©2006 Fairchild Semiconductor Corporation
1
www.fairchildsemi.com
CNY17X, CNY17FX, MOC810X Rev. 1.0.6
CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
September 2006
CNY171, CNY172, CNY173, CNY174, CNY17F1, CNY17F2,
CNY17F3, CNY17F4, MOC8101, MOC8102, MOC8103,
MOC8104, MOC8105, MOC8106, MOC8107, MOC8108
Phototransistor Optocouplers
Features
UL recognized (File # E90700)
VDE recognized
– Add option V for white package (e.g., CNY17F2VM)
– File #102497
– Add option ‘300’ for black package (e.g., CNY17F2300)
– File #94766
Current transfer ratio in select groups
High BV
CEO
—70V minimum (CNY17X/M, CNY17FX/M,
MOC8106/7/8)
Closely matched current transfer ratio (CTR) minimizes
unit-to-unit variation.
Very low coupled capacitance along with no chip to pin 6
base connection for minimum noise susceptability
(CNY17FX/M, MOC810X)
Applications
Power supply regulators
Digital logic inputs
Microprocessor inputs
Appliance sensor systems
Industrial controls
Description
The CNY17, CNY17F and MOC810X devices consist of a
Gallium Arsenide IRED coupled with an NPN phototransistor
in a dual in-line package.
White Package (-M Suffix) Black Package (No -M Suffix)
Schematic
6
1
6
1
6
1
6
1
6
6
1
1
CNY17F1/2/3/4 CNY171/2/3/4
1
2
6
5 COLLECTOR COLLECTOR
4 EMITTERNC NC
NC
ANODE
CATHODE
3
1
2
6
5
4EMITTER
BASE
ANODE
CATHODE
3
CNY17F1M/2M/3M/4M
MOC8101/2/3/4/5/6/7/8
CNY171M/2M/3M/4M
2
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CNY17X, CNY17FX, MOC810X Rev. 1.0.6
CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Absolute Maximum Ratings
Symbol Parameters Device Value Units
TOTAL DEVICE
T
STG
Storage Temperature M -40 to +150 °C
non M -55 to +150
T
OPR
Operating Temperature M -40 to +100 °C
non M -55 to +100
T
SOL
Lead Solder Temperature All 260 for 10 sec °C
P
D
Total Device Power Dissipation @ 25°C (LED plus detector)
Derate Linearly From 25°C
M 250 mW
non M 250
M 2.94 mW/°C
non M 3.30
EMITTER
I
F
Continuous Forward Current M 60 mA
non M 100
V
R
Reverse Voltage All 6 V
I
F
(pk) Forward Current - Peak (1 µs pulse, 300 pps) M 1.5 A
non M 1.0
P
D
LED Power Dissipation 25°C Ambient
Derate Linearly From 25°C
M 120 mW
non M 150
M 1.41 mW/°C
non M 1.8
DETECTOR
I
C
Continuous Collector Current All 50 mA
V
CEO
Collector-Emitter Voltage CNY17X/M, CNY17FX/M,
MOC8106/7/8
70 V
MOC8101/2/3/4/5 30 V
V
ECO
Emitter Collector Voltage All 7 V
P
D
Detector Power Dissipation @ 25°C
Derate Linearly from 25°C
M 150 mW
non M 150
M 1.76 mW/°C
non M 2.0
3
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CNY17X, CNY17FX, MOC810X Rev. 1.0.6
CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Electrical Characteristics
(T
A
= 25°C Unless otherwise specified.)
