• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
1
SURMOUNTTM PIN Diodes:
RoHS
Rev. V6
MADP-042XX5-13060 Series
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Features
Surface Mount
No Wirebonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
High Average and Peak Power Handling
RoHS Compliant
Description
This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM Tech’s patented HMICTM proc-
ess. This device features two silicon pedestals embedded
in a low loss, low dispersion glass. The diode is formed on
the top of one pedestal and connections to the backside of
the device are facilitated by making the pedestal sidewalls
electrically conductive. Selective backside metallization is
applied producing a surface mount device. This vertical
topology provides for exceptional heat transfer. The
topside is fully encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact protection.
These protective coatings prevent damage to the junction
and the anode air-bridge during handling and assembly.
Applications
These packageless devices are suitable for moderate
incident power applications, ≤ 10W/C.W. or where the
peak power is ≤ 50W, pulse width is ≤ 1μS, and duty cycle
is ≤ 0.01%. Their low parasitic inductance, 0.4 nH, and
excellent RC constant, make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts.
INCHES MM
MIN MAX MIN MAX
A 0.040 0.042 1.025 1.075
B 0.021 0.023 0.525 0.575
C 0.004 0.008 0.102 0.203
D 0.013 0.015 0.325 0.375
E 0.011 0.013 0.275 0.325
F 0.013 0.015 0.325 0.375
G 0.019 0.021 0.475 0.525
DIM
Parameter Absolute Maximum
MADP-042…-13060 305 405 505 905
C.W. Incident Power dBm 40 44 43 35
Forward Current 250 mA
Reverse Voltage -80 V
Operating Temperature -55°C to +125°C
Storage Temperature -55°C to +150°C
Junction Temperature +175°C
Mounting Temperature +280°C for 10 seconds
Absolute Maximum Ratings1@ TAMB = +25°C
(unless otherwise specified)
1. Exceeding these limits may cause permanent damage.
G
D E F
Notes:
1. Backside metal: 0.1 μM thick.
2. Yellow hatched areas indicate backside ohmic gold contacts.
3. All devices have the same outline dimensions ( A to G).
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
2
SURMOUNTTM PIN Diodes:
RoHS
Rev. V6
MADP-042XX5-13060 Series
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Specifications Subject to Change Without Notice.
