Applications Guide June 2002 Shindengen Power Modules HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A Features Small size and very low profile Minimal space on printed circuit board Surface mountable Single output maximum dimensions: 33 mm x 12.95 mm x 5.46 mm (1.3 in x 0.530 in x 0.215 in.), tolerance of +/- 0.01 High reliability: designed to meet 200 FITs/5 million hour MTBF High efficiency 5.0 VIN 87% typical @ 3.3V, 5A 3.3 VIN 86% typical @ 2.5V, 5A Applications Single control pin for output voltage margining and on/off control Workstations Servers Instantaneous auto-reset overcurrent protection (non-latching) Desktop computers Overtemperature protection DSP applications No external bias required Distributed power architectures Low inductance surface mount connections Telecommunications equipment Adapter cards LAN/WAN applications Data processing applications The HAL/HAW Power Module provides precise voltage in an industry leading small footprint while offering very high reliability and high efficiency. Designed to meet UL 60950, CSA C22.2 No. 60950-00, and VDE 0805 (IEC60950) Description This Power Module is designed to meet the precise voltage requirements of today's high performance DSP and microprocessor circuits and system board level applications. Advanced circuit techniques, high frequency switching, custom components, and very high density, surface mountable packaging technology deliver high quality, ultra compact, DC-DC conversion. UL is a registered trademark of Underwriters Laboratories, Inc. CSA is a registered trademark of Canadian Standards Association. VDE is a trademark of Verband Deutscher Elektrotechniker e.V. HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A App Guide June 2002 Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute maximum stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. Input voltage range of VIN = 3.0V is listed as 3.3 VIN and input voltage range of VIN = 4.5V - 5.5V is listed as 5.0 VIN.. Parameter Device Symbol Min Max Unit Input Voltage (continuous) 3.3 VIN 5.0 VIN VIN VIN -0.3 -0.3 3.6 5.5 Vdc Vdc Imposed Output Voltage All VOIF -0.3 5.5 Vdc CTRL Terminal Voltage All CTRL -0.3 2.0 Vdc Storage Temperature All TA/STG -40 125 C Electrical Specifications Table 1. Input Specifications Parameter Operating Input Voltage Device Symbol Min Typ Max Unit 3.3 VIN 5.0 VIN VIN VIN 3.0 4.5 3.3 5.0 3.6 5.5 V V Input Ripple Rejection (120 Hz) 50 Operating Input Current (0A IOUT < 5A) (3.0 V < VIN < 3.6V) (4.5V < VIN < 5.5V) Quiescent Input Current (IOUT = 0) (3.0V < VIN < 5.5V) Input Ripple Current: 20 MHz BW, 250 nH Input Inductance (see Figure ) 3.3 VIN 5.0 VIN IIN IIN -- -- All IQ -- 3.3 VIN 5.0 VIN IINripple IINripple -- -- dB 6 5.5 A A -- mA 35 mAp-p mAp-p mAp-p Fusing Considerations CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a normal blow fuse with a maximum rating of 10A (see Safety Specifications on page ). Output Control The control pin is a dual-function port that serves to enable/disable the converter or provide a means of adjusting the output voltage over a prescribed range. When the control pin is grounded, the converter is disabled. With the pin left open, the converter regulates to its specified output voltage. For any other voltage applied to the pin, the output voltage follows this relationship: VCONTROL VOUT = * VOUTNOM 1.5 2 App Guide June 2002 HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A Output Control (continued) The output voltage may be margined up or down in direct proportion to the percentage deviation of the control pin from 1.5V. The control pin may be driven by an imposed voltage to margin up or down or shunted by a resistive element to ground for margin down. The preferred margin technique employs an external control voltage to margin up or