(1)
Isolation Characteristics
Note:
* 5300 Vac(rms) for 1 minute equates to approximately 9000 Vac (pk) for 1 second
** Typical values at T
A
= 25°C
Individual Component Characteristics
Symbol Parameters Test Conditions Device Min. Typ. Max. Units
EMITTER
V
F
Input Forward Voltage I
F
= 60mA CNY17FX/M
CNY17X/M
1.0 1.35 1.65 V
I
F
= 10mA MOC810X 1.0 1.15 1.50
C
J
Capacitance V
F
= 0 V, f = 1.0MHz All 18 pF
I
R
Reverse Leakage Current V
R
= 6 V All 0.001 10 µA
DETECTOR
BV
CEO
Breakdown Voltage
Collector to Emitter I
C
= 1.0mA, I
F
= 0
MOC8101/2/3/4/5 30 100 V
MOC8106/7/8
CNY17F1/2/3/4/M
CNY171/2/3/4/M
70 100
BV
CBO
Collector to Base I
C
= 10µA, I
F
= 0 CNY171/2/3/4/M 70 120
BV
ECO
Emitter to Collector I
E
= 100µA, I
F
= 0 All 7 10
I
CEO
Leakage Current
Collector to Emitter V
CE
= 10 V, I
F
= 0 All 1 50 nA
I
CBO
Collector to Base V
CB
= 10 V, I
F
= 0 CNY171/2/3/4/M 20 nA
C
CE
Capacitance
Collector to Emitter V
CE
= 0, f = 1MHz All 8 pF
C
CB
Collector to Base V
CB
= 0, f = 1MHz CNY171/2/3/4/M 20 pF
C
EB
Emitter to Base V
EB
= 0, f = 1MHz CNY171/2/3/4/M 10 pF
Symbol Characteristic Test Conditions Device Min. Typ.** Max. Units
V
ISO
Input-Output Isolation Voltage f = 60 Hz, t = 1 min.,
I
I-O
2µA
(4)
Black Package 5300 Vac(rms)*
f = 60 Hz, t = 1 sec.,
I
I-O
2µA
(4)
‘M’ White Package 7500 Vac(pk)
R
ISO
Isolation Resistance V
I-O
= 500 VDC
(4)
All 10
11
C
ISO
Isolation Capacitance V
I-O
= Ø, f = 1MHz
(4)
Black Package 0.5 pF
‘M’ White Package 0.2
4
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CNY17X, CNY17FX, MOC810X Rev. 1.0.6
CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Transfer Characteristics
(T
A
= 25°C Unless otherwise specified.)
(1)
Symbol DC Characteristics Test Conditions Min. Typ. Max. Units
COUPLED
(CTR)
(2)
Output Collector
Current
MOC8101 I
F
= 10mA, V
CE
= 10V 50 80 %
MOC8102 73 117
MOC8103 108 173
MOC8104 160 256
MOC8105 65 133
MOC8106 50 150
MOC8107 100 300
MOC8108 250 600
CNY17F1/1M I
F
= 10mA, V
CE
= 5V 40 80
CNY17F2/2M 63 125
CNY17F3/3M 100 200
CNY17F4/4M 160 320
CNY171/1M 40 80
CNY172/2M 63 125
CNY173/3M 100 200
CNY174/4M 160 320
V
CE(sat)
Collector-Emitter
Saturation Voltage
CNY17XM/FXM I
C
= 2.5mA, I
F
= 10mA 0.4 V
MOC8101/2/3/4/5/6/7/8 I
C
= 500µA, I
F
= 5.0mA
CNY17X/FX I
F
= 10mA, I
C
= 2.5mA 0.3 V
Symbol AC Characteristics
(3)
Test Conditions Min. Typ.* Max. Units
NON-SATURATED SWITCHING TIME
t
on
Tu r n-On Time MOC8101/2/3/4/5 I
C
= 2.0mA, V
CC
= 10V, R
L
= 100
220µs
MOC8106/7/8
CNY17X/FX 10
t
off
Tu r n-Off Time MOC8101/2/3/4/5 I
C
= 2.0mA, V
CC
= 10V, R
L
= 100
320
MOC8106/7/8
CNY17X/FX 10
t
d
Delay Time CNY17XM/FXM I
F
= 10mA, V
CC
= 5V, R
L
= 75
5.6 µs
t
r
Rise Time All Devices I
C
= 2.0mA, V
CC
= 10V, R
L
= 100
s
CNY17XM/FXM I
F
= 10mA, V
CC
= 5V, R
L
= 75
4.0
t
s
Storage Time CNY17XM/FXM I
F
= 10mA, V
CC
= 5V, R
L
= 75
4.1 µs
t
f
Fall Time All Devices I
C
= 2.0mA, V
CC
= 10V, R
L
= 100
2µs
CNY17XM/FXM I
F = 10mA, VCC = 5V, RL = 753.5
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CNY17X, CNY17FX, MOC810X Rev. 1.0.6
CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
** All typicals at TA = 25°C
Notes:
