Applications Guide
June 2002
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
3.3 Vdc and 5.0 Vdc Inp u t, 1.5 Vdc - 3.3 Vdc Output, 5A
Applications
■Workstations
■Servers
■Desktop computers
■DSP applications
■Distr ibuted power architectu re s
■Telecommunications equipment
■Adapte r ca rd s
■LAN/WAN applications
■Data processing applications
Features
■Small size and very low profile
■Minimal space on printed circuit board
■Surface mountable
■Single output maximum dimensions:
33 mm x 12.95 mm x 5.46 mm
(1.3 in x 0.530 in x 0.215 in.), tolerance of +/- 0.01
■High reliability: designed to meet 200 FITs/5 million
hour MTBF
■High efficiency
5.0 VIN
87% typical @ 3.3V, 5A
3.3 VIN
86% typical @ 2.5V, 5A
■Single control pin for output voltage margining and
on/off control
■Instantaneous auto-reset ov ercurrent protection
(non-latching)
■Overtemperature protection
■No external bias required
■Low inductance surface mount connections
■ Designed to meet
UL
† 60950, CSA‡ C22.2 No.
60950-00, and VDE§ 0805 (IEC60950)
The HAL/HAW Power Module provides precise voltage in an
industry leading small footprint while offering very high reli-
ability and high efficiency.
Description
This Power Module is designed to meet the precise voltage requirements of today’s high performance
DSP and microprocessor circuits and system board level applications. Advanced circuit techniques, high
frequency switching, custom components, and very high density, surface mountable packaging technology
deliver high quality, ultra compact, DC-DC conversion.
†
UL
is a registered trademark of Underwriters Laboratories, Inc.
‡
CSA
is a registered trademark of Canadian Standards Association.
§
VDE
is a trademark of Verband Deutscher Elektrotechniker e .V.
Shindengen Power Modules
2
App Guide
June 20023.3 Vdc and 5.0 V dc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute maximum stress ratings only. Functional operation of the device is not implied at these or any other conditions
in excess of those giv en in the operations sections of the data sheet. Exposure to absolute maximum ratings for
extended periods can adv ersely affect device reliability. Input voltage range of VIN = 3.0V is listed as 3.3 VIN and
input voltage range of VIN = 4.5V - 5.5V is listed as 5.0 VIN..
Electrical Specifications
Table 1. Input Specifications
Fusing Considerations
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an
integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not
included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety
agencies require a normal blow fuse with a maximum rating of 10A (see Safety Specifications on page ).
Output Control
The control pin is a dual-function port that serves to enable/disable the converter or provide a means of adjusting
the output voltage over a prescribed range. When the control pin is grounded, the converter is disabled. With the
pin left open, the converter regulates to its specified output voltage. For any other v oltage applied to the pin, the
output voltage follows this relationship:
Parameter Device Symbol Min Max Unit
Input Voltage (continuous) 3.3 VIN
5.0 VIN VIN
VIN -0.3
-0.3 3.6
5.5 Vdc
Vdc
Imposed Output Voltage All V OIF -0.3 5.5 Vdc
CTRL Terminal Voltage All CTRL -0.3 2.0 Vdc
Storage Temperature All TA/STG -40 125 °C
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage 3.3 VIN
5.0 VIN VIN
VIN 3.0
4.5 3.3
5.0 3.6
5.5 V
V
Input Ripple Rejection (120 Hz) 50 dB
Operating Input Current
(0A ≤ IOUT < 5A)
(3.0 V < VIN < 3.6V)
(4.5V < VIN < 5.5V) 3.3 VIN
5.0 VIN IIN
IIN —
——
—6
5.5 A
A
Quiescent Input Current (IOUT = 0)
(3.0V < VIN < 5.5V) All IQ——mA
Input Ripple Current: 20 MHz BW, 250 nH
Input Inductance (see Figure ) 3.3 VIN
5.0 VIN IINripple
IINripple 35 mAp-p mAp-p
mAp-p
OUTNOM
CONTROL
OUT V
V
V•
=5.1
3
App Guide
June 2002 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Output Control (continued)
The output voltage may be margined up or down in direct proportion to the percentage deviation of the control pin
from 1.5V. The control pin may be driven by an imposed voltage to margin up or down or shunted by a resistive ele-
ment to ground for margin down. The pref erred margin technique emplo ys an e xternal control v oltage to margin up
or down. A resistor shunt may be used to margin down but the reference will sag due to its internal impedance.