down. A resistor shunt may be used to margin down but the reference will sag due to its internal impedance. VOUT: VCONTROL: VOUTNOM: RMARGIN: The value of the output voltage after margining The voltage at the CTRL pin The ouput voltage if the control pin is left open The shunt resistor to ground for margining TO FB - + 51.1 K CTRL 499 + + 1.5 V VCONTROL - - REFERENCE 100 A 1-0249 Margin Up To margin the converter up apply a voltage to the CTRL pin that is above 1.50 volts by the same percentage as the desired margin up percentage VCONTROL = 1.5 (1 + MARGIN UP %) Example:Margin up 5%: Applying 1.575 volts to the CTRL pin will increase the output voltage by 5% over its unmargined value VCONTROL = 1.5 (1 + .05) VCONTROL = 1.575 Margin Down Assume a percentage to margin down. Then connect a resistor RMARGIN between CTRL and GND. Use the following relations to decide the value of RMARGIN: TO FB 51.1 K CTRL RMARGIN - + 499 + 1.5 V REFERENCE - 100 A 1-0250 3 HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A App Guide June 2002 Output Control (continued) Margin Down (continued) 1 - margin% RMARGIN = 499 * --------------------------------------------- 1 - (1 - margin%) Example: To margin down 5%, then: RMARGIN = 1 - .05 499 * -------------------------------- 1 - (1 - .05) RMARGIN = 9481 Because margining affects the system reference, margining beyond 10% is unacceptable and 0% - 5% is desirable. Margining the unit down beyond 5% requires derating the available current by 1% for every percent beyond 5 that the module is margined down. For example, if a module were margined down 7%, output current would have to be derated 2%. Special Note:The 3.3/2.5V version must be operated at nominal line to achieve margin up. The margin up available for this version is maximum 5% Output Regulation These modules make use of inherent output resistance to facilitate improved transient response. This means that the output voltage will decrease with increasing output current. For this reason, the total DC regulation window at any given operating temperature is comprised of a no-load setpoint and a load dependent voltage drop due to module output resistance. Regulation data provided in Table 2 includes both the initial set point and this voltage drop. Because Table 2 includes output resistance drop, the maximum column represents a no-load condition while the minimum column represents a full-load condition. Production test limits are set such that no module could pass with a full-load regulation point equal to the maximum column. This means that at any operating current, the regulation will always be better than the total window specified in Table 2. 4 App Guide June 2002 HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A Output Regulation (continued) Table 2. Output Specifications Unless otherwise noted, all specifications are defined at nominal line, full load, TAMBIENT - 25 C Parameter Output Voltage These specifications are under all specified input voltage, load current, and temperature conditions. They do not include ripple or transient. Output Current *(see Figures 17 - 22 for derating) Output Ripple (See Figures 4 -- 9) External Load Capacitance* Output Current Limit Inception Device Symbol Min Typ Max Unit 3.3V 2.5V 2.0V 1.8V 1.5V VOUT VOUT VOUT VOUT VOUT 3.20 2.42 1.94 1.74 1.45 3.3 2.5 2.0 1.8 1.5 3.400 2.58 2.06 1.86 1.55 V V V V V -- IOUT 0 -- 5 A 3.3 VIN 5.0 VIN VRIPPLE VRIPPLE -- -- -- -- 80 100 mVpp mVpp All -- -- 5000* -- F All IOUT 5.0 - 3.3 5.0 - 2.5 3.3 - 2.5 3.3 - 2.0 3.3 - 1.8 3.3 - 1.5 -- -- -- -- -- -- 87 82 86 82 80 75 -- -- -- -- -- -- % % % % % % Switching Frequency All FOP -- 900 -- kHz VOUT Dynamic Response to Transient Load (TTRANSITION = 50 s) Nominal Load 50% to 100% Peak Deviation measured as a maximum percentage deviation from