1. Always design to the specified minimum/maximum electrical limits (where applicable).
2. Current Transfer Ratio (CTR) = IC/IF x 100%.
3. For test circuit setup and waveforms, refer to Figures 20.
4, For this test, Pins 1 and 2 are common, and Pins 4 are 5 are common.
Transfer Characteristics (Continued) (TA = 25°C Unless otherwise specified.)(1)
Symbol AC Characteristics(3) Test Conditions Min. Typ. Max. Units
SATURATED SWITCHING TIMES
ton Tu r n-on Time CNY171/F1 IF = 20mA, VCE = 0.4V 5.5 µs
CNY172/F2
CNY173/F3
CNY174/F4
IF = 10mA, VCE = 0.4V 8.0
trRise Time CNY171/F1 IF = 20mA, VCE = 0.4V 4.0 µs
CNY172/F1
CNY173/F3
CNY174/F4
IF = 10mA, VCE = 0.4V 6.0
CNY171M/F1M IF = 20mA, VCC = 5V, RL = 1k4.0
CNY172M/3M/4M
CNY17F2M/F3M/F4M
IF = 10mA, VCC = 5V, RL = 1k6.0
td
Delay Time CNY171M/F1M IF = 20mA, VCC = 5V, RL = 1k5.5 µs
CNY172M/3M/4M
CNY17F2M/F3M/F4M
IF = 10mA, VCC = 5V, RL = 1k8.0
toff Tu r n-off Time CNY171/F1 IF = 20mA, VCE = 0.4V 34 µs
CNY172/F2
CNY173/F3
CNY174/F4
IF = 10mA, VCE = 0.4V 39
tfFall Time CNY171/F1 IF = 20mA, VCE = 0.4V 20 µs
CNY172/F2
CNY173/F3
CNY174/F4
IF = 10mA, VCE = 0.4V 24
CNY171M/F1M IF = 20mA, VCC = 5V, RL = 1k20.0
µs
CNY172M/3M/4M
CNY17F2M/F3M/F4M
IF = 10mA, VCC = 5V, RL = 1k24.0
tsStorage Time CNY171M/F1M IF = 20mA, VCC = 5V, RL = 1k34.0 µs
CNY172M/3M/4M
CNY17F2M/F3M/F4M
IF = 10mA, VCC = 5V, RL = 1k39.0
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CNY17X, CNY17FX, MOC810X Rev. 1.0.6
CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Fig.1 Normalized CTR vs. Forward Current
(Black Package)
Fig.2 Normalized CTR vs. Forward Current
(White Package)
IF - FORWARD CURRENT (mA) IF - FORWARD CURRENT (mA)
051015 20
NORMALIZED CTR
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
VCE = 5.0V
TA = 25˚C
Normalized to
IF = 10 mA
02468101214161820
NORMALIZED CTR
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
VCE = 5.0V
TA = 25˚C
Normalized to
IF = 10 mA
Fig. 3 Normalized CTR vs. Ambient Temperature
(Black Package)
Fig. 4 Normalized CTR vs. Ambient Temperature
(White Package)
-75 -50 -25 0 25 50 75 100 125
NORMALIZED CTR
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Normalized to
IF = 10 mA
TA = 25˚C
IF = 10 mA
IF = 20 mA
TA - AMBIENT TEMPERATURE (˚C) TA - AMBIENT TEMPERATURE (˚C)
-60 -40 -20
0
20 40 60 80 100
NORMALIZED CTR
0.2
0.4
0.6
0.8
1.0
1.2
1.4
IF = 5 mA IF = 5 mA
IF = 10 mA
IF = 20 mA
Normalized to
IF = 10 mA
TA = 25˚C
Fig. 5 CTR vs. RBE (Unsaturated)
(Black Package)
Fig. 6 CTR vs. RBE (Unsaturated)
(White Package)
RBE- BASE RESISTANCE (kΩ) RBE- BASE RESISTANCE (kΩ)
NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN))
NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN))
10 100 1000
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
IF = 20 mA
IF = 10 mA
IF = 5 mA
VCE= 5.0 V
10 100 1000
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
VCE= 5.0 V
IF = 20 mA
IF = 10 mA
IF = 5 mA
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CNY17X, CNY17FX, MOC810X Rev. 1.0.6
CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Fig. 9 Switching Speed vs. Load Resistor
(Black Package)
R-LOAD RESISTOR (kΩ)
0.1 1 10 100
SWITCHING SPEED - (µs)
0.1
1
10
100
1000
Toff
Ton
Tf
IF = 10 mA
VCC = 10 V
