600

A (max) 330

B (min) 1.5

C (± 0.2) 13

F20.2

G (+ 2 / -0) 24.4

N (min) 60

T (max) 30.4

TAPE DIMENSIONS

According to Electronic Industries Association

(EIA) Standard 481 rev. A, Feb. 1986

All dimensions are in mm.

Tape width W 24

Tape Hole Spacing P0 (± 0.1) 4

Component Spacing P 24

Hole Diameter D (± 0.1/-0) 1.5

Hole Diameter D1 (min) 1.5

Hole Position F (± 0.05) 11.5

Compartment Depth K (max) 6.5

Hole Spacing P1 (± 0.1) 2

Top

cover

tape

End

Start

No componentsNo components Components

500mm min

Empty components pockets

saled with cover tape.

User direction of feed

Revision history VND600SP-E

26/26 Doc ID 10876 Rev 3

6 Revision history

Table 17. Document revision history

Date Revision Changes

01-Oct-2004 1 Initial release.

28-Jun-2010 2 Changed Features list.

Reformatted entire document. No content change.

11-Feb-2011 3

Updated Features list.

Updated following tables:

–Ta bl e 5 : Pow e r

–Table 8: Current sense 9 V

≤

VCC

≤

16 V

VND600SP-E

26/26 Doc ID 10876 Rev 3

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