TOTX178S(F) - TOSHIBA - Product.Network

TOTX178S

2001-07-26

FIBER OPTIC TRANSMITTING MODULE

TOTX178S

FIBER OPTIC TRANSMITTING

MODULE FOR DIGITAL AUDIO

INTERFACE

l Conforms to JEITA Standard CP−1201

(For Digital Audio Interfaces including

Fiber Optic inter−connections).

l LED is driven by differential circuit.

1. Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Storage Temperature Tstg −40 to 70 °C

Operating Temperature Topr −20 to 70 °C

Supply Voltage VCC −0.5 to 7 V

Input Voltage VIN −0.5 to VCC + 0.5 V

Soldering Temperature Tsol 260 (Note 1) °C

Note 1: Soldering time ≤ 10 seconds (At a distance of 1 mm from the package).

2. Recommended Operating Conditions

Characteristics Symbol Min Typ. Max Unit

Supply Voltage VCC 4.75 5.0 5.25 V

High−Level Input Voltage VIH 2.0 ― V

CC V

Low−Level Input Voltage VIL 0 ― 0.8 V

Handling precaution: The LED’s used in this product contain GaAs (Gallium Arsenide).

Care must be taken to protect the safety of people and the environment when

scrapping or terminal processing.

Unit: mm

TOTX178S

2001-07-26

3. Electrical and Optical Characteristics (Ta = 25°C, VCC = 5 V)

Characteristics Symbol Test Condition Min Typ. Max Unit

Data Rate NRZ Code (Note 2) DC ― 6 Mb / s

Transmission Distance Using APF (Note 3)and TORX178S 0.2 ― 5 m

Pulse Width Distortion (Note 4) ∆tw

Pulse Width = 165 ns

Pulse Cycle = 330 ns

CL = 10 pF, Using TORX178S

−30 ― 30 ns

Fiber Output Power (Note 5) Pf −21 ― −15 dBm

Peak Emission Wavelength λp ― 660 ― nm

Current Consumption ICC ― 13 20 mA

High Level Input Voltage VIH 2.0 ― ― V

Low Level Input Voltage VIL ― ― 0.8 V

Note 2: LED is on when input signal is high, and off when it is low.

The duty factor must be maintained between 25 to 75%.

Note 3: All Plastic Fiber (970 / 1000 µm).

Note 4: Between input of TOTX178S and output of fiber optic receiving module.

Note 5: Measure with a standard optical fiber, peak value.

4. Mechanical Characteristics (Ta = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Insertion Force Using TOCP172, Initial value ― ― 39.2 N

Withdrawal Force Using TOCP172, Initial value 5.9 ― 39.2 N

5. Application Circuit

6. Required Optical Fiber with Fiber Optic Connectors

TOCP172−□□B

TOTX178S

2001-07-26

7. Precautions during use

(1) Maximum rating

The maximum ratings are the limit values which must not be exceeded during operation of device.

None of these rating value must not be exceeded. If the maximum rating value is exceeded, the

characteristics of devices may never be restored properly. In some extreme cases, the device may be

permanently damages.

(2) Lifetime of light emitters

If an optical module is used for a long period of time, degeneration in the characteristics will mostly

be due to a lowering of the fiber output power (Pf). This is caused by the degradation of the optical

output of the LEDs used as the light source. The cause of degradation of the optical output of the

LEDs may be defects in wafer crystallization or mold resin stress. The detailed causes are, however,

not clear.

The lifetime of light emitters is greatly influenced by the operating conditions and the environment in

which it is used as well as by the lifetime characteristics unique to the device type. Thus, when a light

emitting device and its operating conditions determined, Toshiba recommend that lifetime

characteristics be checked.

Depending on the environment conditions, Toshiba recommend that maintenance such as regular

checks of the amount of optical output in accordance with the condition of operating environment.

(3) Soldering

Optical modules are comprised of internal semiconductor devices. However, in principle, optical

modules are optical components. During soldering, ensure that flux does not contact with the emitting

surface or the detecting surface. Also ensure that proper flux removal is conducted after soldering.

Some optical modules come with a protective cap. The protective cap is used to avoid malfunction

when the optical module is not in use. Note that it is not dust or waterproof.

As mentioned before, optical modules are optical components. Thus, in principle, soldering where

there may be flux residue and flux removal after soldering is not recommended. Toshiba recommend

that soldering be performed without the optical module mounted on the board. Then, after the board

has been cleaned, the optical module should be soldered on to the board manually.

If the optical module cannot be soldered manually, use non−halogen (chlorine−free) flux and make

sure, without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the

effects of flux. In such a cases, be sure to check the devices’reliability.

(4) Vibration and shock

This module is plastic sealed and has its wire fixed by resin. This structure is relatively resistant to

vibration and shock. In actual equipment, there are sometimes cases in which vibration, shock, or

stress is applied to soldered parts or connected parts, resulting in lines cut. A care must be taken in

the design of equipment which will be subject to high levels of vibration.

(5) Attaching the fiber optic transmitting module

Solder the fixed pins (pins 4 and 5) of the fiber optic transmitting module TOTX178S to the printed

circuit board in order to fix it to the board.

(6) Solvent

When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to

pour solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off

using cotton tips.

(7) Protective cap

When the TOTX178S is not in use, attach the protective cap.

(8) Supply voltage

Use the supply voltage within the recommended operating condition (VCC = 5 ± 0.25 V). Make sure

that supply voltage does not exceed the maximum rating value of 7 V, even for an instant.

(9) Input voltage

If a voltage exceeding the maximum rating value (VCC + 0.5 V) is applied to the transmitter input,

the internal IC may suffer damage. If there is a possibility that excessive voltage due to surges may

be added to the input terminal, insert a protective circuit.

(10) Soldering condition

Solder at 260°C or less for no more ten seconds.

TOTX178S

2001-07-26

(11) Precautions when disposing of devices and packing materials.

When disposing devices and packing materials, follow the procedures stipulated by local regulations

in order to protect the environment against contamination.

Compound semiconductors, such as GaAs are used as LED materials in this module. When devices

are disposed of, worker safety and protection of the environment must be taken into account.

(12) Precautions during use

Toshiba is continually working to improve the quality and the reliability of their products.

Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical

sensitivity and their vulnerability to physical stress. It is the responsibility of the buyer, when

utilizing Toshiba products, to observe standards of safety, and to avoid situations in which the

malfunction or failure of a Toshiba product could cause loss of human life, bodily injury or damage to

property.

When developing equipment, please ensure that Toshiba products are used within the specified

operating ranges set forth in the most recent product specifications. Also, please keep in mind the

precautions and conditions set forth in the Toshiba Semiconductor Reliability Handbook.

TOTX178S

2001-07-26

· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor

devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical

stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of

safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of

such TOSHIBA products could cause loss of human life, bodily injury or damage to property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as

set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and

conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability

Handbook” etc..

· The TOSHIBA products listed in this document are intended for usage in general electronics applications

(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,

etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires

extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or

bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or

spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,

medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this

document shall be made at the customer’s own risk.

· Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes

are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the

products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with

domestic garbage.

· The information contained herein is presented only as a guide for the applications of our products. No

responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other

rights of the third parties which may result from its use. No license is granted by implication or otherwise under

any intellectual property or other rights of TOSHIBA CORPORATION or others.

· The information contained herein is subject to change without notice.

000707EAC

RESTRICTIONS O N PRODUCT USE