TA = 25˚C
Fig. 7 CTR vs. RBE (Saturated)
(Black Package)
Fig. 8 CTR vs. RBE (Saturated)
(White Package)
Tr
SWITCHING SPEED - (µs)
Fig. 10 Switching Speed vs. Load Resistor
(White Package)
R-LOAD RESISTOR (kΩ)
0.1 1 10 100
0.1
1
10
100
1000
Toff
Ton
Tf
IF = 10 mA
VCC = 10 V
TA = 25˚C
Tr
R
BE
- BASE RESISTANCE (k Ω)
R
BE
- BASE RESISTANCE (k Ω) R
BE
- BASE RESISTANCE (k Ω)
R
BE
- BASE RESISTANCE (k Ω)
NORMALIZED CTR ( CTR
RBE
/ CTR
RBE(OPEN)
)
NORMALIZED CTR ( CTR
RBE
/ CTR
RBE(OPEN)
)
10 100 1000
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
VCE= 0.3 V
IF = 5 mA
IF = 10 mA
IF = 20 mA
10 100 1000
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
IF = 20 mA
IF = 10 mA
IF = 5 mA
VCE= 0.3 V
10 100 1000 10000 100000
NORMALIZED t
on
- (t
on(RBE)
/ t
on(open)
)
NORMALIZED t
on
- (t
on(RBE)
/ t
on(open)
)
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Fig. 11 Normalized ton vs. RBE
(Black Package)
Fig. 12 Normalized ton vs. RBE
(White Package)
10 100 1000 10000 100000
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VCC = 10 V
IC = 2 mA
RL = 100
VCC = 10 V
IC = 2 mA
RL = 100
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CNY17X, CNY17FX, MOC810X Rev. 1.0.6
CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
10 100 1000 10000 100000
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
RBE- BASE RESISTANCE (k Ω)
10 100 1000 10000 100000
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
VCC = 10 V
IC = 2 mA
RL = 100
VCC = 10 V
IC = 2 mA
RL = 100
NORMALIZED toff - (toff(R
BE
) / toff(open))
NORMALIZED toff - (toff(R
BE
) / toff(open))
Fig. 13 Normalized toff vs. RBE
(Black Package)
RBE- BASE RESISTANCE (k Ω)
Fig. 14 Normalized toff vs. RBE
(White Package)
IF - LED FORWARD CURRENT (mA)
VF - FORWARD VOLTAGE (V)
Fig. 16 LED Forward Voltage vs. Forward Current
(White Package)
110100
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
TA = 25°C
TA = -55°C
TA = 100°C
IF - LED FORWARD CURRENT (mA)
VF - FORWARD VOLTAGE (V)
Fig. 15 LED Forward Voltage vs. Forward Current
(Black Package)
110100
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
TA = 25°C
TA = -55°C
TA = 100°C
0.01 0.1 1 10
0.001
0.01
0.1
1
10
100
IF = 5 mA
IF = 20 mA
IF = 10 mA
Fig. 18 Collector-Emitter Saturation Voltage vs Collector Current
(White Package)
IC - COLLECTOR CURRENT (mA)
VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V)
IF = 2.5 mA
TA = 25
˚C
Fig. 17 Collector-Emitter Saturation Voltage vs Collector Current
(Black Package)
IC - COLLECTOR CURRENT (mA)
VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V)
0.01 0.1 1 10
0.001
0.01
0.1
1
10
100
IF = 2.5 mA
TA = 25
˚C
IF = 20 mA
IF = 10 mA
IF = 5 mA
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CNY17X, CNY17FX, MOC810X Rev. 1.0.6
CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Figure 20. Switching Time Test Circuit Figure 21. Switching Time Test Circuit
RL
IFIC
VCC
OUTPUT (VCE)INPUT
INPUT PULSE
OUTPUT PULSE
ton toff
tr
td
tf
ts
10%
90%
Fig. 19 Dark Current vs. Ambient Temperature
(Black Package)
TA - AMBIENT TEMPERATURE (°C)
0255075100 125
ICEO - COLLECTOR-EMITTER DARK CURRENT (µA)
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
101
VCE = 10 V