nominal VO at full load Nominal Load 50% to 100% Settling Time to VOUT < 10% of VOUT STEADY STATE See Figures 10 - 15 All -- -- < 10 -- % -- -- < 25 -- S Efficiency VIN = Nominal, IOUT = Maximum 7 A * units will start into 5000 F, 5A load at nominal line; units will start into 10,000 F with no load Static Voltage Regulation The ouput voltage measured at the converter output pins on the system board will be within the range shown in Table 3, except during turn-on and turn-off. Static voltage regulation includes: DC Output initial voltage Input voltage range 3.0V - 3.6V 4.5V - 5.5V Load regulation from 0A - 5A Output Ripple and Noise Output ripple and noise is defined as periodic or random deviation from the nominal voltage at the output pins while under constant load and input line. Typical full load output ripple and noise waveforms are shown in Figures 4 - 10. 5 HAl/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A App Guide June 2002 Output Overcurrent Protection/Overtemperature Protection The module is equipped with internal current limiting circuitry for momentary overloads and short circuits. A sustained overload may cause the internal thermal shutdown circuit to activate. The current limit inception is nominally 7 amperes with the module power semiconductors at rated temperature in a 25 C ambient environment. Additionally, the module is equipped with the thermal circuitry to safeguard against thermal damage. The thermal circuit shuts down the module when the case temperature of the top surface of the power semiconductors rises to a maximum of 135 C. Figure 25 provides details on the temperature measuring location for the top surface of the power semiconductor case. The module will be restored to normal operation when the top surface temperature of the power semiconductor is taken below 105 C. Input/Output Decoupling An input capacitance of 100 F with an ESR of less than 100 milliohms and at least 1 F ceramic or equivalent is recommended for the input to the modules. This 100 F capacitor should always be used unless the buss bulk capacitors are located close to the module. This capacitor provides decoupling in the event of a fault to the module output. Input voltage should never go below 2.5V or internal protection circuitry may fail to act. To achieve noise levels shown in Figures - 10, one 100 F tantalum capacitor and one 1 F ceramic capacitor are used. 0.75 inches of 0.14 inch wide track (with no ground beneath) is used as an inductor between the input pin of the module and the decoupling capacitors. Output decoupling used to achieve noise levels shown in Figures -10 is 1 F. Care should be taken that selected output decoupling capacitors do not form troublesome L-C resonant networks with track inductance. TP RIPP TRACE L VIN + VIN - VRM CTRL CBULK 100 F VOUT COM CDECOUP 1 F CDECOUP 1 F ILOAD 1-0251 Figure 1. Input/Output Decoupling Circuit INPUT REFLECTED RIPPLE CURRENT 250 nH VIN + VIN - CTRL CBULK 100 F CDECOUP 1 F VRM VOUT COM CDECOUP 1 F ILOAD 1-0252 Figure 2. Input Reflected Repple Current Measuring Circuit Measured with AC Current Probe 6 App Guide June 2002 HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A Input/Output Decoupling (continued) UP VIN + VIN - CTRL CBULK 100 F VRM VOUT COM CDECOUP 1 F CDECOUP 1 F LOAD SWITCH RLOAD CONTROL 1-0253 Figure 3. Load Transient Response Measuring Circuit TIME, t (1 s/div) 1-0262 Figure 4. Ripple & Noise Characteristic with 6.2 amps resistive load @ 3.3 VIN/1.5 VOUT Input/Output Ripple Performance Figures -10 represent typical input and output ripple noise levels obtained using the circuit shown in Figure . Nominal input and output voltages and a constant ouput current were used during testing. All measurements taken with setup shown in Figures and . the output ripple voltage (top trace) is measured across the output pins using a Lecroy AP 033 differential probe. 