Electrical Specifications @ TAMB = + 25 °C
Parameter Symbol Conditions Min Typ Max Min Typ Max
MADP-042305-13060 MADP-042505-13060
Capacitance CT1,3 - 10V, 1 MHz 1 pF 0.14 0.22 0.28 0.40
Capacitance CT1,3 - 10 V, 1 GHz 1,3 pF 0.15 0.28
Capacitance CT1,3 - 40 V, 1 MHz 1 pF 0.13 0.22 0.27 0.40
Capacitance CT1,3 - 40 V, 1 GHz 1,3 pF 0.14 0.27
Resistance RS2,3 + 20 mA, 1 GHz 2,3 W 1.32 0.83
Forward Voltage VF + 10 mA V 0.87 1.00 0.84 1.00
Reverse Leakage
Current IR -80V uA 10 10
Input Third Order
Intercept Point IIP3
F 1= 1000 MHz
F2 = 1010 MHz
Input Power = +20 dBm
I bias = + 20 mA
dBm 72 76
C.W. Thermal
Resistance θ °C/W 145 115
Lifetime TL +10 mA / -6 mA
( 50% - 90% V ) nS 180 210
Units
Resistance RS2,3 + 50 mA, 1 GHz 2,3 W 1.18 0.76
Parameter Symbol Conditions Min Typ Max Min Typ Max
MADP-042405-13060 MADP-042905-13060
Capacitance CT1,3 - 10 V, 1 MHz 1 pF 0.61 0.75 0.06 0.18
Capacitance CT1,3 - 10 V, 1 GHz 1,3 pF 0.61 0.06
Capacitance CT1,3 - 40 V, 1 MHz 1 pF 0.57 0.75 0.06 0.18
Capacitance CT1,3 - 40 V, 1 GHz 1,3 pF 0.58 0.06
Resistance RS2,3 + 20 mA, 1 GHz 2,3 W 0.62 3.14
Forward Voltage VF + 10 mA V 0.82 1.00 0.93 1.00
Reverse Leakage
Current IR -80V uA 10 10
Input Third Order
Intercept Point IIP3
F 1= 1000 MHz
F2 = 1010 MHz
Input Power = +20 dBm
I bias = + 20 mA
dBm 80 65
C.W. Thermal
Resistance θ4 °C/W 100 185
Lifetime TL +10 mA / -6 mA
( 50% - 90% V ) nS 255 140
Units
Resistance RS2,3 + 50 mA, 1 GHz 2,3 W 0.58 2.60
1. Total capacitance, CT, is equivalent to the sum of junction capacitance ,CJ , and parasitic capacitance, Cpar.
2. Series resistance RS is equivalent to the total diode resistance : RS = RJ ( Junction Resistance) + RC ( Ohmic Resistance)
3. RS and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-1134 package.
4. Theta (θ) is measured with the die mounted in an ODS-1134 package.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
3
SURMOUNTTM PIN Diodes:
RoHS
Rev. V6
MADP-042XX5-13060 Series
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Typical Performance @ TAMB = +25 °C
Rs @ 1GHz
0.100
1.000
10.000
0.001 0.010 0.100
Bias (A )
Rs (o hm)
042905
042305
042505
042405
Ct @ 1GHz
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.800
0 5 10 15 20 25 30 35 40
Bias (V)
Ct (pF)
042905
042305
042505
042405
Ct vs. V Rs vs. I
Ct @ 40V
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.00E+
00 2.00E+
08 4.00E+
08 6.00E+
08 8.00E+
08 1.00E+
09 1.20E+
09 1.40E+
09 1.60E+
09 1.80E+
09
Freq (Hz)
Ct (pF)
042905
042305
042505
042405
Ct @ 10V
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.00E+
00 2.00E+
08 4.00E+
08 6.00E+
08 8.00E+
08 1.00E+
09 1.20E+
09 1.40E+
09 1.60E+
09 1.80E+
09
Freq (Hz)
Ct (pF)
042905
042305
042505
042405
Ct vs. F Ct vs. F
Rs @ 20m A
0.00E+00
5.00E-01
1.00E+00
1.50E+00
2.00E+00
2.50E+00
3.00E+00
3.50E+00
4.00E+00
0.00E+
00 2.00E+
08 4.00E+
08 6.00E+
08 8.00E+
08 1.00E+
09 1.20E+
09 1.40E+
09 1.60E+
09 1.80E+
09
Fr eq (Hz)
Rs (ohm)
042905
042305
042505
042405
Rs @ 10m A
0.00E+00
5.00E-01
1.00E+00
1.50E+00
2.00E+00
2.50E+00
3.00E+00
3.50E+00
4.00E+00
4.50E+00
0.00E+
00 2.00E+
08 4.00E+
08 6.00E+
08 8.00E+
08 1.00E+
09 1.20E+
09 1.40E+
09 1.60E+
09 1.80E+
09
Fr eq (Hz)
Rs (ohm)
042905
042305
042505
042405
Rs vs. F Rs vs. F
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
4
SURMOUNTTM PIN Diodes:
RoHS
Rev. V6
MADP-042XX5-13060 Series
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The
use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should
insure that abrasion and mechanical shock are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently
located on the bottom surface of these devices and are removed from the active junction locations. These devices are well
suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is
recommended. For applications where the average power is ~1W, conductive silver epoxy may also be used. Cure per
manufacturers recommended time and temperature. Typically 1 hour at 150°C.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. A vacuum tip pick-up tool and a force of
60 to100 grams applied to the top surface of the device is recommended. When soldering to soft substrates, such as Duroid, it
is recommended to use a soft solder at the circuit board to mounting pad interface. Position the die so that its mounting pads
are aligned with the circuit board mounting pads. While applying a downward force perpendicular to the top surface of the die,
apply heat near the circuit trace and diode mounting pad. The solder connection to the two pads should not be made one at a
time as this will create unequal heat flow and thermal stress to the part. Solder reflow should not be performed by causing heat
to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads
can be visually inspected through the die after attachment is completed.
Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in Application Note M538 , “Surface Mounting
Instructions“ and can viewed on the MA-COM website @ www.macomtech.com
Ordering Information
The MADP-042XX5-13060 series of surmounts may be ordered in either gel packs or tape and reeled by adding the
appropriate suffix per the table below. Tape and reel dimensions are provided in Application Note M513 located on the
M/A-COM Tech’s website @ www.macomtech.com.
Part Number
Gel Pack Tape and Reel Tape and Reel
Surf Tape Pocket Tape
MADP-042305-13060G MADP-042305-13060T MADP-042305-13060P
MADP-042405-13060G MADP-042405-13060T MADP-042405-13060P
MADP-042505-13060G MADP-042505-13060T MADP-042505-13060P
MADP-042905-13060G MADP-042905-13060T MADP-042905-13060P