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CNY17X, CNY17FX, MOC810X Rev. 1.0.6
CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Black Package (No -M Suffix)
Package Dimensions (Through Hole) Package Dimensions (Surface Mount)
Recommended Pad Layout for Surface Mount
Package Dimensions (0.4” Lead Spacing) Leadform (Black Package Only)
Note:
All dimensions are in inches (millimeters)
0.100 (2.54)
TYP
0.020 (0.51)
MIN
0.350 (8.89)
0.330 (8.38)
0.270 (6.86)
0.240 (6.10)
PIN 1
ID.
0.022 (0.56)
0.016 (0.41)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.115 (2.92)
0.300 (7.62)
TYP
0° to 15°
0.154 (3.90)
0.100 (2.54)
SEATING PLANE
0.016 (0.40)
0.008 (0.20)
Lead Coplanarity : 0.004 (0.10) MAX
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
0.300 (7.62)
TYP
0.405 (10.30)
MAX
0.315 (8.00)
MIN
0.016 (0.40) MIN
2
5
PIN 1
ID.
0.016 (0.41)
0.008 (0.20)
0.100 (2.54)
TYP
0.022 (0.56)
0.016 (0.41)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.165 (4.18)
4
3
0.020 (0.51)
MIN
1
6
SEATING PLANE
0.016 (0.40)
0.008 (0.20)
0.070 (1.78)
0.045 (1.14)
0.350 (8.89)
0.330 (8.38)
0.154 (3.90)
0.100 (2.54)
0.200 (5.08)
0.135 (3.43)
0.004 (0.10)
MIN
0.270 (6.86)
0.240 (6.10)
0.400 (10.16)
TYP
0° to 15°
0.022 (0.56)
0.016 (0.41)
0.100 (2.54) TYP
PIN 1 ID 0.070
(
1.78
)
0.060
(
1.52
)
0.030
(
0.76
)
0.100
(
2.54
)
0.295
(
7.49
)
0.415
(
10.54
)
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CNY17X, CNY17FX, MOC810X Rev. 1.0.6
CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
White Package (-M Suffix)
Package Dimensions (Through Hole) Package Dimensions (Surface Mount)
Recommended Pad Layout for Surface Mount
Package Dimensions (0.4” Lead Spacing) Leadform (White Package Only)
Note:
All dimensions are in inches (millimeters)
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.320 (8.13)
0.070 (1.77)
0.040 (1.02) 0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41) 0.100 (2.54) 15°
0.012 (0.30)
Pin 1 ID
SEATING PLANE
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.390 (9.90)
0.332 (8.43)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.035 (0.88)
0.012 (0.30)
0.012 (0.30)
0.008 (0.20)
0.200 (5.08)
0.115 (2.93)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
Seating Plane
Pin 1 ID
0.350 (8.89)
PIN 1 ID
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
SEATING PLANE
0.040 (1.02) 0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
0.100 (2.54)
0.015 (0.38)
0.012 (0.30)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
0.070
(
1.78
)
0.060
(
1.52
)
0.030
(
0.76
)
0.100
(
2.54
)
0.305
(
7.75
)
0.425
(
10.79
)
12 www.fairchildsemi.com
CNY17X, CNY17FX, MOC810X Rev. 1.0.6
CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Ordering Information
Carrier Tape Specifications (Black Package, No Suffix)
Carrier Tape Specifications (White Package, M Suffix)
Black Package Part
Number Example
(No Suffix)
White Package Part
Number Example
(M Suffix) Description
CNY171S CNY171SM Surface Mount Lead Bend
CNY171SD CNY171SR2M Surface Mount; Tape and reel
CNY171W CNY171TM 0.4" Lead Spacing
CNY171300 CNY171VM VDE Approved
CNY171300W CNY171TVM VDE Approved, 0.4" Lead Spacing
CNY1713S CNY171SVM VDE Approved, Surface Mount
CNY1713SD CNY171SR2VM VDE Approved, Surface Mount, Tape & Reel