VOUT: The value of the output voltage after margining
VCONTROL: The voltage at the CTRL pin
VOUTNOM: The ouput voltage if the control pin is left open
RMARGIN: The shunt resistor to ground fo r margining
1-0249
Margin Up
To margin the converter up apply a voltage to the CTRL pin that is above 1.50 volts b y the same percentage as the
desired margin up percentage
Example:Margin up 5%: Applying 1.575 volts to the CTRL pin will increase the output voltage by 5% over its
unmargined value
Margin Down
Assume a percentage to margin down. Then connect a resistor RMARGIN between CTRL and GND. Use the follow-
ing relations to decide the value of RMARGIN:
1-0250
CTRL
–
+
TO FB
REFERENCE
100 µA
51.1 K
1.5 V
+
–
499
V
CONTROL
+
–
VCONTROL = 1.5 (1 + MARGIN UP %)
VCONTROL = 1.5 (1 + .05)
VCONTROL = 1.575
CTRL
–
+
TO FB
51.1 K
1.5 V
+
–
499RMARGIN
REFERENCE
100 µA
4
App Guide
June 20023.3 Vdc and 5.0 V dc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Output Control (continued)
Margin Down (continued)
Example: To margin down 5%, then:
RMARGIN = 9481
Because margining affects the system reference, margining beyond 10% is unacceptable and 0% - 5% is desirab le.
Margining the unit down beyond 5% requires derating the available current by 1% for every percent beyond 5 that
the module is margined down. F or e xample, if a module were margined down 7%, output current would ha v e to be
derated 2%.
Special Note:The 3.3/2.5V version must be operated at nominal line to achieve margin up.
The margin up available for this version is maximum 5%
Output Regulation
These modules make use of inherent output resistance to facilitate improved transient response. This means that
the output voltage will decrease with increasing output current. For this reason, the total DC regulation window at
any given operating temperature is comprised of a no-load setpoint and a load dependent v oltage drop due to mod-
ule output resistance. Regulation data provided in Table 2 includes both the initial set point and this voltage drop.
Because Table 2 includes output resistance drop, the maximum column represents a no-load condition while the
minimum column represents a full-load condition. Production test limits are set such that no module could pass
with a full-load regulation point equal to the maximum column. This means that at any operating current, the regu-
lation will always be better than the total window specified in Table 2.
499 1 – margin%
1 – (1 – margin%)
-----------------------------------------------
•
RMARGIN =
499 1 – .05
1 – (1 – .05)
--------------------------------
•
RMARGIN =
5 5
App Guide
June 2002 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Output Regulation (continued)
Table 2. Output Specifications
Unless otherwise noted, all specifications are defined at nominal line, full load, TAMBIENT – 25 °C
* units will start into 5000 µF, 5A load at nominal line; units will start into 10,000 µF with no load
Static Voltage Regulation
The ouput voltage measured at the converter output pins on the system board will be within the range shown in
Table 3, except during turn-on and turn-off. Static voltage regulation includes:
■DC Output init ial voltage
■Input voltage range
■3.0V – 3.6V
■4.5V – 5.5V
■Load regulation from 0A – 5A
Output Ripple and Noise
Output ripple and noise is defined as periodic or random deviation from the nominal voltage at the output pins while
under constant load and input line. Typical full load output ripple and noise wav eforms are shown in Figures 4 – 10.
Parameter Device Symbol Min Typ Max Unit
Output Voltage
These specifications are under all specified
input voltage, load current, and temperature
conditions. They do not include ripple or
transient.
3.3V
2.5V
2.0V
1.8V
1.5V
VOUT
VOUT
VOUT
VOUT
VOUT
3.20
2.42
1.94
1.74
1.45
3.3
2.5
2.0
1.8
1.5
3.400
2.58
2.06
1.86
1.55
V
V
V
V
V
Output Current
*(see Figures 17 – 22 for derating) —IOUT 0—5A
Output Ripple
(See Figures 4 — 9) 3.3 VIN
5.0 V IN VRIPPLE
VRIPPLE —
——
—80
100 mVpp
mVpp
External Load Capacitance* All ——5000* —µF
Output Current Limit Inception All IOUT 7A
Efficiency
VIN = Nominal, IOUT = Maximum 5.0 – 3.3
5.0 – 2.5
3.3 – 2.5
3.3 – 2.0
3.3 – 1.8
3.3 – 1.5
η
η
η
η
η
η
—
—
—
—
—
—
87
82
86
82
80
75
—
—
—
—
—
—
%
%
%
%
%
%
Switching Frequency All FOP —900 —kHz
VOUT Dyna mic Res pon se to Transi ent Load
(TTRANSITION = 50 µs)
Nominal Load 50% to 100% Peak Deviation
measured as a maximum percentage deviation
from nominal VO at full load
Nominal Load 50% to 100% Settling Time to
VOUT < 10% of VOUT STEADY STATE
See Figures 10 – 15
All
—
—
—
—
< 10
< 25
—
—
%
µS
6
App Guide
June 20023.3 Vdc and 5.0 V dc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAl/HAW Non-Isolated SMT DC - DC Power Modules:
Output Overcurrent Protection/Overtemperature Protection
The module is equipped with internal current limiting circuitry for momentary overloads and short circuits. A sus-
tained overload may cause the internal thermal shutdown circuit to activate. The current limit inception is nominally
7 amperes with the module power semiconductors at rated temperature in a 25 °C ambient environment. Addition-
ally, the module is equipped with the thermal circuitry to safeguard against thermal damage. The thermal circuit
shuts down the module when the case temperature of the top surface of the power semiconductors rises to a max-
imum of 135 °C. Figure 25 provides details on the temperature measuring location for the top surface of the power
semiconductor case. The module will be restored to normal operation when the top surface temperature of the
power semiconductor is taken below 105 °C.
