HLMP-Cx1A/1B/2A/2B/3A/3B
New 5mm Blue and Green LED Lamps
Data Sheet
CAUTION: INGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN – 1142 for additional details.
Description
These high intensity blue and green T-1¾ package LEDs
are untinted and non-di used. Based on the most e cient
and cost e ective InGaN material technology and incor-
porating second generation optics they produce well
de ned spatial radiation patterns at speci c viewing cone
angles.
Advanced optical grade epoxy construction o ers superior
high temperature and moisture resistance performance in
outdoor signal and sign applications. The epoxy contains
UV inhibitor ro reduce the e ects of long term exposure
to direct sunlight.
Features
Well de ned spatial radiation pattern
High luminous output
Untinted, Non-di used
Available in Color:
– Blue 470nm
– Green 525nm
Viewing Angle: 15°, 23° and 30°
Stando or non-stando
Superior resistance to moisture
Applications
Commercial outdoor advertising
Tra c Sign
Variable Message Sign
2
Package Dimensions
Drawing A (Non-stando )
Drawing B (Stando )
cathode
flat
Cathode
d
1.00 ± 0.20
0.039 ± 0.008
1.30 ± 0.15
0.051 ± 0.006
8.70 ± 0.20
0.343 ± 0.008
5.00 ± 0.20
0.197 ± 0.008
5.80 ± 0.20
0.228 ± 0.008
2.54 ± 0.38
0.100 ± 0.015
0.70 max
0.028
31.60 min
1.244
sq. typ.0.50 ± 0.10
0.020 ± 0.004
1.00 min
0.039
Viewing Angle d
HLMP-Cx1B 12.96±0.25
(0.510±0.010)
HLMP-Cx2B 12.32 ±0.25
(0.485±0.010)
HLMP-Cx3B 12.00±0.25
(0.472±0.010)
Notes:
1. All dimensions are in millimeters (inches)
2. Leads are mild steel with tin plating.
3. The epoxy meniscus is 1.50mm max
1.00 ± 0.20
0.039 ± 0.008
0.70 max
0.028
8.70 ± 0.20
0.343 ± 0.008
5.00 ± 0.20
0.197 ± 0.008
31.60 min
1.244
Cathode
1.00 min
0.039
sq. typ.0.50 ± 0.10
0.020 ± 0.004
2.54 ± 0.38
0.100 ± 0.015
cathode
flat
5.80 ± 0.20
0.228 ± 0.008
3
Device Selection Guide
Part Number Color
Typical Viewing
angle, 2½ (°) [4]
Luminous Intensity Iv (mcd) at 20
mA [1,2,5] Stando /
Non Stando
Package
drawingMin Max
HLMP-CB1A-XY0DD Blue 15° 7200 12000 Non Stando A
HLMP-CB1A-XYBDD
HLMP-CB1A-XYCDD
HLMP-CB1B-XY0DD Stando B
HLMP-CB1B-XYBDD
HLMP-CB1B-XYCDD
HLMP-CB2A-VW0DD 23° 4200 7200 Non Stando A
HLMP-CB2A-VWBDD
HLMP-CB2A-VWCDD
HLMP-CB2B-VW0DD Stando B
HLMP-CB2B-VWBDD
HLMP-CB2B-VWCDD
HLMP-CB3A-UV0DD 30° 3200 5500 Non Stando A
HLMP-CB3A-UVBDD
HLMP-CB3A-UVCDD
HLMP-CB3B-UV0DD Stando B
HLMP-CB3B-UVBDD
HLMP-CB3B-UVCDD
HLMP-CM1A-450DD Green 15° 35000 59000 Non Stando A
HLMP-CM1A-45BDD
HLMP-CM1A-45CDD
HLMP-CM1B-450DD Stando B
HLMP-CM1B-45BDD
HLMP-CM1B-45CDD
HLMP-CM2A-120DD 23° 16000 27000 Non Stando A
HLMP-CM2A-12BDD
HLMP-CM2A-12CDD
HLMP-CM2B-120DD Stando B
HLMP-CM2B-12BDD
HLMP-CM2B-12CDD
HLMP-CM3A-Z10DD 30° 12000 21000 Non Stando A
HLMP-CM3A-Z1BDD
HLMP-CM3A-Z1CDD
HLMP-CM3B-Z10DD Stando B
HLMP-CM3B-Z1BDD
HLMP-CM3B-Z1CDD
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. ½ is the o -axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each bin limit is ± 15%
4
Part Numbering System
Note: please refer to AB 5337 for complete information on part numbering system
Packaging Option
DD: Ammo Pack
Color Bin Selection
0: Full Distribution
B: Color Bin 2 & 3
C: Color Bin 3 & 4
Maximum Intensity Bin
0: No maximum intensity limit (refer to selection guide)
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle and Lead Standoffs
1A: 15° without lead standoff
1B: 15° with lead standoff