7 INPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) II (A) (100 mA/div) INPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) II (A) (100 mA/div) The input reflected ripple current (Bottom trace) is measured with a Lecroy AP 015 current probe. The BW limit is set to 25 MHz. The time base and amplitude dividers settings are shown in their respective figures TIME, t (1 s/div) 1-0261 Figure 5. Ripple & Noise Characteristic with 6.2 amps resistive load @ 3.3 VIN/1.8 VOUT HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A App Guide June 2002 Input/Output Ripple Performance (contin- INPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) II (A) (100 mA/div) INPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) II (A) (100 mA/div) ued) TIME, t (1 s/div) 1-0256 Figure 8. Ripple & noise Characteristic with 5.8 amps resistive load @ 5.0VIN/1.8VOUT TIME, t (1 s/div) 1-0260 INPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) II (A) (100 mA/div) INPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) II (A) (100 mA/div) Figure 6. Ripple & Noise Characteristic with 6.2 amps resistive load @ 3.3 VIN/2.0 VOUT TIME, t (1 s/div) 1-0257 Figure 9. Ripple & Noise Characteristic with 6.3 amps resistive load @ 5.0 VIN/2.5 VOUT TIME, t (2 s/div) 1-0259 Figure 7. Ripple & Noise Characteristic with 6.2 amps resistive load @ 3.3 VIN/2.5 VOUT 8 App Guide June 2002 HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A OUTPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) IO (A) (2 A/div) Input/Output Ripple Performance (contin- INPUT CURRENT, OUTPUT VOLTAGE, VI (A) (100 mA/div) VO (V) (20 mV/div) ued) 1-0270 1-0258 Figure 12.Transient Respond Characteristic of 3.3VIN/1.5VOUT with IOUT step up =1A-6A Static load, Dt=50s, VOUT=20mV/DIV @ Fall time Condition OUTPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) IO (A) (2 A/div) Figure 10.Ripple & Noise Characteristic with 6.3 amps resistive load @ 5.0 VIN/3.3 VOUT Transient Response Performance Figures 11-24 depict typical transient responses obtained using the circuit shown in Figure . OUTPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) IO (A) (2 A/div) IO = 1A - 6A TIME, t (0.2 ms/div) TIME, t (1 s/div) VO = 1.5V VO = 1.8V IO = 1A - 6A TIME, t (0.2 ms/div) 1-0271 Figure 13.Transient Respond Characteristic of 3.3VIN/1.8VOUT with IOUT step up =1A-6A Static load, Dt=50s, VOUT=20mV/DIV @ Rise time Condition IO = 1A - 6A TIME, t (0.2 ms/div) 1-0269 Figure 11.Transient Respond Characteristic of 3.3VIN/1.5VOUT with IOUT step up =1A-6A Static load, Dt=50s, VOUT=20mV/DIV @ Rise time Condition 9 VO = 1.5V HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A App Guide June 2002 OUTPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) IO (A) (2 A/div) OUTPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) IO (A) (2 A/div) Transient Response Performance (continued) VO = 1.8V IO = 1A - 6A 1-0274 1-0272 Figure 16.Transient Respond Characteristic of 3.3VIN/2.0VOUT with IOUT step up =1A-6A Static load, Dt=50s, VOUT=20mV/DIV @ Fall time Condition OUTPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) IO (A) (2 A/div) Figure 14.Transient Respond Characteristic of 3.3VIN/1.8VOUT with IOUT step up =1A-6A Static load, Dt=50s, VOUT=20mV/DIV @ Fall time Condition OUTPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) IO (A) (2 A/div) IO = 1A - 6A TIME, t (0.2 ms/div) TIME, t (0.2 ms/div) VO = 2.0V IO = 1A - 6A VO = 2.5V IO = 1A - 6A TIME, t (0.2 ms/div) 1-0275 TIME, t (0.2 ms/div) 1-0273 Figure 15.Transient Respond Characteristic of 3.3VIN/2.0VOUT with IOUT step up =1A-6A Static load, Dt=50s, VOUT=20mV/DIV @ Rise time Condition 10 VO = 2.0V Figure 17.Transient Respond Characteristic of 3.3VIN/2.5VOUT