4.0 ± 0.1
Ø1.55 ± 0.05
User Direction of Feed
4.0 ± 0.1
1.75 ± 0.10
7.5 ± 0.1
16.0 ± 0.3
12.0 ± 0.1
0.30 ± 0.05
13.2 ± 0.2
4.85 ± 0.20
0.1 MAX 10.30 ± 0.20
9.55 ± 0.20
Ø1.6 ± 0.1
4.0 ± 0.1
Ø1.5 MIN
User Direction of Feed
2.0 ± 0.05
1.75 ± 0.10
11.5 ± 1.0
24.0 ± 0.3
12.0 ± 0.1
0.30 ± 0.05
21.0 ± 0.1
4.5 ± 0.20
0.1 MAX 10.1 ± 0.20
9.1 ± 0.20
Ø1.5 ± 0.1/-0
13 www.fairchildsemi.com
CNY17X, CNY17FX, MOC810X Rev. 1.0.6
CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Marking Information (Black package non ‘M’ suffix)
Reflow Profile (Black Package, No Suffix)
CNY17-1
V XX YY K
1
2
6
43 5
Definitions
1Fairchild logo
2Device number
3VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4Two digits year code, e.g., ‘03’; One digit year code for ‘M’
version, e.g. ‘5’
5Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
• Peak reflow temperature: 225° C (package surface temperature)
• Time of temperature higher than 183° C for 60–150 seconds
• One time soldering reflow is recommended
215°C, 10–30 s
225 C peak
Time (Minute)
0
300
250
200
150
100
50
0
0.5 1 1.5 2 2.5 3 3.5 4 4.5
Temperature (°C)
Time above 183° C, 60–150 sec
Ramp up = 3 C/sec
14 www.fairchildsemi.com
CNY17X, CNY17FX, MOC810X Rev. 1.0.6
CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Marking Information (White package M suffix)
Reflow Profile (White Package, M Suffix)
CNY17-1
V X YY Q
1
2
6
43 5
Definitions
1Fairchild logo
2Device number
3VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4 Single digit year code, e.g. ‘5’
5Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
°C
Time (s)
0 60 180120 270
260°C
>245°C = 42 Sec
Time above
183°C = 90 Sec
360
1.822°C/Sec Ramp up rate
33 Sec
15 www.fairchildsemi.com
CNY17X, CNY17FX, MOC810X Rev. 1.0.6
CNY17X, CNY17FX, MOC810X Phototransistor Optocouplers
Rev. I20
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER
ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which,
(a) are intended for surgical implant into the body, or (b) support or
sustain life, or (c) whose failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
ACEx™
ActiveArray™
Bottomless
Build it Now™
CoolFET™
CROSSVOLT
DOME™
EcoSPARK™
E2CMOS™
EnSigna™
FACT™
FAST®
FASTr™
FPS™
FRFET™
FACT Quiet Series™
GlobalOptoisolator™
GTO™
HiSeC™
I2C™
i-Lo
ImpliedDisconnect™
IntelliMAX™
ISOPLANAR
LittleFET™
MICROCOUPLER™
MicroFET™
MicroPak™
MICROWIRE™
MSX™
MSXPro™
OCX™
OCXPro™
OPTOLOGIC®
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerEdge™
PowerSaver™
PowerTrench®
QFET®
QS™
QT Optoelectronics™
Quiet Series
RapidConfigure™
RapidConnect™
µSerDes™
ScalarPump™
SILENT SWITCHER®
SMART START™
SPM™
Stealth™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TCM™
TinyBoost™
TinyBuck™
TinyPWM
TinyPower™
TinyLogic®
TINYOPTO™
TruTranslation™
UHC™
UniFET™
UltraFET®
VCX™
Wire
Across the board. Around the world.™
The Power Franchise®
Programmable Active Droop™
Datasheet Identification Product Status Definition
Advance Information Formative or In Design This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary First Production This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve
design.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice to improve design.