2A: 23° without lead standoff
2B: 23° with lead standoff
3A: 30° without lead standoff
3B: 30° with lead standoff
Color
B: Blue 470
M: Green 525
HLMP C x xx x x x xx
Absolute Maximum Ratings
TJ = 25°C
Parameter Blue / Green Unit
DC Forward Current [1] 30 mA
Peak Forward Current 100 [2] mA
Power Dissipation 116 mW
Reverse Voltage 5 V
LED Junction Temperature 110 °C
Operating Temperature Range -40 to + 85 °C
Storage Temperature Range -40 to + 100 °C
Notes:
1. Derate linearly as shown in gure 4.
2. Duty Factor 10%, frequency 1KHz.
5
Electrical / Optical Characteristics
TJ = 25°C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage
Green / Blue
VF
2.8 3.2 3.8
VI
F = 20 mA
Reverse Voltage VR5V
IR = 10 A
Dominant Wavelength[1]
Green
Blue
d
519.0
460.0
525.0
470.0
539.0
480.0
nm IF = 20 mA
Peak Wavelength
Green
Blue
PEAK
516
464
nm Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Spectral Half Width
Green
Blue
1/2
30
23
nm IF = 20mA
Thermal Resistance RJ-PIN 240 °C/W LED Junction-to-Pin
Luminous E cacy [2]
Green
Blue
V
518
78
lm/W Emitted Luminous Flux /
Emitted Radiant Flux
Thermal coe cient of d
Green
Blue
0.028
0.024
nm/°C IF = 20 mA ; +25°C ≤ TJ ≤ +100°C
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/V where IV is the luminous intensity in candelas and V is
the luminous e cacy in lumens/watt.
6
Figure 1. Relative Intensity vs Wavelength Figure 2. Forward Current vs Forward Voltage
Figure 3. Relative Intensity vs Forward Current Figure 4. Maximum Forward Current vs Ambient Temperature
Figure 5. Relative Dominant Wavelength Shift vs Forward Current Figure 6. Radiation Pattern for 15°
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630
WAVELENGTH - nm
RELATIVE INTENSITY
GREENBLUE
0
20
40
60
80
100
012345
FORWARD VOLTAGE-V
FORWARD CURRENT-mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
020406080100 120
DC FORWARD CURRENT-mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
GREEN
BLUE
-10
-5
0
5
10
0 20406080100
FORWARD CURRENT-mA
RELATIVE DOMINANT
WAVELENGTH SHIFT -nm
GREEN
BLUE
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT -DEGREE
NORMALIZED INTENSITY
0
5
10
15
20
25
30
35
0 20 40 60 80 100
TA - AMBIENT TEMPERATURE - °C
IFmax - MAXIMUM FORWARD
CURRENT - mA
7
Figure 7. Radiation Pattern for 23° Figure 8. Radiation Pattern for 30°
Figure 9. Relative Light Output vs Junction Temperature Figure 10. Relative Forward Voltage vs Junction Temperature
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREE
NORMALIZED INTENSITY
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREE
NORMALIZED INTENSITY
0.1
1
10
-40 -200 20406080100 120
TJ - JUNCTION TEMPERATURE TJ - JUNCTION TEMPERATURE
NORMALZIED INTENSITY (PHOTO)
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
-40 -20 0 20 40 60 80 100 120
FORWARD VOLTAGE SHIFT-V
Green
Blue
Green
Blue
8
Intensity Bin Limit Table (1.3:1 Iv bin ratio)
Bin
Intensity (mcd) at 20mA
Min Max
U 3200 4200
V 4200 5500
W 5500 7200
X 7200 9300
Y 9300 12000
Z 12000 16000
1 16000 21000
2 21000 27000
3 27000 35000
4 35000 45000
5 45000 59000
Tolerance for each bin limit is ± 15%
Blue Color Bin Table
Bin
Min
Dom
Max
Dom
Corner
Point Chromaticity Coordinate
1 460 464 x 0.1440 0.1818 0.1766 0.1374
y 0.0297 0.0904 0.0966 0.0374
2 464 468 x 0.1374 0.1766 0.1699 0.1291
y 0.0374 0.0966 0.1062 0.0495
3 468 472 x 0.1291 0.1699 0.1616 0.1187
y 0.0495 0.1062 0.1209 0.0671