with IOUT step up =1A-6A Static load, Dt=50s, VOUT=20mV/DIV @ Rise time Condition App Guide June 2002 HAl/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A OUTPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) IO (A) (2 A/div) OUTPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) IO (A) (2 A/div) Transient Response Performance (continued) VO = 2.5V IO = 1A - 6A 1-0264 1-0276 Figure 20.Transient Respond Characteristic of 5.0VIN/1.8VOUT with IOUT step up =1A-6A Static load, Dt=50s, VOUT=20mV/DIV @ Fall time Condition OUTPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) IO (A) (2 A/div) Figure 18.Transient Respond Characteristic of 3.3VIN/2.5VOUT with IOUT step up =1A-6A Static load, Dt=50s, VOUT=20mV/DIV @ Fall time Condition OUTPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) IO (A) (2 A/div) IO = 1A - 6A TIME, t (0.2 ms/div) TIME, t (0.2 ms/div) VO = 1.8V IO = 1A - 6A VO = 2.5V IO = 1A - 6A TIME, t (0.2 ms/div) 1-0265 TIME, t (0.2 ms/div) 1-0263 Figure 19.Transient Respond Characteristic of 5.0VIN/1.8VOUT with IOUT step up =1A-6A Static load, Dt=50s, VOUT=20mV/DIV @ Rise time Condition 11 VO = 1.8V Figure 21.Transient Respond Characteristic of 5.0VIN/2.5VOUT with IOUT step up =1A-6A Static load, Dt=50s, VOUT=20mV/DIV @ Rise time Condition HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A App Guide June 2002 OUTPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) IO (A) (2 A/div) OUTPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) IO (A) (2 A/div) Transient Response Performance (continued) VO = 2.5V IO = 1A - 6A 1-0268 1-0266 Figure 22.Transient Respond Characteristic of 5.0VIN/2.5VOUT with IOUT step up =1A-6A Static load, DT=50s, VOUT=20V/DIV @ Fall time Condition OUTPUT CURRENT, OUTPUT VOLTAGE, VO (V) (20 mV/div) IO (A) (2 A/div) IO = 1A - 6A TIME, t (0.2 ms/div) TIME, t (0.2 ms/div) VO = 3.3V IO = 1A - 6A TIME, t (0.2 ms/div) 1-0267 Figure 23.Transient Respond Characteristic of 5.0VIN/3.3VOUT with IOUT step up =1A-6A Static load, Dt=50s, VOUT=20mV/DIV @ Rise time Condition 12 VO = 3.3V Figure 24.Transient Respond Characteristic of 5.0VIN/3.3VOUT with IOUT step up =1A-6A Static load, Dt=50s, VOUT=20mV/DIV @ Fall time Condition App Guide June 2002 HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A Thermal Ratings HAL/HAW Power Modules are rated to operate in ambient temperatures from -40 C to 85 C. The derating curves below are provided as design aids for proper application of the power modules. To insure adequate cooling, the module temperature should be measured in the system configuration. Ideally, temperature will be measured using an infrared temperature probe (such as the FLUKE 80T-IR) or imaging system under the maximum ambient temperature and the minimum air flow conditions. Diode and FET case temperatures measured on the top surface's hottest spot should not exceed 105 C. An alternative method of measuring temperature is the use of thermocouples. For best results, a small thermocouple should be attached to the leads of each FET and diode using a small amount of thermal epoxy. 1-0??? Figure 25. Thermocouple Location 13 HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A App Guide June 2002 Thermal Ratings (continued) OUTPUT CURRENT, IO (A) 7 OUTPUT CURRENT, IO (A) 7 6 5 4 2.5 m/s (500 ft./min.) 2.0 m/s (400 ft./min.) 1.5 m/s (300 ft./min.) 1.0 m/s (200 ft./min.) 0.5 m/s (100 ft./min.) 3 2 1 6 5 4 2.5 m/s (500 ft./min.) 2.0 m/s (400 ft./min.) 1.5 m/s (300 ft./min.) 1.0 m/s (200 ft./min.) 0.5 m/s (100 ft./min.) 3 2 1 0 30 40 0 30 40 50 60 TEMPERATURE (C) 70 50 60 TEMPERATURE (C) 70 80 1-0283 80 1-0281 Figure 28.Thermal Derating 3.3 VIN, 2.0 VOUT Figure 26.Thermal Derating 3.3 VIN, 1.5 VOUT OUTPUT CURRENT, IO (A) 7 OUTPUT CURRENT, IO (A) 7 6 5 4 2.5 m/s (500 ft./min.) 2.0 m/s (400 