SL2MOS5401 Addendum contactless chip card module specification Rev. 3.0 -- 15 January 2009 Product data sheet 168230 PUBLIC 1. General description This document gives specifications for the product SL2MOS5401. * The SL2MOS5401 is the integrated circuit SL2ICS5401 in the package SOT500AA1. Therefore this document encompasses all information not covered by the specification of the package and/or the functional specification of the integrated circuit. * Detailed information on the package is given in the contactless chip card module specification. * Functionality of the integrated circuit is described in the "Product data sheet SL2ICS53/SL2ICS54". 2. Ordering information Table 1. Ordering information Type number Package Name Description Version SL2MOS5401EV PLLMC Plastic leadless module carrier package; 35 mm wide tape SOT500 3. Specifications 3.1 Chip Functionality of the integrated circuit is described in the "Product data sheet SL2ICS53/SL2ICS54". SL2MOS5401 NXP Semiconductors Addendum contactless chip card module specification 4. Limiting values Table 2. Limiting values [1][2] In accordance with the Absolute Maximum Rating System (IEC 60134). Processing temperature: refer to "Contactless chip card module specification" Symbol Parameter Tstg storage temperature Conditions VESD electrostatic discharge voltage Imax LA-LB maximum input peak current Tjop operating junction temperature ILA-LB input current [4] Max Unit -25 +85 C - 2 kVpeak -60 +60 mApeak -25 +85 C - 30 mArms [1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical Characteristics section of this specification is not implied. [2] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima. [3] MIL-STD-883D, Method 3015.7, Human Body Model. [4] The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to parameter ILA-LB). 168230 Product data sheet [3] Min (c) NXP B.V. 2009. All rights reserved. Rev. 3.0 -- 15 January 2009 2 of 6 SL2MOS5401 NXP Semiconductors Addendum contactless chip card module specification 5. Characteristics 5.1 Electrical characteristics Table 3. Characteristics[1] Symbol Parameter Conditions Min Typ Max Unit 2.5 2.6 2.9 Vrms Top = -25 to 85 C VLA-LB minimum supply voltage for READ/WRITE/EAS fop operating frequency [2] 13.553 13.560 13.567 MHz Cres input capacitance between LA - LB [3] 92 97 102 pF Pmin minimum operating supply power [4] - 280 - W m modulation of RF voltage for demodulator response [5] - - - % tPsm modulation pulse length of RF voltage [5] - - - s tD demodulator response time [5] - - - s Rmod load modulation [5] - - - - year - cycle VLA-LB = 2 Vrms m = Vmax - Vmin Vmax + Vmin m 10 %, 100 % EEPROM characteristics: tret data retention time nendu(W) write endurance Tamb 55 C 10 100000 [1] Typical ratings are not guaranteed. These values listed are at room temperature. [2] Bandwidth limitation ( 7 kHz) according to ISM band regulations. - [3] Measured with an HP 4285A LCR meter at 13.56 MHz. [4] Including losses in resonant capacitor and rectifier. [5] Refer to ISO/IEC 15693-2 and ISO/IEC 15693-3 including pulse shapes and tolerances; proper coil design assumed 6. References [1] Data sheet -- Product data sheet SL2ICS53/SL2ICS54 168230 Product data sheet (c) NXP B.V. 2009. All rights reserved. Rev. 3.0 -- 15 January 2009 3 of 6 SL2MOS5401 NXP Semiconductors Addendum contactless chip card module specification 7. Revision history Table 4. Revision history Document ID Release date Data sheet status Change notice Supersedes 168230 20090115 Product data sheet - - 168230 Product data sheet (c) NXP B.V. 2009. All rights reserved. Rev. 3.0 -- 15 January 2009 4 of 6 SL2MOS5401 NXP Semiconductors Addendum contactless chip card module specification 8. Legal information 8.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term `short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 8.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 8.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 8.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I-CODE -- is a trademark of NXP B.V. 9. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 168230 Product data sheet (c) NXP B.V. 2009. All rights reserved. Rev. 3.0 -- 15 January 2009 5 of 6 SL2MOS5401 NXP Semiconductors Addendum contactless chip card module specification 10. Tables Table 1. Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .1 Limiting values [1][2] . . . . . . . . . . . . . . . . . . . . . . .2 Table 3. Table 4. Characteristics[1] . . . . . . . . . . . . . . . . . . . . . . . . 3 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 4 11. Contents 1 2 3 3.1 4 5 5.1 6 7 8 8.1 8.2 8.3 8.4 9 10 11 General description . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . Chip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical characteristics . . . . . . . . . . . . . . . . . . References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 2 3 3 3 4 5 5 5 5 5 5 6 6 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 January 2009 Document identifier: 168230