4 472 476 x 0.1187 0.1616 0.1517 0.1063
y 0.0671 0.1209 0.1423 0.0945
5 476 480 x 0.1063 0.1517 0.1397 0.0913
y 0.0945 0.1423 0.1728 0.1327
Tolerance for each bin limit is ± 0.5 nm
Green Color Bin Table
Bin
Min
Dom
Max
Dom
Corner
Point Chromaticity Coordinate
1 519 523 x 0.0667 0.1200 0.1450 0.0979
y 0.8323 0.7375 0.7319 0.8316
2 523 527 x 0.0979 0.1450 0.1711 0.1305
y 0.8316 0.7319 0.7218 0.8189
3 527 531 x 0.1305 0.1711 0.1967 0.1625
y 0.8189 0.7218 0.7077 0.8012
4 531 535 x 0.1625 0.1967 0.2210 0.1929
y 0.8012 0.7077 0.6920 0.7816
5 535 539 x 0.1929 0.2210 0.2445 0.2233
y 0.7816 0.6920 0.6747 0.7600
Tolerance for each bin limit is ± 0.5 nm.
Note:
1. All bin categories are established for classi cation of products. Products may not be available in all bin categories. Please contact your Avago
representative for further information.
9
Precautions:
Lead Forming:
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
LED component may be e ectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
ESD precaution must be properly applied on the
1.59mm
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature 105°C Max. -
Preheat time 60 sec Max -
Peak temperature 260°C Max. 260°C Max.
Dwell time 5 sec Max. 5 sec Max
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering pro le to ensure that it is always conforming
to recommended soldering conditions.
Note:
1. PCB with di erent size and design (component density) will have
di erent heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
pro le again before loading a new type of PCB.
Avago Technologies LED Con guration
Any alignment xture that is being applied during
wave soldering should be loosely tted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment xture or pallet.
If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using re ow soldering prior to insertion the TH LED.
Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause di culty inserting the TH LED.
Refer to application note AN5334 for more information about
soldering and handling of high brightness TH LED lamps.
CATHODE
InGaN Device
10
Example of Wave Soldering Temperature Pro le for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C ± 5°C
(maximum peak temperature = 260°C)
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
60 sec Max
TIME (sec)
260°C Max
105°C Max
TEMPERATURE (°C)
Ammo Packs Drawing
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless stando or non-stando
6.35 ± 1.30
0.250 ± 0.051
12.70 ± 1.00
0.500 ± 0.039
9.125 ± 0.625
0.3595 ± 0.0245
9.125 ± 0.625
0.3595 ± 0.0245
18.00 ± 0.50
0.7085 ± 0.0195
0.70 ± 0.20
0.0275 ± 0.0075 AA
12.70 ± 0.30
0.500 ± 0.012
VIEW AA
4.00 ± 0.20
0.1575 ± 0.0075
ØTYP.
20.5 ± 1.00
0.8070 ± 0.0394
CATHODE
11
Packaging Box for Ammo Packs
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
LABEL ON THIS
SIDE OF BOX
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS.
ANODE LEAD LEAVES
THE BOX FIRST.
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 260C
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Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved.
AV02-2228EN - March 7, 2012
(ii) Avago Baby Label (Only available on bulk packaging)
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Color Bin
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
260C
Lam
p
s Bab
y
Label
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