Input/Output Decoupling
An input capacitance of 100 µF with an ESR of less than 100 milliohms and at least 1 µF ceramic or equivalent is
recommended for the input to the modules. This 100 µF capacitor should always be used unless the b uss bulk
capacitors are located close to the module. This capacitor provides decoupling in the ev ent of a f ault to the module
output. Input voltage should never go below 2.5V or internal protection circuitry may f ail to act. To achie v e noise lev-
els shown in Figures – 10, one 100 µF tantalum capacitor and one 1 µF ceramic capacitor are used. 0.75 inches of
0.14 inch wide track (with no ground beneath) is used as an inductor between the input pin of the module and the
decoupling capacitors.
Output decoupling used to achie ve noise levels shown in Figures –10 is 1 µF. Care should be taken that selected
output decoupling capacitors do not form troublesome L-C resonant networks with track inductance.
1-0251
Figure 1. Input/Output Decoupling Circuit
1-0252
Figure 2. Input Reflected Repple Current Measuring Circuit
Measured with AC Current Probe
CTRL COM
TRACE L VRM
VIN VOUT
VIN
+
–
CBULK
100 µFCDECOUP
1 µFCDECOUP
1 µF
TP RIPP
ILOAD
CTRL COM
250 nH VRM
V
IN
V
OUT
V
IN
+
–
C
BULK
100 µFC
DECOUP
1 µFC
DECOUP
1 µF
INPUT REFLECTED RIPPLE CURRENT
I
LOAD
App Guide
June 2002
7
3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Input/Output Decoupling (continued)
1-0253
Figure 3. Load Transient Response Measuring Circ uit
CTRL COM
VRM
VIN VOUT
VIN
+
–
CBULK
100 µFCDECOUP
1 µFCDECOUP
1 µF
UP
RLOAD
LOAD
SWITCH
CONTROL
1-0262
Figure 4. Ripple & Noise Characteristic with 6.2
amps resistive load @ 3.3 VIN/1.5 VOUT
Input/Output Ripple Performance
Figures –10 represent typical input and output ripple
noise le vels obtained using the circuit shown in Figure .
Nominal input and output voltages and a constant
ouput current were used during testing. All measure-
ments taken with setup shown in Figures and . the out-
put ripple voltage (top trace) is measured across the
output pins using a Lecroy AP 033 differential probe.
The input reflected ripple current (Bottom trace) is
measured with a Lecro y AP 015 current probe. The BW
limit is set to 25 MHz. The time base and amplitude
dividers settings are shown in their respective figures
1-0261
Figure 5. Ripple & Noise Characteristic with 6.2
amps resistive load @ 3.3 VIN/1.8 VOUT
TIME, t (1 µs/div)
OUTPUT V OLTAGE,
VO (V) (20 mV/div)
INPUT CURRENT,
II (A) (100 mA/div)
TIME, t (1 µs/div)
OUTPUT V OLTAGE,
VO (V) (20 mV/div)
INPUT CURRENT,
II (A) (100 mA/div)
88
App Guide
June 20023.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Input/Output Ripple Performance (contin-
ued)
1-0260
Figure 6. Ripple & Noise Characteristic with 6.2
amps resistive load @ 3.3 VIN/2.0 VOUT
1-0259
Figure 7. Ripple & Noise Characteristic with 6.2
amps resistive load @ 3.3 VIN/2.5 VOUT
1-0256
Figure 8. Ripple & noise Characteri st ic with 5.8
amps resistive load @ 5.0VIN/1.8VOUT
1-0257
Figure 9. Ripple & Noise Characteristic with 6.3
amps resistive load @ 5.0 VIN/2.5 VOUT
TIME, t (1 µs/div)
OUTPUT V OLTAGE,
V
O
(V) (20 mV/div)
INPUT CURRENT,
I
I
(A) (100 mA/div)
TIME, t (2 µs/div)
OUTPUT V OLTAGE,
VO (V) (20 mV/div)
INPUT CURRENT,
II (A) (100 mA/div)
TIME, t (1 µs/div)
OUTPUT V OLTAGE,
VO (V) (20 mV/div)
INPUT CURRENT,
II (A) (100 mA/div)
TIME, t (1 µs/div)
OUTPUT V OLTAGE,
VO (V) (20 mV/div)
INPUT CURRENT,
II (A) (100 mA/div)
9
App Guide
June 20023.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Input/Output Ripple Performance (contin-
ued)
1-0258
Figure 10.Ripple & Noise Characteristic with 6.3
amps resistive load @ 5.0 VIN/3.3 VOUT
Transient Response Pe rformance
Figure s 11–24 depict typical transient responses
obtained using the circuit shown in Figure .