Obsolete Not In Production This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
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MOC8102
6-Pin DIP Phototransistor Output Optocoupler- No Base Connection
Features
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Contents
Features
Applications
Product status/pricing/packaging
Order Samples
Application notes
Safety agency certificates
Qualification Support
zUL recognized (File # E90700)
zVDE recognized
{Add option V for white package (e.g., CNY17F2VM)
{File #102497
{Add option '300' for black package (e.g., CNY17F2300)
{File #94766
zCurrent transfer ratio in select groups
zHigh BVCEO - 70V minimum (CYN17X/M, CNY17FX/M,
MOC8106/7/8)
zClosely matched current transfer ratio (CTR) minimizes unit-to-unit
variation
zVery low coupled capacitance along with no chip to pin 6 base
connection for minimum noise susceptibility (CNY17FX/M,
MOC810X)
zPower supply regulators
zDigital logic inputs
zMicroprocessor inputs
zAppliance sensor systems
zIndustrial controls
Datasheet
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Product status/pricing/packaging
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Application notes
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Safety agency certificates
Product Product status Pb-free Status Package type Leads Packing method
MOC8102 Lifetime Buy DIP-B 6 BULK
MOC8102300 Lifetime Buy DIP-B 6 BULK
MOC8102300W Lifetime Buy DIP-B 6 BULK
MOC81023S Lifetime Buy SMDIP-B 6 BULK
MOC81023SD Lifetime Buy SMDIP-B 6 TAPE REEL
MOC81023SDL Lifetime Buy SMDIP-B 6 TAPE REEL
MOC8102S Lifetime Buy SMDIP-B 6 BULK
MOC8102SD Lifetime Buy SMDIP-B 6 TAPE REEL
MOC8102W Lifetime Buy DIP-B 6 BULK
Indicates product with Pb-free second-level interconnect. For more information click here.
A
BR-42021: Control Interface for Standard 0 - 10VDC Dimmers (110 K) Jul
27, 2007
A
N-42026: Phase Modulated PWM Topology with the ML4818 (279 K) Jul 27,
2007
Certificate Agency
E90700, Vol. 1 (936 K) UL (1577) Underwriters Laboratories Inc.
E90700, Vol. 1 (936 K) C-UL Underwriters Laboratories Inc.
FI 12482 (245 K) FIMKO FIMKO
Pa
e 2 of 3Product Folder - Fairchild P/N MOC8102 - 6-Pin DIP Phototransistor Out
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Qualification Support
Click on a product for detailed qualification data
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0122085 (677 K) SEMKO SEMKO
P01101067 (1638 K) NEMKO NEMKO
310684-02 (623 K) DEMKO DEMKO Testing & Certification
1027742 (2305 K) CSA Canadian Standards Association
94766 (1673 K) VDE VDE Pruf-und Zertifizierungsinstitut
P98102918 (138 K) NEMKO NEMKO
Product
MOC8102
MOC8102300
MOC8102300W
MOC81023S
MOC81023SD
MOC81023SDL
MOC8102S
MOC8102SD
MOC8102W
© 2007 Fairchild Semiconductor
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