ft./min.) 1.5 m/s (300 ft./min.) 1.0 m/s (200 ft./min.) 0.5 m/s (100 ft./min.) 3 2 1 6 5 4 2.5 m/s (500 ft./min.) 2.0 m/s (400 ft./min.) 1.5 m/s (300 ft./min.) 1.0 m/s (200 ft./min.) 0.5 m/s (100 ft./min.) 3 2 1 0 30 40 50 60 TEMPERATURE (C) 70 80 0 30 40 50 60 TEMPERATURE (C) 70 80 1-0282 Figure 27.Thermal Derating 3.3 VIN, 1.8 VOUT 14 1-0280 Figure 29.Thermal Derating 3.3 VIN, 2.5 VOUT App Guide June 2002 HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A Thermal Ratings (continued) Efficiency OUTPUT CURRENT, IO (A) 6 5 4 2.5 m/s (500 ft./min.) 2.0 m/s (400 ft./min.) 1.5 m/s (300 ft./min.) 1.0 m/s (200 ft./min.) 0.5 m/s (100 ft./min.) 3 2 1 0 30 40 50 60 TEMPERATURE (C) 70 80 1-0279 Figure 30.Thermal Derating of 5.0VIN/1.8VOUT EFFICIENCY, (%) Figures 33--39 show typical efficiency charts for HAL/HAW Power Modules at different input voltages. The data reflects a 25 C ambient temperature. Efficiencies will decrease approximately 2% at maximum temperatures. Efficiency is measured in production at 25 C and full load. 80 78 76 74 72 70 68 66 64 62 60 VI = 3.0 V VI = 3.3 V VI = 3.6 V 0 1 7 2 3 4 OUTPUT CURRENT, IO (A) 5 6 Figure 33. Efficiency: 3.3 VIN, 1.5 VOUT 5 4 2.5 m/s (500 ft./min.) 2.0 m/s (400 ft./min.) 1.5 m/s (300 ft./min.) 1.0 m/s (200 ft./min.) 0.5 m/s (100 ft./min.) 3 2 1 88 84 0 30 40 50 60 TEMPERATURE (C) 70 80 1-0278 Figure 31.Thermal Derating 5.0 VIN, 2.5 VOUT EFFICIENCY, (%) OUTPUT CURRENT, IO (A) 1-0290 6 80 72 68 64 60 7 VI = 3.0 V VI = 3.3 V VI = 3.6 V 76 0 1 2 3 4 OUTPUT CURRENT, IO (A) 5 6 OUTPUT CURRENT, IO (A) 1-0289 6 Figure 34. Efficiency: 3.3 VIN, 1.8 VOUT 5 4 2.5 m/s (500 ft./min.) 2.0 m/s (400 ft./min.) 1.5 m/s (300 ft./min.) 1.0 m/s (200 ft./min.) 0.5 m/s (100 ft./min.) 3 2 1 0 30 40 50 60 TEMPERATURE (C) 70 80 1-0277 Figure 32.Thermal Derating 5.0 VIN, 3.3 VOUT 15 HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A App Guide June 2002 Efficiency (continued) EFFICIENCY, (%) 88 EFFICIENCY, (%) 88 84 80 VI = 3.0 V VI = 3.3 V VI = 3.6 V 76 72 84 80 VI = 4.5 V VI = 5.0 V VI = 5.5 V 76 72 68 64 68 60 64 60 0 1 2 3 4 5 6 OUTPUT CURRENT, IO (A) 0 1 2 3 4 OUTPUT CURRENT, IO (A) 5 6 1-0285 Figure 38. Efficiency: 5.0 VIN, 2.5 VOUT 1-0288 Figure 35. Efficiency: 3.3 VIN, 2.0 VOUT 92 88 EFFICIENCY, (%) 92 EFFICIENCY, (%) 88 84 VI = 3.0 V VI = 3.3 V VI = 3.6 V 80 76 72 84 VI = 4.5 V VI = 5.0 V VI = 5.5 V 80 76 72 68 68 64 64 60 0 60 0 1 2 3 4 OUTPUT CURRENT, IO (A) 5 6 1 2 3 4 5 1-0284 1-0287 Figure 39. Efficiency: 5.0 VIN, 3.3 VOUT EFFICIENCY, (%) Figure 36. Efficiency: 3.3 VIN, 2.5 VOUT 80 78 76 74 72 70 68 66 64 62 60 VI = 4.5 V VI = 5.0 V VI = 5.5 V 0 1 2 3 4 OUTPUT CURRENT, IO (A) 5 6 1-0286 Figure 37. Efficiency: 5.0 VIN, 1.8 VOUT 16 6 OUTPUT CURRENT, IO (A) App Guide June 2002 HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A Static Regulation OUTPUT VOLTAGE, VO (V) 1.55 VI = 3.6 V VI = 3.3 V VI = 3.0 V 1.54 1.53 1.52 2.04 OUTPUT VOLTAGE, VO (V) Figures 40--46 show typical static regulation forHAL/HAW Power Modules at different input voltages. The data reflects a 25 C ambient temperature. VI = 3.6 V VI = 3.3 V VI = 3.0 V 2.03 2.02 2.01 2.00 1.99 1.98 1.97 1.96 0 1.51 1 1.50 2 3 4 OUTPUT CURRENT, IO (A) 5 1.49 1.48 6 1-0295 0 1 2 3 4 OUTPUT CURRENT, IO (A) 5 Figure 42. Static Regulation 3.3 VIN, 2.0 VOUT 6 1-0297 OUTPUT VOLTAGE, VO (V) Figure 40. Static Regulation 3.3 VIN, 1.5 VOUT OUTPUT VOLTAGE, VO (V) 1.84 VI = 3.6 V VI = 3.3 V VI = 3.0 V 1.83 1.82 1.81 VI = 3.6 V VI = 3.3 V VI = 3.0 V 2.535 2.530 2.525 2.520 2.515 2.510 2.505 0 1.80 1 2 3 4 OUTPUT CURRENT, IO (A) 5 6 1.79 1-0294 1.78 1.77 0 1 2 3 4 OUTPUT CURRENT, IO (A) 5 6 1-0296 Figure 41. Static Regulation 3.3 VIN, 1.8 VOUT 17 2.550 2.545 2.540 Figure 43. Static Regulation 3.3 VIN, 2.5 VOUT App Guide June 2002 HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A