1-0269
Figure 11.Transient Respond Characteristic of
3.3VIN/1.5VOUT wi th IOUT step up =1A-6A
Static load, Dt=50µs, VOUT=20mV/DIV @
Rise time Condition
1-0270
Figure 12.Transient Respond Characteristic of
3.3VIN/1.5VOUT with IOUT step up =1A-6A
Static load, Dt=50µs, VOUT=20mV/DIV @
Fall time Condition
1-0271
Figure 13.Transient Respond Characteristic of
3.3VIN/1.8VOUT with IOUT step up =1A-6A
Static load, Dt=50µs, VOUT=20mV/DIV @
Rise time Condition
TIME, t (1 µs/div)
OUTPUT V OLTAGE,
VO (V) (20 mV/div)
INPUT CURRENT,
VI (A) (100 mA/div)
TIME, t (0.2 ms/div)
OUTPUT V OLTAGE,
V
O
(V) (20 mV/div)
OUTPUT CURRENT,
I
O
(A) (2 A/div)
I
O
= 1A - 6A
V
O
= 1.5V
TIME, t (0.2 ms/div)
OUTPUT V OLTAGE,
VO (V) (20 mV/div)
OUTPUT CURRENT,
IO (A) (2 A/div)
IO = 1A - 6A
VO = 1.5V
TIME, t (0.2 ms/div)
OUTPUT V OLTAGE,
VO (V) (20 mV/div)
OUTPUT CURRENT,
IO (A) (2 A/div)
IO = 1A - 6A
VO = 1.8V
1010
App Guide
June 20023.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Transient Response P erformance (continued)
1-0272
Figure 14.Transient Respond Characteristic of
3.3VIN/1.8VOUT wi th IOUT step up =1A-6A
Static load, Dt=50µs, VOUT=20mV/DIV @
Fall time Condition
1-0273
Figure 15.Transient Respond Characteristic of
3.3VIN/2.0VOUT wi th IOUT step up =1A-6A
Static load, Dt=50µs, VOUT=20mV/DIV @
Rise time Condition
1-0274
Figure 16.Transient Respond Characteristic of
3.3VIN/2.0VOUT with IOUT step up =1A-6A
Static load, Dt=50µs, VOUT=20mV/DIV @
Fall time Condition
1-0275
Figure 17.Transient Respond Characteristic of
3.3VIN/2.5VOUT with IOUT step up =1A-6A
Static load, Dt=50µs, VOUT=20mV/DIV @
Rise time Condition
TIME, t (0.2 ms/div)
OUTPUT V OLTAGE,
VO (V) (20 mV/div)
OUTPUT CURRENT,
IO (A) (2 A/div)
IO = 1A - 6A
VO = 1.8V
TIME, t (0.2 ms/div)
OUTPUT V OLTAGE,
V
O
(V) (20 mV/div)
OUTPUT CURRENT,
I
O
(A) (2 A/div)
I
O
= 1A - 6A
V
O
= 2.0V
TIME, t (0.2 ms/div)
OUTPUT V OLTAGE,
VO (V) (20 mV/div)
OUTPUT CURRENT,
IO (A) (2 A/div)
IO = 1A - 6A
VO = 2.0V
TIME, t (0.2 ms/div)
OUTPUT V OLTAGE,
V
O
(V) (20 mV/div)
OUTPUT CURRENT,
I
O
(A) (2 A/div)
I
O
= 1A - 6A
V
O
= 2.5V
11
App Guide
June 20023.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAl/HAW Non-Isolated SMT DC - DC Power Modules:
Transient Response P erformance (continued)
1-0276
Figure 18.Transient Respond Characteristic of
3.3VIN/2.5VOUT wi th IOUT step up =1A-6A
Static load, Dt=50µs, VOUT=20mV/DIV @
Fall time Condition
1-0263
Figure 19.Transient Respond Characteristic of
5.0VIN/1.8VOUT wi th IOUT step up =1A-6A
Static load, Dt=50µs, VOUT=20mV/DIV @
Rise time Condition
1-0264
Figure 20.Transient Respond Characteristic of
5.0VIN/1.8VOUT with IOUT step up =1A-6A
Static load, Dt=50µs, VOUT=20mV/DIV @
Fall time Condition
1-0265
Figure 21.Transient Respond Characteristic of
5.0VIN/2.5VOUT with IOUT step up =1A-6A
Static load, Dt=50µs, VOUT=20mV/DIV @
Rise time Condition
TIME, t (0.2 ms/div)
OUTPUT V OLTAGE,
V
O
(V) (20 mV/div)
OUTPUT CURRENT,
I
O
(A) (2 A/div)
I
O
= 1A - 6A
V
O
= 2.5V
TIME, t (0.2 ms/div)
OUTPUT V OLTAGE,
VO (V) (20 mV/div)
OUTPUT CURRENT,
IO (A) (2 A/div)
IO = 1A - 6A
VO = 1.8V
TIME, t (0.2 ms/div)
OUTPUT V OLTAGE,
VO (V) (20 mV/div)
OUTPUT CURRENT,
IO (A) (2 A/div)
IO = 1A - 6A
VO = 1.8V
TIME, t (0.2 ms/div)
OUTPUT V OLTAGE,
VO (V) (20 mV/div)
OUTPUT CURRENT,
IO (A) (2 A/div)
IO = 1A - 6A
VO = 2.5V
1212
App Guide
