Three-Phase Power MOSFET Controller
A3932
10
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Applications Information
Additionally, a 0.1 μF (or larger) decoupling capacitor
should be connected between LCAP and AGND as close to the
device terminals as possible.
Protection Circuitry. The A3932 has several protection
features:
1) Bootstrap Circuit. The bootstrap capacitor is charged
whenever a low-side MOSFET is on, Sx output goes low,
and the load current recirculates. This happens constantly
during normal operation. The high-side MOSFET will not be
allowed to turn on before the charging has decayed to less than
approximately 9 mA. No fault will be registered.
When a phase’s high-side driver is on for a long time (100%
duty cycle operation) its charge pump is designed to maintain
VGS > 9 V on the bridge FET if IGHx (the load on the gate driver)
< 10 μA.
2) Hall Invalid. Illegal codes for the HALL inputs (000 or
111) will force a fault and coast the motor. Noisy Hall lines
may cause double TACH pulses and, therefore, code errors that
produce faults. Additional external pullup loading and fi ltering
may be required depending on the system.
3) VREG Undervoltage.
An internal regulator supplies the
low-side gate driver and the bootstrap charge current. It is critical
to ensure that VREG is at the proper level before enabling any of the
outputs. The undervoltage circuit is active during power-up and
will force a motor coast condition (all gate drives, GHx and GLx =
0) until VREG is greater than approximately 9.7 V.
4) Thermal Shutdown. A junction temperature greater than
165°C will signal a fault and coast the motor (all gate drives
LOW). If the junction temperature then falls to less than 155°C
(hysteresis), the fault will be cleared.
5) Motor Lead Shorted to Ground. The A3932 will signal
a fault if a motor lead is shorted to ground. A short to ground
is assumed after a high side is turned on and greater than 2 V is
measured between the drain (VBB) and source (SA/SB/SC) of the
high-side power MOSFET. This fault is cleared at the beginning
of each commutation. If a stalled motor results from a fault, the
fault can only be cleared by toggling the RESET terminal or by a
power-up sequence.
Synchronous Rectifi cation. To reduce power dissipation
in the external MOSFETs, the A3932 control logic turns on the
appropriate low-side and high-side driver during the load-current
recirculation, PWM-off cycle. Synchronous rectifi cation allows
current to fl ow through the MODE-selected MOSFET, rather
than the body diode, during the decay time. The body diodes of
the SR power MOSFETs will conduct only during the dead time
required at each PWM transition.
Dead Time. It is required to have a dead-time delay between a
high- or low-side turn off and the next turn-on event to prevent
cross conduction. The potential for cross conduction occurs with
synchronous rectifi cation, direction changes, PWM, or after a
bootstrap capacitor charging cycle. The dead time is set by a
resistor (Rdead) between the DEAD terminal and LCAP
(+5 V) and can be set between 100 ns and 5.5 μs.
The following equations are valid for Rdead between 5.6 kΩ
and 470 kΩ. At 25°C,
tdead (nom, ns) = 37 + (11.9 x 10-3 x (Rdead + 500))
For predicting worst case, over voltage and temperature
extremes,
tdead (min, ns) = 10 + (6.55 x 10-3 x (Rdead + 350))
tdead (max, ns) = 63 + (17.2 x 10-3 x (Rdead + 650))
For comparison with IDEAD test currents,
IDEAD = (VLCAP – Vbe)/(Rdead + Rint)
where (nominal values) VLCAP = 5 V, Vbe = 0.7 V at 25°C, and
Rint = 500 Ω.
Rather than use Rdead values near 470 kΩ, set DEAD =
ground (VDEAD = 0 V), which activates an internal (IDEAD =
10 μA) current source.
The choice of power MOSFET and external series gate
resistance determines the selection of the dead-time resistor. The
dead time should be made long enough to cover the variation of
the MOSFET gate capacitance and series gate resistance (both
external and internal to the A3932) tolerances.
Decoupling. The internal reference, VREG, supplies current
for the gate-drive circuit. As the gates are driven high they
will require current from an external capacitor to support the
transients. This capacitor should be placed as close as possible
to the VREG terminal. Its value should be at least 20 times larger
than the bootstrap capacitor. continued next page