Static Regulation (continued) An example of a reflow profile (using the 63/37 solder) for the HAL/HAW Power Module is: 1.84 OUTPUT VOLTAGE, VO (V) Reflow Profile VI = 5.5 V VI = 5.0 V VI = 4.5 V Pre-heating zone: room temperature to 183 C (2.0 to 4.0 minutes maximum) 1.81 Initial ramp rate: < 2.5 C per second 1.80 Soaking zone: 155 C to 183 C - 60 to 90 seconds typical (2.0 minutes maximum) 1.78 Reflow zone ramp rate: 1.3 C to 1.6 C per second 1.77 Reflow zone: 210 C to 235 C peak temperature - 30 to 60 seconds typical (90 seconds maximum) 1.83 1.82 1.79 1.76 0 1 2 3 4 OUTPUT CURRENT, IO (A) 5 6 1-0293 REFLOW PROFILE ALLOY: Sn63Pb37 or Sn62Pb36Ag02 Figure 44. Static Regulation 5.0 VIN, 1.8 VOUT PEAK TEMP. 210 - 235 C 220 1.3 - 1.6 C/SEC TEMPERATURE (C) 200 OUTPUT VOLTAGE, VO (V) 2.56 2.55 2.54 180 0.5 - 0.6 C/SEC 160 140 <2.5 C/SEC SOAKING ZONE REFLOW ZONE 2.0 MIN MAX 60 - 90 SEC 30 - 90 SEC MAX 30 - 60 SEC 120 100 80 PRE-HEATING 60 2.0 - 4.0 MIN 40 2.53 20 0 VI = 5.5 V VI = 5.0 V VI = 4.5 V 2.52 0 30 60 90 120 150 180 TIME (SECONDS) 210 240 270 1-0303 2.51 0 1 2 3 4 OUTPUT CURRENT, IO (A) 5 6 1-0292 Figure 45. Static Regulation 5.0 VIN, 2.5 VOUT OUTPUT VOLTAGE, VO (V) 3.35 3.34 VI = 5.5 V VI = 5.0 V VI = 4.5 V 3.33 3.32 3.31 3.30 3.29 3.28 0 1 2 3 4 OUTPUT CURRENT, IO (A) 5 6 1-0291 Figure 46. Static Regulation 5.0 VIN, 3.3 VOUT 18 Figure 47. Reflow Profile -- Source: Kester HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A App Guide June 2002 Recommendation for Power Module Pick and Place Placement of the HAL/HAW can be achieved by choosing one of the below points. Recommended Location Pick Point 1: The Product ID label, which is attaced over the surface mount inductors, provides the largest and most versatile pick point. This label is 0.340" x 0.440". Up to an 8-mm outside diameter nozzle can be utilized to obtain maximum vacuum pick-up. Smaller diameter nozzles can also be utilized. For all nozzle sizes, travel and rotation speeds may need to be reduced. this off center pick point may pose some challenges for some vision recognition systems. Alternate Locations Pick Points 2 and 3: These points provide a location that is closest to the center of gravity on the x-axis centerline. A nozzle size of 2.5mm to 3.7mm can be utilized in these locations. Care is needed to avoid nozzle contact with adjacent components. Placement system accuracy needs to be verified. Travel and rotations speeds will need to be reduced. It is possible that a custom nozzle can be designed to utilize both of these points simultaneously. Pick Point 4: This point is only available to machines that can move off of the x-axis centerline. It provides a larger surface area and is close to the center of gravity. A 4-mm outside diameter nozzle can be utilized. Travel and rotations speeds will need to be reduced. If rotational slipping occurs, rubber tipped nozzles can be utilized to prevent slippage. These recommendations are general and apply only to machines that use vacuum nozzles to place components. Machines with the capability of adding mechanical gripping to the sides of assembly can also be utilized. Testing with a specific placement machine is recommended to determine optimal placement procedures. Figure 48. HAL/HAW Top Side 19 App Guide June 2002 HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A Pad Size Recommended surface mount pad size is a minimum of 0.12 in. x 0.075 in. and a maximum of 0.140 in. x 0.095 in. Solder Paste Height The recommended solder paste height as applied via standard SMT processes is 0.006" or higher. Solder Paste Coverage The recommended solder paste coverage over surface mount pads in 90% 0.677 0.190 0.405 0.025 0.310 0.430 1.177 RECOMMENDED PAD LAYOUT PAD SIZE MIN: 0.120 x 0.075 MAX: 0.140 x 0.095 1-0298 Figure 49. Pad