June 20023.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Transient Response P erformance (continued)
1-0266
Figure 22.Transient Respond Characteristic of
5.0VIN/2.5VOUT wi th IOUT step up =1A-6A
Static load, DT=50µs, VOUT=20V/DIV @ Fall
time Condition
1-0267
Figure 23.Transient Respond Characteristic of
5.0VIN/3.3VOUT wi th IOUT step up =1A-6A
Static load, Dt=50µs, VOUT=20mV/DIV @
Rise time Condition
1-0268
Figure 24.Transient Respond Characteristic of
5.0VIN/3.3VOUT with IOUT step up =1A-6A
Static load, Dt=50µs, VOUT=20mV/DIV @
Fall time Condition
TIME, t (0.2 ms/div)
OUTPUT V OLTAGE,
VO (V) (20 mV/div)
OUTPUT CURRENT,
IO (A) (2 A/div)
IO = 1A - 6A
VO = 2.5V
TIME, t (0.2 ms/div)
OUTPUT V OLTAGE,
VO (V) (20 mV/div)
OUTPUT CURRENT,
IO (A) (2 A/div)
IO = 1A - 6A
VO = 3.3V
TIME, t (0.2 ms/div)
OUTPUT V OLTAGE,
VO (V) (20 mV/div)
OUTPUT CURRENT,
IO (A) (2 A/div)
IO = 1A - 6A
VO = 3.3V
13
App Guide
June 20023.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Thermal Ratings
HAL/HAW Power Modules are rated to operate in ambient temperatures from -40 °C to 85 °C. The derating curves
below are provided as design aids for proper application of the power modules. To insure adequate cooling, the
module temperature should be measured in the system configuration. Ideally, temperature will be measured using
an infrared temperature probe (such as the FLUKE 80T-IR) or imaging system under the maximum ambient tem-
perature and the minimum air flow conditions. Diode and FET case temperatures measured on the top surface’s
hottest spot should not exceed 105 °C. An alternative method of measuring temperature is the use of thermocou-
ples. For best results, a small thermocouple should be attached to the leads of each FET and diode using a small
amount of thermal epoxy.
1-0???
Figure 25. Thermocouple Location
1414
App Guide
June 20023.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Thermal Ratings (continued)
1-0283
Figure 26.Thermal Derating 3.3 VIN, 1.5 VOUT
1-0282
Figure 27.Thermal Derating 3.3 VIN, 1.8 VOUT
1-0281
Figure 28.Thermal Derating 3.3 VIN, 2.0 VOUT
1-0280
Figure 29.Thermal Derating 3.3 VIN, 2.5 VOUT
7
6
5
4
3
2
1
030 40 50 60 70 80
TEMPERATURE (˚C)
2.5 m/s (500 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
1.5 m/s (300 ft./min.)
OUTPUT CURRENT, IO (A)
7
6
5
4
3
2
1
030 40 50 60 70 80
TEMPERATURE (˚C)
2.5 m/s (500 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
1.5 m/s (300 ft./min.)
OUTPUT CURRENT, I
O
(A)
7
6
5
4
3
2
1
030 40 50 60 70 80
TEMPERATURE (˚C)
2.5 m/s (500 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
1.5 m/s (300 ft./min.)
OUTPUT CURRENT, IO (A)
7
6
5
4
3
2
1
030 40 50 60 70 80
TEMPERATURE (˚C)
2.5 m/s (500 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
1.5 m/s (300 ft./min.)
OUTPUT CURRENT, I
O
(A)
15
App Guide
June 20023.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Thermal Ratings (continued)
1-0279
Figure 30.Thermal Derating of 5.0VIN/1.8VOUT
1-0278
Figure 31.Thermal Derating 5.0 VIN, 2.5 VOUT
1-0277
Figure 32.Thermal Derating 5.0 VIN, 3.3 VOUT
Efficiency
Figures 33—39 show typical efficiency charts for HAL/HAW
Power Modules at different input voltages. The
data reflects a 25 °C ambient temperature. Efficiencies
will decrease approximately 2% at maximum tempera-
tures. Efficiency is measured in production at 25 °C
and full load.
