SL2MOS5401EV,118 - NXP Semiconductors

1. General description

This document gives specifications for the product SL2MOS5401.

•The SL2MOS5401 is the integrated circuit SL2ICS5401 in the package SOT500AA1.

Therefore this document encompasses all information not covered by the specification of

the package and/or the functional specification of the integrated circuit.

•Detailed information on the package is given in the contactless chip card module

specification.

•Functionality of the integrated circuit is described in the “Product data sheet

SL2ICS53/SL2ICS54”.

2. Ordering information

3. Specifications

3.1 Chip

Functionality of the integrated circuit is described in the “Product data sheet

SL2ICS53/SL2ICS54”.

SL2MOS5401

Addendum contactless chip card module specification

Rev. 3.0 — 15 January 2009 Product data sheet

168230 PUBLIC

Table 1. Ordering information

Type number Package

Name Description Version

SL2MOS5401EV PLLMC Plastic leadless module carrier package; 35 mm wide tape SOT500

Product data sheet Rev. 3.0 — 15 January 2009 2 of 6

NXP Semiconductors SL2MOS5401

Addendum contactless chip card module specification

4. Limiting values

[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at these or any conditions other

than those described in the Operating Conditions and Electrical Characteristics section of this specification

is not implied.

[2] This product includes circuitry specifically designed for the protection of its internal devices from the

damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be

taken to avoid applying greater than the rated maxima.

[3] MIL-STD-883D, Method 3015.7, Human Body Model.

[4] The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to

parameter ILA-LB).

Table 2. Limiting values [1][2]

In accordance with the Absolute Maximum Rating System (IEC 60134).

Processing temperature: refer to “Contactless chip card module specification”

Symbol Parameter Conditions Min Max Unit

Tstg storage temperature −25 +85 °C

VESD electrostatic discharge voltage [3] -±2kV

peak

Imax LA-LB maximum input peak current −60 +60 mApeak

Tjop operating junction temperature −25 +85 °C

ILA-LB input current [4] -30mA

rms

Product data sheet Rev. 3.0 — 15 January 2009 3 of 6

NXP Semiconductors SL2MOS5401

Addendum contactless chip card module specification

5. Characteristics

5.1 Electrical characteristics

[1] Typical ratings are not guaranteed. These values listed are at room temperature.

[2] Bandwidth limitation (± 7 kHz) according to ISM band regulations.

[3] Measured with an HP 4285A LCR meter at 13.56 MHz.

[4] Including losses in resonant capacitor and rectifier.

[5] Refer to ISO/IEC 15693-2 and ISO/IEC 15693-3 including pulse shapes and tolerances; proper coil design assumed

6. References

[1] Data sheet — Product data sheet SL2ICS53/SL2ICS54

Table 3. Characteristics[1]

Symbol Parameter Conditions Min Typ Max Unit

Top = −25 to 85 °C

VLA-LB minimum supply voltage for

READ/WRITE/EAS

± 2.5 ± 2.6 ± 2.9 Vrms

fop operating frequency [2] 13.553 13.560 13.567 MHz

Cres input capacitance between

LA – LB

VLA-LB = 2 Vrms [3] 92 97 102 pF

Pmin minimum operating supply

power

[4] -280-μW

m modulation of RF voltage for

demodulator response

[5] ---%

tPsm modulation pulse length

of RF voltage

[5] ---μs

tDdemodulator response time m ≥ 10 %, 100 %[5] ---μs

Rmod load modulation [5] ---Ω

EEPROM characteristics:

tret data retention time Tamb ≤ 55 °C 10 - year

nendu(W) write endurance 100000 - - cycle

minmax

V+ V

V- V

Product data sheet Rev. 3.0 — 15 January 2009 4 of 6

NXP Semiconductors SL2MOS5401

Addendum contactless chip card module specification

7. Revision history

Table 4. Revision history

Document ID Release date Data sheet status Change notice Supersedes

168230 20090115 Product data sheet - -

Product data sheet Rev. 3.0 — 15 January 2009 5 of 6

NXP Semiconductors SL2MOS5401

Addendum contactless chip card module specification

8. Legal information

8.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

8.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

8.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/profile/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conflict between information in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

8.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

I-CODE — is a trademark of NXP B.V.

9. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

NXP Semiconductors SL2MOS5401

Addendum contactless chip card module specification

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 15 January 2009

Document identifier: 168230

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

10. Tables

Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .1

Table 2. Limiting values [1][2] . . . . . . . . . . . . . . . . . . . . . . .2

Table 3. Characteristics[1] . . . . . . . . . . . . . . . . . . . . . . . . 3

Table 4. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 4

11. Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 1

2 Ordering information. . . . . . . . . . . . . . . . . . . . . 1

3 Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3.1 Chip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

5.1 Electrical characteristics . . . . . . . . . . . . . . . . . . 3

6 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 5

8.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 5

8.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

9 Contact information. . . . . . . . . . . . . . . . . . . . . . 5

10 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6