Locations 20 HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A App Guide June 2002 Mechanical Specifications Table 3. Parameter Symbol Physical Size Min Typical Max Unit L W H -- -- * Dimensions listed are typical, with a tolerance of +/- 0.01 inches Weight Module I/O Connectors Coplanarity Interconnecting Labeling -- *33 (1.3) -- mm (in.) -- 13.46 (0.53) -- mm (in.) -- 5.46 (0.215) -- mm (in.) -- 3.1 -- grams (oz.) -- -- 4 (0.158) mm (in.) Low-inductance surface-mount connector The label spans the magnetic component and contains the following: Line 1: VIN and VOUT, version number Line 2: Tyco Comcode Line3: Lot number (year manufactured; manufacturing site, work week built, lot number within work week, panel number; circuit serial number within panel) Line 4: Barcode GENERAL NOTES: (A) PART DESCRIPTION: VIN/VOUT A VIN/VOUT 3.3 VIN/1.5 VOUT 3.3 VIN/1.8 VOUT 3.3 VIN/2.0 VOUT 3.3 VIN/2.5 VOUT 5.0 VIN/1.8 VOUT 5.0 VIN/2.5 VOUT 5.0 VIN/3.3 VOUT MFG. P/N HAL1R5005 HAL1R8005 HAL2R0005 HAL2R5005 HAW1R8005 HAW2R5005 HAW3R3005 A = REVISION NUMBER (B) MANUFACTURING P/N: SEE TABLE ABOVE (C) PART S/N: YSSWWLLPPMM Y = YEAR CODE S = SITE (EX. DJ-MESQUITE, KZ-MATAMOROS...) W = BUILD WEEK L = LOT NUMBER M = PANEL NUMBER (01-20) M = MODULE NUMBER (01-78) (D) CODE 128 BAR CODE => WWLLPPMM CODE: AUTO SELECTION NARROW BAR WIDTHS (DOTS) = 2 : 003"/27.27 CPI A HAL/HAW PRODUCT LABEL ILLUSTRATING A 3.3V/1.5V AUSTIN LITE, REVISION 1, LOT #1, PANEL #1, MODULE #1, BUILT IN AUSTIN DURING THE 25TH WEEK OF 2000 1-0299 Figure 50. HAL/HAW Power Module Label 21 App Guide June 2002 HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A Safety Specifications EMI: FCC Class B and EN55022 Class B Radiated Emissions Safety: Designed to meet UL 60950, CSA C22.2 No. 60950-00, and VDE 0805 (IEC 60950) For safety agency approval of the system in which the HAL/HAW Power Module is used, the power module must be installed in compliance with the spacing and separation requirements of the end use safety agency standard. For the converter output to meet the requirements of safety extra low voltage (SELV), the input must meet SELV requirements. The HAL/HAW Power Module has extra low voltage (ELV) outputs when all inputs are ELV. The input to these units is to be provided with a maximum 10A normal blow fuse in the ungrounded lead. 1.300 0.310 0.190 0.725 0.048 GND VOUT 0.530 0.480 LISMC PAD 0.070 VIN CONTROL 0.050 0.075 0.120 BOTTOM VIEW OF BOARD 1-0300 Figure 51. Bottom View of Board Note:Measurement is in inches PICK POINT 0.945 (24.0) 0.925 (23.5) 0.158 (4.0) TOP COVER TAPE EMBOSSED CARRIER FEED DIRECTION 0.205 (5.2) 1.45 (36.8) 1.73 (44.0) 1.59 (40.5) TOP COVER TAPE EMBOSSED CARRIER NOTE: CONFORMS TO EAI-481 REV. A STANDARD 1-0301 Figure 52. Tape Dimensions Note:HAL/HAW Power Modules are shipped in quantities of 250 modules per tape and reel. 22 HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A App Guide June 2002 Ordering Information Please contact your Tyco Electronics' Account Manager or Field Application Engineer for pricing and availability. Table 4. Coding Scheme for Ordering Product Code Comcode HAL1R5005 108847294 HAL1R8005 108847237 HAL2R0005 108847245 HAL2R5005 108834961 HAW1R8005 108892464 HAW2R5005 108834979 HAW3R3005 108847252 23 Expanded Product Description 3.3 VIN; 1.5 VOUT; 4 terminal surface mount; 5A IOUT; Tape & Reel package 3.3 VIN; 1.8 VOUT; 4 terminal surface mount; 5A IOUT; Tape & Reel package 3.3 VIN; 2.0 VOUT; 4 terminal surface mount; 5A IOUT; Tape & Reel package 3.3 VIN; 2.5 VOUT; 4 terminal surface mount; 5A IOUT; Tape & Reel package 5 VIN; 1.8 VOUT; 4 terminal surface mount; 5A IOUT; Tape & Reel package 5 VIN; 2.5 VOUT; 4 terminal surface mount; 5A IOUT; Tape & Reel package 5 VIN; 3.3 VOUT; 4 terminal surface mount; 5A IOUT; Tape & Reel package