1-0290
Figure 33. Efficiency: 3.3 VIN, 1.5 VOUT
1-0289
Figure 34. Efficiency: 3.3 VIN, 1.8 VOUT
6
5
4
3
2
1
030 40 50 60 70 80
TEMPERATURE (˚C)
2.5 m/s (500 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
1.5 m/s (300 ft./min.)
OUTPUT CURRENT, I
O
(A)
7
6
5
4
3
2
1
030 40 50 60 70 80
TEMPERATURE (˚C)
2.5 m/s (500 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
1.5 m/s (300 ft./min.)
OUTPUT CURRENT, IO (A)
7
6
5
4
3
2
1
0
OUTPUT CURRENT, IO (A)
30 40 50 60 70 80
TEMPERATURE (˚C)
2.5 m/s (500 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
1.5 m/s (300 ft./min.)
80
78
76
74
72
70
68
66
64
62
60 3012 456
EFFICIENCY, η (%)
OUTPUT CURRENT, IO (A)
V
I
= 3.0 V
V
I
= 3.3 V
V
I
= 3.6 V
88
84
80
76
72
68
64
60 3012 456
EFFICIENCY, η (%)
OUTPUT CURRENT, IO (A)
V
I
= 3.0 V
V
I
= 3.3 V
V
I
= 3.6 V
1616
App Guide
June 20023.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Efficiency (continued)
1-0288
Figure 35. Efficiency: 3.3 VIN, 2.0 VOUT
1-0287
Figure 36. Efficiency: 3.3 VIN, 2.5 VOUT
1-0286
Figure 37. Efficiency: 5.0 VIN, 1.8 VOUT
1-0285
Figure 38. Efficiency: 5.0 VIN, 2.5 VOUT
1-0284
Figure 39. Efficiency: 5.0 VIN, 3.3 VOUT
88
84
80
76
72
68
64
60 3012 456
EFFICIENCY, η (%)
OUTPUT CURRENT, I
O
(A)
V
I
= 3.0 V
V
I
= 3.3 V
V
I
= 3.6 V
92
88
84
80
76
72
68
64
60 3012 456
EFFICIENCY, η (%)
OUTPUT CURRENT, IO (A)
V
I
= 3.0 V
V
I
= 3.3 V
V
I
= 3.6 V
80
78
76
74
72
70
68
66
64
62
60 3012 456
EFFICIENCY, η (%)
OUTPUT CURRENT, IO (A)
VI = 4.5 V
VI = 5.0 V
VI = 5.5 V
88
84
80
76
72
68
64
60 3012 456
EFFICIENCY, η (%)
OUTPUT CURRENT, IO (A)
VI = 4.5 V
VI = 5.0 V
VI = 5.5 V
92
88
84
80
76
72
68
64
60 3012 456
EFFICIENCY, η (%)
OUTPUT CURRENT, I
O
(A)
VI = 4.5 V
VI = 5.0 V
VI = 5.5 V
17
App Guide
June 20023.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Static Regulation
Figures 40—46 show typical static regulation forHAL/HAW
Power Modules at different input voltages. The
data reflects a 25 °C ambient temperature.
1-0297
Figure 40. Static Regulation 3.3 VIN, 1.5 VOUT
1-0296
Figure 41. Static Regulation 3.3 VIN, 1.8 VOUT
1-0295
Figure 42. Static Regulation 3.3 VIN, 2.0 VOUT
1-0294
Figure 43. Static Regulation 3.3 VIN, 2.5 VOUT
VI = 3.6 V
VI = 3.3 V
VI = 3.0 V
OUTPUT CURRENT, IO (A)
OUTPUT V OLTAGE, VO (V)
01234 65
1.55
1.54
1.53
1.52
1.51
1.50
1.49
1.48
V
I
= 3.6 V
V
I
= 3.3 V
V
I
= 3.0 V
OUTPUT CURRENT, I
O
(A)
OUTPUT V OLTAGE, V
O
(V)
01234 65
1.84
1.83
1.82
1.81
1.80
1.79
1.78
1.77
VI = 3.6 V
VI = 3.3 V
VI = 3.0 V
OUTPUT CURRENT, IO (A)
OUTPUT V OLTAGE, VO (V)
01234 65
2.04
2.03
2.02
2.01
2.00
1.99
1.98
1.97
1.96
VI = 3.6 V
VI = 3.3 V
VI = 3.0 V
OUTPUT CURRENT, IO (A)
OUTPUT V OLTAGE, VO (V)
01234 65
2.550
2.545
2.540
2.535
2.530
2.525
2.520
2.515
2.510
2.505
18
App Guide
June 20023.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Static Regulation (continued)
1-0293
Figure 44. Static Regulation 5.0 VIN, 1.8 VOUT
1-0292
Figure 45. Static Regulation 5.0 VIN, 2.5 VOUT
1-0291
Figure 46. Static Regulation 5.0 VIN, 3.3 VOUT
Reflow Profile
An example of a reflow profile (using the 63/37 solder)
for the HAL/HAW Power Module is:
■Pre-heating zone: room temperature to 183 °C (2.0
to 4.0 minutes maximum)
■Initial ramp rate: < 2.5 °C per second
■Soaking zone: 155 °C to 183 °C – 60 to 90 seconds
typical (2.0 minutes maximum)
■Reflow zone ramp rate: 1.3 °C to 1.6 °C per second
■Reflow zone: 210 °C to 235 °C peak temperature –
30 to 60 seconds typical (90 seconds maximum)
1-0303
Figure 47. Reflow Profile — Source: Kester
VI = 5.5 V
VI = 5.0 V
VI = 4.5 V
OUTPUT CURRENT, IO (A)
OUTPUT V OLTAGE, VO (V)
01234 65
1.84
1.83
1.82
1.81
1.80
1.79
1.78
1.77
1.76
VI = 5.5 V
VI = 5.0 V
VI = 4.5 V
OUTPUT CURRENT, IO (A)
OUTPUT V OLTAGE, VO (V)
01234 65
2.56
2.55
2.54
2.53
2.52
2.51
VI = 5.5 V
VI = 5.0 V
VI = 4.5 V
OUTPUT CURRENT, IO (A)
OUTPUT V OLTAGE, VO (V)
01234 65
3.35
3.34
3.33
3.32
3.31
3.30
3.29
3.28
TIME (SECONDS)
ALLOY: Sn63Pb37 or Sn62Pb36Ag02
REFLOW PROFILE
TEMPERATURE (˚C)
0
20
40
60
80
100
120
140
160
180
200
220
30 60 90 120 150 180 210 240 270
0
REFLOW ZONE
30 - 90 SEC MAX
30 - 60 SEC
2.0 MIN MAX
60 - 90 SEC
SOAKING ZONE
<2.5 ˚C/SEC
0.5 - 0.6 ˚C/SEC
1.3 - 1.6 ˚C/SEC PEAK TEMP.
210 - 235 ˚C
2.0 - 4.0 MIN
PRE-HEATING
19
App Guide
June 20023.3 Vdc and 5.0 V dc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Recommendation for Power Module Pick and Place
Placement of the HAL/HAW can be achieved by choosing one of the below points.
Recommended Location
■
Pick Point 1:
The Product ID label, which is attaced over the surface mount inductors, provides the largest and
most versatile pick point. This label is 0.340” x 0.440”. Up to an 8-mm outside diameter nozzle can be utilized to
obtain maximum vacuum pick-up. Smaller diameter nozzles can also be utilized. For all nozzle sizes, travel and
rotation speeds may need to be reduced. this off center pick point may pose some challenges for some vision
recognition systems.
Alternate Locations
■
Pick Poi nts 2 and 3:
These points provide a location that is closest to the center of gravity on the x-axis center-
line. A nozzle size of 2.5mm to 3.7mm can be utilized in these locations. Care is needed to avoid nozzle contact
with adjacent components. Placement system accuracy needs to be verified. Travel and rotations speeds will
need to be reduced. It is possible that a custom nozzle can be designed to utilize both of these points simulta-
neously.
■
Pick Point 4:
This point is only available to machines that can move off of the x-axis centerline. It provides a
larger surface area and is close to the center of gravity. A 4-mm outside diameter nozzle can be utilized. Travel
and rotations speeds will need to be reduced.
If rotational slipping occurs, rubber tipped nozzles can be utilized to prevent slippage.
These recommendations are general and apply only to machines that use vacuum nozzles to place components.
Machines with the capability of adding mechanical gripping to the sides of assembly can also be utilized.
Testing with a specific placement machine is recommended to determine optimal placement procedures.
Figure 48. HAL/HAW Top Side
20
App Guide
June 20023.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Pad Size
Recommended surface mount pad size is a minimum of 0.12 in. x 0.075 in. and a maximum of 0.140 in. x 0.095 in.
Solder Paste Height
The recommended solder paste height as applied via standard SMT processes is 0.006” or higher.
Solder Paste Coverage
The recommended solder paste coverage ov er surface mount pads in 90%
1-0298
Figure 49. Pad Locations
0.430
0.405
0.025
0.677 0.190 0.310
1.177
RECOMMENDED PAD LAYOUT
PAD SIZE
MIN:
MAX: 0.120 x 0.075
0.140 x 0.095
21
App Guide
June 20023.3 Vdc and 5.0 V dc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Mechanical Specifications
Table 3.
1-0299
Figure 50. HAL/HAW Power Module Label
Parameter Symbol Min Typical Max Unit
Physical Size
* Dimensions listed are typical, with a tolerance
of +/- 0.01 inches
L
W
H
—
—
—
*33 (1.3)
13.46 (0.53)
5.46 (0.215)
—
—
—
mm (in.)
mm (in.)
mm (in.)
Weight ——3.1 —grams (oz.)
Module I/O Conn ec tors Coplan arity ———4 (0.158) mm (in.)
Interconnecting Low-inductance surface-mount connector
Labeling The label spans the magnetic component and contains the following:
■Line 1: VIN and VOUT, version number
■Line 2: Tyco Comcode
■Line3: Lot number (year manufactured; manuf acturing site, work week
built, lot number within work week, panel number; circuit serial number
within panel)
■Line 4: Barcode
A = REVISION NUMBER
GENERAL NOTES:
(A) PART DESCRIPTION: VIN/VOUT A
(B) MANUFACTURING P/N: SEE TABLE ABOVE
(C) PART S/N: YSSWWLLPPMM
(D) CODE 128 BAR CODE => WWLLPPMM
CODE: AUTO SELECTION
NARROW BAR WIDTHS (DOTS) = 2 : 003"/27.27 CPI
VIN/VOUT
3.3 VIN/1.5 VOUT
3.3 VIN/1.8 VOUT
3.3 VIN/2.0 VOUT
3.3 VIN/2.5 VOUT
5.0 VIN/1.8 VOUT
5.0 VIN/2.5 VOUT
5.0 VIN/3.3 VOUT
HAL1R5005
HAL1R8005
HAL2R0005
HAL2R5005
HAW1R8005
HAW2R5005
HAW3R3005
MFG. P/N
= YEAR CODE
= SITE (EX. DJ-MESQUITE, KZ-MATAMOROS...)
= BUILD WEEK
= LOT NUMBER
= PANEL NUMBER (01-20)
= MODULE NUMBER (01-78)
Y
S
W
L
M
M
A HAL/HAW PRODUCT LABEL ILLUSTRATING A 3.3V/1.5V
AUSTIN LITE, REVISION 1, LOT #1, PANEL #1, MODULE #1,
BUILT IN AUSTIN DURING THE 25TH WEEK OF 2000
22
App Guide
June 20023.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Safety Specifications
EMI: FCC Class B and EN55022 Class B Radiated Emissions
Safety: Designed to meet UL 60950, CSA C22.2 No. 60950-00, and VDE 0805 (IEC 60950)
For safety agency approval of the system in which the HAL/HAW Power Module is used, the power module must
be installed in compliance with the spacing and separation requirements of the end use safety agency standard.
For the converter output to meet the requirements of safety extra low voltage (SELV), the input must meet SELV
requirements.
The HAL/HAW Power Module has extra low voltage (ELV) outputs when all inputs are ELV.
The input to these units is to be provided with a maximum 10A normal blow fuse in the ungrounded lead.
1-0300
Figure 51. Bottom View of Board
Note:Measurement is in inches
1-0301
Figure 52. Tape Dimensions
Note:HAL/HAW Power Modules are shipped in quantities of 250 modules per tape and reel.
0.7250.1900.310
1.300
0.048
0.050
0.075
0.480
0.530
0.070
0.120
GND VOUT
CONTROLVIN
LISMC PAD
BOTTOM VIEW OF BOARD
0.925
(23.5)
0.945
(24.0) 0.158
(4.0)
PICK POINT TOP COVER TAPE
EMBOSSED CARRIER
FEED
DIRECTION 1.45
(36.8)
1.59
(40.5)
1.73
(44.0)
TOP COVER TAPE EMBOSSED CARRIER
0.205
(5.2)
NOTE: CONFORMS TO EAI-481 REV. A STANDARD
23
App Guide
June 20023.3 Vdc and 5.0 V dc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
HAL/HAW Non-Isolated SMT DC - DC Power Modules:
Ordering Information
Please contact your Tyco Electronics’ Account Manager or Field Application Engineer for pricing and availability.
Table 4. Coding Scheme for Ordering
Product Code Comcode Expanded Product Description
HAL1R5005 108847294 3.3 VIN; 1.5 VOUT; 4 terminal surface mount; 5A IOUT;
Tape & Reel package
HAL1R8005 108847237 3.3 VIN; 1.8 VOUT; 4 terminal surface mount; 5A IOUT;
Tape & Reel package
HAL2R0005 108847245 3.3 VIN; 2.0 VOUT; 4 terminal surface mount; 5A IOUT;
Tape & Reel package
HAL2R5005 108834961 3.3 VIN; 2.5 VOUT; 4 terminal surface mount; 5A IOUT;
Tape & Reel package
HAW1R8005 108892464 5 VIN; 1.8 VOUT; 4 terminal surface mount; 5A IOUT;
Tape & Reel package
HAW2R5005 108834979 5 VIN; 2.5 VOUT; 4 terminal surface mount; 5A IOUT;
Tape & Reel package
HAW3R3005 108847252 5 VIN; 3.3 VOUT; 4 terminal surface mount; 5A IOUT;
Tape & Reel package
